CN109656047A - A kind of substrate and preparation method - Google Patents
A kind of substrate and preparation method Download PDFInfo
- Publication number
- CN109656047A CN109656047A CN201811510414.3A CN201811510414A CN109656047A CN 109656047 A CN109656047 A CN 109656047A CN 201811510414 A CN201811510414 A CN 201811510414A CN 109656047 A CN109656047 A CN 109656047A
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- Prior art keywords
- substrate
- optical film
- pixel
- sio
- unit frame
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
- G02F1/133509—Filters, e.g. light shielding masks
- G02F1/133514—Colour filters
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1339—Gaskets; Spacers; Sealing of cells
- G02F1/13394—Gaskets; Spacers; Sealing of cells spacers regularly patterned on the cell subtrate, e.g. walls, pillars
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1339—Gaskets; Spacers; Sealing of cells
- G02F1/13396—Spacers having different sizes
Abstract
The present invention relates to field of display technology, more particularly to a kind of substrate and preparation method, the substrate include underlay substrate, the pixel-array unit frame being arranged on the underlay substrate, the optical film, colored filter and indium tin oxide films set gradually on the underlay substrate and from bottom to top are arranged in.Base plate preparation method is also provided, pixel-array unit frame is prepared on underlay substrate, prepares certain thickness SiOxOr SiOxAnd SiNxThe optical film of structure, and colored filter and indium tin oxide films and major-minor support column are prepared on the optical film.Substrate of the invention can be improved the transmitance of light, reduce the fever of display, reduce the power consumption of product, save the cost.
Description
Technical field
The present invention relates to field of display technology more particularly to a kind of substrate and preparation methods.
Background technique
With the continuous development of display panel technology, various liquid crystal displays (Liquid Crystal Display, LED)
Also more and more to incorporate among life, the field of application is also more extensive.
In traditional LCD industry, the backlight module of display is by many devices such as substrate, optical filter, polaroid
Part composition, in the device of these compositions, since thin film transistor (TFT) (Thin Film Transistor, TFT) array can be to light
There is certain blocking, polaroid and colored filter can also absorb some light, so that the transmitance of light becomes smaller, these polarisations
Piece and colored filter reduce the transmitance of light and the absorption to light so that by backlight issue light some
It is just depleted in transmission process, statistics discovery, final only about 5% light-transmissive display, common colored filter
Mating plate (Color Filter, CF) substrate single layer tin-doped indium oxide tin thin film (Indium lower to the transmitance of light, traditional
Tin Oxide, ITO) it is relatively low to the transmitance of light, in this way, having resulted in the great wasting of resources, it is unfavorable for product power consumption
Reduction and the saving of use cost.
In conclusion the polaroid and colorized optical filtering sector-meeting in existing display absorb most of light, so that light
Transmitance reduce, cause the loss of the big degree of light, further increase the power consumption of product, it is therefore desirable to propose further
Scheme is improved, a kind of optical filter of high transparency is designed, with the transmitance of increasing light.
Summary of the invention
The present invention provides a substrate and preparation method, to solve the devices such as the CF substrate in existing display device in backlight module
Part is low to the light transmittance of light, the big problem of fiber-loss.
In order to solve the above technical problems, technical solution provided by the invention is as follows:
According to the first aspect of the embodiments of the present disclosure, a kind of substrate is provided, comprising:
Underlay substrate；
Pixel-array unit frame on the underlay substrate is set；
It is thin that the optical film, colored filter and tin indium oxide set gradually on the underlay substrate and from bottom to top is set
Film.
According to a preferred embodiment of the invention, the pixel-array unit frame is arranged in the optical film and the substrate
Between substrate.
According to a preferred embodiment of the invention, pixel-array unit frame setting the indium tin oxide films it
On.
According to a preferred embodiment of the invention, it is additionally provided between the pixel-array unit frame and the optical film
RGB color hinders pixel layer.
According to a preferred embodiment of the invention, the substrate further includes support column.
According to a preferred embodiment of the invention, the support column is arranged on the indium tin oxide films.
According to a preferred embodiment of the invention, the optical film is made of SiNx and SiOx.
According to a preferred embodiment of the invention, the optical film is SiOx.
According to a preferred embodiment of the invention, the optical film is SiO2 anti-reflection film, the thickness of the SiO2 anti-reflection film
For
According to the second aspect of the invention, a kind of base plate preparation method is also provided, comprising:
Step S100 prepares pixel-array unit frame by black matrix" manufacturing process on underlay substrate,
Step S110 prepares certain thickness SiO on the basis of step S100xOr SiOxAnd SiNxThe optics of structure
Film, and colored filter and indium tin oxide films are prepared on the optical film,
Step S120 prepares major-minor support column on the basis of step S110.
According to a preferred embodiment of the invention, between the step S100 and the step S110 further include:
Step S200 prepares RGB color resistance pixel layer on the basis of step S100.
According to a preferred embodiment of the invention, the preparation process of the step S100 and the step S110 are interchangeable.
In conclusion the invention has the benefit that
By improving to existing substrate and CF substrate layer, certain thickness is further added by CF substrate film structure
The optical film of degree, the optical film are able to ascend the transmitance of light, reduce loss of the light in backlight module, reduce display
Heat condition, so that the light for reflecting display becomes more, to reduce the power consumption of product, save the cost.
Detailed description of the invention
It, below will be to embodiment or the prior art in order to illustrate more clearly of embodiment or technical solution in the prior art
Attached drawing needed in description is briefly described, it should be apparent that, the accompanying drawings in the following description is only some of invention
Embodiment for those of ordinary skill in the art without creative efforts, can also be attached according to these
Figure obtains other attached drawings.
Fig. 1 is the schematic diagram of substrate structure of the embodiment of the present invention；
Fig. 2 is the film structure schematic diagram of the embodiment of the present invention；
Fig. 3 is the schematic cross-section of the board structure of second of embodiment of the invention；
Fig. 4 is the schematic cross-section of the board structure of the third embodiment of the invention；
Fig. 5 is the base plate preparation method flow chart of the embodiment of the present invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description.Obviously, described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, those skilled in the art's every other implementation obtained without creative efforts
Example, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that, term " center ", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside", etc. instruction
Orientation or positional relationship be based on the orientation or positional relationship shown in the drawings, be merely for convenience of description the present invention and simplification retouch
It states, rather than the device or element of indication or suggestion meaning must have a particular orientation, be constructed and operated in a specific orientation,
Therefore it is not considered as limiting the invention.In addition, term " first ", " second " are used for description purposes only, and cannot understand
For indication or suggestion relative importance or implicitly indicate the quantity of indicated technical characteristic.Define as a result, " first ",
The feature of " second " can explicitly or implicitly include one or more feature.In the description of the present invention, " more
It is a " it is meant that two or more, unless otherwise specifically defined.
Following disclosure provides many different embodiments or example is used to realize different structure of the invention.In order to
Simplify disclosure of the invention, hereinafter the component of specific examples and setting are described.Certainly, they are merely examples, and
And it is not intended to limit the present invention.In addition, the present invention can in different examples repeat reference numerals and/or reference letter,
This repetition is for purposes of simplicity and clarity, itself not indicate between discussed various embodiments and/or setting
Relationship.In addition, the present invention provides various specific techniques and material example, but those of ordinary skill in the art can be with
Recognize the application of other techniques and/or the use of other materials.
As shown in FIG. 1, FIG. 1 is the structural schematic diagrams of substrate of the present invention.Board structure includes underlay substrate 101, optical film
102, colored filter 103, indium tin oxide films ito film layer 104, major-minor support column 105, pixel-array unit frame 106.This reality
It applies in example, optical film 102, colored filter 103 and 104 three of ito film layer are successively set on underlay substrate 101 from bottom to top
On.Pixel-array unit frame 106 and major-minor support column 105 are all disposed within above ito film layer 104,105 pairs of branch of major-minor support column
Device above dagger plays the role of support, and the height length of major-minor support column 105 is different, can play in this way to device
The effect of second protection can arrange color blocking pixel layer on pixel-array unit frame 106.It is only color in traditional CF substrate
Colo(u)r filter 103 and ito film layer 104, when the light of LED light transmitting reaches colored filter 103 and ito film layer 104 by reflection
When, since the two light transmittance is low and to the absorption of light and blocks, so that the light transmitted is reduced.The present invention provides
Optical film 102, colored filter 103 and ito film layer 104, enable to light penetrate when light loss reduce, penetrate
Rate improves, to reach antireflective effect.
As shown in Fig. 2, Fig. 2 is film structure schematic diagram of the invention.Film structure includes optical film 202, colorized optical filtering
Piece 203, indium tin oxide films ito film layer 204, wherein optical film 202, colored filter 203, ito film layer 204 is from bottom to top
It is sequentially distributed.
The optical film 202 can be by SiOxIt constitutes or by SiNxAnd SiOxIt together constitutes with.In the present embodiment, with light
For learning 202 anti-reflection film of film, optical film 202 is respectively SiOxAnd SiNx+SiOx, contrast groups are existing common 135nm thickness
CF substrate.It is tested by the transmitance of the visible light to wavelength within the scope of 500nm~650nm, obtained experiment pair
It is more as shown in table 1 below than data:
1. common substrate of table and substrate transmitance of the present invention compare
It knows when substrate is after joined optical film 202 of the invention, when the wavelength of light is within the scope of 500nm~650nm
When, these light are visible light, when light is enhanced through the transmitance in substrate time of the invention, in this way, through aobvious
Show that the light of device screen also enhances accordingly, and then improves the performance of equipment.
When optical film is SiO2When, in the SiO for carrying out different-thickness2Film experiment, works as SiO2Film thickness
The transmitance wave band of substrate is whole mobile to long wave direction, and the transmitance of long wave is higher than shortwave；Film thicknessThe transmitance wave band of substrate is whole mobile to shortwave direction, and waveform distortions occurs, shows at this time
There is mechanical periodicity in the rate of mistake, in SiO2Film thickness range are as follows:The amplitude that substrate transmitance improves is most
Greatly.
Meanwhile when optical film is SiO2When film layer, the reflectivity of light is than commonly carrying on the back in backlight module substrate of the invention
The reflectivity of light is high by 7~9% in optical mode group substrate, and the transmitance of light improves: 1.4%~2.31%, and it is in stable state.
As shown in figure 3, Fig. 3 is the structural section schematic diagram of second of embodiment of substrate of the present invention.In Fig. 3, substrate
Structure includes underlay substrate 301, optical film 302, colored filter 303, indium tin oxide films ito film layer 304, major-minor support column
305, pixel-array unit frame 306.At this point, pixel-array unit frame 306 is arranged on underlay substrate 301 first, then again
It is sequentially prepared optical film 302, colored filter 303, ito film layer 304 from bottom to top.When light through reflecting into come after, still
It can be across optical film 302, colored filter 303, ito film layer 304, by above-mentioned experiment it is found that the transmitance of light can also obtain
It improves, anti-reflection rate is got higher.
As shown in figure 4, Fig. 4 is the structural section schematic diagram of the third embodiment of substrate of the present invention.Board structure includes
Underlay substrate 401, optical film 402, colored filter 403, indium tin oxide films ito film layer 404, major-minor support column 405, pixel
Array element frame 406.In the preparation, pixel-array unit frame 406 is arranged on underlay substrate 401 first, then again in picture
R, G, B color blocking pixel layer are prepared between pixel array unit frame 406, are then successively arranged from bottom to top on color blocking pixel layer again
Certain thickness optical film 402, colored filter 403, ito film layer 404, finally, major-minor branch is arranged on ito film layer 404 again
Dagger 405.In this way, different light after color blocking pixel layer still can membrane system through the invention, after membrane system, light
Anti-reflection property enhanced, the transmitance of light can be also improved.
As shown in figure 5, Fig. 5 is base plate preparation method stream of the present invention the present invention also provides a kind of preparation method of substrate
Cheng Tu.
Step S100 prepares pixel-array unit frame by black matrix" manufacturing process on underlay substrate,
Step S110 prepares certain thickness SiO on the basis of step S100xOr SiOxAnd SiNxThe optics of structure
Film, and colored filter and indium tin oxide films are prepared on the optical film,
Step S120 prepares major-minor support column on the basis of step S110.
In above-mentioned manufacturing process, since the anti-reflection property of light is mainly just being increased after optical film of the invention
By force, therefore between step S100 and the step S110 can also have step S200, prepared on the basis of step S100 R,
G, B color blocking pixel layer.Meanwhile the preparation sequence of the step S100 and step S110 is interchangeable, after exchange, has no effect on
The anti-reflection property of light.
The preparation method for being provided for the embodiments of the invention a kind of substrate and substrate above is described in detail, herein
In apply that a specific example illustrates the principle and implementation of the invention, the explanation of above example is only intended to sides
Assistant solves technical solution of the present invention and its core concept；Those skilled in the art should understand that: it still can be right
Technical solution documented by foregoing embodiments is modified or equivalent replacement of some of the technical features；And this
It modifies or replaces, the range of the technical solution for various embodiments of the present invention that it does not separate the essence of the corresponding technical solution.
Claims (12)
1. a kind of substrate, which is characterized in that the substrate includes:
Underlay substrate；
Pixel-array unit frame on the underlay substrate is set；
The optical film, colored filter and indium tin oxide films set gradually on the underlay substrate and from bottom to top is set.
2. substrate according to claim 1, which is characterized in that pixel-array unit frame setting in the optical film and
Between the underlay substrate.
3. substrate according to claim 1, which is characterized in that the pixel-array unit frame is arranged in the tin indium oxide
On film.
4. substrate according to claim 2, which is characterized in that between the pixel-array unit frame and the optical film also
It is provided with RGB color resistance pixel layer.
5. substrate according to claim 1, which is characterized in that the substrate further includes support column.
6. substrate according to claim 5, which is characterized in that the support column is arranged on the indium tin oxide films.
7. substrate according to claim 1, which is characterized in that the optical film is by SiNxAnd SiOxIt constitutes.
8. substrate according to claim 1, which is characterized in that the optical film is SiOx。
9. substrate according to claim 8, which is characterized in that the optical film is SiO2Anti-reflection film, the SiO2Anti-reflection film
With a thickness of
10. a kind of production method of substrate characterized by comprising
Step S100 prepares pixel-array unit frame by black matrix" manufacturing process on underlay substrate,
Step S110 prepares certain thickness SiO on the basis of step S100xOr SiOxAnd SiNxThe optical film of structure, and
Colored filter and indium tin oxide films are prepared on the optical film,
Step S120 prepares major-minor support column on the basis of step S110.
11. the production method of substrate according to claim 10, which is characterized in that the step S100 and the step
Between S110 further include:
Step S200 prepares RGB color resistance pixel layer on the basis of step S100.
12. method for preparing substrate according to claim 10, which is characterized in that the step S100 and step S110
Preparation sequence it is interchangeable.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811510414.3A CN109656047B (en) | 2018-12-11 | 2018-12-11 | Substrate and preparation method |
| PCT/CN2019/074959 WO2020118887A1 (en) | 2018-12-11 | 2019-02-13 | Substrate and preparation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811510414.3A CN109656047B (en) | 2018-12-11 | 2018-12-11 | Substrate and preparation method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109656047A true CN109656047A (en) | 2019-04-19 |
| CN109656047B CN109656047B (en) | 2020-08-04 |
Family
ID=66113786
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811510414.3A Active CN109656047B (en) | 2018-12-11 | 2018-12-11 | Substrate and preparation method |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN109656047B (en) |
| WO (1) | WO2020118887A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114822282A (en) * | 2021-01-29 | 2022-07-29 | 京东方科技集团股份有限公司 | Display panel, display device and method for preparing display panel |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050140894A1 (en) * | 2003-12-31 | 2005-06-30 | Lg.Philips Lcd Co., Ltd. | Liquid crystal display device and fabricating method thereof |
| CN102879948A (en) * | 2012-09-29 | 2013-01-16 | 京东方科技集团股份有限公司 | Color filter substrate, liquid crystal display device and manufacturing method of color filter substrate |
| CN103151468A (en) * | 2013-03-07 | 2013-06-12 | 深圳市华星光电技术有限公司 | Diode, manufacturing method thereof and display device |
| CN105223724A (en) * | 2015-10-08 | 2016-01-06 | 深圳市华星光电技术有限公司 | Quantum dot liquid crystal indicator |
-
2018
- 2018-12-11 CN CN201811510414.3A patent/CN109656047B/en active Active
-
2019
- 2019-02-13 WO PCT/CN2019/074959 patent/WO2020118887A1/en active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050140894A1 (en) * | 2003-12-31 | 2005-06-30 | Lg.Philips Lcd Co., Ltd. | Liquid crystal display device and fabricating method thereof |
| CN102879948A (en) * | 2012-09-29 | 2013-01-16 | 京东方科技集团股份有限公司 | Color filter substrate, liquid crystal display device and manufacturing method of color filter substrate |
| CN103151468A (en) * | 2013-03-07 | 2013-06-12 | 深圳市华星光电技术有限公司 | Diode, manufacturing method thereof and display device |
| CN105223724A (en) * | 2015-10-08 | 2016-01-06 | 深圳市华星光电技术有限公司 | Quantum dot liquid crystal indicator |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114822282A (en) * | 2021-01-29 | 2022-07-29 | 京东方科技集团股份有限公司 | Display panel, display device and method for preparing display panel |
| CN114822282B (en) * | 2021-01-29 | 2023-11-28 | 京东方科技集团股份有限公司 | Display panel, display device and method for manufacturing display panel |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109656047B (en) | 2020-08-04 |
| WO2020118887A1 (en) | 2020-06-18 |
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