CN109622345B - Ultrasonic transducer - Google Patents
Ultrasonic transducer Download PDFInfo
- Publication number
- CN109622345B CN109622345B CN201811490315.3A CN201811490315A CN109622345B CN 109622345 B CN109622345 B CN 109622345B CN 201811490315 A CN201811490315 A CN 201811490315A CN 109622345 B CN109622345 B CN 109622345B
- Authority
- CN
- China
- Prior art keywords
- array
- layer
- ultrasonic transducer
- transducer
- backing layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000001514 detection method Methods 0.000 claims abstract description 10
- 239000000463 material Substances 0.000 claims description 30
- 238000002604 ultrasonography Methods 0.000 claims description 16
- 239000007787 solid Substances 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 14
- 239000000945 filler Substances 0.000 claims description 8
- PILOURHZNVHRME-UHFFFAOYSA-N [Na].[Ba] Chemical compound [Na].[Ba] PILOURHZNVHRME-UHFFFAOYSA-N 0.000 claims description 2
- FSAJRXGMUISOIW-UHFFFAOYSA-N bismuth sodium Chemical compound [Na].[Bi] FSAJRXGMUISOIW-UHFFFAOYSA-N 0.000 claims description 2
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 claims description 2
- BITYAPCSNKJESK-UHFFFAOYSA-N potassiosodium Chemical compound [Na].[K] BITYAPCSNKJESK-UHFFFAOYSA-N 0.000 claims description 2
- 238000003980 solgel method Methods 0.000 claims description 2
- 230000007547 defect Effects 0.000 abstract description 7
- 230000035945 sensitivity Effects 0.000 abstract description 5
- 239000004005 microsphere Substances 0.000 description 12
- 239000000523 sample Substances 0.000 description 10
- 239000002131 composite material Substances 0.000 description 7
- 239000003822 epoxy resin Substances 0.000 description 7
- 229920000647 polyepoxide Polymers 0.000 description 7
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 230000009969 flowable effect Effects 0.000 description 3
- 239000011734 sodium Substances 0.000 description 3
- 239000004215 Carbon black (E152) Substances 0.000 description 2
- 229910010252 TiO3 Inorganic materials 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- 150000002430 hydrocarbons Chemical class 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 230000001788 irregular Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 229910003327 LiNbO3 Inorganic materials 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000001934 delay Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000001802 infusion Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000011344 liquid material Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000009659 non-destructive testing Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 238000000992 sputter etching Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/0207—Driving circuits
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
- G01N29/24—Probes
- G01N29/2437—Piezoelectric probes
Abstract
An ultrasonic transducer is disclosed, comprising: the ultrasonic detection device comprises a first ultrasonic transducer array, a second ultrasonic transducer array and a phase control array transducer array, wherein the first ultrasonic transducer array is a phased array transducer array and comprises a plurality of independent first array elements which are arranged in a plane and used for detecting the plane; the second ultrasonic transducer array is a convex array transducer array and comprises a plurality of independent second array elements, the independent second array elements are arranged in a curved surface mode and used for detecting the curved surface, the defect of an irregular-shaped workpiece can be detected through the ultrasonic transducer, and the detection sensitivity is improved.
Description
Technical Field
The application relates to the technical field of transducers, in particular to an ultrasonic transducer.
Background
In the aspect of ultrasonic nondestructive testing technology, the frequency of a common ultrasonic probe for testing is low and is mostly within 10MHz, wherein a single probe accounts for the majority, and part of the probes are phased array probes. The design of ultrasonic phased array probe commonly used is based on huygens' principle, and the probe has the array element that is one-dimensional range on the azimuth direction, and mutual independence between every array element stimulates every array element according to certain electron time delay to form a new ultrasonic wave array face, through exerting different electron time delays, can make the ultrasonic beam take place to deflect, in order to satisfy various measuring needs.
The inventor of the application finds in long-term research that when a workpiece to be detected has a cylindrical hole and needs to detect a fine defect near the cylindrical surface, the frequency of the existing probe is not high enough, and only ultrasonic waves can reach the vicinity of the cylindrical surface through other surfaces on the workpiece, so that the defect near the cylindrical surface is indirectly detected, that is, the sensitivity of the existing probe is not high enough, and the resolution is not enough.
Disclosure of Invention
In view of the above, the present application provides an ultrasonic transducer capable of detecting irregularly shaped workpieces, providing detection sensitivity.
In order to solve the technical problem, the application adopts a technical scheme that: provided is an ultrasonic transducer including:
the ultrasonic detection device comprises a first ultrasonic transducer array, a second ultrasonic transducer array and a third ultrasonic transducer array, wherein the first ultrasonic transducer array is a phased array transducer array and comprises a plurality of independent first array elements which are arranged in a plane and used for detecting the plane;
and the second ultrasonic transducer array is a convex array transducer array and comprises a plurality of independent second array elements, and the plurality of independent second array elements are arranged in a curved surface manner and used for detecting the curved surface.
The beneficial effect of this application is: ultrasonic transducer in this application can detect the defect on plane and the curved surface simultaneously including the phased array transducer array that is the plane and arranges and the convex array transducer array that the curved surface arranged, can detect the irregularly-shaped work piece of shape, compares prior art, can improve the sensitivity that detects.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts. Wherein:
FIG. 1 is a schematic structural diagram of an embodiment of an ultrasound transducer of the present application;
FIG. 2 is a cross-sectional view of the ultrasonic transducer of FIG. 1 taken along A-A;
fig. 3 is a cross-sectional view of the ultrasonic transducer of fig. 1 taken along the direction B-B.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
Referring to fig. 1 to 3, fig. 1 is a schematic structural diagram of an embodiment of an ultrasound transducer of the present application, fig. 2 is a sectional view of the ultrasound transducer of fig. 1 along a direction a-a, and fig. 3 is a sectional view of the ultrasound transducer of fig. 1 along a direction B-B. The ultrasonic transducer 100 includes a first ultrasonic transducer array 10 and a second ultrasonic transducer array 20, the first ultrasonic transducer array 10 being a phased array transducer array 10, and the second ultrasonic transducer array 20 being a convex array transducer array 20.
In the prior art, the phased array transducer array 10 is used in a phased array probe and the convex array transducer array 20 is used in a convex array probe.
The first ultrasonic transducer array 10 is used for detecting a plane, and includes a plurality of independent first array elements 11, where the plurality of first array elements 11 are arranged in a plane, where the number of the first array elements 11 may be multiple, for example, 5, 8, etc.; the second ultrasonic transducer array 20 is used for detecting a curved surface, and includes a plurality of independent second array elements 21, where the plurality of independent second array elements 21 are arranged in a curved surface, where the number of the second array elements 21 is also multiple, for example, 64, 128, 256, and the like, and the number of the first array elements 11 and the second array elements 21 is not limited in this application.
The first ultrasonic transducer array 10 and the second ultrasonic transducer array 20 work on different principles, and when the first ultrasonic transducer array 10 works, an independent excitation signal is applied to each first array element 11 according to a certain time delay; when the second ultrasonic transducer array 20 works, it is assumed that it includes 128 second array elements 21, it is assumed that No. 1-8 second array elements 21 are No. 1 subarrays, No. 2-9 second array elements are No. 2 subarrays, No. 3-10 second array elements are No. 3 subarrays … … 121-128 second array elements are No. 121 subarrays, the sequence of the whole scanning period is that No. 1 subarrays transmit and receive ultrasonic waves, No. 2 subarrays finish tasks of transmitting and receiving ultrasonic waves, then No. 3 subarrays perform work of transmitting and receiving ultrasonic waves, and go down in sequence until No. 121 subarrays finish tasks of transmitting and receiving ultrasonic waves, namely, a scanning period is finished. It should be noted that the scanning mode of the second ultrasound transducer array 20 may also be an interval scanning mode, which is not limited herein. In the prior art, convex array transducer array 20 is generally used for medical instrument, and it can form images to human tissue, and human tissue is soft, and inspection equipment is when the inspection back of contacting with the human body, and human tissue can produce deformation, and human tissue is visible as the curved surface this moment, and the wave front that convex array transducer array 20 produced simultaneously also is the curved surface, that is to say, convex array transducer array 20 is effectual to the curved surface detection.
Therefore, in the present embodiment, the ultrasonic transducer 100 is provided to include the phased array transducer array 10 for detecting a plane and the convex array transducer array 20 for detecting a curved surface, when the shape of the workpiece to be detected is irregular, for example, when the workpiece to be detected includes both a plane and a curved surface, the first ultrasonic transducer array 10 can detect a plane portion on the workpiece, and the second ultrasonic transducer array 20 can detect a curved surface portion on the workpiece, that is, compared with the prior art, the curved surface on the workpiece can be directly detected by using the ultrasonic transducer 100 in the present application without using an indirect detection method, so that the detection sensitivity can be improved.
With continued reference to fig. 1, the plurality of independent first array elements 11 are arranged to form a circular surface 12, and the plurality of second array elements 21 are arranged to form a curved surface 22 extending around the circumference of the circular surface 12 and in a direction perpendicular to one side of the circular surface 12, i.e. the curved surface 22 is perpendicular to the side wall of the circular surface 12.
Specifically, the ultrasound transducer 100 composed of the first ultrasound transducer array 10 and the second ultrasound transducer array 20 has a cylindrical shape. When a cylindrical hole exists in a workpiece to be detected, the transducer 100 can go deep into the cylindrical hole for detection, wherein the first ultrasonic transducer array 10 can detect a defect on the bottom surface of the cylindrical hole, and the second ultrasonic transducer array 20 can detect a defect on the cylindrical surface of the cylindrical hole.
The curved surface 22 formed by arranging the plurality of second array elements 21 surrounds the circumference of the circular surface 12, so that when the cylindrical holes on the workpiece are detected, the second ultrasonic transducer array 20 can detect the whole cylindrical surface of the cylindrical holes at one time. Of course, in other embodiments, the curved surface 22 formed by the plurality of second array elements 21 may also partially surround the circular surface 12 formed by the plurality of first array elements 11, and in this case, when detecting the cylindrical hole, the detection of the entire cylindrical surface in the cylindrical hole may be completed by rotating the ultrasonic transducer 100.
The first array elements 21 are distributed annularly according to concentric circles, and the second array elements 22 are arranged in parallel and extend in a direction away from the circular surface 12, that is, the extending direction of the second array elements 22 is perpendicular to the circular surface 12. Of course, in other embodiments, the plurality of first array elements 11 may also be arranged in parallel along the diameter direction of the circular surface 12, and the plurality of second array elements 22 may also be arranged in parallel along the circumferential direction, that is, the single second array element 21 is a ring, and the relative arrangement manner of the first array elements 11 and the second array elements 22 is not limited in this application.
With continued reference to fig. 1, the ultrasonic transducer 100 further includes a substrate 30, the substrate 30 surrounding the circumference of the circular surface 12 and extending in a direction perpendicular to one side of the circular surface 12, wherein the second ultrasonic transducer array 20 is fixed on the substrate 30, i.e., the first ultrasonic transducer array 10 and the second ultrasonic transducer array 20 are fixed and supported by the substrate 30.
The material of the substrate 30 may be a single material or a composite material. Specifically, the material may be a material having good flexibility, such as metal, polyimide, or the like, or may be an epoxy resin having good flexibility after being cured. In an application scenario, ground lines electrically connected to the first ultrasonic transducer array 10 and the second ultrasonic transducer array 20 may be fabricated on the substrate 30.
Referring to fig. 2, the first ultrasonic transducer array 11 includes a first backing layer 111, a first transducer layer 112 covering the first backing layer 111, and a first matching layer 113 covering the first transducer layer 112, with a plurality of first cuts 114 extending from the first matching layer 113 to the first backing layer 111 to form a plurality of independent first elements 11.
In preparation, a flowable, curable backing layer material may be combined with the first transducer layer 112 by infusion, or may be pre-formed and adhered to the first transducer layer 112 by an adhesive. The first backing layer 111 has a uniform acoustic impedance or is graded along the direction of acoustic emission.
The first backing layer 111 is a solid layer 111, and the plurality of first slits 114 are filled with a solid filler or a gaseous filler, or the first backing layer 111 is a gas layer 111, and the plurality of first slits 114 are filled with a solid filler.
Specifically, the material of the first backing layer 111 is a single material or a composite material, the single material includes but is not limited to metal, epoxy resin, zirconia, alumina, etc., the composite material includes microspheres suspended in epoxy resin or other flowable, curable liquid substance, the material of the microspheres may be metal, silica, alumina, zirconia, rubber, or other material, the microspheres may be hollow solid microspheres including a surrounding or encapsulating gas (air or a gas such as hydrocarbon gas), or solid microspheres, and the microspheres may be mixed with epoxy resin or polymer in different proportions, so as to obtain composite materials with different consistencies and densities. The material filled in the first plurality of slits 114 may be a single material, or may be a composite material, the single material includes but is not limited to a curable filling material such as epoxy resin, silicon rubber, etc., the composite material includes microspheres suspended in epoxy resin or other flowable, curable liquid material, the material of the microspheres may be metal, silica, alumina, zirconia, rubber, or other material, the microspheres may be hollow solid microspheres including a surrounding or encapsulating gas (air or a gas such as hydrocarbon gas), or may be solid microspheres, and the microspheres may be mixed with epoxy resin or polymer in different proportions, so as to obtain composite materials with different consistencies and densities. The first cutouts 114 may be filled with a gaseous filling material, and the filled gaseous filling material may be a gas or a mixed gas. It should be noted that, when the first backing layer 111 is a gas layer 111, in order to fix the plurality of first array elements 11, the plurality of first slits 114 must be filled with a solid filler.
Wherein the width of the plurality of first cuts 114 is substantially the same, the width thereof is between 10-100 μm, and the acoustic impedance of the filler in the plurality of first cuts 114 is uniform or gradually changes along the emission direction of the sound wave.
The first transducer layer 112 includesOne or more transducer elements configured to transmit ultrasonic energy at a central operating frequency (hundred megahertz or more). In one application scenario, the first transducer layer 112 is a thin film layer made of K0.5Na0.5NbO3/Bi0.5Na0.5TiO3(KNN/BNT, potassium sodium niobate/bismuth sodium titanate), LiNbO3(lithium niobate), Ba0.5Na0.5TiO3(BNT, barium sodium titanate), the first transducer layer 112 made of these materials is very thin, usually has a thickness of only tens of micrometers, and can generate ultrasonic waves with very high frequency when vibrating, which can reach hundreds of megahertz or more, thereby improving the resolution of the ultrasonic transducer 100 compared with the prior art, and in an application scenario, the first transducer layer 112 is made by using a sol-gel method. Of course, in other application scenarios, the first transducer layer 112 may be made of other materials that can be made into a piezoelectric film, or made by using other manufacturing processes, which is not limited herein.
The first matching layer 113 is smaller than the acoustic impedance of the first transducer layer 112, and since the frequency of the ultrasonic waves generated by the first transducer layer 112 is high in this embodiment, the thickness of the first matching layer 113 is small. In one application scenario, the first matching layer 113 may be formed directly on the first transducer layer 112 by a process including, but not limited to, vacuum coating, or a separately prepared first matching layer 113 may be bonded to the surface of the first transducer layer 112 by using a curable adhesive of the epoxy or the like type.
In an application scenario, the first matching layer 113 includes a plurality of sub-matching layers arranged in a stacked manner, which is schematically illustrated in fig. 2 by two sub-matching layers 1131, 1132. In the acoustic wave emitting direction, the acoustic impedance of the multiple sub-matching layers gradually decreases, that is, the acoustic impedance of layer 1132 is smaller than the acoustic impedance of layer 1131 in fig. 2.
After the first backing layer 111, the first transducer layer 112 and the first matching layer 113 are bonded, a plurality of first cutouts 114 extending from the first matching layer 113 to the first backing layer 111 are formed by photolithography, chemical etching, ion etching or mechanical cutting with a blade to form a plurality of independent first arrays 11. In an application scenario, the plurality of first cuts 114 extend to the first backing layer 111, but do not extend through the first backing layer 111.
Wherein, in order to ensure that the electrical impedance of the first array elements 11 is equivalent, the sound wave emitting areas of the first array elements 11 are the same.
Referring to fig. 3, the second ultrasonic transducer array 20 includes a second backing layer 211 secured to the substrate 30, a second transducer layer 212 overlying the second backing layer 211, and a second matching layer 213 overlying the second transducer layer 212, with a plurality of second cuts 214 extending from the second matching layer 213 to the second backing layer 211 to form a plurality of individual second array elements 21.
The second ultrasonic transducer array 20 is similar to the first ultrasonic transducer array 10 in the manufacturing method, and will not be described in detail. The second backing layer 211, the second transducer layer 212, and the second matching layer 213 in the second ultrasound transducer array 20 correspond to and have the same function as the first backing layer 111, the first transducer layer 112, and the first matching layer 113 in the first ultrasound transducer array 10, and the selection range of each layer of material corresponds to and is approximately the same as the selection range of each layer of material in the first ultrasound transducer array 10, which can be referred to above for details and will not be described herein again. The properties and thicknesses of the layers of the second ultrasonic transducer array 20 may be the same as or different from those of the layers of the first ultrasonic transducer array 10, for example, when the frequencies of the ultrasonic waves emitted by the first ultrasonic transducer array 10 and the second ultrasonic transducer array 20 are different, the material properties and thicknesses of the first transducer layer 112 and the second transducer layer 212 may be different, so that the material properties and thicknesses of the first backing layer 111 and the second backing layer 211 are different, and the material properties and thicknesses of the first matching layer 113 and the second matching layer 213 are different.
It should be noted that, in the second ultrasound transducer array 20, the plurality of second cuts 214 may extend from the second matching layer 213 only to the second backing layer 211, or may extend from the second matching layer 213 and through the second backing layer 211 to extend to the substrate 30, but cannot extend through the substrate 30 at this time, wherein the material selection range filled in the second cuts 214 is substantially the same as the material selection range filled in the first cuts 114, which is not described herein, and meanwhile, the acoustic impedance of the material filled in the second cuts 214 is uniform or gradually changes along the emission direction of the acoustic wave. Wherein the width of the second cut 214 is also between 10-100 microns.
While in the second ultrasound transducer array 20 the second backing layer 20 is a solid layer 20 and the second cut-out 214 is filled with a solid or gaseous filling, i.e. the material of the second backing layer 211 cannot be a gas, unlike the first ultrasound transducer array 10.
As with the first ultrasonic transducer array 10, the sound wave emitting areas of the second array elements 21 are the same, so as to ensure that the electrical impedances of the second array elements 21 are the same; the acoustic impedance of the second transducer layer 212 is greater than the acoustic impedance of the second matching layer 213, and the second matching layer 213 also includes a plurality of sub-matching layers, which are schematically illustrated in fig. 3 by 2 sub-matching layers 2131, 2132, and the acoustic impedances of the sub-matching layers decrease gradually along the direction of sound wave emission, i.e., the acoustic impedance of layer 2132 in fig. 3 is less than the acoustic impedance of layer 2131.
In summary, the ultrasonic transducer 100 of the present application includes the phased array transducer array 10 in a planar arrangement and the convex array transducer array 20 in a curved arrangement, so that defects on the planar and curved surfaces can be detected simultaneously, and a workpiece with an irregular shape can be detected.
The above description is only for the purpose of illustrating embodiments of the present application and is not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by the contents of the specification and the drawings of the present application or are directly or indirectly applied to other related technical fields, are also included in the scope of the present application.
Claims (8)
1. An ultrasonic transducer, comprising:
the ultrasonic detection device comprises a first ultrasonic transducer array, a second ultrasonic transducer array and a third ultrasonic transducer array, wherein the first ultrasonic transducer array is a phased array transducer array and comprises a plurality of independent first array elements which are arranged in a plane and used for detecting the plane;
the second ultrasonic transducer array is a convex array transducer array and comprises a plurality of independent second array elements which are arranged in a curved surface manner and used for detecting the curved surface;
it is wherein, it is a plurality of independent first array element is arranged into the disc, and is a plurality of second array element is arranged and is formed the curved surface centers on the circumference of disc and to the perpendicular one side direction of disc extends, and is a plurality of simultaneously the sound wave emission area of first array element is the same, and is a plurality of the sound wave emission area of second array element is the same.
2. The ultrasonic transducer of claim 1,
the curved surface that a plurality of second array element was arranged and is formed surrounds the circumference of round surface, and a plurality of first array element is annular according to the concentric circles simultaneously and distributes, and is a plurality of second array element is parallel and extends along keeping away from the direction of round surface.
3. The ultrasonic transducer of claim 1,
the ultrasonic transducer includes: a substrate surrounding a circumference of the circular surface and extending in a direction perpendicular to a side of the circular surface, wherein the second ultrasonic transducer array is fixed on the substrate;
the first ultrasound transducer array includes a first backing layer, a first transducer layer overlying the first backing layer, and a first matching layer overlying the first transducer layer, with a plurality of first cuts extending from the first matching layer to the first backing layer to form a plurality of the individual first array elements;
the second ultrasound transducer array includes a second backing layer secured to the substrate, a second transducer layer overlying the second backing layer, and a second matching layer overlying the second transducer layer, with a plurality of second kerfs extending from the second matching layer to the second backing layer to form a plurality of the second individual array elements.
4. The ultrasonic transducer of claim 3,
the acoustic impedance of the first transducer layer is larger than that of the first matching layer, the acoustic impedance of the second transducer layer is larger than that of the second matching layer, meanwhile, the first matching layer/the second matching layer comprise multiple sub-matching layers which are arranged in a laminated mode, and the acoustic impedances of the multiple sub-matching layers are gradually reduced along the sound wave emission direction.
5. The ultrasonic transducer of claim 3,
the plurality of first cuts do not extend through the first backing layer, the plurality of second cuts extend through the second backing layer and to the substrate, but the plurality of second cuts do not extend through the substrate.
6. The ultrasonic transducer of claim 3,
the first backing layer is a solid layer, and the plurality of first cuts are filled with solid fillers or gaseous fillers, or the first backing layer is a gas layer, and the plurality of first cuts are filled with solid fillers;
the second backing layer is a solid layer, and the second incision is filled with a solid or gaseous filling.
7. The ultrasonic transducer according to claim 3 wherein the material of said first/second transducer layer is one of potassium sodium niobate/bismuth sodium titanate, lithium niobate, barium sodium titanate.
8. The ultrasonic transducer of claim 3, wherein the first/second transducer layers are fabricated using a sol-gel process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811490315.3A CN109622345B (en) | 2018-12-06 | 2018-12-06 | Ultrasonic transducer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811490315.3A CN109622345B (en) | 2018-12-06 | 2018-12-06 | Ultrasonic transducer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109622345A CN109622345A (en) | 2019-04-16 |
| CN109622345B true CN109622345B (en) | 2020-08-28 |
Family
ID=66071755
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811490315.3A Active CN109622345B (en) | 2018-12-06 | 2018-12-06 | Ultrasonic transducer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109622345B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113030266A (en) * | 2021-03-25 | 2021-06-25 | 武汉理工大学 | Automobile third-generation hub bearing outer ring ultrasonic phased array detection device and method |
| CN113812973A (en) * | 2021-09-06 | 2021-12-21 | 江苏霆升科技有限公司 | Miniature ultrasonic transducer based on thermosensitive backing |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL9001755A (en) * | 1990-08-02 | 1992-03-02 | Optische Ind De Oude Delft Nv | ENDOSCOPIC SCANNER. |
| US9789515B2 (en) * | 2014-05-30 | 2017-10-17 | Fujifilm Dimatix, Inc. | Piezoelectric transducer device with lens structures |
| CN107765237B (en) * | 2017-04-20 | 2020-01-31 | 丁贤根 | phased array identification method and system |
| CN206763314U (en) * | 2017-05-31 | 2017-12-19 | 陈江龙 | A kind of contact ultrasonic transducer for being used to detect |
| CN209502195U (en) * | 2018-12-06 | 2019-10-18 | 深圳先进技术研究院 | Ultrasonic transducer |
-
2018
- 2018-12-06 CN CN201811490315.3A patent/CN109622345B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN109622345A (en) | 2019-04-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Hu et al. | Stretchable ultrasonic transducer arrays for three-dimensional imaging on complex surfaces | |
| JP3478874B2 (en) | Ultrasonic phased array converter and method of manufacturing the same | |
| US8408063B2 (en) | Ultrasonic probe, and ultrasonic diagnostic apparatus using the same | |
| US9502023B2 (en) | Acoustic lens for micromachined ultrasound transducers | |
| US20210043825A1 (en) | Multi-cell transducer | |
| US20070035204A1 (en) | Dual frequency band ultrasound transducer arrays | |
| US7969067B2 (en) | Ultrasound probe | |
| WO2007126069A1 (en) | Ultrasonic probe | |
| CN109622345B (en) | Ultrasonic transducer | |
| WO2009066184A2 (en) | High frequency piezocomposite and methods for manufacturing same | |
| ES2750800T3 (en) | Procedure and device for broadband measurement with multi-element aerial ultrasound transducers | |
| CN210401326U (en) | Ultrasonic transducer | |
| US20190160491A1 (en) | Multi-element, capacitive, ultrasonic, air-coupled transducer | |
| CN108459085A (en) | Ultrasonic probe | |
| CN109530196B (en) | Transducer assembly and method of making the same | |
| JP2000358299A (en) | Wave transmitting and receiving element for ultrasonic probe, its production method and ultrasonic probe using the same element | |
| JP2009082612A (en) | Ultrasonic probe and piezoelectric transducer | |
| US10828013B2 (en) | Piezoelectric element, ultrasonic probe, ultrasonic measurement device, and manufacturing method of piezoelectric element | |
| US9758668B2 (en) | Method and apparatus for ultrasound transducer arrays with accelerated cure adhesives | |
| CN110095532B (en) | Ultrasonic transducer and method for manufacturing ultrasonic transducer | |
| CN106248802A (en) | A kind of high-resolution TOFD detection ultrasound probe | |
| CN209502195U (en) | Ultrasonic transducer | |
| WO2020113535A1 (en) | Ultrasonic transducer | |
| US20140036633A1 (en) | Ultrasonic probe | |
| US11965994B2 (en) | Ultrasonic transducer for a measuring device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20231018 Address after: 518000 A-301, office building, Shenzhen Institute of advanced technology, No. 1068, Xue Yuan Avenue, Shenzhen University Town, Shenzhen, Guangdong, Nanshan District, China Patentee after: Shenzhen shen-tech advanced Cci Capital Ltd. Address before: 1068 No. 518055 Guangdong city in Shenzhen Province, Nanshan District City Xili University School Avenue Patentee before: SHENZHEN INSTITUTES OF ADVANCED TECHNOLOGY |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20240112 Address after: 200120 Building 1, No. 1235 and 1237, Miaoxiang Road, Lingang New Area, China (Shanghai) Pilot Free Trade Zone, Pudong New Area, Shanghai Patentee after: SHANGHAI NOZOLI MACHINE TOOLS TECHNOLOGY Co.,Ltd. Address before: 518000 A-301, office building, Shenzhen Institute of advanced technology, No. 1068, Xue Yuan Avenue, Shenzhen University Town, Shenzhen, Guangdong, Nanshan District, China Patentee before: Shenzhen shen-tech advanced Cci Capital Ltd. |
|
| TR01 | Transfer of patent right |