CN109648012A - Circuit board element pin shearing method and shearing equipment - Google Patents
Circuit board element pin shearing method and shearing equipment Download PDFInfo
- Publication number
- CN109648012A CN109648012A CN201811633681.XA CN201811633681A CN109648012A CN 109648012 A CN109648012 A CN 109648012A CN 201811633681 A CN201811633681 A CN 201811633681A CN 109648012 A CN109648012 A CN 109648012A
- Authority
- CN
- China
- Prior art keywords
- pin
- lantern ring
- circuit board
- diameter
- information
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21F—WORKING OR PROCESSING OF METAL WIRE
- B21F11/00—Cutting wire
Abstract
The invention discloses a kind of circuit board element pin shearing method and shearing equipments, wherein, the cutting method includes: the pin parameter information for obtaining pin to be sheared in the pad parameters information of pin pad and circuit board on circuit board, and pin parameter information includes height of pin demand information and pin cross-sectional diameter information；Target height limiting device is chosen from the height limiting device of plurality of specifications according to pad parameters information, height of pin demand information and pin cross-sectional diameter information；By set ring set wait shear on pin, the positioning working face I of lantern ring is bonded with pin pad, and the positioning working face II of lantern ring is bonded with the jaw plane of cutting nippers；Cutting nippers shears pin to be sheared.This case improves shear rate and shearing precision by the matching of height of pin demand information and the thickness of lantern ring, effectively control shear height；In addition, pin will not be cut short by the diameter of lantern ring and the matching of pad parameters information to scrap electronic component, circuit board Denso qualification rate after shearing is improved.
Description
Technical field
The present invention relates to production tooling device technical field more particularly to a kind of circuit board element pin shearing method and
Shearing equipment.
Background technique
Electronic device assembly when, the pin of mounting related components be typically all it is long, there is minority to meet the requirements and do not have to
It shears (probability is lower), is usually unsatisfactory for pin require, long, overlength and is typically necessary shearing, the pin after shearing is long
Degree (cutting foot height) have length requirement, cannot it is too short, can not be too long, need to meet the technical requirements of Denso, lead at this time
Cross naked-eye observation be difficult determine shearing jaw the distance of pad is fallen to wiring board, if not being controlled the distance, easily make by
Shearing pin valuable parts, valuable connector etc. cause expendable (pin is cut short) without allow using, thus in the presence of
During pin shearing, the foot height of cutting after shearing not can be effectively controlled, and in shear history, easily causes electronic component and draw
Foot cut short without allow using the technical issues of.
Summary of the invention
It is existing to solve the purpose of the present invention is to provide a kind of circuit board element pin shearing method and shearing equipment
Pin shearing during, the foot height of cutting after shearing not can be effectively controlled, and in shear history, easily causes and cut pin mistake
Short electronic component do not allow using the technical issues of.
To solve the above-mentioned problems, the present invention provides a kind of circuit board element pin shearing methods comprising:
The pin parameter information of pin to be sheared in the pad parameters information of pin pad and circuit board on circuit board is obtained,
Pin parameter information includes height of pin demand information and pin cross-sectional diameter information；
According to pad parameters information, height of pin demand information and pin cross-sectional diameter information from the limit for height of plurality of specifications
Target height limiting device is chosen in device, target height limiting device includes lantern ring, the diameter and pad parameters information matches of lantern ring, the thickness of lantern ring
It is matched with height of pin demand information, lantern ring includes pin perforation, the diameter and pin cross-sectional diameter information of pin perforation
Match；
Ring set will be covered on shearing pin, the positioning working face I of lantern ring bottom surface is bonded with pin pad, covers determining for top surface of ring
Position working face II is bonded with the jaw plane of cutting nippers；
Pin to be sheared is sheared using cutting nippers.
As a further improvement of the present invention, target height limiting device further includes handle, and handle is in shear history, remaining fixed
The stability of position working face I and positioning working face II.
As a further improvement of the present invention, the shape of handle is in " Z " font.
As a further improvement of the present invention, the other end of handle is additionally provided with a lantern ring, the diameter of lantern ring, thickness and draws
The diameter for wearing hole is different from the diameter that the diameter of another lantern ring on handle, thickness and pin are perforated.
As a further improvement of the present invention, height of pin range in height of pin demand information are as follows: 1.5mm ± 0.8mm,
And height of pin >=0.8mm.
To solve the above-mentioned problems, the present invention also provides a kind of circuit board element pin shearing equipment comprising:
Height limiting device comprising lantern ring, the pad parameters information matches of pin pad, lantern ring on the diameter and circuit board of lantern ring
Thickness matched with the height of pin demand information of pin to be sheared on circuit board；Lantern ring includes pin perforation, pin perforation
The pin cross-sectional diameter information matches of diameter and pin to be sheared, the positioning working face I of lantern ring bottom surface are bonded with pin pad；
Cutting nippers comprising jaw plane, the positioning working face II for covering top surface of ring are bonded with jaw plane.
As a further improvement of the present invention, target height limiting device further includes handle, and handle is in shear history, remaining fixed
The stability of position working face I and positioning working face II.
As a further improvement of the present invention, the shape of handle is in " Z " font.
As a further improvement of the present invention, the other end of handle is additionally provided with a lantern ring, the diameter of lantern ring, thickness and draws
The diameter for wearing hole is different from the diameter that the diameter of another lantern ring on handle, thickness and pin are perforated.
As a further improvement of the present invention, height of pin range in height of pin demand information are as follows: 1.5mm ± 0.8mm,
And height of pin >=0.8mm.
Compared with prior art, the present invention is straight by pad parameters information, height of pin demand information and pin cross section
Diameter information chooses target height limiting device from the height limiting device of plurality of specifications, passes through of height of pin demand information and the thickness of lantern ring
Match, it is ensured that the shear height after shearing can be effectively controlled, to meet the technical requirements of Denso, to improve shearing speed
Rate and shearing precision；In addition, passing through the matching of pad parameters information and the diameter of lantern ring, it can be ensured that in shear history,
Not will cause cut the too short electronic component of pin do not allow using the problem of, so that circuit board is qualified after improving shearing
Rate, further, the matching of the diameter and pin cross-sectional diameter information perforated by pin can solve pin shearing process
In, quickly guide height limiting device slide into make lantern ring bottom surface positioning working face I and pad face paste close, by positioning working face I with
The conjunction of pad face paste solves the problems, such as that height limiting device shakes.
Detailed description of the invention
Fig. 1 is the flow diagram of circuit board element pin shearing method one embodiment of the present invention；
Fig. 2 is the schematic perspective view of circuit board element pin shearing equipment one embodiment of the present invention；
Fig. 3 is the schematic cross-sectional view of circuit board element pin shearing equipment one embodiment of the present invention；
Fig. 4 is the stereochemical structure signal of height limiting device one embodiment in circuit board element pin shearing equipment of the present invention
Figure.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, is clearly and completely retouched to the technical solution in embodiment
It states, similar reference numerals represent similar component in attached drawing.Obviously, will be described below embodiment is only the present invention one
Divide embodiment, instead of all the embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art are not making
Every other embodiment obtained, shall fall within the protection scope of the present invention under the premise of creative work.
Fig. 1 illustrates a kind of one embodiment of circuit board element pin shearing method of the present invention.In the present embodiment,
As shown in Figure 1, the circuit board element pin shearing method, comprising:
Step S1 obtains the pin ginseng of pin to be sheared in the pad parameters information of pin pad and circuit board on circuit board
Number information, pin parameter information includes height of pin demand information and pin cross-sectional diameter information.
In the present embodiment, height of pin range in height of pin demand information are as follows: 1.5mm ± 0.8mm, and height of pin
≥0.8mm。
Further, in the present embodiment, pin cross-sectional diameter range in pin cross-sectional diameter information are as follows: 0.2-
1.2mm。
It should be noted that the present embodiment is not limited to the size of above-described embodiment description, some fixations can also be applied
Be greater than above-mentioned special size height, to play the pin of connection function.
Step S2, according to pad parameters information, height of pin demand information and pin cross-sectional diameter information from a variety of rule
Target height limiting device is chosen in the height limiting device of lattice, target height limiting device includes lantern ring, the diameter and pad parameters information matches of lantern ring, set
The thickness of ring is matched with height of pin demand information, and lantern ring includes pin perforation, and the diameter of pin perforation and pin cross section are straight
Diameter information matches.
In the present embodiment, the diameter of lantern ring and pad parameters information matches, cause in shear history, height limiting device and circuit
The stability of contact fitting between plate is high.
Further, the thickness of lantern ring is matched with height of pin demand information, it is ensured that the shear height after shearing can obtain
To effective control, to meet the technical requirements of Denso, to improve shear rate and shearing precision.
It should be noted that during actual shearing, the thickness of shear height (height of pin after shearing)=lantern ring+
The jaw chamfer height of cutting nippers.
Further, the diameter and pin cross-sectional diameter information matches of pin perforation, avoids height limiting device in pin shearing
In the process, quickly guiding height limiting device slides into the positioning working face I for making lantern ring bottom surface and pad face paste is closed, by positioning working face
I is closed with pad face paste to be solved to shake in shear history, to improve shearing precision indirectly.
Further, on the basis of the above embodiments, in other embodiments, target height limiting device further includes handle, handle
For in shear history, maintaining positioning working face I and positioning the stability of working face II.
Specifically, the shape of handle is in " Z " font.
Further, the other end of handle is additionally provided with a lantern ring, diameter, thickness and the diameter of pin perforation of lantern ring with
The diameter difference that diameter, the thickness of another lantern ring on handle are perforated with pin.
The lantern ring of two Different Rules is arranged by a handle for the present embodiment, to meet the shearing of two different pins
Demand, to improve user experience.
Step S3, by set ring set on shearing pin, the positioning working face I of lantern ring bottom surface is bonded with pin pad, lantern ring
The positioning working face II of top surface is bonded with the jaw plane of cutting nippers.
Step S4 shears pin to be sheared using cutting nippers.
The present embodiment passes through pad parameters information, height of pin demand information and pin cross-sectional diameter information from a variety of rule
Target height limiting device is chosen in the height limiting device of lattice, passes through the matching of height of pin demand information and the thickness of lantern ring, it is ensured that after shearing
Shear height can be effectively controlled, to meet the technical requirements of Denso, to improve shear rate and shearing is accurate
Degree；In addition, passing through the matching of pad parameters information and the diameter of lantern ring, it can be ensured that in shear history, not will cause and cut
The too short electronic component of pin do not allow using the problem of, thus improve shearing after circuit board qualification rate, further, lead to
The diameter of pin perforation and the matching of pin cross-sectional diameter information are crossed, during can solve pin shearing, quickly guiding is limited
High device slides into the positioning working face I for making lantern ring bottom surface and pad face paste is closed, and is closed and is solved by positioning working face I and pad face paste
The problem of height limiting device shakes.
It should be understood that the size of the serial number of each step is not meant that the order of the execution order in above-described embodiment, each process
Execution sequence should be determined by its function and internal logic, the implementation process without coping with the embodiment of the present application constitutes any limit
It is fixed.
Fig. 2-Fig. 4 illustrates a kind of one embodiment of circuit board element pin shearing equipment of the present invention.In this implementation
In example, as shown in Fig. 2, the circuit board element pin shearing equipment application is in circuit board 3, specifically, 3 component of circuit board
Pin shearing equipment includes height limiting device 1 and cutting nippers 2.Referring to Fig. 3, there are pin pad 30 and pin to be sheared 31 on the circuit board 3.
Specifically, referring to fig. 4, height limiting device 1 includes lantern ring, the pad of pin pad 30 on the diameter D and circuit board 3 of lantern ring
Parameter information matching.In the present embodiment, the diameter of lantern ring and pad parameters information matches, cause in shear history, height limiting device 1
The stability of contact fitting between circuit board 3 is high.
Further, the thickness △ of lantern ring is matched with the height of pin demand information of pin 31 to be sheared on circuit board 3.?
In the present embodiment, height of pin range in height of pin demand information are as follows: 1.5mm ± 0.8mm, and height of pin >=0.8mm.This
Outside, the thickness △ of lantern ring is matched with height of pin demand information, it is ensured that and the shear height after shearing can be effectively controlled, with
Meet the technical requirements of Denso, to improve shear rate and shearing precision.It should be noted that in actual shearing process
In, thickness △+cutting nippers jaw chamfer height of shear height (height of pin after shearing)=lantern ring.
Further, lantern ring includes pin perforation 10, and the diameter d and the pin of pin 31 to be sheared of pin perforation 10 are transversal
The matching of face diameter information, in the present embodiment, pin cross-sectional diameter range in pin cross-sectional diameter information are as follows: 0.2-
1.2mm.The diameter and pin cross-sectional diameter information matches of pin perforation 10, avoid height limiting device from shaking in shear history
It is dynamic, to improve shearing precision indirectly.
Further, the positioning working face I11 of lantern ring bottom surface is bonded with pin pad 30；Cutting nippers 2 includes jaw plane, set
The positioning working face II 12 of top surface of ring is bonded with jaw plane.
This implementation passes through pad parameters information, height of pin demand information and pin cross-sectional diameter information from plurality of specifications
Height limiting device in choose target height limiting device, pass through the matching of height of pin demand information and the thickness of lantern ring, it is ensured that after shearing
Shear height can be effectively controlled, to meet the technical requirements of Denso, to improve shear rate and shearing precision；
In addition, passing through the matching of pad parameters information and the diameter of lantern ring, it can be ensured that in shear history, not will cause and cut pin
Too short electronic component do not allow using the problem of, thus improve shearing after circuit board qualification rate, further, by drawing
The diameter in hole and the matching of pin cross-sectional diameter information are worn, during can solve pin shearing, quickly guides height limiting device
It slides into the positioning working face I for making lantern ring bottom surface and pad face paste is closed, closed by positioning working face I and pad face paste and solve limit for height
The problem of device shakes.
On the basis of the present embodiment, in other embodiments, referring to fig. 4, target height limiting device 1 further includes handle 13, handle
13 in shear history, maintaining positioning working face I and positioning the stability of working face II.
Specifically, the shape of handle 13 is in " Z " font.
Further, the other end of handle 13 is additionally provided with a lantern ring, the diameter that diameter, thickness and the pin of lantern ring are perforated
It is different from the diameter of the diameter of another lantern ring on handle 13, thickness and pin perforation.
The lantern ring of two Different Rules is arranged by a handle for the present embodiment, to meet the shearing of two different pins
Demand, to improve user experience.
In the above-described embodiments, it all emphasizes particularly on different fields to the description of each embodiment, is not described in detail or remembers in some embodiment
The part of load may refer to the associated description of other embodiments.
The specific embodiment of invention is described in detail above, but it is only used as example, the present invention is not intended to limit
With specific embodiments described above.For a person skilled in the art, any equivalent modifications that the invention is carried out
Or substitute also all among scope of the invention, therefore, the made equalization in the case where not departing from the spirit and principles in the present invention range
Transformation and modification, improvement etc., all should be contained within the scope of the invention.
Claims (8)
1. a kind of circuit board element pin shearing method, characterized in that it comprises:
The pin parameter information of pin to be sheared in the pad parameters information of pin pad and the circuit board on circuit board is obtained,
The pin parameter information includes height of pin demand information and pin cross-sectional diameter information；
According to the pad parameters information, the height of pin demand information and the pin cross-sectional diameter information from a variety of rule
Target height limiting device is chosen in the height limiting device of lattice, the target height limiting device includes lantern ring, and the diameter of the lantern ring and the pad are joined
Number information matches, the thickness of the lantern ring are matched with the height of pin demand information, and the lantern ring includes pin perforation, described
The diameter of pin perforation and the pin cross-sectional diameter information matches；
By the set ring set on the shearing pin, the positioning working face I of the lantern ring bottom surface is bonded with the pin pad,
The positioning working face II of the set top surface of ring is bonded with the jaw plane of cutting nippers, the positioning surface I and the set of the lantern ring bottom surface
The positioning working face II of top surface of ring is substantially parallel；
The pin to be sheared is sheared using the cutting nippers.
2. circuit board element pin shearing method according to claim 1, which is characterized in that the target height limiting device is also
Including handle, the handle is in shear history, maintaining the stabilization of the positioning working face I and the positioning working face II
Property.
3. circuit board element pin shearing method according to claim 2, which is characterized in that the shape of the handle is in
" Z " font.
4. circuit board element pin shearing method according to claim 2, which is characterized in that the other end of the handle
It is additionally provided with a lantern ring, diameter, thickness and the diameter of pin perforation of the lantern ring and another lantern ring on the handle
The diameter that diameter, thickness and pin are perforated is different.
5. a kind of circuit board element pin shearing equipment, characterized in that it comprises:
Height limiting device comprising lantern ring, the pad parameters information matches of pin pad, described on the diameter and circuit board of the lantern ring
The thickness of lantern ring is matched with the height of pin demand information of pin to be sheared on the circuit board；The lantern ring includes that pin is worn
Hole, the diameter of the pin perforation and the pin cross-sectional diameter information matches of the pin to be sheared, the lantern ring bottom surface
Positioning working face I is bonded with the pin pad；
Cutting nippers comprising jaw plane, the positioning working face II of the set top surface of ring are bonded with the jaw plane.
6. circuit board element pin shearing equipment according to claim 5, which is characterized in that the target height limiting device is also
Including handle, the handle is in shear history, maintaining the stabilization of the positioning working face I and the positioning working face II
Property.
7. circuit board element pin shearing equipment according to claim 6, which is characterized in that the shape of the handle is in
" Z " font.
8. circuit board element pin shearing equipment according to claim 6, which is characterized in that the other end of the handle
It is additionally provided with a lantern ring, diameter, thickness and the diameter of pin perforation of the lantern ring and another lantern ring on the handle
The diameter that diameter, thickness and pin are perforated is different.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811633681.XA CN109648012B (en) | 2018-12-29 | 2018-12-29 | Method and equipment for shearing pins of circuit board components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811633681.XA CN109648012B (en) | 2018-12-29 | 2018-12-29 | Method and equipment for shearing pins of circuit board components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109648012A true CN109648012A (en) | 2019-04-19 |
| CN109648012B CN109648012B (en) | 2020-02-14 |
Family
ID=66116967
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811633681.XA Active CN109648012B (en) | 2018-12-29 | 2018-12-29 | Method and equipment for shearing pins of circuit board components |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109648012B (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4516310A (en) * | 1983-02-25 | 1985-05-14 | Usm Corporation | Cut-clinch mechanism for variably spaced component leads |
| CN1691882A (en) * | 2004-04-30 | 2005-11-02 | 意讯永焱股份有限公司 | Clipper and processing method for leg cutting of printed circuit board employing same clipper |
| CN202684187U (en) * | 2012-07-18 | 2013-01-23 | 福州安远汽车电器有限公司 | Wire cutting nipper for diode with long and short pins |
| CN202861276U (en) * | 2012-09-20 | 2013-04-10 | 安徽亿民照明电器有限公司 | Shearing mechanism for pins of circuit board components |
| CN103381458A (en) * | 2012-05-02 | 2013-11-06 | 珠海格力电器股份有限公司 | Shearing device for pins of electronic element |
| CN204685914U (en) * | 2015-06-28 | 2015-10-07 | 南通瑞达电子材料有限公司 | A kind of circuit board connecting pins cutter of convenient operation |
-
2018
- 2018-12-29 CN CN201811633681.XA patent/CN109648012B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4516310A (en) * | 1983-02-25 | 1985-05-14 | Usm Corporation | Cut-clinch mechanism for variably spaced component leads |
| CN1691882A (en) * | 2004-04-30 | 2005-11-02 | 意讯永焱股份有限公司 | Clipper and processing method for leg cutting of printed circuit board employing same clipper |
| CN103381458A (en) * | 2012-05-02 | 2013-11-06 | 珠海格力电器股份有限公司 | Shearing device for pins of electronic element |
| CN202684187U (en) * | 2012-07-18 | 2013-01-23 | 福州安远汽车电器有限公司 | Wire cutting nipper for diode with long and short pins |
| CN202861276U (en) * | 2012-09-20 | 2013-04-10 | 安徽亿民照明电器有限公司 | Shearing mechanism for pins of circuit board components |
| CN204685914U (en) * | 2015-06-28 | 2015-10-07 | 南通瑞达电子材料有限公司 | A kind of circuit board connecting pins cutter of convenient operation |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109648012B (en) | 2020-02-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| DE60221037T2 (en) | METHOD AND SYSTEM FOR RELEASING A SLOT MODULE | |
| CN107650484A (en) | The preparation method of the attaching method of film layer, display panel and display device | |
| DE102012205893A1 (en) | Balanced cooling system and method for high density stacked cages | |
| EP2939506B1 (en) | Semi-finished product for the production of a printed circuit board and method for producing the same | |
| JP2015043357A (en) | Module component manufacturing method | |
| DE102015117929A1 (en) | Hybrid antenna, antenna arrangement and method for producing an antenna arrangement | |
| EP2927702A1 (en) | Semiconductor device with removable wiring board portion for evaluation and corresponding method of manufacturing | |
| EP3188220A3 (en) | Bare die integration with printed components | |
| CN109648012A (en) | Circuit board element pin shearing method and shearing equipment | |
| JP6093073B1 (en) | Metal foil substrate for electronic circuits | |
| EP2943048A1 (en) | Board integrated interconnect | |
| EP3229492A1 (en) | Microphone | |
| US20130248237A1 (en) | Printed circuit board | |
| DE102017101267B4 (en) | Optoelectronic component and method for producing an optoelectronic component | |
| US9711894B2 (en) | Electrical connector and programming method | |
| JP2016082074A (en) | Electrical device and method of manufacturing the same | |
| JP3550253B2 (en) | Electronics | |
| CN107295759B (en) | Welding shielding mold manufacturing method, welding shielding mold and welding structure | |
| EP2549496A3 (en) | Inductive component with connection contacts visible during filling | |
| JP3420147B2 (en) | Processing method of printed wiring board and printed wiring board | |
| JP2016112864A (en) | Metal mask data output device and output method | |
| US5601122A (en) | Dual mode single device dual action lead forming tool | |
| DE102018008783A1 (en) | Clip for semiconductor package | |
| DE112017001517T5 (en) | sensor | |
| KR20120053586A (en) | Apparatus for generating bill of material for electronic part auto-inserting system and method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |