CN109649067A - The preparation method of accurate and complicated amorphous alloy components or craftwork - Google Patents
The preparation method of accurate and complicated amorphous alloy components or craftwork Download PDFInfo
- Publication number
- CN109649067A CN109649067A CN201910059393.6A CN201910059393A CN109649067A CN 109649067 A CN109649067 A CN 109649067A CN 201910059393 A CN201910059393 A CN 201910059393A CN 109649067 A CN109649067 A CN 109649067A
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- amorphous alloy
- alloy plate
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- hot wafering
- silicon mould
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- 229910000808 amorphous metal alloy Inorganic materials 0.000 title claims abstract description 108
- 238000002360 preparation method Methods 0.000 title claims abstract description 11
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 50
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 50
- 239000010703 silicon Substances 0.000 claims abstract description 50
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 18
- 238000000227 grinding Methods 0.000 claims abstract description 11
- 238000007599 discharging Methods 0.000 claims abstract description 5
- 230000000717 retained effect Effects 0.000 claims abstract description 3
- 238000000034 method Methods 0.000 claims description 19
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 8
- 238000002425 crystallisation Methods 0.000 claims description 7
- 238000005498 polishing Methods 0.000 claims description 7
- 230000008025 crystallization Effects 0.000 claims description 5
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 4
- 239000003795 chemical substances by application Substances 0.000 claims description 4
- 238000005520 cutting process Methods 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 4
- 238000001259 photo etching Methods 0.000 claims description 4
- 230000009466 transformation Effects 0.000 claims description 4
- 235000019441 ethanol Nutrition 0.000 claims description 2
- 230000003746 surface roughness Effects 0.000 claims description 2
- 238000000465 moulding Methods 0.000 abstract description 5
- 238000007493 shaping process Methods 0.000 abstract description 3
- 238000010438 heat treatment Methods 0.000 abstract description 2
- 241000533950 Leucojum Species 0.000 description 12
- 238000010586 diagram Methods 0.000 description 9
- 239000000956 alloy Substances 0.000 description 5
- 239000007791 liquid phase Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000005300 metallic glass Substances 0.000 description 3
- 238000004781 supercooling Methods 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000009757 thermoplastic moulding Methods 0.000 description 2
- 241000238631 Hexapoda Species 0.000 description 1
- 241000221931 Hypomyces rosellus Species 0.000 description 1
- 229910000806 Latten Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B44—DECORATIVE ARTS
- B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
- B44C5/00—Processes for producing special ornamental bodies
- B44C5/04—Ornamental plaques, e.g. decorative panels, decorative veneers
- B44C5/0446—Ornamental plaques, e.g. decorative panels, decorative veneers bearing graphical information
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B44—DECORATIVE ARTS
- B44C—PRODUCING DECORATIVE EFFECTS; MOSAICS; TARSIA WORK; PAPERHANGING
- B44C1/00—Processes, not specifically provided for elsewhere, for producing decorative surface effects
- B44C1/24—Pressing or stamping ornamental designs on surfaces
Abstract
The invention discloses the preparation methods of a kind of accurate and complicated amorphous alloy components or craftwork, including silicon molding to make;Upper and lower hot wafering heating;Bulk amorphous alloy is placed on and is pressed into preforming amorphous alloy plate between upper and lower hot wafering;Preforming amorphous alloy plate is placed on the upper surface of silicon mould and silicon mould is completely covered, upper hot wafering, which slowly moves down, touches preforming amorphous alloy plate, pressure is slowly applied to upper hot wafering, the pressure maintaining regular hour fast discharging pressure again after pressure reaches certain numerical value is taken out in the combination of amorphous alloy plate and silicon mould and immediately investment water and is cooled down rapidly;Combination is taken out from water, impregnates the regular hour in certain density KOH solution, until fully erased silicon mould, is retained and is printed figuratum amorphous alloy plate;Amorphous alloy plate above and below is carried out to corase grinding respectively and essence is thrown.Operation of the present invention is simple and convenient, and shaping efficiency is high, and precision is high, and dimensional homogeneity is good, and forming force is small, and controllability is good.
Description
Technical field
The invention belongs to amorphous alloy plasticity field shaping techniques, and in particular to a kind of accurate and complicated amorphous alloy zero
The preparation method of part or craftwork can be used for Zr- system, Pd- system, Pt- system, La- system etc. with good thermoplastic molding's ability
The molding of amorphous alloy.
Background technique
Show that block amorphous alloy and congruent crystalline state close about the result of study of block amorphous alloy material in recent years
Golden material compare have more superior mechanical performance, excellent physics and chemical property, such as high intensity, hardness, elastic limit,
Wearability, corrosion resistance, the characteristic of excellent soft magnetism and superconductivity etc., all in fields such as electronics, machinery, chemical industry
Extensive use is arrived.Although there is hardly possible and process, is difficult molding scarce in block amorphous alloy with good characteristics described above
Point, to greatly limit its application range.Therefore, the molding of block amorphous alloy becomes one of amorphous alloy application extension
Technological difficulties.
Nearly all glassy metal all shows glass transition behaviro in heating, this is when material enters supercooling liquid phase region
Afterwards, the viscosity of material reduces rapidly, and shows the viscous flow property of similar liquids, in this temperature range, glassy metal tool
There is extraordinary superplasticity, its machine-shaping that is highly advantageous to meets production labyrinth, it can be achieved that duplication to fine feature
The requirement of product.Glassy metal does not have the limitation of crystallite dimension simultaneously, can be in micron using the viscous flow of supercooling liquid phase region
Complex-shaped component even is processed under nanoscale, while can guarantee fine surfaces, it is great in precision/micro element field
Application prospect.
Summary of the invention
The purpose of the present invention is there is the shortcomings that difficult processing, difficult molding for block amorphous alloy, by being closed using amorphous
Gold carries out thermoplastic molding to block amorphous alloy, improves to accurate and complex profile in the viscous flow of supercooling liquid phase region
The forming ability of amorphous alloy product.
In order to solve the above technical problem, the present invention provides a kind of accurate and complicated amorphous alloy components or craftworks
Preparation method includes the following steps:
(1) pattern for being cut out required components or craftwork with certain depth on silicon wafer using photoetching technique, is made
Silicon mould;
(2) upper and lower hot wafering is heated to specific temperature, keeps constant temperature;
(3) bulk amorphous alloy of the certain volume of well cutting is placed between upper and lower hot wafering and within a certain period of time by it
It is pressed into preforming amorphous alloy plate, rear take out in amorphous alloy plate and immediately investment water cools down rapidly;
(4) step (2) are repeated;
(5) silicon mould is placed between upper and lower hot wafering, and preforming amorphous alloy plate is placed on the upper surface of silicon mould and complete
All standing silicon mould, upper hot wafering, which slowly moves down, touches preforming amorphous alloy plate, stop at this time upper hot wafering move down and
Setting at a temperature of keep the temperature the regular hour, after pressure is slowly applied to upper hot wafering, when pressure reaches within the regular hour
Pressure maintaining regular hour fast discharging pressure again after certain numerical value takes out the combination of amorphous alloy plate and silicon mould and immediately
It is cooled down rapidly in investment water;
(6) combination that amorphous alloy plate and silicon mould are taken out from water, when impregnating certain in certain density KOH solution
Between, until fully erased silicon mould, the amorphous alloy plate for being printed on components or craftwork pattern is retained, by it from KOH solution
It takes out and is rinsed well with clear water;
(7) the amorphous alloy plate above and below for being printed on components or craftwork pattern is carried out to corase grinding respectively and essence is thrown, that is, is obtained both
Accurate and complicated amorphous alloy components or craftwork.
Further, required components or craftwork pattern scribe depth less than silicon on silicon wafer in the step (1)
The thickness of piece.
Further, specific temperature is glass transformation temperature T in amorphous alloy in the step (2)gWith crystallization temperature Tx
Between.
Further, compacting amorphous alloy plate slowly applies pressure and reaches 5-35 kN, then pressure maintaining one in the step (3)
The fixed time.
Further, the time of compacting amorphous alloy plate adds in the step (5) in amorphous alloy in the step (3)
The summation of the time imprinted on plate is no more than crystallization time of the amorphous alloy in the step (2) under specific temperature.
Further, it in the step (5), needs that first silicon mould is put into acetone soln and cleans a period of time through ultrasonic machine,
Preforming amorphous alloy plate is put in thereon again.
Further, the face that amorphous alloy plate preforming in the step (5) is contacted with silicon mould need to remove the oxygen on surface
Compound and spot, after cleaned up and dried up with ethyl alcohol.
Further, it is 5-10 kN that upper hot wafering, which slowly applies pressure numerical value achieved, in the step (5).
Further, in the step (6) combination of amorphous alloy plate and silicon mould 100oThe concentration of C is 20%KOH
1-3 h is impregnated in solution.
Further, in the step (7), clout is first cut off, then close to the amorphous for being printed on components or craftwork pattern
Golden plate above and below carries out corase grinding with the waterproof abrasive paper of different meshes and polishing agent on automatic grinding and polishing device respectively and essence is thrown.
Further, the amorphous alloy obtained in the step (7) not only accurate but also complicated components or handicraft surface
No marking and surface roughness are 1 μm.
The preparation method of accurate and complicated amorphous alloy components or craftwork of the invention have it is simple to operate, at
The advantages that type is high-efficient, and precision is high, and dimensional homogeneity is good, and forming force is small, and controllability is good.
Detailed description of the invention
Fig. 1 is the process flow chart of one embodiment of the invention.
Fig. 2 is the silicon mould schematic diagram that required components pattern is had in one embodiment of the invention.
Fig. 3 is the amorphous alloy gear parts schematic diagram that one embodiment obtains through the invention.
Fig. 4 is the amorphous alloy flange wheel parts schematic diagram that one embodiment obtains through the invention.
Fig. 5 is the amorphous alloy senser element schematic diagram that one embodiment obtains through the invention.
Fig. 6 is the amorphous alloy snowflake blade technolgy product schematic diagram that one embodiment obtains through the invention.
Fig. 7 is the amorphous alloy insect wing craftwork schematic diagram that one embodiment obtains through the invention.
Fig. 8 is the amorphous alloy cobweb craftwork schematic diagram that one embodiment obtains through the invention.
Fig. 9 is the amorphous alloy institutional framework craftwork schematic diagram that one embodiment obtains through the invention.
Specific embodiment
Presently in connection with drawings and examples, the present invention is described in further detail.
Embodiment 1
The embodiment of the present invention is used to illustrate the preparation method of a kind of accurate and complicated amorphous alloy components or craftwork, use
Amorphous alloy is Zr base noncrystal alloy, consisting of Zr44Ti11Cu10Ni10Be25(at.%), as shown in Figure 1, process flow such as
Under:
(1) the gear components pattern of 550 μm of depth is cut out on the silicon wafer of 1 mm thickness using photoetching technique, band
There is the silicon mould of gear components, as shown in Fig. 2, silicon mould made of carving immediately need to be put into acetone soln and clean 1 in ultrasonic machine
H, rear take out are dried;
(2) upper and lower hot wafering is heated to Zr44Ti11Cu10Ni10Be25The glass transformation temperature T of amorphous alloyg=350oC and knot
Brilliant temperature Tx=471o425 between CoC temperature keeps constant temperature;
It (3) is 150 mm by the volume of well cutting3Blocky Zr44Ti11Cu10Ni10Be25Amorphous alloy is placed on hot wafering up and down
Between, upper hot wafering, which slowly moves down, touches Zr44Ti11Cu10Ni10Be25Stop mobile upper hot wafering when amorphous alloy block,
425 oAfter placing 20 s under C constant temperature, then slowly applies pressure in 40 s and reach 5 kN and suppress 1 mm thickness
Zr44Ti11Cu10Ni10Be25Amorphous alloy thin plate, takes out Zr afterwards44Ti11Cu10Ni10Be25Amorphous alloy thin plate is put into water immediately
It is cooling rapidly;
(4) upper and lower hot wafering is heated to 425 againoC temperature keeps constant temperature;
(5) it is placed between upper and lower hot wafering with the silicon mould of gear components pattern and preformed
Zr44Ti11Cu10Ni10Be25Amorphous alloy thin plate, preformed Zr44Ti11Cu10Ni10Be25Amorphous alloy thin plate is placed on band
Have the top of the silicon mould of gear part diagram case and cover bulk silicon mould, upper hot wafering slowly move down touch it is preformed
Zr44Ti11Cu10Ni10Be25Amorphous alloy thin plate stops upper hot wafering at this time and moves down and 425oKept the temperature at a temperature of C 30 s when
Between, after pressure is slowly applied to upper hot wafering, the fast discharging pressure again after 60 s of pressure maintaining after pressure reaches 7 kN in 30 s
Power takes out Zr44Ti11Cu10Ni10Be25The combination that amorphous alloy thin plate has been pressed into the silicon mould with gear components pattern is vertical
It puts into water and cools down rapidly;
(6) Zr is taken out from water44Ti11Cu10Ni10Be25Amorphous alloy thin plate has been pressed into the combination of silicon mould, is 20% in concentration
KOH solution in and 100oClean silicon mould is removed after impregnating 1 h at a temperature of C, it is remaining to be printed on gear components pattern
Zr44Ti11Cu10Ni10Be25Amorphous alloy thin plate is printed on the Zr of gear components pattern44Ti11Cu10Ni10Be25Amorphous alloy thin
Plate taking-up from KOH solution is rinsed well with clear water;
(7) Zr of gear components pattern will be printed on44Ti11Cu10Ni10Be25Amorphous alloy thin plate cuts off clout, then to being printed on tooth
Take turns the Zr of components pattern44Ti11Cu10Ni10Be25Waterproof abrasive paper and the polishing of different meshes are used respectively in amorphous alloy thin plate top and bottom
Agent carries out corase grinding on automatic grinding and polishing device and essence is thrown, can be obtained surface do not have scratch it is not only accurate but also complicated and with a thickness of
500 μm of Zr44Ti11Cu10Ni10Be25Amorphous alloy gear components, as shown in Figure 3.
Zr is suppressed in the present embodiment in step (3)44Ti11Cu10Ni10Be25The time of amorphous alloy thin plate adds step (5)
In in Zr44Ti11Cu10Ni10Be25The summation that the time of gear components pattern is imprinted on amorphous alloy thin plate must not exceed
Zr44Ti11Cu10Ni10Be25Amorphous alloy is 425 in step (2)oCrystallization time at a temperature of C;
Embodiment 2
The embodiment of the present invention is used to illustrate the preparation method of a kind of accurate and complicated amorphous alloy components or craftwork, use
Amorphous alloy is Pd base noncrystal alloy, consisting of Pd43Cu27Ni10P20(at.%).
A kind of precision of the present embodiment and the preparation process of complicated amorphous alloy components or craftwork are as follows:
(1) the snowflake blade technolgy product pattern of 450 μm of depth is cut out on the silicon wafer of 1 mm thickness using photoetching technique,
Silicon mould with snowflake blade technolgy product pattern, silicon mould made of quarter need to be put into acetone soln immediately cleans 1 h in ultrasonic machine,
It takes out and dries afterwards;
(2) upper and lower hot wafering is heated to Pd43Cu27Ni10P20The glass transformation temperature T of amorphous alloyg=305oC and crystallization temperature
Spend Tx=384o345 between CoC temperature keeps constant temperature;
It (3) is 350 mm by the volume of well cutting3Blocky Pd43Cu27Ni10P20Amorphous alloy is placed between hot wafering up and down,
Upper hot wafering, which slowly moves down, touches Pd43Cu27Ni10P20Stop mobile upper hot wafering when amorphous alloy block, 345oC constant temperature
After 20 s of lower placement, then slowly applies pressure in 40 s and reach the Pd that 7 kN suppress 1 mm thickness43Cu27Ni10P20Amorphous
Latten takes out Pd afterwards43Cu27Ni10P20Amorphous alloy thin plate is put into water immediately to be cooled down rapidly;
(4) upper and lower hot wafering is heated to 345 againoC temperature keeps constant temperature;
(5) it is placed between upper and lower hot wafering with the silicon mould of snowflake blade technolgy product pattern and preformed
Pd43Cu27Ni10P20Amorphous alloy thin plate, preformed Pd43Cu27Ni10P20Amorphous alloy thin plate is placed on snowflake piece
The top of the silicon mould of craftwork and cover bulk silicon mould, upper hot wafering slowly move down touch it is preformed
Pd43Cu27Ni10P20Amorphous alloy thin plate stops upper hot wafering at this time and moves down and 345oThe time of 30 s is kept the temperature at a temperature of C,
Pressure is slowly applied to upper hot wafering afterwards, the fast discharging pressure again after 60 s of pressure maintaining after pressure reaches 7 kN in 30 s,
Take out Pd43Cu27Ni10P20The combination that amorphous alloy thin plate has been pressed into the silicon mould with snowflake blade technolgy product pattern is put into immediately
It is cooled down rapidly in water;
(6) Pd is taken out from water43Cu27Ni10P20Amorphous alloy thin plate has been pressed into the combination of silicon mould, the KOH for being 20% in concentration
In solution and 100oClean silicon mould is removed after impregnating 1.5 h at a temperature of C, it is remaining to be printed on snowflake blade technolgy product pattern
Pd43Cu27Ni10P20Amorphous alloy thin plate is printed on the Pd of snowflake blade technolgy product pattern43Cu27Ni10P20Amorphous alloy thin plate is from KOH
Taking-up is rinsed well with clear water in solution;
(7) Pd of snowflake blade technolgy product pattern will be printed on43Cu27Ni10P20Amorphous alloy thin plate cuts off clout, then to being printed on snowflake
The Pd of blade technolgy product pattern43Cu27Ni10P20The waterproof abrasive paper of different meshes and polishing agent is used to exist respectively in amorphous alloy thin plate top and bottom
Corase grinding is carried out on automatic grinding and polishing device and essence is thrown, and can be obtained surface does not have scratch not only accurate but also complicated and with a thickness of 400 μm
Pd43Cu27Ni10P20Amorphous alloy snowflake blade technolgy product (as shown in Figure 6).
Pd is suppressed in the present embodiment in step (3)43Cu27Ni10P20The time of amorphous alloy thin plate plus in step (5)
Pd43Cu27Ni10P20The summation that the time of snowflake blade technolgy product pattern is imprinted on amorphous alloy thin plate must not exceed
Pd43Cu27Ni10P20Amorphous alloy is 345 in step (2)oCrystallization time at a temperature of C.
Similarly, the components of Fig. 4, Fig. 5, Fig. 7, Fig. 8 and Fig. 9 etc. or craftwork can be according in embodiments 1 or embodiment 2
Preparation step be made.
Above-mentioned desirable embodiment according to the present invention is enlightenment, and through the above description, relevant staff is complete
Various changes and amendments can be carried out without departing from the scope of the technological thought of the present invention'.This invention it is technical
Range is not limited to the contents of the specification, it is necessary to which the technical scope thereof is determined according to the scope of the claim.
Claims (11)
1. the preparation method of accurate and complicated amorphous alloy components or craftwork, which comprises the steps of:
(1) pattern for being cut out required components or craftwork with certain depth on silicon wafer using photoetching technique, is made
Silicon mould;
(2) upper and lower hot wafering is heated to specific temperature, keeps constant temperature;
(3) bulk amorphous alloy of the certain volume of well cutting is placed between upper and lower hot wafering and within a certain period of time by it
It is pressed into preforming amorphous alloy plate, rear take out in amorphous alloy plate and immediately investment water cools down rapidly;
(4) step (2) are repeated;
(5) silicon mould is placed between upper and lower hot wafering, and preforming amorphous alloy plate is placed on the upper surface of silicon mould and complete
All standing silicon mould, upper hot wafering, which slowly moves down, touches preforming amorphous alloy plate, stop at this time upper hot wafering move down and
Setting at a temperature of keep the temperature the regular hour, after pressure is slowly applied to upper hot wafering, when pressure reaches within the regular hour
Pressure maintaining regular hour fast discharging pressure again after certain numerical value takes out the combination of amorphous alloy plate and silicon mould and immediately
It is cooled down rapidly in investment water;
(6) combination that amorphous alloy plate and silicon mould are taken out from water, when impregnating certain in certain density KOH solution
Between, until fully erased silicon mould, the amorphous alloy plate for being printed on components or craftwork pattern is retained, by it from KOH solution
It takes out and is rinsed well with clear water;
(7) the amorphous alloy plate above and below for being printed on components or craftwork pattern is carried out to corase grinding respectively and essence is thrown, that is, is obtained both
Accurate and complicated amorphous alloy components or craftwork.
2. the method according to claim 1, wherein required components or craftwork pattern in the step (1)
The thickness scribed depth and be less than silicon wafer on silicon wafer.
3. the method according to claim 1, wherein specific temperature is in amorphous alloy in the step (2)
Glass transformation temperature TgWith crystallization temperature TxBetween.
4. the method according to claim 1, wherein compacting amorphous alloy plate slowly applies in the step (3)
Pressure reaches 5-35 kN, then pressure maintaining regular hour.
5. the method according to claim 1, wherein the time of compacting amorphous alloy plate adds in the step (3)
It is special in the step (2) that the summation of the time imprinted on amorphous alloy plate in the upper step (5) is no more than amorphous alloy
Determine the crystallization time at temperature.
6. the method according to claim 1, wherein in the step (5) needing that silicon mould is first put into acetone soln
It is middle to clean a period of time through ultrasonic machine, then preforming amorphous alloy plate is put in thereon.
7. the method according to claim 1, wherein amorphous alloy plate and silicon preforming in the step (5)
The face of mould contact need to remove the oxide and spot on surface, after cleaned up and dried up with ethyl alcohol.
8. the method according to claim 1, wherein upper hot wafering slowly applies pressure institute in the step (5)
The numerical value reached is 5-10 kN.
9. the method according to claim 1, wherein in the step (6) amorphous alloy plate and silicon mould combination
Body is 100o1-3 h is impregnated in the KOH solution that the concentration of C is 20%.
10. the method according to claim 1, wherein in the step (7), clout is first cut off, then to being printed on zero
The waterproof abrasive paper of different meshes and polishing agent is used to throw in automatic grinding respectively in the amorphous alloy plate above and below of component or craftwork pattern
Corase grinding is carried out on ray machine and essence is thrown.
11. the method according to claim 1, wherein the amorphous alloy obtained in the step (7) it is not only accurate but also
Complicated components or handicraft surface no marking and surface roughness are 1 μm.
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Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101947853A (en) * | 2010-09-14 | 2011-01-19 | 华中科技大学 | Preparation method of amorphous alloy mold and application thereof in micro-flow groove forming |
US20130139964A1 (en) * | 2011-11-16 | 2013-06-06 | California Institute Of Technology | Amorphous metals and composites as mirrors and mirror assemblies |
US20140007984A1 (en) * | 2012-07-05 | 2014-01-09 | Christopher D. Prest | Cast core insert out of etchable material |
CN104308452A (en) * | 2014-08-21 | 2015-01-28 | 清华大学 | Amorphous alloy micro-nano structure stamping forming mould and preparation and application methods thereof |
CN104607611A (en) * | 2015-02-11 | 2015-05-13 | 东莞台一盈拓科技股份有限公司 | Mobile phone shell and amorphous alloy reinforcement block thereof and manufacturing method of amorphous alloy reinforcement block |
CN106276782A (en) * | 2016-09-07 | 2017-01-04 | 中国工程物理研究院材料研究所 | The preparation method of metal micro pipe based on non-gold synthetic |
CN108237211A (en) * | 2017-12-29 | 2018-07-03 | 广东工业大学 | A kind of manufacturing method of non-crystaline amorphous metal micropin |
CN109136920A (en) * | 2018-07-26 | 2019-01-04 | 中国工程物理研究院材料研究所 | A kind of beryllium mirror specular layer and preparation method thereof based on amorphous alloy |
-
2019
- 2019-01-22 CN CN201910059393.6A patent/CN109649067A/en active Pending
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101947853A (en) * | 2010-09-14 | 2011-01-19 | 华中科技大学 | Preparation method of amorphous alloy mold and application thereof in micro-flow groove forming |
US20130139964A1 (en) * | 2011-11-16 | 2013-06-06 | California Institute Of Technology | Amorphous metals and composites as mirrors and mirror assemblies |
US20140007984A1 (en) * | 2012-07-05 | 2014-01-09 | Christopher D. Prest | Cast core insert out of etchable material |
CN104308452A (en) * | 2014-08-21 | 2015-01-28 | 清华大学 | Amorphous alloy micro-nano structure stamping forming mould and preparation and application methods thereof |
CN104607611A (en) * | 2015-02-11 | 2015-05-13 | 东莞台一盈拓科技股份有限公司 | Mobile phone shell and amorphous alloy reinforcement block thereof and manufacturing method of amorphous alloy reinforcement block |
CN106276782A (en) * | 2016-09-07 | 2017-01-04 | 中国工程物理研究院材料研究所 | The preparation method of metal micro pipe based on non-gold synthetic |
CN108237211A (en) * | 2017-12-29 | 2018-07-03 | 广东工业大学 | A kind of manufacturing method of non-crystaline amorphous metal micropin |
CN109136920A (en) * | 2018-07-26 | 2019-01-04 | 中国工程物理研究院材料研究所 | A kind of beryllium mirror specular layer and preparation method thereof based on amorphous alloy |
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Application publication date: 20190419 |