CN109612586A - Secondary device method for monitoring state based on infrared thermal imaging - Google Patents
Secondary device method for monitoring state based on infrared thermal imaging Download PDFInfo
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Abstract
This application involves a kind of secondary device method for monitoring state based on infrared thermal imaging: the current infrared thermal imaging data of secondary device are obtained；Current infrared thermal imaging data are compared with Infrared Targets thermal imaging data, obtain comparison result；The current state of secondary device is determined according to comparison result.Using the technological means of infrared imaging and using having insulation breakdown or even apparent fuel factor this phenomenon before most of secondary devices " failure ", a kind of effective selection is provided to the monitoring means of present secondary circuit, it is solved after solving part secondary circuit only and can be carried out accident, it can not carry out accident anticipation and abnormality diagnostic defect, the initiative of the O&M level and O&M that make secondary device has promotion by a relatively large margin, in secondary device status assessment, hidden troubles removing, there is biggish meaning in terms of the work such as O&M inspection, and new distinguishing rule is provided for the O&M state of secondary circuit, get rid of the insufficient predicament of original judgment basis.
Description
Technical field
This application involves infrared thermal imaging technique fields, supervise more particularly to the secondary device state based on infrared thermal imaging
Prosecutor method.
Background technique
Second power equipment supervised primary equipment in electric system, including measurement, control, protection, adjusting
Ancillary equipment, the equipment of usually not direct and electric energy production connection, such as measurement meter, such as voltmeter, ammeter, power
Table, electric energy meter are used for electric parameter in measuring circuit etc.；Primary equipment refers to the equipment for directly transporting and distributing electric energy, such as becomes
Depressor, breaker, disconnecting switch, power cable, bus, power transmission line, reactor, arrester, high-tension fuse, Current Mutual Inductance
Device, voltage transformer etc..Equipment and circuit for electrical secondary system, especially low value equipment, such as traditional relay element,
The circuit CT, the conversion terminal case etc. in place, condition monitoring means are still poor, can only be by monitoring daily tour manually to send out
Existing relevant issues, not only effective monitoring degree is very low in this way, but also the evaluation of relevant monitoring course quantization is difficult, can only almost lean on
" naked eyes " judge visible problem.Various existing hidden danger can not be done and estimated in advance, problem exposure ability has often only been arrived,
Even cannot all it realize, the secondary monitoring requirement under the bulk power grid epoch now is obviously much not achieved in this.
Summary of the invention
Based on this, it is necessary to provide a kind of secondary device method for monitoring state based on infrared thermal imaging.
A kind of secondary device method for monitoring state based on infrared thermal imaging comprising following steps: secondary device is obtained
Current infrared thermal imaging data；The current infrared thermal imaging data are compared with Infrared Targets thermal imaging data, are obtained
To comparison result；The current state of the secondary device is determined according to the comparison result.
Above-mentioned secondary device method for monitoring state utilizes the technological means and the most of secondary devices of utilization of infrared imaging
Insulation breakdown or even apparent fuel factor this phenomenon are had before " failure ", and one is done to secondary device now from new angle
Dress is placed in monitoring, equipment non-device for present secondary circuit, including contactor, relay, terminal block etc. and open air on the spot
It sets, provides a kind of effective selection to present secondary circuit monitoring means few in number, it is secondary to solve part
Circuit solves after only can be carried out accident, can not carry out accident anticipation and abnormality diagnostic defect, keeps the O&M of secondary device horizontal
There is promotion by a relatively large margin with the initiative of O&M, in work sides such as secondary device status assessment, hidden troubles removing, O&M inspections
There is biggish meaning in face, provides important tool for secondary device monitoring, and provide for the O&M state of secondary circuit new
Distinguishing rule gets rid of the insufficient predicament of original judgment basis.
The current infrared thermal imaging data are compared with Infrared Targets thermal imaging data in one of the embodiments,
To before, the secondary device method for monitoring state further include: using parameter preset and method the amendment current infrared heat at
As data.
The Infrared Targets thermal imaging data include the separate same position of difference in three-phase system in one of the embodiments,
The current or history infrared thermal imaging data for the secondary device set.
The Infrared Targets thermal imaging data include same electric connecting member different location in one of the embodiments,
Infrared thermal imaging data.
The comparison result is temperature difference in one of the embodiments,.
After the current state for determining the secondary device according to the comparison result in one of the embodiments, institute
State secondary device method for monitoring state further include: the secondary device is generated according to the comparison result and history comparison result
Operating status figure.
After the current state for determining the secondary device according to the comparison result in one of the embodiments, institute
State secondary device method for monitoring state further include: according to the current infrared thermal imaging data and the current infrared thermal imaging number of history
According to the operating status figure for generating the secondary device, and the institute using the operating status figure of the secondary device as subsequent step
State Infrared Targets thermal imaging data.
In one of the embodiments, the following steps are included: obtaining the current infrared of whole secondary devices of target area
Thermal imaging data；Each current infrared thermal imaging data are carried out correspondingly with each Infrared Targets thermal imaging data respectively
It compares, obtains the comparison result of each current infrared thermal imaging data；It is determined respectively according to each comparison result each described
The current state of secondary device.
Determine that the current state of a certain secondary device occurs according to the comparison result in one of the embodiments,
When abnormal, the secondary device method for monitoring state further include: closely reacquire the secondary device being abnormal
Current infrared thermal imaging data simultaneously execute subsequent step.
Determine that the current state of the secondary device includes: to work as according to the comparison result in one of the embodiments,
The comparison result issues alarm signal when being more than threshold value.
Detailed description of the invention
Fig. 1 is the flow diagram of one embodiment of the application.
Fig. 2 is the flow diagram of another embodiment of the application.
Fig. 3 is the flow diagram of another embodiment of the application.
Specific embodiment
In order to make the above objects, features, and advantages of the present application more apparent, with reference to the accompanying drawing to the application
Specific embodiment be described in detail.Many details are explained in the following description in order to fully understand this Shen
Please.But the application can be implemented with being much different from other way described herein, those skilled in the art can be not
Similar improvement is done in the case where violating the application intension, therefore the application is not limited by the specific embodiments disclosed below.
It should be noted that it can be directly another when element is referred to as " being fixed on " or " being set to " another element
On one element or there may also be elements placed in the middle.When an element is considered as " connection " another element, it can be with
It is directly to another element or may be simultaneously present centering elements.Term as used herein " vertically ", " level
", "left", "right" and similar statement for illustrative purposes only, be not meant to be the only embodiment.
Unless otherwise defined, all technical and scientific terms used herein and the technical field for belonging to the application
The normally understood meaning of technical staff is identical.The term used in the description of the present application is intended merely to description tool herein
The purpose of the embodiment of body, it is not intended that in limitation the application.Term " and or " used herein includes one or more
Any and all combinations of relevant listed item.
Infrared thermal imaging uses the infrared ray specific band signal of photoelectric technology detection object heat radiation, which is converted
At the image and figure differentiated for human vision, and temperature value can be further calculated out.Infrared thermal imaging technique makes the mankind
Dysopia is surmounted, thus people " can see " temperature distribution state of body surface.Since infrared ray is to very big part
Solid and liquid substance penetration capacity it is very poor, therefore infrared thermal imaging detection is infrared radiation to measure body surface
Based on energy；But in traditional technology, infrared thermal imaging technique is from the condition monitoring for being not used for secondary device, as shown in Figure 1, one
Secondary device method for monitoring state of the kind based on infrared thermal imaging comprising following steps: obtain the current infrared of secondary device
Thermal imaging data；The current infrared thermal imaging data are compared with Infrared Targets thermal imaging data, obtain comparison result；
The current state of the secondary device is determined according to the comparison result.Above-mentioned secondary device method for monitoring state, utilization are infrared
The technological means of imaging and using had before most of secondary devices " failure " insulation breakdown or even apparent fuel factor this
One phenomenon does a monitoring to secondary device now from new angle, for present secondary circuit, including contactor, relay,
The non-device equipment such as terminal block and open air or on the spot placing device etc. are provided to present secondary circuit monitoring means few in number
A kind of effective selection solves after solving part secondary circuit only and can be carried out accident, can not carry out accident anticipation and
Abnormality diagnostic defect, the initiative of the O&M level and O&M that make secondary device have promotion by a relatively large margin, set secondary
There is biggish meaning in terms of the work such as standby status assessment, hidden troubles removing, O&M inspection, provides important work for secondary device monitoring
Tool, and new distinguishing rule is provided for the O&M state of secondary circuit, get rid of the insufficient predicament of original judgment basis.
The current infrared thermal imaging data are compared with Infrared Targets thermal imaging data in one of the embodiments,
To before, the secondary device method for monitoring state further include: using parameter preset and method the amendment current infrared heat at
As data.As shown in Fig. 2, a kind of secondary device method for monitoring state based on infrared thermal imaging comprising following steps: obtaining
The current infrared thermal imaging data of secondary device；The current infrared thermal imaging data are corrected using parameter preset and method；It will
The current infrared thermal imaging data are compared with Infrared Targets thermal imaging data, obtain comparison result；According to the comparison
As a result the current state of the secondary device is determined.Remaining embodiment and so on.Further, it is abandoned using data filtering method
Except broadcasting range is more than the current infrared thermal imaging data of threshold range, such as threshold range is greater than 10000 degrees Celsius
Or it is lower than -100 degrees Celsius, it is to be understood that threshold range given here is only a reference value, in practical application
In can rule of thumb or historical data is adjusted, it is therefore an objective to remove the meaningless noise of mutation.Specific parameter and
Method can be designed or be adjusted using traditional secondary monitor loop means, and the application and its each embodiment have no additional limit to this
System.
Infrared Targets thermal imaging data are a very important reference values, are realized but very flexible, can be in due course
Adjustment, such as replaced new equipment in particular by the new equipment of different model, then there is the reply effect of highly significant.At it
In middle one embodiment, the Infrared Targets thermal imaging data include the secondary device of the separate same position of difference in three-phase system
Current or history infrared thermal imaging data.Further, the Infrared Targets thermal imaging data include history infrared thermal imaging
Data can easily obtain the Infrared Targets thermal imaging data in this way.Further, the history infrared thermal imaging data
The history infrared thermal imaging of the secondary device of history infrared thermal imaging data, same or similar position including current secondary equipment
The history infrared thermal imaging data of the secondary device of the separate same position of difference in data or three-phase system.Alternatively, the history
Infrared thermal imaging data are the average value of the history infrared thermal imaging data of current secondary equipment.Further, the target is red
Outer thermal imaging data are the current infrared thermal imaging data of other normal secondary devices；Two are obtained in one of the embodiments,
Before the current infrared thermal imaging data of secondary device, the secondary device method for monitoring state further include: be target secondary device
Setting is referring to secondary device；Also, the Infrared Targets thermal imaging data be the infrared heat of the history referring to secondary device at
As the average value of data.In practical applications, the average value can be the numerical value of a continuous renewal.Alternatively, wherein one
In a embodiment, before the current infrared thermal imaging data for obtaining secondary device, the secondary device method for monitoring state is also wrapped
It includes: being arranged for target secondary device referring to secondary device；Also, by the current infrared thermal imaging data and Infrared Targets heat at
Before being compared as data, the secondary device method for monitoring state further include: obtain described referring to the normal of secondary device
Value is used as the Infrared Targets thermal imaging data.Further, the normal value conduct referring to secondary device is obtained from cloud
The Infrared Targets thermal imaging data.Such design can be obtained from Cloud Server or cloud network referring to secondary device
Normal value, as the reference being compared with current infrared thermal imaging data, to obtain more accurate reference value；It also helps
The comparison base of batch data can be realized in unified management, the unified normal value referring to secondary device for adjusting cloud, primary upgrading
Plinth has the advantages that using convenient；Also, the characteristics of being frequently accompanied by " insulation breakdown " with the failure of secondary device is also used,
In a sense, be bound to seriously generate heat before apparatus insulated breakdown in this way, as long as and insulate do not puncture, equipment would not be sent out
Raw failure, so if can run through serious fever before apparatus insulated breakdown confirms problem in advance, and apparatus insulated
It adopts an effective measure before breakdown, it will be able to effectively avoid problem generation and greatization, solving part secondary circuit only can be carried out
It is solved after accident, accident anticipation and abnormality diagnostic defect can not be carried out, make the O&M level and the active of O&M of secondary device
Property has promotion by a relatively large margin.But in practical applications, this " insulation " is often difficult to control for secondary device,
First is that because the component sizes such as relay are smaller, second is that because also smaller for weak electrical loop breakdown voltage itself, it can not
Its insulation characterisitic is determined by the method for experiment.Therefore its incident fuel factor just becomes main monitor control index.Therefore
The application and its each embodiment use the infrared thermal imaging technique as a kind of main temperature-sensitive thermometry, pass through detected sample
This infrared ray radiated forms infrared temperature detecting map, by comparing in " three-phase system " not after carrying out all kinds of parameters revisions
With the temperature difference of separate same position or the temperature difference of same electric connecting member different location, to determine element or device operating status,
And then carry out condition monitoring, so that the O&M state for secondary circuit provides new distinguishing rule, get rid of it is original judge according to
According to insufficient predicament.
And/or in one of the embodiments, the Infrared Targets thermal imaging data include same electric connecting member not
With the infrared thermal imaging data of position.The Infrared Targets thermal imaging data include same electrical in one of the embodiments,
The infrared thermal imaging data of the secondary device of coupling part different location.Same electric connecting member difference position can be monitored in this way
The secondary device set.Further, the Infrared Targets thermal imaging data include the different location of secondary device it is infrared heat at
As data.Such design, Infrared Targets thermal imaging data are very convenient selection and change, when once after the accident,
Unified upgrade may be implemented to update, total system is easily achieved, thus to secondary circuit now few in number, contactor, after
Electric appliance, the non-device equipment such as terminal block and open air or placing device monitoring means provide a kind of effective selection on the spot,
In secondary device status assessment, hidden troubles removing, there is biggish meaning in terms of the work such as O&M inspection, is provided for secondary device monitoring
Important tool.
In each embodiment, by the design of current infrared thermal imaging data and Infrared Targets thermal imaging data, realize pair
Secondary device malfunction has done characteristic quantity capture, and is captured and analyzed based on this kind of characteristic quantity, and this application provides one kind
The new standard for judging secondary device loop fault or abnormality provides foundation for subsequent this method use.Wherein
In one embodiment, the comparison result is temperature difference.Alternatively, the comparison result is described in one of the embodiments,
The ratio of current infrared thermal imaging data and Infrared Targets thermal imaging data；Alternatively, the comparison in one of the embodiments,
It as a result is the difference of the current infrared thermal imaging data and Infrared Targets thermal imaging data.In practical applications, it can also adopt
Realize the concrete mode for obtaining the comparison result and its specific presentation mode with the method for computer digital animation, the application and
Its each embodiment does not make any additional limitation to this.In this way, using the technological means of infrared imaging, secondary set using most of
Insulation breakdown or even apparent fuel factor this phenomenon are had before standby " failure ", from completely different, simple with traditional approach
Easily, monitoring is made to secondary device now from another angle.
After the current state for determining the secondary device according to the comparison result in one of the embodiments, institute
State secondary device method for monitoring state further include: the secondary device is generated according to the comparison result and history comparison result
Operating status figure.As shown in figure 3, a kind of secondary device method for monitoring state based on infrared thermal imaging comprising following steps:
Obtain the current infrared thermal imaging data of secondary device；The current infrared thermal imaging number is corrected using parameter preset and method
According to；The current infrared thermal imaging data are compared with Infrared Targets thermal imaging data, obtain comparison result；According to described
Comparison result determines the current state of the secondary device；It is generated according to the comparison result and history comparison result described secondary
The operating status figure of equipment.Remaining embodiment and so on.Further, the secondary device method for monitoring state further include:
The operating status figure is exported to management terminal.It is determined in one of the embodiments, according to the comparison result described secondary
After the current state of equipment, the secondary device method for monitoring state further include: according to the current infrared thermal imaging data
And the current infrared thermal imaging data of history generate the operating status figure of the secondary device, and using the operation of the secondary device
The Infrared Targets thermal imaging data of the state diagram as subsequent step.Such design can visualize described current infrared
Thermal imaging data and the history infrared thermal imaging data obtained before, it will be understood that for each secondary device, history
Infrared thermal imaging data repeatedly current infrared thermal imaging data obtained before being.Further, using the side FIFO
Formula only retains recent N number of current infrared thermal imaging data as the current infrared thermal imaging data of the history, and described two
Secondary device method for monitoring state further include: raw according to the current infrared thermal imaging data and the current infrared thermal imaging data of history
At the operating status figure of the secondary device, and the mesh using the operating status figure of the secondary device as subsequent step
Mark infrared thermal imaging data.
The secondary device method for monitoring state is the following steps are included: obtain target area in one of the embodiments,
Whole secondary devices current infrared thermal imaging data；Respectively by each current infrared thermal imaging data and each Infrared Targets
Thermal imaging data are compared correspondingly, obtain the comparison result of each current infrared thermal imaging data；According to each institute
State the current state that comparison result determines each secondary device respectively.In this way, a piece of target area can disposably be obtained
Whole secondary devices current infrared thermal imaging data, be conducive to simplify obtaining step, batch obtain data.One wherein
It is described secondary to set when determining that the current state of a certain secondary device is abnormal according to the comparison result in embodiment
Standby method for monitoring state further include: closely reacquire the current infrared thermal imaging data for the secondary device being abnormal
And execute subsequent step.That is, the secondary device method for monitoring state is the following steps are included: the whole for obtaining target area is secondary
The current infrared thermal imaging data of equipment；Respectively by each current infrared thermal imaging data and each Infrared Targets thermal imaging data
It is compared correspondingly, obtains the comparison result of each current infrared thermal imaging data；According to each comparison result
The current state for determining each secondary device respectively determines the current shape of a certain secondary device according to the comparison result
When state is abnormal, the current infrared thermal imaging data for the secondary device being abnormal closely are reacquired；It will be described
Current infrared thermal imaging data are compared with Infrared Targets thermal imaging data, obtain comparison result；According to the comparison result
Determine the current state of the secondary device.Remaining embodiment and so on.In this way, can be accurate square again by first range
Formula reduces the operand of acquisition, when problem, which goes out, to show an inkling, is analyzed where rapid concentrate firepower determines problem and precisely,
To obtain more accurate comparison result, and then the current state of the secondary device is more clearly determined, after tested for same
The different location resolution ratio of one secondary device can reach 5 μm of position difference and Temperature Difference Ratio is to can reach 0.001 DEG C.
Further, infrared using spatial mode in one of the embodiments, in the secondary device method for monitoring state
Thermal imaging apparatus obtains the current infrared thermal imaging data of whole secondary devices of target area and/or closely reacquires hair
The current infrared thermal imaging data of the raw abnormal secondary device；Further, it is obtained using spatial mode infrared thermal imaging equipment
The current infrared thermal imaging data of whole secondary devices of target area and/or short distance reacquisition are taken to be abnormal described
The current infrared thermal imaging data of secondary device include: infrared on the translation track for forming plane right-angle coordinate using being located at
Thermal imaging apparatus obtains the current infrared thermal imaging data of whole secondary devices of target area and/or closely reacquires hair
The current infrared thermal imaging data of the raw abnormal secondary device；In one of the embodiments, by infrared thermal imaging equipment
It is arranged on two sections of mutually controlled tracks being arranged with translation gliding, two sections of tracks form flat square in the projection of a plane and sit
Mark system, and the plane where the sliding position of two sections of tracks is arranged in parallel.The leakage of μ A rank may be implemented in such design
Conductance causes the effective monitoring of secondary device fever.
Determine that the current state of the secondary device includes: root according to the comparison result in one of the embodiments,
Determine whether the current state of the secondary device is abnormal according to the comparison result；In one of the embodiments, according to
Comparison result determines sending alarm signal when the current state exception of the secondary device and/or notifies administrative staff.Wherein
In one embodiment, according to the comparison result determine the secondary device current state be or include: when the comparison tie
Fruit issues alarm signal when being more than threshold value.The secondary device is determined according to the comparison result in one of the embodiments,
Current state include: to judge whether the comparison result is more than threshold value according to the comparison result, be determine it is described secondary
The current state of equipment is abnormal, issues alarm signal and/or notifies administrative staff.The threshold value in one of the embodiments,
Including preset temperature value or image data value etc.；Further, working as the secondary device, is determined according to the comparison result
Preceding state includes: further to obtain when the comparison result is more than threshold value and be located at same electrical connection with current secondary equipment
The current infrared thermal imaging data of partial whole secondary devices simultaneously execute subsequent step.Alternatively, true according to the comparison result
The current state of the fixed secondary device includes: further to obtain and set with current secondary when the comparison result is more than threshold value
The current infrared thermal imaging data of standby other secondary devices positioned at same electric connecting member simultaneously execute subsequent step.Wherein
In one embodiment, determine that the current state of the secondary device includes: to judge the comparison result according to the comparison result
Whether it is more than threshold value, is to issue alarm signal, obtains and be located at whole the two of same electric connecting member with current secondary equipment
The current infrared thermal imaging data of secondary device or other secondary devices, respectively by each current infrared thermal imaging data and each mesh
Mark infrared thermal imaging data are compared correspondingly, obtain the comparison result of each current infrared thermal imaging data, i.e.,
The comparison result of each secondary device determines the current state of each secondary device according to each comparison result respectively.
Remaining embodiment and so on.Alternatively, determining that the current state of the secondary device includes: when described according to the comparison result
When comparison result is more than threshold value, further obtains other secondary devices for being located at same target area with current secondary equipment and work as
Preceding infrared thermal imaging data simultaneously execute subsequent step.Alternatively, determining the current shape of the secondary device according to the comparison result
State includes: further to obtain when the comparison result is more than threshold value and be located at the complete of same target area with current secondary equipment
The current infrared thermal imaging data of portion's secondary device simultaneously execute subsequent step.Such design, when a secondary device is asked
When inscribing or being likely to occur problem, judge with searching for by following the clues rapidly same electric connecting member whole secondary devices or other two
Secondary device or the whole secondary devices or other secondary devices of same target area, if problem occurs, is to take immediately
Measure.
Further, the current shape of the secondary device is determined according to the comparison result in one of the embodiments,
State includes: also to obtain the current environment image of the secondary device, and be transferred to management when the comparison result is more than threshold value
Terminal.Determine that the current state of the secondary device includes: when described according to the comparison result in one of the embodiments,
Comparison result issues alarm signal when being more than threshold value, obtains the current environment image of the secondary device, and is transferred to management eventually
End.In this way, administrative staff can obtain the photo of the scene of the accident at the first time, adopted with a definite target in view according to the severity of thing
Take counter-measure.
Further, the current shape of the secondary device is determined according to the comparison result in one of the embodiments,
State includes: when the comparison result is more than threshold value, and also disable the secondary device；In one of the embodiments, when described
When comparison result is more than threshold value, the secondary device is cut off.Institute is determined according to the comparison result in one of the embodiments,
The current state for stating secondary device includes: to issue alarm signal when the comparison result is more than threshold value, and disable described secondary set
It is standby.Such design, by giving two using infrared heating amount as the foundation for judging secondary device failure, exception and accident prediction
Secondary device condition monitoring provides a kind of new monitoring foundation, adopts an effective measure, can be prevented in time before accident generation
Possible trouble avoids pushing comes to shove, and on this basis, obtains secondary device infrared thermal imaging by infrared temperature-sensitive imaging technique, leads to
Thermal imaging comparison is crossed, secondary device dependent failure point and operating status is analyzed, infrared imaging temperature-sensitive technical application is set to secondary
In standby condition monitoring, using the correlated condition of infrared imagery technique analysis electrical secondary system equipment, according to point of monitored device
Class, such as current relay, the circuit CT transfer terminal box, can be further by equipment or element exception, the standard system of failure
It fixes, thus as a kind of new standard technique application.Disable before the secondary device in one of the embodiments, or
Meanwhile secondary device method for monitoring state further include: spare secondary device or stand-by circuit are enabled, so that secondary circuit maintains just
It is often used.
It should be noted that the other embodiments of the application further include, the mutually group of the technical characteristic in the various embodiments described above
Close the secondary device method for monitoring state based on infrared thermal imaging that is formed by, can implement, each embodiment based on infrared
The secondary device method for monitoring state of thermal imaging is also referred to as Transformer Insulation Aging test macro.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
The several embodiments of the application above described embodiment only expresses, the description thereof is more specific and detailed, but simultaneously
The limitation to claim therefore cannot be interpreted as.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the concept of this application, various modifications and improvements can be made, these belong to the protection of the application
Range.Therefore, the scope of protection shall be subject to the appended claims by the application.
Claims (10)
1. a kind of secondary device method for monitoring state based on infrared thermal imaging, which comprises the following steps:
Obtain the current infrared thermal imaging data of secondary device；
The current infrared thermal imaging data are compared with Infrared Targets thermal imaging data, obtain comparison result；
The current state of the secondary device is determined according to the comparison result.
2. secondary device method for monitoring state according to claim 1, which is characterized in that by the current infrared thermal imaging number
According to before being compared with Infrared Targets thermal imaging data, the secondary device method for monitoring state further include: using default ginseng
Several and method corrects the current infrared thermal imaging data.
3. secondary device method for monitoring state according to claim 1, which is characterized in that the Infrared Targets thermal imaging data
The current or history infrared thermal imaging data of secondary device including the separate same position of difference in three-phase system.
4. secondary device method for monitoring state according to claim 1, which is characterized in that the Infrared Targets thermal imaging data
Infrared thermal imaging data including same electric connecting member different location.
5. secondary device method for monitoring state according to claim 1, which is characterized in that the comparison result is temperature difference.
6. secondary device method for monitoring state according to claim 1, which is characterized in that determine institute according to the comparison result
After the current state for stating secondary device, the secondary device method for monitoring state further include: according to the comparison result and go through
History comparison result generates the operating status figure of the secondary device.
7. secondary device method for monitoring state according to claim 1, which is characterized in that determine institute according to the comparison result
After the current state for stating secondary device, the secondary device method for monitoring state further include: according to the current infrared heat at
As data and the current infrared thermal imaging data of history generate the operating status figure of the secondary device, and the use secondary device
The Infrared Targets thermal imaging data of the operating status figure as subsequent step.
8. secondary device method for monitoring state according to claim 1, which comprises the following steps:
Obtain the current infrared thermal imaging data of whole secondary devices of target area；
Respectively each current infrared thermal imaging data are compared correspondingly with each Infrared Targets thermal imaging data, are obtained
To the comparison result of each current infrared thermal imaging data；
Determine the current state of each secondary device respectively according to each comparison result.
9. secondary device method for monitoring state according to claim 8, which is characterized in that determine certain according to the comparison result
When the current state of one secondary device is abnormal, the secondary device method for monitoring state further include: closely again
It obtains the current infrared thermal imaging data for the secondary device being abnormal and executes subsequent step.
10. according to claim 1 to secondary device method for monitoring state described in any one of 9, which is characterized in that according to the ratio
The current state that the secondary device is determined to result includes: to issue alarm signal when the comparison result is more than threshold value.
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