CN109651810B - Poly (m-phenylene isophthalamide) heat-conducting composite material and preparation method thereof - Google Patents
Poly (m-phenylene isophthalamide) heat-conducting composite material and preparation method thereof Download PDFInfo
- Publication number
- CN109651810B CN109651810B CN201811583087.4A CN201811583087A CN109651810B CN 109651810 B CN109651810 B CN 109651810B CN 201811583087 A CN201811583087 A CN 201811583087A CN 109651810 B CN109651810 B CN 109651810B
- Authority
- CN
- China
- Prior art keywords
- composite material
- heat
- metaphenylene diamine
- graphene oxide
- polyisophthaloyl metaphenylene
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
- C08K3/041—Carbon nanotubes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
- C08K3/042—Graphene or derivatives, e.g. graphene oxides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Medicinal Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Materials Engineering (AREA)
- Combustion & Propulsion (AREA)
- Thermal Sciences (AREA)
- Physics & Mathematics (AREA)
- Nanotechnology (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Carbon And Carbon Compounds (AREA)
Abstract
The invention relates to a polyisophthaloyl metaphenylene diamine heat-conducting composite material and a preparation method thereof. The preparation method comprises the following steps: and (3) uniformly dispersing the carbon material in a polymer solution to obtain a composite polyisophthaloyl metaphenylene diamine solution, then coating the solution on a substrate, and completely volatilizing the solvent to obtain the composite polyisophthaloyl metaphenylene diamine. The invention has high temperature resistance, high strength and good heat-conducting property, is suitable for the fields of electronic packaging, high-temperature industrial heat-radiating equipment, circuit boards and the like, and has wide practical prospect.
Description
Technical Field
The invention belongs to the field of heat conduction materials, and particularly relates to a polyisophthaloyl metaphenylene diamine heat conduction composite material and a preparation method thereof.
Background
The polymer-based heat-conducting composite material is widely applied to the fields of aerospace, electronic and electrical industries, industrial equipment, heat dissipation products and the like. At present, more than 95% of electronic packaging substrates and heat sinks are made of polymer-based heat-conducting composite materials. With the development of electronic technology, high-power and highly-integrated electronic devices generate more heat, and if the heat cannot be dissipated in time, the performance of components is affected and even the components are failed. However, the traditional polymer-based heat-conducting composite materials such as polypropylene (PP), epoxy resin, polymethyl methacrylate (PMMA) and the like have the phenomena of poor dimensional stability and reduced physical and chemical properties at a high temperature due to low working limit temperature, and thus the requirements of high-power and high-integration electronic components on heat dissipation conditions are increasingly not met. Therefore, the development of high temperature resistant polymer-based heat-conducting composite materials is an important direction for the current development of heat-conducting materials.
Due to the structural particularity of the polymer material, the thermal conductivity is generally very low and is between 0.1 and 0.4W/mK. A common and practical approach is to add thermally conductive fillers to the polymer matrix to prepare polymer-based thermally conductive composites. In patent CN106009445B, the boron nitride nanodisk is added into a polyvinyl alcohol solution to prepare the polyvinyl alcohol heat-conducting composite material, but the heat resistance of the material is low. The patent CN104592950B shows that the heat-conducting property of the composite material prepared by preparing the precursor of the graphene and polymer composite material, carbonizing and graphitizing the precursor is obviously improved, but the mechanical property of the material is seriously reduced.
Therefore, a new heat conductive composite material is still needed to be developed to solve the problem of heat dissipation under high power and highly integrated electrical high temperature conditions.
Disclosure of Invention
The invention aims to solve the technical problem of providing a polyisophthaloyl metaphenylene diamine heat-conducting composite material and a preparation method thereof, wherein the material has the advantages of high temperature resistance, high strength, high heat conductivity, easiness in molding and processing and the like, can dissipate a large amount of heat generated by high-integration and high-power electronic components, keeps good dimensional stability, does not obviously reduce the physical and chemical properties, and has very wide and practical prospect.
The invention provides a polyisophthaloyl metaphenylene diamine heat-conducting composite material, which takes polyisophthaloyl metaphenylene diamine as a matrix and takes reduced graphene oxide frGO with functionalized surface and multi-walled carbon nano-tubes (MWCNTs) as heat-conducting fillers.
The polyisophthaloyl metaphenylene diamine is copolymerized from isophthaloyl and metaphenylene diamine.
The surface functionalized reduced graphene oxide frGO is obtained by grafting an oligomer on the surface of graphene oxide and reducing the graphene oxide.
The oligomer is obtained by the polycondensation of m-aminobenzoic acid with the purity of more than 99 percent.
The reduction is carried out by using ethylenediamine, hydrazine hydrate or vitamin C, preferably hydrazine hydrate.
In the composite material, the mass fraction of polyisophthaloyl metaphenylene diamine is 95-99.5 wt%, and the total mass fraction of frGO and MWCNTs is 0.5-5 wt%.
The mass ratio of the frGO to the MWCNTs is 2: 1-10: 1.
The thickness of the polyisophthaloyl metaphenylene diamine heat-conducting composite material is 20-100 mu m.
The invention also provides a preparation method of the polyisophthaloyl metaphenylene diamine heat-conducting composite material, which comprises the following steps:
adding reduced graphene oxide (frGO) with functionalized surface and multi-walled carbon nano-tubes (MWCNTs) into a polyisophthaloyl metaphenylene diamine solution, and stirring at the temperature of 80-120 ℃ for 12-24 hours to obtain a polyisophthaloyl metaphenylene diamine composite solution; and (3) salivating and coating the obtained composite solution on a substrate, and completely drying to obtain the polyisophthaloyl metaphenylene diamine heat-conducting composite material.
The frGO and the MWCNTs are subjected to ultrasonic dispersion in a solvent for 3-6 hours in advance, and 5 hours are preferred.
The solvent adopted by the composite solution is one or more selected from N, N-dimethylacetamide, N-dimethylformamide and N-methylpyrrolidone, and N, N-dimethylacetamide is preferred.
The solid content of the polyisophthaloyl metaphenylene diamine is 12-16 wt%, and preferably 14 wt%.
The drying temperature is 80-120 ℃, and the drying time is 12-24 hours.
According to the invention, graphene oxide is prepared, surface functionalized reduced graphene oxide is obtained by a certain method, and then a multi-walled carbon nanotube is fixed on the surface functionalized reduced graphene oxide by utilizing a pi-pi conjugation effect, so that the composite heat-conducting particle is obtained. And then adding the composite material into a polyisophthaloyl metaphenylene diamine matrix, and coating and drying to obtain the polyisophthaloyl metaphenylene diamine-based heat-conducting composite material.
Advantageous effects
The polyisophthaloyl metaphenylene diamine heat-conducting composite material is prepared by adding surface-functionalized reduced graphene oxide and a multi-walled carbon nanotube into a polyisophthaloyl metaphenylene diamine polymer matrix. Due to the extremely high thermal conductivity coefficient (5000W/m.K), graphene can be used as a heat-conducting particle to obviously improve the heat-conducting property of the polyisophthaloyl metaphenylene diamine matrix, while the carbon nano tube has excellent heat-conducting property, and the remarkable length-diameter ratio of the carbon nano tube can play a role of a heat-conducting bridge between graphene nano sheet layers, so that a three-dimensional heat-conducting network is formed in a composite material system, and the heat-conducting property of the polyisophthaloyl metaphenylene diamine composite material is improved by utilizing the synergistic effect of reduced oxidized graphene and a multi-wall carbon tube.
Compared with the polymer-based composite heat conduction material used in the past, the special chemical structure of the polyisophthaloyl metaphenylene diamine endows the polyisophthaloyl metaphenylene diamine with outstanding high temperature resistance, excellent mechanical property and outstanding high-temperature dimensional stability; the invention has the advantages of simple preparation process, excellent physical and chemical properties, large-scale production and the like, is suitable for high-power and high-integration electronic and electrical heat dissipation systems, is suitable for the fields of electronic packaging, high-temperature industrial heat dissipation equipment, circuit boards and the like, and has very wide and practical prospect.
Drawings
Fig. 1 is a TEM image of prepared graphene, wherein a is graphene oxide; b is surface functionalized reduced graphene oxide.
Figure 2 is a TEM image of a composite particle of surface functionalized reduced graphene oxide with multi-walled carbon tubes.
Fig. 3 is an infrared spectrum of oligomeric polymers, graphene oxide, surface functionalized reduced graphene oxide.
FIG. 4 is a SEM image of the cross section of the polyisophthaloyl metaphenylene diamine heat-conducting composite material.
FIG. 5 is a schematic diagram of the thermal conductivity of the polyisophthaloyl metaphenylene diamine thermal conductive composite material of the present invention.
Detailed Description
The invention will be further illustrated with reference to the following specific examples. It should be understood that these examples are for illustrative purposes only and are not intended to limit the scope of the present invention. Further, it should be understood that various changes or modifications of the present invention may be made by those skilled in the art after reading the teaching of the present invention, and such equivalents may fall within the scope of the present invention as defined in the appended claims.
Example 1
1. Dispersing 0.4g of graphene oxide in 40ml of N, N-dimethylacetamide, and carrying out ultrasonic treatment for 3 hours;
2. adding 0.685g of m-aminobenzoic acid into 40ml of N, N-dimethylacetamide, and reacting for 24h at 130 ℃; then adding the dispersed graphene oxide solution into the solution, and continuing to react for 20 hours; and finally, adding 1ml of hydrazine hydrate, carrying out suction filtration and drying after reacting for 4 hours to obtain the functionalized reduced graphene oxide.
3. The prepared functionalized reduced graphene oxide and the multi-walled carbon nano-tubes are ultrasonically dispersed in N, N-dimethylacetamide for 3 hours according to the mass ratio of 2:1, and then added into polyisophthaloyl metaphenylene diamine slurry, the solid content of the prepared composite solution is 12%, and the mass fraction of carbon materials (namely the functionalized reduced graphene oxide and the multi-walled carbon nano-tubes) is 0.5%.
4. And coating the composite solution on a substrate, and drying at 80 ℃ for 24h to obtain the polyisophthaloyl metaphenylene diamine heat-conducting composite material. A sample size of 2mm by 2mm was made for testing in-plane thermal conductivity and a sample size of 5mm by 5mm was used for testing face-to-face thermal conductivity. The in-plane thermal conductivity of the obtained composite material was: 3.17W/m.K.
Example 2
1. Dispersing 0.4g of graphene oxide in 40ml of N, N-dimethylacetamide, and carrying out ultrasonic treatment for 3 hours;
2. adding 0.685g of m-aminobenzoic acid into 40ml of N, N-dimethylacetamide, and reacting for 24h at 130 ℃; then adding the dispersed graphene oxide solution into the solution, and continuing to react for 20 hours; and finally, adding 1ml of hydrazine hydrate, carrying out suction filtration and drying after reacting for 4 hours to obtain the functionalized reduced graphene oxide.
3. The prepared functionalized reduced graphene oxide and the multi-walled carbon nano-tubes are ultrasonically dispersed in N, N-dimethylacetamide for 6 hours according to the mass ratio of 4:1, and then added into polyisophthaloyl metaphenylene diamine slurry, the solid content of the prepared composite solution is 14%, and the mass fraction of carbon materials (namely the functionalized reduced graphene oxide and the multi-walled carbon nano-tubes) is 1%.
4. And coating the composite solution on a substrate, and drying at 100 ℃ for 16h to obtain the polyisophthaloyl metaphenylene diamine heat-conducting composite material. A sample size of 2mm by 2mm was made for testing in-plane thermal conductivity and a sample size of 5mm by 5mm was used for testing face-to-face thermal conductivity. The in-plane thermal conductivity of the obtained composite material was: 5.43W/m.K.
Example 3
1. Dispersing 0.4g of graphene oxide in 40ml of N, N-dimethylacetamide, and carrying out ultrasonic treatment for 3 hours;
2. adding 0.685g of m-aminobenzoic acid into 40ml of N, N-dimethylacetamide, and reacting for 24h at 130 ℃; then adding the dispersed graphene oxide solution into the solution, and continuing to react for 20 hours; and finally, adding 1ml of hydrazine hydrate, carrying out suction filtration and drying after reacting for 4 hours to obtain the functionalized reduced graphene oxide.
3. The prepared functionalized reduced graphene oxide and the multi-walled carbon nano-tubes are ultrasonically dispersed in N, N-dimethylacetamide for 4 hours according to the mass ratio of 6:1, and then added into polyisophthaloyl metaphenylene diamine slurry, the solid content of the prepared composite solution is 16%, and the mass fraction of carbon materials (namely the functionalized reduced graphene oxide and the multi-walled carbon nano-tubes) is 2%.
4. And coating the composite solution on a substrate, and drying at 90 ℃ for 20h to obtain the polyisophthaloyl metaphenylene diamine heat-conducting composite material. A sample size of 2mm by 2mm was made for testing in-plane thermal conductivity and a sample size of 5mm by 5mm was used for testing face-to-face thermal conductivity. The in-plane thermal conductivity of the obtained composite material was: 6.17W/m.K.
Example 4
1. Dispersing 0.4g of graphene oxide in 40ml of N, N-dimethylacetamide, and carrying out ultrasonic treatment for 3 hours;
2. adding 0.685g of m-aminobenzoic acid into 40ml of N, N-dimethylacetamide, and reacting for 24h at 130 ℃; then adding the dispersed graphene oxide solution into the solution, and continuing to react for 20 hours; and finally, adding 1ml of hydrazine hydrate, carrying out suction filtration and drying after reacting for 4 hours to obtain the functionalized reduced graphene oxide.
3. The prepared functionalized reduced graphene oxide and the multi-walled carbon nano-tubes are ultrasonically dispersed in N, N-dimethylacetamide for 5 hours according to the mass ratio of 8:1, and then added into polyisophthaloyl metaphenylene diamine slurry, the solid content of the prepared composite solution is 13%, and the mass fraction of carbon materials (namely the functionalized reduced graphene oxide and the multi-walled carbon nano-tubes) is 4%.
4. And coating the composite solution on a substrate, and drying at 110 ℃ for 15h to obtain the polyisophthaloyl metaphenylene diamine heat-conducting composite material. A sample size of 2mm by 2mm was made for testing in-plane thermal conductivity and a sample size of 5mm by 5mm was used for testing face-to-face thermal conductivity. The in-plane thermal conductivity of the obtained composite material was: 8.18W/m.K.
Example 5
1. Dispersing 0.4g of graphene oxide in 40ml of N, N-dimethylacetamide, and carrying out ultrasonic treatment for 3 hours;
2. adding 0.685g of m-aminobenzoic acid into 40ml of N, N-dimethylacetamide, and reacting for 24h at 130 ℃; then adding the dispersed graphene oxide solution into the solution, and continuing to react for 20 hours; and finally, adding 1ml of hydrazine hydrate, carrying out suction filtration and drying after reacting for 4 hours to obtain the functionalized reduced graphene oxide.
3. The prepared functionalized reduced graphene oxide and the multi-walled carbon nano-tubes are ultrasonically dispersed in N, N-dimethylacetamide for 3 hours according to the mass ratio of 10:1, and then added into polyisophthaloyl metaphenylene diamine slurry, the solid content of the prepared composite solution is 14%, and the mass fraction of carbon materials (namely the functionalized reduced graphene oxide and the multi-walled carbon nano-tubes) is 5%.
4. And coating the composite solution on a substrate, and drying at 100 ℃ for 18h to obtain the polyisophthaloyl metaphenylene diamine heat-conducting composite material. A sample size of 2mm by 2mm was made for testing in-plane thermal conductivity and a sample size of 5mm by 5mm was used for testing face-to-face thermal conductivity. The in-plane thermal conductivity of the obtained composite material was: 8.76W/m.K.
As can be seen from fig. 1, after the graphene oxide (fig. 1a) is subjected to surface graft reduction, the surface becomes rougher (fig. 1b), which is caused by the reaction of the oligomer with the graphene oxide surface functional group.
As shown in fig. 2, due to the pi-pi conjugation effect, the multi-walled carbon tube can be firmly fixed on the surface of the functionalized reduced graphene oxide, and no obvious agglomeration phenomenon occurs.
As can be seen from fig. 3, N-H, C ═ O, C — N peaks appear on the infrared spectrum of the functionalized reduced graphene oxide (frGO), indicating that the oligomer was successfully grafted to the surface of the reduced graphene oxide.
As can be seen from FIG. 4, the FGC-0 section is smooth and flat, while the FGC-0.5 and FGC-2 sections become rough after addition of frGO and MWCNTs; in FGC-0.5 (white arrow MWCNTs, black arrow frGO), MWCNTs are uniformly distributed; in FGC-2 (white line is a heat-conducting network), frGO and MWCNTs form a three-dimensional heat-conducting network, and the heat-conducting property of the polyisophthaloyl metaphenylene diamine composite material is improved.
FIG. 5 is a schematic diagram of the heat conduction mechanism of a pure poly (m-phenylene isophthalamide) material (left) and a poly (m-phenylene isophthalamide) heat-conducting composite material (right). For pure poly (m-phenylene isophthalamide), as the heat conductivity coefficient is low, heat cannot be conducted inside in time, and then heat accumulation is caused; for the poly (m-phenylene isophthalamide) heat-conducting composite material, frGO and MWCNTs can form a three-dimensional heat-conducting network in a polymer matrix, and heat can be transferred and dissipated in time in the matrix.
Claims (7)
1. A polyisophthaloyl metaphenylene diamine heat conduction composite material is characterized in that: the composite material takes polyisophthaloyl metaphenylene diamine as a matrix, and surface functionalized reduced graphene oxide (frGO) and multi-walled carbon nano-tubes (MWCNTs) as heat-conducting fillers; the surface functionalized reduced graphene oxide frGO is obtained by grafting an oligomer on the surface of graphene oxide and reducing the graphene oxide; the oligomer is obtained by the polycondensation of m-aminobenzoic acid with the purity of more than 99 percent.
2. A thermally conductive composite material as claimed in claim 1, wherein: the reduction is carried out by using ethylenediamine, hydrazine hydrate or vitamin C.
3. A thermally conductive composite material as claimed in claim 1, wherein: in the composite material, the mass fraction of polyisophthaloyl metaphenylene diamine is 95-99.5 wt%, and the total mass fraction of frGO and MWCNTs is 0.5-5 wt%.
4. A thermally conductive composite material as claimed in claim 1 or 3, wherein: the mass ratio of the frGO to the MWCNTs is 2: 1-10: 1.
5. The preparation method of the polyisophthaloyl metaphenylene diamine heat-conducting composite material as defined in claim 1, which comprises the following steps:
adding reduced graphene oxide (frGO) with functionalized surface and multi-walled carbon nano-tubes (MWCNTs) into a polyisophthaloyl metaphenylene diamine solution, and stirring at the temperature of 80-120 ℃ for 12-24 hours to obtain a polyisophthaloyl metaphenylene diamine composite solution; and coating the obtained composite solution on a substrate in a casting manner, and completely drying to obtain the polyisophthaloyl metaphenylene diamine heat-conducting composite material.
6. The method of claim 5, wherein the step of preparing the heat conductive composite material comprises: the solvent adopted by the composite solution is one or more selected from N, N-dimethylacetamide, N-dimethylformamide and N-methylpyrrolidone; the solid content of the polyisophthaloyl metaphenylene diamine is 12-16 wt%.
7. The method of claim 5, wherein the step of preparing the heat conductive composite material comprises: the drying temperature is 80-120 ℃, and the drying time is 12-24 hours.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811583087.4A CN109651810B (en) | 2018-12-24 | 2018-12-24 | Poly (m-phenylene isophthalamide) heat-conducting composite material and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811583087.4A CN109651810B (en) | 2018-12-24 | 2018-12-24 | Poly (m-phenylene isophthalamide) heat-conducting composite material and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109651810A CN109651810A (en) | 2019-04-19 |
| CN109651810B true CN109651810B (en) | 2021-05-11 |
Family
ID=66115016
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811583087.4A Active CN109651810B (en) | 2018-12-24 | 2018-12-24 | Poly (m-phenylene isophthalamide) heat-conducting composite material and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109651810B (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108993178A (en) * | 2018-07-27 | 2018-12-14 | 天津工业大学 | A kind of preparation method of high throughput high temperature resistant composite nanometer filtering film |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101338033B1 (en) * | 2012-02-10 | 2013-12-06 | 금오공과대학교 산학협력단 | Aramid composites reinforced with mixed carbon nanomaterials of graphene and carbon nanotube and process for producing the same |
| KR20130100467A (en) * | 2012-03-02 | 2013-09-11 | 이성균 | CNT Graphene Meta Aramid Composition |
-
2018
- 2018-12-24 CN CN201811583087.4A patent/CN109651810B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108993178A (en) * | 2018-07-27 | 2018-12-14 | 天津工业大学 | A kind of preparation method of high throughput high temperature resistant composite nanometer filtering film |
Non-Patent Citations (1)
| Title |
|---|
| "功能化改性还原氧化石墨烯-碳纳米管/热塑性聚氨酯复合材料膜的制备及性能";欧忠星等;《复合材料学报》;20160331;第33卷(第3期);第486-494页 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109651810A (en) | 2019-04-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Ma et al. | Through-plane assembly of carbon fibers into 3D skeleton achieving enhanced thermal conductivity of a thermal interface material | |
| Wu et al. | Achieving a collapsible, strong, and highly thermally conductive film based on oriented functionalized boron nitride nanosheets and cellulose nanofiber | |
| Zhu et al. | Highly thermally conductive papers with percolative layered boron nitride nanosheets | |
| Choi et al. | Synthesis of silica-coated graphite by enolization of polyvinylpyrrolidone and its thermal and electrical conductivity in polymer composites | |
| Meng et al. | Recent progress on fabrication and performance of polymer composites with highly thermal conductivity | |
| WO2014196496A1 (en) | Resin-impregnated boron nitride sintered body and use for same | |
| CN107892784B (en) | Polymer-based nanocomposite and preparation method thereof | |
| Zhang et al. | Graphene nanosheet/silicone composite with enhanced thermal conductivity and its application in heat dissipation of high-power light-emitting diodes | |
| JP2012255055A (en) | Composite material comprising inorganic-organic composite composition, and method of producing the same | |
| Fan et al. | Constructing fibrillated skeleton with highly aligned boron nitride nanosheets confined in alumina fiber via electrospinning and sintering for thermally conductive composite | |
| Zhao et al. | A combination of aramid nanofiber and silver nanoparticle decorated boron nitride for the preparation of a composite film with superior thermally conductive performance | |
| Wang et al. | Highly thermally conductive and electrical insulating epoxy-based composites containing oriented ternary carbon/graphene/MgO hybrid network | |
| Niu et al. | Preparation of quasi-isotropic thermal conductive composites by interconnecting spherical alumina and 2D boron nitride flakes | |
| Liu et al. | 3D expanded graphite frameworks for dual-functional polymer composites with exceptional thermal conductive and electromagnetic interference shielding capabilities | |
| Zhang et al. | Low effective content of reduced graphene oxide/silver nanowire hybrids in epoxy composites with enhanced conductive properties | |
| CN109651810B (en) | Poly (m-phenylene isophthalamide) heat-conducting composite material and preparation method thereof | |
| Cao et al. | Large-scale fabrication of graphene/polyamide-6 composite as a high thermal conductivity engineering composite for thermal radiators | |
| Wang et al. | Facile fabrication of multi-walled carbon nanotubes and its enhancement on thermally conductive adhesive applied in heat dissipation devices | |
| Zuo et al. | Angular-Shaped Boron Nitride Nanosheets with a High Aspect Ratio to Improve the Out-of-Plane Thermal Conductivity of Polyimide Composite Films | |
| KR20130081448A (en) | Composite material and method of producing the same | |
| CN105778134B (en) | A kind of graphene composite polymer film material and preparation method thereof | |
| Wang et al. | Facile fabrication of three-dimensional thermal conductive composites with synergistic effect of multidimensional fillers | |
| CN104804205A (en) | Preparation method of polymer/carbon tube composite film material with anisotropy | |
| KR101454454B1 (en) | Ingredient of conducting pastes based on nano carbon materials having multiple hydrogen bonding motifs for printing and their fabrication method | |
| CN116160737A (en) | Anisotropic heat conduction multi-layer polymer composite material and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |