CN109640012A - A kind of multispectral TDI imaging method and device - Google Patents

A kind of multispectral TDI imaging method and device Download PDF

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Publication number
CN109640012A
CN109640012A CN201811480714.1A CN201811480714A CN109640012A CN 109640012 A CN109640012 A CN 109640012A CN 201811480714 A CN201811480714 A CN 201811480714A CN 109640012 A CN109640012 A CN 109640012A
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image
face
multispectral
image sensor
array cmos
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薛旭成
韩诚山
胡长虹
黄�良
李洪法
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Changchun Institute of Optics Fine Mechanics and Physics of CAS
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Changchun Institute of Optics Fine Mechanics and Physics of CAS
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    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70SSIS architectures; Circuits associated therewith
    • H04N25/76Addressed sensors, e.g. MOS or CMOS sensors
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/10Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from different wavelengths
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70SSIS architectures; Circuits associated therewith
    • H04N25/71Charge-coupled device [CCD] sensors; Charge-transfer registers specially adapted for CCD sensors
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N5/00Details of television systems
    • H04N5/222Studio circuitry; Studio devices; Studio equipment
    • H04N5/262Studio circuits, e.g. for mixing, switching-over, change of character of image, other special effects ; Cameras specially adapted for the electronic generation of special effects
    • H04N5/265Mixing
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N9/00Details of colour television systems
    • H04N9/44Colour synchronisation
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N9/00Details of colour television systems
    • H04N9/64Circuits for processing colour signals

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  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Color Television Image Signal Generators (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)

Abstract

The present invention relates to photodetection imaging fields, more particularly to a kind of multispectral TDI imaging method and device, this method and device are under numeric field TDI mode, it is panchromatic (P) and indigo plant (B1) in the array CMOS image sensor framework of face, green (B2), red (B3), imaging parameter is separately provided in near-infrared (B4) spectral coverage, using face array CMOS image sensor push away sweep operating mode under realize multispectral number of segment word TDI push-scanning image, panchromatic wave-band image in the array CMOS image sensor of face and multiband image are subjected to fusion treatment, synthesis obtains color image, panchromatic remote sensing image and multiband visual fusion are handled, obtain the high-resolution of existing panchromatic image, there is the image of the colour information of multiband image again, imaging precision is high.

Description

A kind of multispectral TDI imaging method and device
Technical field
The present invention relates to photodetection imaging fields, in particular to a kind of multispectral TDI imaging method and device.
Background technique
TDI (Time Delayed and Integration, time delay integration) technology passes through multiple to same target Exposure is cumulative, image motion velocity with push away sweep speed and strictly match when, sensitivity and the signal-to-noise ratio of imaging system can be greatly improved, because This is widely used in space remote sensing field.Requirement especially as people to remote sensing images resolution ratio is higher and higher, TDI imaging Technology is widely used in high resolution space remote sensing field.
High resolution space remote sensing field generallys use TDI CCD as detector at present.TDI CCD is to realize TDI Ideal component, time delay integration process betide charge-domain.In strict vertical transfer timing and horizontal transfer timing Under driving, charge is shifted between vertical transfer register and horizontal shifting register, integrates, is exported.Once TDI CCD device system After causing type, photoelectron can only shift under the control of vertical transfer timing along specific single direction, and turn of charge Move direction must with push away sweep direction it is consistent when just can make cumulative image that aliasing ambiguity will not occur.Therefore by TDI CCD The constraint of cage structure, TDI CCD can only forward scan blur-free imagings.However in many applications, single passes by scan and obtain Not enough information, because the orbital period it is long if if reimaging of passing by for the second time real-time it is too poor, particularly with slightly vertical The emergency case to die is even more not let slip an opportunity.If being therefore able to achieve the flyback imaging to area-of-interest, can greatly mention Height obtains the efficiency of remote sensing information, and improves the utilization rate of remote sensing camera.In addition, being limited by camera opto-mechanical part, sense The installation direction of device could can only be installed reversely sometimes, if sensor has bilateral scanning imaging function at this time, can loosen To the layout requirements of mechanical-optical setup part.
With being constantly progressive for CMOS manufacturing process, cmos sensor by its is at low cost, integrated level is high, small power consumption, at Many advantages are waited as control is simple, receives significant attention and has captured most of industry and commercial market in recent years, supervised in space The space applications such as visual organ, star sensor field also shows powerful potentiality.Because of the reason of cmos sensor internal structure, electricity Lotus can not store for a long time inside it, therefore the TDI cmos device of similar TDI CCD is not easy to obtain.
Summary of the invention
The embodiment of the invention provides a kind of multispectral TDI imaging method and devices, at least to realize that precision is higher more Spectrum TDI imaging.
According to an embodiment of the invention, providing a kind of multispectral TDI imaging method, comprising the following steps:
It is panchromatic (P) and blue (B1), green (B2), red in the array CMOS image sensor framework of face under numeric field TDI mode (B3), imaging parameter is separately provided in near-infrared (B4) spectral coverage;
Using face array CMOS image sensor push away sweep operating mode under realize multispectral number of segment word TDI push-scanning image;
Panchromatic wave-band image in the array CMOS image sensor of face and multiband image are subjected to fusion treatment, synthesis obtains coloured silk Chromatic graph picture.
Further, method further include:
The color image that synthesis obtains is exported in a manner of multispectral segment sync.
Further, the color image that synthesis obtains is exported in such a way that about multispectral section both direction is synchronous.
Further, multispectral section of upper direction output is face array CMOS image sensor odd rows of picture data, under multispectral section Direction output is face array CMOS image sensor even number line image data.
Further, imaging parameters include integral sum of series gain.
Further, panchromatic (P), blue (B1), green (B2), red (B3), near-infrared (B4) spectral coverage series line number are respectively 2* N1 row, 2*N2 row, 2*N3 row, 2*N4 row, 2*N5 row;Wherein N1, N2, N3, N4, N5 are the integer more than or equal to 1.
Further, using face array CMOS image sensor push away sweep operating mode under realize that multispectral number of segment word TDI is pushed away and sweep Imaging include: by face array CMOS image sensor on panchromatic (P) and blue (B1), green (B2), red (B3), near-infrared (B4) spectral coverage Windowing.
Further, panchromatic wave-band image in the array CMOS image sensor of face and multiband image are subjected to fusion treatment, It includes: to assign R, G, B tri- wave bands respectively R, G, channel B in the array CMOS image sensor framework of face that synthesis, which obtains color image, Spectral information.
According to another embodiment of the present invention, a kind of multispectral TDI imaging device is provided, comprising:
Parameter set unit, for being panchromatic in the array CMOS image sensor framework of face under numeric field TDI mode (P) and imaging parameter is separately provided in blue (B1), green (B2), red (B3), near-infrared (B4) spectral coverage;
Push-scanning image unit, for using face array CMOS image sensor push away sweep operating mode under realize multispectral number of segment word TDI push-scanning image;
Fusion treatment unit, for melting panchromatic wave-band image in the array CMOS image sensor of face with multiband image Conjunction processing, synthesis obtain color image.
Further, device further include:
Synchronism output unit, the color image for obtaining synthesis are exported in a manner of multispectral segment sync.
Multispectral TDI imaging method and device in the embodiment of the present invention are swept using face array CMOS image sensor pushing away Multispectral number of segment word TDI push-scanning image is realized under operating mode, by panchromatic wave-band image in the array CMOS image sensor of face and more waves Section image carries out fusion treatment, and synthesis obtains color image, and panchromatic remote sensing image and multiband visual fusion are handled, obtained both There is the high-resolution of panchromatic image, and have the image of the colour information of multiband image, imaging precision is high.
Detailed description of the invention
The drawings described herein are used to provide a further understanding of the present invention, constitutes part of this application, this hair Bright illustrative embodiments and their description are used to explain the present invention, and are not constituted improper limitations of the present invention.In the accompanying drawings:
Fig. 1 is the flow chart of the multispectral TDI imaging method of the present invention;
Fig. 2 is the preferred flow charts of the multispectral TDI imaging method of the present invention;
Fig. 3 is the structural schematic diagram of face array CMOS image sensor in the present invention;
Fig. 4 is the module map of the multispectral TDI imaging device of the present invention;
Fig. 5 is the preferred module figure of the multispectral TDI imaging device of the present invention.
Specific embodiment
In order to enable those skilled in the art to better understand the solution of the present invention, below in conjunction in the embodiment of the present invention Attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is only The embodiment of a part of the invention, instead of all the embodiments.Based on the embodiments of the present invention, ordinary skill people The model that the present invention protects all should belong in member's every other embodiment obtained without making creative work It encloses.
It should be noted that description and claims of this specification and term " first " in above-mentioned attached drawing, " Two " etc. be to be used to distinguish similar objects, without being used to describe a particular order or precedence order.It should be understood that using in this way Data be interchangeable under appropriate circumstances, so as to the embodiment of the present invention described herein can in addition to illustrating herein or Sequence other than those of description is implemented.In addition, term " includes " and " having " and their any deformation, it is intended that cover Cover it is non-exclusive include, for example, the process, method, system, product or equipment for containing a series of steps or units are not necessarily limited to Step or unit those of is clearly listed, but may include be not clearly listed or for these process, methods, product Or other step or units that equipment is intrinsic.
Embodiment 1
An embodiment according to the present invention provides a kind of multispectral TDI imaging method, referring to Fig. 1, comprising the following steps:
Step S101: under numeric field TDI mode, in the array CMOS image sensor framework of face be panchromatic (P) and blue (B1), Imaging parameter is separately provided in green (B2), red (B3), near-infrared (B4) spectral coverage;
Step S102: using face array CMOS image sensor push away sweep operating mode under realize that multispectral number of segment word TDI is pushed away and sweep Imaging;
Step S103: carrying out fusion treatment for panchromatic wave-band image in the array CMOS image sensor of face and multiband image, Synthesis obtains color image.
Multispectral TDI imaging method in the embodiment of the present invention sweeps Working mould pushing away using face array CMOS image sensor Multispectral number of segment word TDI push-scanning image is realized under formula, by panchromatic wave-band image in the array CMOS image sensor of face and multiband image Fusion treatment is carried out, synthesis obtains color image, and panchromatic remote sensing image and multiband visual fusion are handled, obtained existing panchromatic The high-resolution of image, and have the image of the colour information of multiband image, imaging precision is high.
In as a preferred technical scheme, referring to fig. 2, method further include:
Step S104: the color image that synthesis obtains is exported in a manner of multispectral segment sync.The mode of output image is set It is set to multispectral segment sync output, in order to store fusion treatment and display with the later period.
In as a preferred technical scheme, the color image that synthesis the is obtained side synchronous with about multispectral section both direction Formula output, referring to Fig. 3.
In as a preferred technical scheme, multispectral section of upper direction output is face array CMOS image sensor odd rows of picture number According to multispectral section of lower direction output is face array CMOS image sensor even number line image data, referring to Fig. 3.
In as a preferred technical scheme, imaging parameters include integral sum of series gain.Under numeric field TDI mode, 5 The imaging parameters such as integral sum of series gain can be separately provided in spectral coverage, realize that open score section adopts the different reflectance signatures of target Collection.
In as a preferred technical scheme, referring to Fig. 3, panchromatic (P), indigo plant (B1), green (B2), red (B3), near-infrared (B4) Spectral coverage series line number is respectively 2*N1 row, 2*N2 row, 2*N3 row, 2*N4 row, 2*N5 row;Wherein N1, N2, N3, N4, N5 be greater than Integer equal to 1.Face array CMOS image sensor surface is provided with the optical filter for multispectral imaging, can be face battle array CMOS The pixel of imaging sensor corresponding region provides the light of panchromatic (P) and blue (B1), green (B2), red (B3), near-infrared (B4) spectral coverage Signal.
In as a preferred technical scheme, using face array CMOS image sensor push away sweep operating mode under realize multispectral section Digital TDI push-scanning image includes: by face array CMOS image sensor in panchromatic (P) and blue (B1), green (B2), red (B3), close red (B4) spectral coverage uplifting window outside.By, in P, B1, B2, B3, B4 spectral coverage uplifting window, realizing multispectral section to face array CMOS image sensor The function of TDI push-scanning image simultaneously.
In as a preferred technical scheme, by panchromatic wave-band image in the array CMOS image sensor of face and multiband image into Row fusion treatment, the i.e. pixel of panchromatic wave-band image are aligned with the pixel of multiband image and merge, and synthesis obtains color image packet It includes: assigning R, G, channel B in the array CMOS image sensor framework of face to R, G, B spectral information of tri- wave bands respectively.Wherein, entirely Color wave band is shown as gray level image.Panchromatic remote sensing image spatial resolution is high, but can not explicitly look for coloured silk.In practical operation, By it and the processing of multiband visual fusion, the high-resolution of existing panchromatic image is obtained, and have the colour information of multiband image Image.It is multispectral to refer to multiple single-range intakes in atural object radiation.Assign R, G, B tri- waves respectively R, G, channel B Section is the spectral information of blue (B1), green (B2), red (B3), and synthesis obtains color image.
Embodiment 2
According to another embodiment of the present invention, a kind of multispectral TDI imaging device is provided, referring to fig. 4, comprising:
Parameter set unit 10, for being panchromatic in the array CMOS image sensor framework of face under numeric field TDI mode (P) and imaging parameter is separately provided in blue (B1), green (B2), red (B3), near-infrared (B4) spectral coverage;
Push-scanning image unit 20, for using face array CMOS image sensor push away sweep operating mode under realize multispectral number of segment Word TDI push-scanning image;
Fusion treatment unit 30, for carrying out panchromatic wave-band image in the array CMOS image sensor of face and multiband image Fusion treatment, synthesis obtain color image.
Multispectral TDI imaging device in the embodiment of the present invention sweeps Working mould pushing away using face array CMOS image sensor Multispectral number of segment word TDI push-scanning image is realized under formula, by panchromatic wave-band image in the array CMOS image sensor of face and multiband image Fusion treatment is carried out, synthesis obtains color image, and panchromatic remote sensing image and multiband visual fusion are handled, obtained existing panchromatic The high-resolution of image, and have the image of the colour information of multiband image, imaging precision is high.
In as a preferred technical scheme, referring to Fig. 5, device further include:
Synchronism output unit 40, the color image for obtaining synthesis are exported in a manner of multispectral segment sync.
The serial number of the above embodiments of the invention is only for description, does not represent the advantages or disadvantages of the embodiments.
In the above embodiment of the invention, it all emphasizes particularly on different fields to the description of each embodiment, does not have in some embodiment The part of detailed description, reference can be made to the related descriptions of other embodiments.
In several embodiments provided herein, it should be understood that disclosed technology contents can pass through others Mode is realized.Wherein, system embodiment described above is only schematical, such as the division of unit, can be one kind Logical function partition, there may be another division manner in actual implementation, such as multiple units or components can combine or can To be integrated into another system, or some features can be ignored or not executed.Another point, shown or discussed is mutual Coupling, direct-coupling or communication connection can be through some interfaces, the indirect coupling or communication connection of unit or module, It can be electrical or other forms.
Unit may or may not be physically separated as illustrated by the separation member, shown as a unit Component may or may not be physical unit, it can and it is in one place, or may be distributed over multiple units On.It can some or all of the units may be selected to achieve the purpose of the solution of this embodiment according to the actual needs.
It, can also be in addition, the functional units in various embodiments of the present invention may be integrated into one processing unit It is that each unit physically exists alone, can also be integrated in one unit with two or more units.Above-mentioned integrated list Member both can take the form of hardware realization, can also realize in the form of software functional units.
It, can if integrated unit is realized in the form of SFU software functional unit and when sold or used as an independent product To be stored in a computer readable storage medium.Based on this understanding, technical solution of the present invention substantially or Say that all or part of the part that contributes to existing technology or the technical solution can embody in the form of software products Out, which is stored in a storage medium, including some instructions are used so that a computer equipment (can be personal computer, server or network equipment etc.) executes all or part of step of each embodiment method of the present invention Suddenly.And storage medium above-mentioned includes: USB flash disk, read-only memory (ROM, Read-Only Memory), random access memory The various media that can store program code such as (RAM, Random Access Memory), mobile hard disk, magnetic or disk.
The above is only a preferred embodiment of the present invention, it is noted that for the ordinary skill people of the art For member, various improvements and modifications may be made without departing from the principle of the present invention, these improvements and modifications are also answered It is considered as protection scope of the present invention.

Claims (10)

1. a kind of multispectral TDI imaging method, which comprises the following steps:
It is panchromatic (P) and blue (B1), green (B2), red in the array CMOS image sensor framework of face under numeric field TDI mode (B3), imaging parameter is separately provided in near-infrared (B4) spectral coverage;
Using face array CMOS image sensor push away sweep operating mode under realize multispectral number of segment word TDI push-scanning image;
Panchromatic wave-band image in the array CMOS image sensor of face and multiband image are subjected to fusion treatment, synthesis obtains cromogram Picture.
2. the method according to claim 1, wherein the method also includes:
The color image that synthesis obtains is exported in a manner of multispectral segment sync.
3. according to the method described in claim 2, it is characterized in that, the color image that synthesis is obtained is with about multispectral section two The synchronous mode in direction exports.
4. according to the method described in claim 3, it is characterized in that, described multispectral section upper direction output is that face array CMOS image passes Sensor odd rows of picture data, the multispectral section of lower direction output is face array CMOS image sensor even number line image data.
5. the method according to claim 1, wherein the imaging parameters include integral sum of series gain.
6. according to the method described in claim 5, it is characterized in that, panchromatic (P), blue (B1), green (B2), red (B3), close Infrared (B4) spectral coverage series line number is respectively 2*N1 row, 2*N2 row, 2*N3 row, 2*N4 row, 2*N5 row;Wherein N1, N2, N3, N4, N5 is the integer more than or equal to 1.
7. the method according to claim 1, wherein described sweep work pushing away using face array CMOS image sensor Realize that multispectral number of segment word TDI push-scanning image includes: by face array CMOS image sensor at panchromatic (P) and blue (B1), green under mode (B2), red (B3), near-infrared (B4) spectral coverage uplifting window.
8. the method according to claim 1, wherein described by panchromatic wave-band shadow in the array CMOS image sensor of face As and multiband image carry out fusion treatment, synthesis obtain color image include: by R in the array CMOS image sensor framework of face, G, channel B assigns R, G, B spectral information of tri- wave bands respectively.
9. a kind of multispectral TDI imaging device characterized by comprising
Parameter set unit, under numeric field TDI mode, in the array CMOS image sensor framework of face be panchromatic (P) and Imaging parameter is separately provided in blue (B1), green (B2), red (B3), near-infrared (B4) spectral coverage;
Push-scanning image unit, for using face array CMOS image sensor push away sweep operating mode under realize multispectral number of segment word TDI Push-scanning image;
Fusion treatment unit, for carrying out panchromatic wave-band image in the array CMOS image sensor of face to merge place with multiband image Reason, synthesis obtain color image.
10. device according to claim 9, which is characterized in that described device further include:
Synchronism output unit, the color image for obtaining synthesis are exported in a manner of multispectral segment sync.
CN201811480714.1A 2018-12-05 2018-12-05 A kind of multispectral TDI imaging method and device Pending CN109640012A (en)

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Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110475062A (en) * 2019-07-24 2019-11-19 北京空间机电研究所 A kind of agility Imaging remote sensing camera depth is standby and rapid restarting method and system
CN111510647A (en) * 2020-04-27 2020-08-07 中国科学院长春光学精密机械与物理研究所 Uniform charge transfer control method for multi-spectral-segment TDICMOS
CN112399085A (en) * 2020-11-19 2021-02-23 中国科学院长春光学精密机械与物理研究所 Satellite-borne multi-mode photoelectric imaging device and imaging method
CN112565635A (en) * 2020-11-30 2021-03-26 长光卫星技术有限公司 Multi-mode space optical camera with on-orbit reconstruction
CN113055576A (en) * 2021-03-31 2021-06-29 中国科学院长春光学精密机械与物理研究所 Space camera TDICCD bidirectional push-broom imaging circuit
CN114397255A (en) * 2021-11-12 2022-04-26 中国科学院西安光学精密机械研究所 Wide-spectrum high-resolution video spectral imaging system and method
CN115767301A (en) * 2022-11-16 2023-03-07 中国电子科技集团公司第四十四研究所 Multi-spectral-band time sequence control method based on 3D type integrated TDI-CMOS image sensor
FR3143804A1 (en) * 2022-12-19 2024-06-21 Sophia METHOD FOR TAKING COMBINED HYPERSPECTRAL AND PANCHROMATIC MOVING PHOTOGRAPHS USING A SPATIAL IMAGER

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20150312504A1 (en) * 2014-04-28 2015-10-29 Isolynx, Llc Camera Systems For Processing Event Timing Images
US20180047857A1 (en) * 2012-04-10 2018-02-15 Kla-Tencor Corporation Back-Illuminated Sensor With Boron Layer

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20180047857A1 (en) * 2012-04-10 2018-02-15 Kla-Tencor Corporation Back-Illuminated Sensor With Boron Layer
US20150312504A1 (en) * 2014-04-28 2015-10-29 Isolynx, Llc Camera Systems For Processing Event Timing Images

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
曲宏松: "基于数字域TDI算法改进面阵CMOS图像传感器功能", 《光学 精密工程》 *
李新娥: "大视场多光谱相机图像拼接与融合技术研究", 《中国博士学位论文全文数据库(电子期刊)》 *
桑美贞: "TDI型CMOS图像传感器时序控制设计与实现", 《传感器技术学报》 *
薛旭成: "应用双排TDI CCD提高空间推扫遥感相机动态范围", 《光学 精密工程》 *

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
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CN110475062B (en) * 2019-07-24 2021-07-09 北京空间机电研究所 Method and system for deep standby and quick restart of agile imaging remote sensing camera
CN111510647A (en) * 2020-04-27 2020-08-07 中国科学院长春光学精密机械与物理研究所 Uniform charge transfer control method for multi-spectral-segment TDICMOS
CN111510647B (en) * 2020-04-27 2021-08-31 中国科学院长春光学精密机械与物理研究所 Uniform charge transfer control method for multi-spectral-segment TDICMOS
CN112399085A (en) * 2020-11-19 2021-02-23 中国科学院长春光学精密机械与物理研究所 Satellite-borne multi-mode photoelectric imaging device and imaging method
CN112565635A (en) * 2020-11-30 2021-03-26 长光卫星技术有限公司 Multi-mode space optical camera with on-orbit reconstruction
CN113055576A (en) * 2021-03-31 2021-06-29 中国科学院长春光学精密机械与物理研究所 Space camera TDICCD bidirectional push-broom imaging circuit
CN113055576B (en) * 2021-03-31 2021-12-31 中国科学院长春光学精密机械与物理研究所 Space camera TDICCD bidirectional push-broom imaging circuit
CN114397255A (en) * 2021-11-12 2022-04-26 中国科学院西安光学精密机械研究所 Wide-spectrum high-resolution video spectral imaging system and method
CN114397255B (en) * 2021-11-12 2023-09-01 中国科学院西安光学精密机械研究所 Wide-spectrum high-resolution video spectrum imaging system and method
CN115767301A (en) * 2022-11-16 2023-03-07 中国电子科技集团公司第四十四研究所 Multi-spectral-band time sequence control method based on 3D type integrated TDI-CMOS image sensor
FR3143804A1 (en) * 2022-12-19 2024-06-21 Sophia METHOD FOR TAKING COMBINED HYPERSPECTRAL AND PANCHROMATIC MOVING PHOTOGRAPHS USING A SPATIAL IMAGER

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Application publication date: 20190416