CN109637964A - A kind of silicon wafer input and output material is reformed structure and its method of reforming - Google Patents
A kind of silicon wafer input and output material is reformed structure and its method of reforming Download PDFInfo
- Publication number
- CN109637964A CN109637964A CN201910032804.2A CN201910032804A CN109637964A CN 109637964 A CN109637964 A CN 109637964A CN 201910032804 A CN201910032804 A CN 201910032804A CN 109637964 A CN109637964 A CN 109637964A
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- silicon wafer
- reforming
- gear wheel
- reformed
- drive shaft
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
It reforms structure and its method of reforming the invention discloses a kind of silicon wafer input and output material, it is reformed structure by the way that multiple groups are respectively set on a plurality of counter drive shaft, and structure of reforming narrows from the width and forms a set of normalizing device that transmission shaft combines with a plurality of counter drive shaft, it is rotated by counter drive shaft, the silicon wafer in face of being placed on it is driven and moves in a straight line forward, if silicon wafer not among the area that reforms or skew, reforms gear wheel encountering the more and more narrow area that reforms, can be adjusted in time skew state.If necessary to carry out larger size silicon wafer switching, it is only necessary to which come loose lock nut, and the gear wheel that then will reform is threaded to required position, without replacing whole counter drive shaft.
Description
Technical field
The present invention relates to a kind of feed inlet and outlet normalizing devices, can be switched fast under the premise of being changed without entire normalizing device
It reforms required for different size silicon wafers rib position, belongs to a kind of semiconductor and solar energy cleaning equipment and wet-treating is set
It is standby, especially chain type cleaning equipment and wet processing apparatus.
Background technique
In cleaning industry, especially chain type wet-treating industry, silicon wafer often is equipped in main equipment inlet and outlet and is reformed dress
It sets, skew does not occur to reach silicon wafer when entering equipment, is substantially all made of stationary structure at present, since silicon wafer raw material is raw
The innovation of production technology, silicon wafer develop to large scale direction, and the silicon wafer of such as traditional 125 square is gradually by market, at present
Mainstream is the silicon wafer of 156 square, also has the silicon wafer of 166 square in the near future.When being fed die size, tradition is reformed dress
It sets and needs integral replacing that can be applicable in.Switching surfaces are higher, and change larger.
Summary of the invention
The problem to be solved in the present invention is that traditional silicon wafer feed inlet and outlet normalizing device is not applied for sizes silicon wafer
Problem.
In order to solve the above-mentioned technical problem, it reforms structure the technical solution of the present invention is to provide a kind of silicon wafer input and output material,
Including bottom plate, the bottom plate is equipped with main shaft, and the main shaft is fixed on bottom plate by bearing support block, the master
Multiple main drive gears are installed, the main drive gear is fixed on bottom plate with the side of main shaft respectively on transmission shaft
Multiple auxiliary driving gear engagements, the multiple auxiliary driving gear are separately connected a plurality of counter drive shaft, and a plurality of counter drive shaft is simultaneously
Column arrange, and are equipped with the structure of reforming for silicon wafer of reforming on a plurality of counter drive shaft arranged side by side side by side respectively, described to set side by side
The multiple structures of reforming set are on same middle line, and the structure size of reforming arranged side by side is according to silicon wafer movement side shown in arrow A
To forming the dress of reforming that the size of a set of longitudinal arrangement and structure of reforming becomes narrow gradually from the bottom to top on multiple counter drive shafts
It sets；By the normalizing device, make silicon wafer when by moving from the bottom to top shown in arrow A, passes through the structure of reforming become narrow gradually
Size adjust not among normalizing device or the silicon wafer of skew.
Preferably, more set normalizing devices are equipped on a plurality of counter drive shaft side by side, reforming for silicon wafer can be carried out simultaneously
Adjustment, improves efficiency.
Preferably, the structure of reforming includes a pair of gear wheel of reforming being arranged on counter drive shaft, the gear wheel one of reforming
The edge at end is equipped with the baffle of convex, and this is oppositely arranged baffle, the silicon wafer for be placed on this to reform gear wheel it
Between, the edge of the silicon wafer is limited by baffle.
Preferably, the gear wheel other end of reforming is equipped with the lock nut for locking gear wheel of reforming, and returns for limiting
The displacement of positive gear wheel.
Preferably, the multiple groups on every counter drive shaft, which are reformed, is equipped with limiting slot between structure.
Preferably, limit stop ring is equipped in the limiting slot, barrier when for running between adjacent structure of reforming and
Damping.
Preferably, the lock nut, reform gear wheel and counter drive shaft is connected through a screw thread, for the ruler according to silicon wafer
It is very little, each pair of the distance between gear wheel upper stop piece of reforming is adjusted, and lock nut determines gear wheel adjusted of reforming by screw fastening.
Preferably, locating slot, and the side by being arranged in locating slot are equipped between the lock nut and counter drive shaft
Retaining ring sealing.
It reforms method the present invention also provides a kind of silicon wafer input and output material, steps are as follows:
S1: silicon wafer is put into the normalizing device:
S2: being rotated by motor driven main shaft and drive main drive gear and auxiliary driving gear gear motion, thus
Tape splicing move counter drive shaft rotation, make on counter drive shaft reform gear wheel drive silicon wafer according to the direction of motion shown in arrow A forward
It moves in a straight line；
It becomes narrow gradually if silicon wafer not in the centre of normalizing device or skew, is transmitted the edge of forward silicon wafer encountering
Reform in structure reform gear wheel when, skew state can be adjusted in time.
Multiple groups are respectively set on a plurality of counter drive shaft and reform structure by the present invention, and structure of reforming narrows from the width and a plurality of pair
Transmission shaft forms a set of normalizing device of transmission shaft combination, is rotated by counter drive shaft, the silicon wafer in the face that is placed on it is driven
It moves in a straight line forward, if silicon wafer not among the area that reforms or skew, is reformed gear wheel, i.e., encountering the more and more narrow area that reforms
Skew state can be adjusted in time.If necessary to carry out larger size silicon wafer switching, it is only necessary to which come loose lock nut, then will return
Position required for positive gear wheel is threaded to, without replacing whole counter drive shaft.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of silicon wafer input and output material normalizing device provided by the invention；
Fig. 2 is the schematic structural cross-sectional view of structure of reforming in Fig. 1.
Serial number is as follows in figure:
1, main drive gear；2, counter drive shaft；3, silicon wafer；4, limiting slot；5, limit stop ring；6, it reforms gear wheel；7, it locks
Nut.
Specific embodiment
In order to make the present invention more obvious and understandable, hereby with preferred embodiment, and attached drawing is cooperated to be described in detail below.
It as shown in Figure 1 and Figure 2, include bottom plate for a kind of silicon wafer input and output material provided by the invention structure of reforming, on the bottom plate
Equipped with main shaft, the main shaft is fixed on bottom plate by bearing support block, is equipped on the main shaft multiple
Main drive gear 1, multiple auxiliary driving gears that the main drive gear 1 is fixed on bottom plate respectively with the side of main shaft are nibbled
It closes, the multiple auxiliary driving gear is separately connected a plurality of counter drive shaft 2, a plurality of 2 arranged in parallel of counter drive shaft；It is described arranged side by side
A plurality of counter drive shaft 2 on be equipped with structure of reforming for silicon wafer 3 of reforming side by side respectively, the structure of reforming includes a pair of of setting
Gear wheel 6 of reforming on counter drive shaft 2, the edge of described 6 one end of gear wheel of reforming are equipped with the baffle 6-1 of convex, and this is to gear
Piece 6-1 is oppositely arranged, and the silicon wafer 3 is for being placed on this between gear wheel 6 of reforming, and the edge of the silicon wafer 3 is by baffle 6-1 institute
Limitation, 6 other end of gear wheel of reforming is equipped with the lock nut 7 for locking gear wheel 6 of reforming, for limiting gear wheel 6 of reforming
Displacement.
The multiple structures of reforming being set side by side are on same middle line, and the structure size of reforming arranged side by side is according to arrow
3 direction of motion of silicon wafer shown in A, formed on multiple counter drive shafts 2 size of a set of longitudinal arrangement and structure of reforming by down toward
On the normalizing device that becomes narrow gradually；By the normalizing device, makes silicon wafer 3 when by moving from the bottom to top shown in arrow A, pass through
The size of the structure of reforming become narrow gradually adjusts not among normalizing device or the silicon wafer 3 of skew.
Further, the lock nut 7, gear wheel 6 of reforming are connected through a screw thread with counter drive shaft 2, for according to silicon wafer
Size adjusts each pair of the distance between 6 upper stop piece 6-1 of gear wheel that reforms, and lock nut 7 determines adjusted reform by screw fastening
Gear wheel 6；Locating slot, and the side block circle 7-1 by being arranged in locating slot are equipped between the lock nut 7 and counter drive shaft 2
Sealing.
Further, more set normalizing devices are equipped on a plurality of counter drive shaft 2 side by side, returning for silicon wafer 3 can be carried out simultaneously
Positive justification improves efficiency, and the multiple groups on every counter drive shaft 2, which are reformed, is equipped with limiting slot 4, the limiting slot 4 between structure
It is interior to be equipped with limit stop ring 5, barrier and damping when for running between adjacent structure of reforming.
A kind of silicon wafer input and output material provided by the invention is reformed method, and steps are as follows:
S1: silicon wafer 3 is put into the normalizing device:
S2: being rotated by motor driven main shaft and drive main drive gear 1 and auxiliary driving gear gear motion, thus
Tape splicing moves counter drive shaft 2 and rotates, and the gear wheel 6 of reforming on counter drive shaft 2 is made to drive silicon wafer 3 according to the direction of motion shown in arrow A
It moves in a straight line forward；
Gradually become if silicon wafer 3 not in the centre of normalizing device or skew, is transmitted the edge of forward silicon wafer 3 encountering
It is narrow reform in structure reform gear wheel 6 when, skew state can be adjusted in time.
Multiple groups are respectively set on a plurality of counter drive shaft and reform structure by the present invention, and structure of reforming narrows from the width and a plurality of pair
Transmission shaft forms a set of normalizing device of transmission shaft combination, is rotated by counter drive shaft, the silicon wafer in the face that is placed on it is driven
It moves in a straight line forward, if silicon wafer not among the area that reforms or skew, is reformed gear wheel, i.e., encountering the more and more narrow area that reforms
Skew state can be adjusted in time.If necessary to carry out larger size silicon wafer switching, it is only necessary to which come loose lock nut, then will return
Position required for positive gear wheel is threaded to, without replacing whole counter drive shaft.
Claims (9)
- Structure, including bottom plate 1. a kind of silicon wafer input and output material is reformed, the bottom plate are equipped with main shaft, and the main shaft passes through Bearing support block is fixed on bottom plate, and multiple main drive gears (1), the main drive gear are equipped on the main shaft (1) the multiple auxiliary driving gears being fixed on respectively with the side of main shaft on bottom plate engage, the multiple auxiliary driving gear point It does not connect a plurality of counter drive shaft (2), a plurality of counter drive shaft (2) arranged in parallel, which is characterized in that a plurality of pair arranged side by side It is equipped with the structure of reforming for silicon wafer of reforming (3) on transmission shaft (2) side by side respectively, the multiple structures of reforming being set side by side exist On same middle line, the structure size of reforming arranged side by side is according to silicon wafer shown in arrow A (3) direction of motion, in multiple auxiliary driving The normalizing device that the size of a set of longitudinal arrangement and structure of reforming becomes narrow gradually from the bottom to top is formed on axis (2)；It is reformed by this Device makes silicon wafer (3) when by moving from the bottom to top shown in arrow A, is adjusted by the size of the structure of reforming become narrow gradually It is whole not among normalizing device or skew silicon wafer (3).
- The structure 2. a kind of silicon wafer input and output material according to claim 1 is reformed, which is characterized in that a plurality of counter drive shaft (2) more set normalizing devices are equipped on side by side, the adjustment of reforming of silicon wafer (3) can be carried out simultaneously, improved efficiency.
- The structure 3. a kind of silicon wafer input and output material according to claim 2 is reformed, which is characterized in that the structure of reforming includes one To the gear wheel of reforming (6) being arranged on counter drive shaft (2), the edge of described gear wheel of reforming (6) one end is equipped with the baffle of convex (6-1), and this is oppositely arranged baffle (6-1), the silicon wafer (3) is for being placed on this between gear wheel of reforming (6), the silicon The edge of piece (3) is limited by baffle (6-1).
- The structure 4. a kind of silicon wafer input and output material according to claim 3 is reformed, which is characterized in that the gear wheel of reforming (6) is another One end is equipped with the lock nut (7) for locking gear wheel of reforming (6), for limiting the displacement of gear wheel of reforming (6).
- 5. being reformed structure according to a kind of described in any item silicon wafer input and output materials of claim 2-4, which is characterized in that every pair Multiple groups on transmission shaft (2) reform and are equipped with limiting slot (4) between structure.
- The structure 6. a kind of silicon wafer input and output material according to claim 5 is reformed, which is characterized in that set in the limiting slot (4) There are limit stop ring (5), the barrier and damping when for running between adjacent structure of reforming.
- The structure 7. a kind of silicon wafer input and output material according to claim 6 is reformed, which is characterized in that the lock nut (7) is returned Positive gear wheel (6) is connected through a screw thread with counter drive shaft (2), for the size according to silicon wafer, is adjusted and is kept off on each pair of gear wheel of reforming (6) The distance between piece (6-1), and lock nut (7) determines gear wheel of reforming (6) adjusted by screw fastening.
- The structure 8. a kind of silicon wafer input and output material according to claim 7 is reformed, which is characterized in that the lock nut (7) with Locating slot is equipped between counter drive shaft (2), and the side block circle (7-1) by being arranged in locating slot seals.
- A kind of method 9. silicon wafer input and output material according to claim 1-8 is reformed, steps are as follows:S1: silicon wafer (3) is put into the normalizing device:S2: it is rotated by motor driven main shaft and drives main drive gear (1) and auxiliary driving gear gear motion, thus indirectly Counter drive shaft (2) rotation is driven, makes the gear wheel of reforming (6) on counter drive shaft (2) that silicon wafer (3) be driven to transport according to shown in arrow A Dynamic direction moves in a straight line forward；Gradually become if silicon wafer (3) not in the centre of normalizing device or skew, is transmitted the edge of forward silicon wafer (3) encountering When narrow gear wheel of reforming (6) reformed in structure, skew state can be adjusted in time.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910032804.2A CN109637964B (en) | 2019-01-14 | 2019-01-14 | Silicon wafer feeding and discharging righting structure and righting method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910032804.2A CN109637964B (en) | 2019-01-14 | 2019-01-14 | Silicon wafer feeding and discharging righting structure and righting method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109637964A true CN109637964A (en) | 2019-04-16 |
| CN109637964B CN109637964B (en) | 2023-09-19 |
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| CN201910032804.2A Active CN109637964B (en) | 2019-01-14 | 2019-01-14 | Silicon wafer feeding and discharging righting structure and righting method thereof |
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| CN207403325U (en) * | 2017-10-19 | 2018-05-25 | 苏州矽美仕绿色新能源有限公司 | Applied to the device of reforming at laminating machine charging |
| CN209641641U (en) * | 2019-01-14 | 2019-11-15 | 上海釜川自动化设备有限公司 | A kind of silicon wafer input and output material is reformed structure |
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| KR20120023246A (en) * | 2010-09-01 | 2012-03-13 | 엘지디스플레이 주식회사 | Substrate supporting apparatus |
| CN102769065A (en) * | 2011-05-06 | 2012-11-07 | 宇通光能股份有限公司 | Guider and substrate conveying device thereof |
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| CN109637964B (en) | 2023-09-19 |
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