CN109638634A - A kind of radium-shine light emitting devices - Google Patents
A kind of radium-shine light emitting devices Download PDFInfo
- Publication number
- CN109638634A CN109638634A CN201811533659.8A CN201811533659A CN109638634A CN 109638634 A CN109638634 A CN 109638634A CN 201811533659 A CN201811533659 A CN 201811533659A CN 109638634 A CN109638634 A CN 109638634A
- Authority
- CN
- China
- Prior art keywords
- carrier
- side wall
- radium
- light emitting
- emitting devices
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0233—Mounting configuration of laser chips
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/16—Human faces, e.g. facial parts, sketches or expressions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02253—Out-coupling of light using lenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
- H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/06—Arrangements for controlling the laser output parameters, e.g. by operating on the active medium
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- General Health & Medical Sciences (AREA)
- Oral & Maxillofacial Surgery (AREA)
- Health & Medical Sciences (AREA)
- Human Computer Interaction (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Led Device Packages (AREA)
Abstract
The present invention relates to a kind of radium-shine light emitting devices comprising: a carrier, the support portion with a top, a bottom and the side at the top of this, and the top coating of the part of the carrier has a conductive layer；One lens are sticked in the support portion, and a top coating of the lens has a transparent conductive film, and the transparent conductive film at the top of the lens is electrically connected by a conducting resinl with the conductive layer at the top of the carrier；And a weld pad, it configures in the bottom of the carrier；Wherein, the carrier further includes the inside configured in the carrier and the metallic conductor being connected between the conductive layer and the weld pad.The present invention reduces the numbers that the position of component is corresponding and binds, to reduce the risk that component falls off.Meanwhile support portion is formed to carry lens by carrier, making lens that can quickly move through configuration can engage in the support portion of carrier with carrier, thus the risk for reducing lens displacement or falling off.
Description
Technical field
The present invention relates to a kind of radium-shine light emitting devices, more particularly to one kind to be suitable for radium-shine group of vertical cavity surface emitting type
The radium-shine light emitting devices of part (Vertical Cavity Surface-Emitting Laser, hereinafter referred to as VCSEL).
Background technique
In order to the status of more accurately discriminating user, the biological identifications technology such as fingerprint, face, iris, vein is just positive
In ground development, wherein face recognition is even more one of focus of attention.In order to promote the precision of face recognition technology, including hang down
The radium-shine light emitting devices of the straight radium-shine component of cavity surface emitting being applied in face recognition technology widely, mainly to
The depth information of user face is measured, the face recognition information of user is specific to further foundation.And in order to avoid vertically total
Laser light direct irradiation user's eyes of the radium-shine component transmitting of vibration Cavity surface emitting damage, and radium-shine light emitting devices would generally
User face is irradiated in after homogenizing laser light by lens again, therefore, how to control in real time lens state (displacement or
Damage) it is important one of project.
However, in order to control lens state in real time, well known radium-shine light emitting devices usually requires to utilize routing
Mode establishes the approach being electrically connected with control circuit, and this mode not only causes cumbersome in manufacturing process, is exposed to
Outer gold thread is even more the risk for increasing gold thread fracture, and then leads to not the case where normally monitoring lens state generation.
Summary of the invention
In order to solve the above-mentioned problems of the prior art, the present invention is intended to provide a kind of radium-shine light emitting devices, to mention
Its high safeguard protection performance.
A kind of radium-shine light emitting devices of the present invention comprising:
One carrier, the support portion with a top, a bottom and the side at the top of this, and the carrier
Partial top coating has a conductive layer；
One lens are sticked in the support portion, and a top coating of the lens has a transparent conductive film, described
The transparent conductive film at the top of mirror is electrically connected by a conducting resinl with the conductive layer at the top of the carrier；And
One weld pad is configured in the bottom of the carrier；
Wherein, the carrier further include the inside configured in the carrier and be connected to the conductive layer and the weld pad it
Between a metallic conductor.
In above-mentioned radium-shine light emitting devices, the carrier includes:
One bottom carrier；
One first side wall is set to a top of the bottom carrier, and around the bottom carrier to form one first
Opening；And
One second side wall is set to a top of first side wall, and around first side wall to form one second
Be open and expose first side wall part top as the support portion, wherein it is described second opening bore it is big
In the bore of first opening；
Wherein, the bottom carrier, the first side wall and the second side wall are one of the forming.
In above-mentioned radium-shine light emitting devices, second side coping is coated with the conductive layer.
In above-mentioned radium-shine light emitting devices, the metallic conductor is connected to the described of second side coping and leads
Between electric layer and the weld pad.
In above-mentioned radium-shine light emitting devices, the inner wall of the part of the support portion and second side wall is coated with
The conductive layer, and the metallic conductor is connected between the conductive layer and the weld pad of the support portion.
Above-mentioned radium-shine light emitting devices further includes a control circuit, is electrically connected with the weld pad, described to monitor
The electrical variation of bright conductive film.
The radium-shine light emitting devices of another kind of the present invention comprising:
One carrier, the support portion with a top, a bottom and the side at the top of this, and the carrier
The outer wall of partial top and the part of the carrier is coated with a conductive layer；
One lens are sticked in the support portion, and a top coating of the lens has a transparent conductive film；And
One weld pad, the bottom configured in the carrier are simultaneously connect with the conductive layer；
Wherein, the institute that the transparent conductive film at the top of the lens passes through the top of a conducting resinl and the carrier
State conductive layer electrical connection.
In above-mentioned radium-shine light emitting devices, the carrier includes:
One bottom carrier；
One first side wall is set to a top of the bottom carrier, and around the bottom carrier to form one first
Opening；And
One second side wall is set to a top of first side wall, and around first side wall to form one second
Be open and expose first side wall part top as the support portion, wherein it is described second opening bore it is big
In the bore of first opening；
Wherein, the bottom carrier, the first side wall and the second side wall are one of the forming.
In above-mentioned radium-shine light emitting devices, the bottom carrier, the outer wall of the first side wall and the second side wall and institute
It states second side coping and is coated with the conductive layer, and the outer wall position of the bottom carrier, the first side wall and the second side wall
In same plane.
Above-mentioned radium-shine light emitting devices further includes a control circuit, is electrically connected with the weld pad, described to monitor
The electrical variation of bright conductive film.
Due to using above-mentioned technical solution, the present invention is by using integrally formed carrier, thus reduction group
The position correspondence of part and the number of bonding, to reduce the risk that component falls off.Meanwhile support portion is formed to carry by carrier
Lens, making lens that can quickly move through configuration can engage in the support portion of carrier with carrier, to reduce lens displacement or de-
The risk fallen.In addition, lens and carrier can be binded each other more quickly also by way of top coating adhesive agent.
At the same time it can also make to be electrically connected to each other between component by way of conducting layer coated, to sense lens state in real time, with
Close laser light emission component in time when lens displacement or damage to protect human eye.
Detailed description of the invention
Fig. 1 is the structural perspective of radium-shine light emitting devices of the invention；
Fig. 2 is the structural profile illustration of the embodiment one of radium-shine light emitting devices of the invention；
Fig. 3 is the structural profile illustration of the embodiment two of radium-shine light emitting devices of the invention；And
Fig. 4 is the structural profile illustration of the embodiment three of radium-shine light emitting devices of the invention.
Wherein:
1 radium-shine light emitting devices
10 bottom carriers
11 through-holes
12 metallic conductors
20 first side walls
21 first openings
22 accommodating spaces
30 second side walls
31 second openings
32 support portions
33 conductive layers
40 electronic building bricks
50 lens
51 transparent conductive films
60,60a, 60b, 60c weld pad
70 control circuits
80 conducting resinls
T1, T2 thickness
101,201,301 top
102,202,302 bottom
Specific embodiment
With reference to the accompanying drawing, presently preferred embodiments of the present invention is provided, and is described in detail.
Fig. 1 and Fig. 2 is please referred to, Fig. 1 is according to the structural perspective of the radium-shine light emitting devices of the embodiment of the present invention, figure
2 is according to the structural profile illustrations of the radium-shine light emitting devices of the embodiment of the present invention one.
Laser light emitting devices 1 is a carrier comprising bottom carrier 10, the first side wall 20 and the second side wall 30, and
Bottom carrier 10 has top 201 and bottom 202 and the second side wall with top 101 and bottom 102, the first side wall 20
30 have top 301 and bottom 302, and top 101,201,301 is located at the opposite side of bottom 102,202,302.
First side wall 20 is arranged and is surrounded on the top 101 of bottom carrier 10, and the bottom 202 and part of the first side wall 20
Bottom carrier 10 top 101 be connected and expose part bottom carrier 10 top 101, close to the first side wall
The side at 20 top 201 forms the first opening 21 and between the first opening 21 and the atop part 101 of bottom carrier 10
Form accommodating space 22.
Second side wall 30 is arranged and is surrounded on the top 201 of the first side wall 20, bottom 302 and the part of the second side wall 30
The top 201 of first side wall 20 is connected and exposes the top 201 of the first side wall 20 of part, close to the second side wall 30
The side at top 301 form the second opening 31, and second side wall 30 between the second opening 31 and the first opening 21
Support portion 32 is formed between inner wall and the inner wall of the first side wall 20, that is, support portion 32 is is surrounded and exposed by the second side wall 30
The first side wall 20 atop part 201.
For the thickness T2 of second side wall 30 less than the thickness T1 of the first side wall 20, the outer wall of the second side wall 30 do not protrude from first
The outer wall of side wall 20, and second opening 31 bore be greater than first opening 21 bore (in other words, the inner wall of the second side wall 30 with
The inner wall of first side wall 20 is not in same plane, and the inner wall of the first side wall 20 is recessed in the inner wall of the second side wall 30), therefore shape
At support portion 32.By taking Fig. 2 as an example, support portion 32 is formed by L shape support portion 32 for the first side wall 20 and the second side wall 30, and
System that invention is not limited thereto.
In this embodiment, the outer wall of the outer wall of the second side wall 30 and the first side wall 20 is generally aligned in the same plane (that is, second side
The outer wall of the outer wall of wall 30 and the first side wall 20 is in alignment with each other).In another embodiment, the outer wall of the second side wall 30 and the first side
The outer wall of wall 20, which is not generally aligned in the same plane, (that is, unjustified between the outer wall of the second side wall 30 and the outer wall of the first side wall 20, and to be had
There is spacing distance).
At least partly top 301 of second side wall 30 is coated with conductive layer 33, wherein the material of conductive layer 33 is gold
Belong to, generally copper metal, and invention is not limited thereto system.
Accommodating space 22 is used to accommodate an at least electronic building brick 40 at the top 101 for being configured at bottom carrier 10, and accommodates
Space 22 can be used for reflexing to some light that electronic building brick 40 is emitted the direction of the first opening 21, wherein electronic building brick 40
For a radium-shine component of vertical cavity surface emitting type, light is, for example, laser light, and invention is not limited thereto system.
Bottom carrier 10 also has multiple through-holes 11, therefore the electronic building brick 40 for being configured at accommodating space 22 can pass through through-hole
11 weld pad (solder pad) 60 with configuration in the bottom of bottom carrier 10 102 is electrically connected (weld pad 60a as shown in Figure 2),
Wherein, weld pad 60 can be surface sticking assembly (Surface Mounted Devices, SMD), and invention is not limited thereto
System.
Radium-shine light emitting devices 1 also has an at least metallic conductor 12, and the bottom that metallic conductor 12 configured in the same side carries
Body 10, the first side wall 20 and the second side wall 30 inside and be electrically connected to conductive layer 33 and the (weld pad as shown in Figure 2 of weld pad 60
60b or 60c) between.In other words, metallic conductor 12 runs through the bottom carrier 10 positioned at the same side, the first side wall 20 and second
Side wall 30, and be electrically connected between conductive layer 33 and weld pad 60.By taking Fig. 2 as an example, the configuration of metallic conductor 12 is left half side (right in figure
It is half side) bottom carrier 10, the first side wall 20 and the second side wall 30 inside, and be electrically connected to left half side (right half side) lead
Between electric layer 33 and weld pad 60b (weld pad 60c).Metallic carrier 12 is, for example, conductive copper metal, and invention is not limited thereto system.
Support portion 32 is for carrying and accommodating a lens 50, and lens 50 are engaged with each other with support portion 32, and wherein lens 50 are
Diffraction optics lens (Diffractive optical element, DOE) or lenticule (Micorlens), and the present invention not with
This is limitation.
In this embodiment, at least partly top 501 of lens 50 is (i.e. adjacent to the second opening 31 and far from the first opening 21
Side) be coated with transparent conductive film 51, wherein transparent conductive film 51 can for tin indium oxide (Indium Tin Oxide,
ITO), CTO film (Cd2SnO4) or CIO film (Cdln2O4), and invention is not limited thereto system.
In this embodiment, the top 501 of the lens 50 engaged with support portion 32 and the top 301 of the second side wall 30 are located at
Same plane.
In this embodiment, the conductive layer 33 at the top 301 of the second side wall 30 is partly saturating with the top 501 of lens 50
Bright conductive film 51 is binded each other by conducting resinl 80.For further, conducting resinl 80 can be coated on the top 501 of lens 50
Some and be electrically connected with transparent conductive film 51 so that the transparent conductive film 51 of lens 50 pass through conducting resinl 80 and second
The top 301 of side wall 30 is partly binded, and is electrically connected with the conductive layer 33 at the top 301 of the second side wall 30, wherein conducting resinl
80 be metallic conduction glue, and invention is not limited thereto system.
In one embodiment, radium-shine light emitting devices 1 further includes control circuit 70 or external control circuit 70, and weld pad 60
(60a, 60b, 60c in such as Fig. 2) is electrically connected with control circuit 70, that is, radium-shine light emitting devices 1 can for finished product (including control
Circuit 70) or semi-finished product (external control circuit 70), and invention is not limited thereto system.Control circuit 70 can by weld pad 60b,
60c and the transparent conductive film 51 being electrically connected to each other, conducting resinl 80, metallic conductor 12 carry out real-time monitoring transparent conductive film 51
Resistance value whether change, and then judge whether lens 50 are displaced or damage.For example, control circuit 70 can be in weld pad
One current value is provided between 60b, 60c and monitors the voltage value between weld pad 60b, 60c to judge the electricity of transparent conductive film 51
Whether resistance value changes.When control circuit 70 judges that lens 50 have been displaced or have damaged according to the variation of voltage value, then electricity is controlled
Road 70, which controls electronic building brick 40 by weld pad 60a immediately, makes its closing, is emitted directly toward human eye to avoid the laser light not homogenized
It damages.Become that is, radium-shine light emitting devices 1 of the invention can monitor the electrical of transparent conductive film 51 by control circuit 70
Change the state that (variation of voltage value, current value, resistance value or capacitance etc. between two weld pads) carrys out effective monitoring lens 50.
In one embodiment, bottom carrier 10 and the first side wall 20 are ceramics bracket or copper stent, the second side wall 30
Material is PPA resin (Polyphthalamide), LEP (Light Emitting PVC) or epoxy resin (Epoxy), or gold
Belong to the materials such as material side wall, and invention is not limited thereto system.
In one embodiment, metallic conductor 12, bottom carrier 10, the first side wall 20 and the second side wall 30 are integrated into
Shape, and invention is not limited thereto system.
In one embodiment, bottom carrier 10 can be one of shape of round ellipse, quadrangle or polygon
Shape, the first side wall 20, the second side wall 30 and lens 50 correspond to bottom carrier 10 and formed round, ellipse, quadrangle or
First the 21, second opening 31 and lens 50 of opening of polygon, and invention is not limited thereto system.
The bore of first opening 21 and the second opening 31 can be according to the first opening 21 and the implementation shape of the second opening 31
Formula (round, ellipse, quadrangle or polygon) and be length, width, area, diameter or long axis, and the present invention not as
Limitation.
Referring to FIG. 3, Fig. 3 is the structural profile illustration according to the radium-shine light emitting devices of the embodiment of the present invention two.Fig. 3
The difference is that, in Fig. 3, conductive layer 33 is led other than at least partly top 301 for being coated on the second side wall 30 with Fig. 2's
Electric layer 33 is also coated on at least part inner wall and support portion 32 of the second side wall 30.Simultaneously as conductive layer 33 is coated on
At least part inner wall and support portion 32 of two side walls 30, therefore metallic conductor 12 is configured in bottom carrier 10 and the first side
The inside of wall 20, and be electrically connected with the support portion 32 and weld pad 60 (60b, 60c) for being coated with conductive layer 33.In this embodiment
Metallic conductor 12 the metallic conductor 12 being shorter in length than in Fig. 2 embodiment length.
Referring to FIG. 4, Fig. 4 is the structural profile illustration according to the radium-shine light emitting devices of the embodiment of the present invention three.Fig. 4
The difference is that, in Fig. 4, conductive layer 33 is led other than at least partly top 301 for being coated on the second side wall 30 with Fig. 2's
Electric layer 33 is also coated on at least part outer wall of bottom carrier 10, the first side wall 20 and the second side wall 30, and with weld pad 60
(60b, 60c) electrical connection.In this embodiment, due to conductive layer 33 can directed along bottom carrier 10, the first side wall 20 and
At least part outer wall of second side wall 30 is electrically connected with weld pad 60 (60b, 60c), and therefore, this embodiment need not additionally configure aforementioned
Metallic conductor 12.
In the fig. 4 embodiment, for the ease of the coating of conductive layer 33, bottom carrier 10, the first side wall 20 and second
The outer wall of side wall 30 can be generally aligned in the same plane (that is, the outer wall of bottom carrier 10, the outer wall of the second side wall 30 and the first side wall 20
Outer wall is in alignment with each other).
It is comprehensive with described, since carrier of the invention can be one of the forming, the position pair of component can be effectively reduced
It answers and the number that binds is to reduce the risk that component falls off, and may make lens 50 are quickly move through to be configured at support portion 32
Engage with carrier, thus the case where effectively reducing the displacement of lens 50 or falling off.The present invention is also by top coating conduction
The mode of glue 80, so as to more quickly bind lens 50 each other with carrier.In addition, by conducting resinl 80, electrically conducting transparent
Film 51 can be electrically connected by conductive layer 33 with weld pad 60 (60b and 60c), and need not be come and weldering through the made gold thread of routing
Pad 60 is electrically connected, so that the case where being exposed to outer gold thread fracture is effectively prevented, so that radium-shine light emitting devices 1 can be stablized
Ground monitors 50 state of lens.
Therefore, radium-shine light emitting devices 1 of the invention not only has simple structure, can also promote the configuration of lens 50
Stable degree, while the damage of lens 50 can also be protected human eyes from and damaged, it significantly improves radium-shine light emitting devices 1 and exists
Commercial benefit.
Above-described, only presently preferred embodiments of the present invention, the range being not intended to limit the invention, of the invention is upper
Stating embodiment can also make a variety of changes.Letter made by all claims applied according to the present invention and description
Single, equivalent changes and modifications, fall within the claims of the invention patent.The not detailed description of the present invention is normal
Advise technology contents.
Claims (10)
1. a kind of radium-shine light emitting devices, which is characterized in that described device includes:
One carrier, the support portion with a top, a bottom and the side at the top of this, and the part of the carrier
Top coating have a conductive layer；
One lens are sticked in the support portion, and a top coating of the lens has a transparent conductive film, the lens
The transparent conductive film at top is electrically connected by a conducting resinl with the conductive layer at the top of the carrier；And
One weld pad is configured in the bottom of the carrier；
Wherein, the carrier further includes the inside configured in the carrier and is connected between the conductive layer and the weld pad
One metallic conductor.
2. radium-shine light emitting devices according to claim 1, which is characterized in that the carrier includes:
One bottom carrier；
One first side wall is set to a top of the bottom carrier, and around the bottom carrier to form one first opening；
And
One second side wall is set to a top of first side wall, and around first side wall to form one second opening
And expose first side wall part top as the support portion, wherein it is described second opening bore be greater than institute
State the bore of the first opening；
Wherein, the bottom carrier, the first side wall and the second side wall are one of the forming.
3. radium-shine light emitting devices according to claim 2, which is characterized in that second side coping coating is
State conductive layer.
4. radium-shine light emitting devices according to claim 3, which is characterized in that the metallic conductor is connected to described second
Between the conductive layer and the weld pad of side coping.
5. radium-shine light emitting devices according to claim 3, which is characterized in that the support portion and second side wall
The inner wall of part be coated with the conductive layer, and the metallic conductor is connected to the conductive layer and the institute of the support portion
It states between weld pad.
6. radium-shine light emitting devices according to claim 1, which is characterized in that described device further includes a control circuit,
It is electrically connected with the weld pad, to monitor the electrical variation of the transparent conductive film.
7. a kind of radium-shine light emitting devices, which is characterized in that described device includes:
One carrier, the support portion with a top, a bottom and the side at the top of this, and the part of the carrier
Top and the outer wall of part of the carrier be coated with a conductive layer；
One lens are sticked in the support portion, and a top coating of the lens has a transparent conductive film；And
One weld pad, the bottom configured in the carrier are simultaneously connect with the conductive layer；
Wherein, the transparent conductive film at the top of the lens is led by a conducting resinl and the described of the top of the carrier
Electric layer electrical connection.
8. radium-shine light emitting devices according to claim 7, which is characterized in that the carrier includes:
One bottom carrier；
One first side wall is set to a top of the bottom carrier, and around the bottom carrier to form one first opening；
And
One second side wall is set to a top of first side wall, and around first side wall to form one second opening
And expose first side wall part top as the support portion, wherein it is described second opening bore be greater than institute
State the bore of the first opening；
Wherein, the bottom carrier, the first side wall and the second side wall are one of the forming.
9. radium-shine light emitting devices according to claim 8, which is characterized in that the bottom carrier, the first side wall and
The outer wall of second side wall and second side coping are coated with the conductive layer, and the bottom carrier, the first side wall with
And second the outer wall of side wall be generally aligned in the same plane.
10. radium-shine light emitting devices according to claim 7, which is characterized in that described device further includes a control circuit,
It is electrically connected with the weld pad, to monitor the electrical variation of the transparent conductive film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811533659.8A CN109638634A (en) | 2018-12-14 | 2018-12-14 | A kind of radium-shine light emitting devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811533659.8A CN109638634A (en) | 2018-12-14 | 2018-12-14 | A kind of radium-shine light emitting devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109638634A true CN109638634A (en) | 2019-04-16 |
Family
ID=66074056
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811533659.8A Pending CN109638634A (en) | 2018-12-14 | 2018-12-14 | A kind of radium-shine light emitting devices |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109638634A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110212402A (en) * | 2019-05-07 | 2019-09-06 | 上海灿瑞科技股份有限公司 | Laser diode device |
| CN111934189A (en) * | 2020-09-29 | 2020-11-13 | 常州纵慧芯光半导体科技有限公司 | Light emitting module and packaging method thereof |
| US20210336402A1 (en) * | 2020-04-23 | 2021-10-28 | Analog Devices International Unlimited Company | Laser system |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070046932A1 (en) * | 2005-08-31 | 2007-03-01 | Fuji Photo Film Co., Ltd. | Optical module |
| EP1995834A1 (en) * | 2006-03-10 | 2008-11-26 | Nichia Corporation | Light emitting device |
| CN102324690A (en) * | 2011-09-29 | 2012-01-18 | 马英俊 | Semiconductor solid laser |
| CN105572811A (en) * | 2014-10-31 | 2016-05-11 | 高准精密工业股份有限公司 | Surface-mounted type laser module group |
| CN106531001A (en) * | 2016-11-04 | 2017-03-22 | 杭州元色科技有限公司 | Reflective big-pixel bistable-state color display module |
| US20170353004A1 (en) * | 2016-06-03 | 2017-12-07 | Princeton Optronics, Inc. | VCSEL Illuminator Package |
| CN107634050A (en) * | 2016-07-15 | 2018-01-26 | 日月光半导体制造股份有限公司 | Semiconductor encapsulation device and its manufacture method |
| CN107942612A (en) * | 2017-11-24 | 2018-04-20 | 深圳奥比中光科技有限公司 | The optical projection apparatus and its method for packing of the film containing monitoring |
| WO2018110981A1 (en) * | 2016-12-15 | 2018-06-21 | 엘지이노텍 주식회사 | Optical transmission module |
| CN108919511A (en) * | 2018-07-25 | 2018-11-30 | 北京小米移动软件有限公司 | Optical devices and equipment |
-
2018
- 2018-12-14 CN CN201811533659.8A patent/CN109638634A/en active Pending
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070046932A1 (en) * | 2005-08-31 | 2007-03-01 | Fuji Photo Film Co., Ltd. | Optical module |
| EP1995834A1 (en) * | 2006-03-10 | 2008-11-26 | Nichia Corporation | Light emitting device |
| CN102324690A (en) * | 2011-09-29 | 2012-01-18 | 马英俊 | Semiconductor solid laser |
| CN105572811A (en) * | 2014-10-31 | 2016-05-11 | 高准精密工业股份有限公司 | Surface-mounted type laser module group |
| US20170353004A1 (en) * | 2016-06-03 | 2017-12-07 | Princeton Optronics, Inc. | VCSEL Illuminator Package |
| CN107634050A (en) * | 2016-07-15 | 2018-01-26 | 日月光半导体制造股份有限公司 | Semiconductor encapsulation device and its manufacture method |
| TW201812366A (en) * | 2016-07-15 | 2018-04-01 | 日月光半導體製造股份有限公司 | Semiconductor package device and method of manufacturing the same |
| CN106531001A (en) * | 2016-11-04 | 2017-03-22 | 杭州元色科技有限公司 | Reflective big-pixel bistable-state color display module |
| WO2018110981A1 (en) * | 2016-12-15 | 2018-06-21 | 엘지이노텍 주식회사 | Optical transmission module |
| CN107942612A (en) * | 2017-11-24 | 2018-04-20 | 深圳奥比中光科技有限公司 | The optical projection apparatus and its method for packing of the film containing monitoring |
| CN108919511A (en) * | 2018-07-25 | 2018-11-30 | 北京小米移动软件有限公司 | Optical devices and equipment |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110212402A (en) * | 2019-05-07 | 2019-09-06 | 上海灿瑞科技股份有限公司 | Laser diode device |
| US20210336402A1 (en) * | 2020-04-23 | 2021-10-28 | Analog Devices International Unlimited Company | Laser system |
| CN111934189A (en) * | 2020-09-29 | 2020-11-13 | 常州纵慧芯光半导体科技有限公司 | Light emitting module and packaging method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US11069827B2 (en) | Semiconductor device | |
| CN109638634A (en) | A kind of radium-shine light emitting devices | |
| US9201203B2 (en) | Photoelectric composite substrate and method of manufacturing the same | |
| CN110594598B (en) | Protection mechanism for light source | |
| CN210118715U (en) | Housing for light source mounted on substrate and electronic apparatus | |
| US10777710B2 (en) | Protection mechanism for light source | |
| KR20070107734A (en) | Optical communication module and manufacturing method thereof | |
| JP2002267893A (en) | Optical module, method for manufacturing the same, and optical transmitter | |
| CN108734075A (en) | Taken module and its manufacturing method | |
| CN103809253B (en) | Photopolymer substrate, the manufacture method of photopolymer substrate and optical module | |
| JP2014164198A (en) | Optical communication device | |
| JP2006310123A (en) | Planar lighting system | |
| TWI671966B (en) | Laser light emitting device | |
| JP2018018887A (en) | Optical semiconductor device | |
| TWI707192B (en) | Structured light projecting module and electronic device thereof | |
| KR102407744B1 (en) | Optical film stack, changeable light source device, and face sensing module | |
| JP6822442B2 (en) | Light emitting device and its manufacturing method | |
| CN114788103A (en) | Optoelectronic module | |
| CN209343008U (en) | Lens fixing device | |
| JP5268268B2 (en) | Manufacturing method of light-emitting parts | |
| CN109860161B (en) | Display assembly, preparation method of display assembly and display device | |
| US11366332B2 (en) | Mini-interconnect capacitor | |
| US12130471B2 (en) | Optical element mounting module | |
| CN209329391U (en) | Radium-shine light emitting devices | |
| JP3585952B2 (en) | Optical coupling device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20190416 |
|
| WD01 | Invention patent application deemed withdrawn after publication |