CN109600478A

CN109600478A - Piezoelectric element and preparation method thereof, housing unit and electronic device

Info

Publication number: CN109600478A
Application number: CN201710920345.2A
Authority: CN
Inventors: 夏栋; 郑刚强
Original assignee: Nanchang OFilm Biometric Identification Technology Co Ltd
Current assignee: Nanchang OFilm Biometric Identification Technology Co Ltd
Priority date: 2017-09-30
Filing date: 2017-09-30
Publication date: 2019-04-09

Abstract

Piezoelectric element disclosed by the invention includes piezoelectric layer, first electrode, second electrode and connection electrode.Piezoelectric layer includes piezoelectric body and conducting element, and piezoelectric body includes opposite first surface and second surface, and conducting element and piezoelectric body are integrally formed to be embedded in piezoelectric body, and conducting element runs through first surface and second surface.First electrode setting is electrically connected on the first surface and with conducting element.Second electrode is arranged on a second surface.Connection electrode setting is electrically connected on a second surface and with conducting element, and connection electrode is spaced apart from each other with second electrode.The conducting element of first surface and second surface is formed through in piezoelectric layer, it is respectively set in first surface and second surface and is electrically connected first electrode and connection electrode with conducting element, first electrode is broken in bending place when avoiding for first electrode being bent on second surface from side.The invention also discloses a kind of production method of piezoelectric element, housing unit and electronic devices.

Description

Piezoelectric element and preparation method thereof, housing unit and electronic device

Technical field

The present invention relates to electronic technology field, in particular to a kind of piezoelectric element and preparation method thereof, housing unit and electricity Sub-device.

Background technique

Piezoelectric element includes first surface, second surface and side, and first surface and second surface are located at piezoelectric element Opposite two sides, side surrounding first surface and second surface are simultaneously all connected with first surface and second surface.Existing piezoelectricity member The first electrode setting of part is bent on second surface on the first surface and laterally, thus, first electrode is held in bending place It is easily broken, so as to cause piezoelectric element failure.

Summary of the invention

The embodiment provides a kind of piezoelectric element, the production method of piezoelectric element, housing unit and electronics dresses It sets.

The piezoelectric element of embodiment of the present invention includes:

Piezoelectric layer, the piezoelectric layer include piezoelectric body and conducting element, and the piezoelectric body includes the first opposite table Face and second surface, the conducting element and the piezoelectric body are integrally formed to be embedded in the piezoelectric body, described to lead Electric device runs through the first surface and the second surface；

First electrode, the first electrode setting are electrically connected on the first surface and with the conducting element；

Second electrode, the second electrode are arranged on the second surface；And

Connection electrode, the connection electrode is arranged on the second surface and is electrically connected with the conducting element, described Connection electrode is spaced apart from each other with the second electrode.

Leading for first surface and second surface is formed through in piezoelectric layer in the piezoelectric element of embodiment of the present invention Electric device is respectively set in first surface and second surface and is electrically connected first electrode and connection electrode with conducting element, avoids First electrode is broken in bending place when first electrode is bent on second surface from side, thus first electrode and connection Electrode electrical connection is more stable.Meanwhile piezoelectric layer is an integral molding structure the binding force made between conducting element and piezoelectric body It is larger, it can be avoided conducting element and be stripped out from piezoelectric body.

In some embodiments, the conducting element includes gold, silver, any one or more in copper.In this way, conductive The electric conductivity of element is good.

The production method of the piezoelectric element of embodiment of the present invention, which is characterized in that the production method includes:

Piezoelectric material and conductive material are provided；

The conductive material is embedded in the piezoelectric material and is integrally formed to obtain piezoelectric layer, the piezoelectric layer includes The piezoelectric body formed by the piezoelectric material and the conducting element formed by the conductive material, the piezoelectric body includes phase The first surface and second surface of back, the conducting element are embedded in the piezoelectric body, and the conducting element is through described First surface and the second surface；

First electrode is formed on the first surface, and the first electrode is electrically connected with the conducting element；

Second electrode is formed on the second surface；And

Connection electrode is formed in the second surface, and the connection electrode is electrically connected with the conducting element and with described the Two electrodes are spaced apart from each other.

Piezoelectric layer is integrally formed the combination made between conducting element and piezoelectric body by the piezoelectric element of present embodiment Power is larger, can be avoided conducting element and is stripped out from piezoelectric body.Meanwhile directly distinguishing in first surface and second surface The first electrode and connection electrode being electrically connected with conducting element are formed, avoids first electrode being bent to second surface from side First electrode is broken in bending place when upper, thus first electrode be electrically connected with connection electrode it is more stable.

The housing unit of embodiment of the present invention includes:

Shell, the shell include roof, bottom wall and side wall, and the roof is opposite with the bottom wall, opens on the roof Equipped with accommodating chamber, the side wall connects the roof and the bottom wall, and the side wall includes opposite inner surface and outer surface；With

Piezoelectricity mould group, the piezoelectricity mould group are installed on the internal surface and are housed in the accommodating chamber, the piezoelectricity Mould group is used to generate electric signal according to the touch control operation of user, and the piezoelectricity mould group includes piezoelectric element, the piezoelectric element packet It includes:

First electrode, the first electrode setting are electrically connected with the conducting element on the first surface；

Second electrode, second electrode are arranged on the second surface；And

First surface and are formed through in the housing unit of embodiment of the present invention and the piezoelectric layer in piezoelectric element The conducting element on two surfaces is respectively set in first surface and second surface and is electrically connected first electrode and connection with conducting element Electrode, first electrode is broken in bending place when avoiding for first electrode being bent on second surface from side, thus first Electrode is electrically connected more stable with connection electrode.Meanwhile piezoelectric layer be an integral molding structure make conducting element and piezoelectric body it Between binding force it is larger, can be avoided conducting element and be stripped out from piezoelectric body.The housing unit of embodiment of the present invention The touch control operation of user is incuded by piezoelectricity mould group.Wherein the inside of housing unit, therefore housing unit is arranged in piezoelectricity mould group No setting is required for outer surface physical button, realize the integrated design of housing unit, improve the waterproof of housing unit and anti- Dirt performance.

In some embodiments, the piezoelectricity mould group further includes circuit board, and the piezoelectric element is arranged in the interior table On face and the circuit board, the inner surface and the circuit board two sides that be located at the piezoelectric element opposite.Compared to Circuit board is arranged between piezoelectric element and inner surface, the setting of the piezoelectric element of present embodiment circuit board and inner surface it Between, make piezoelectric element closer to user, so that the deformation quantity that piezoelectric element occurs is bigger, the electric signal of generation is stronger, and then presses The sensitivity of electric mould group sensing touch control operation is higher.

In some embodiments, the piezoelectricity mould group further includes circuit board, and the piezoelectric element is arranged in the circuit On plate, on the internal surface, the inner surface and the piezoelectric element are located at the circuit board for the circuit board setting Opposite two sides.Compared to directly attaching piezoelectric element on an internal surface, present embodiment can be avoided pastes in piezoelectric element It is attached on an internal surface when piezoelectric element torn down from circuit board.

In some embodiments, the piezoelectricity mould group further includes route, and the route makes on the internal surface, institute State piezoelectric element setting on the internal surface and with the connection.Present embodiment makes route on an internal surface, It avoids using circuit board, to reduce the space that piezoelectricity mould group occupies accommodating chamber.

In some embodiments, the inner surface opens up fluted, and the route is produced on the inner surface and described In groove, the route is continuously distributed.At this point, piezoelectric element can be housed in groove and be electrically connected with route, so that piezoelectricity The space that element occupies accommodating chamber is smaller, consequently facilitating being laid out other elements (for example, circuit main board) or structure in accommodating chamber (for example, location structure, support construction).

In some embodiments, the housing unit further includes setting element, and the setting element setting is described outer On surface and corresponding with the piezoelectricity mould group, the setting element includes groove, protrusion, text, figure, any one in symbol Kind is a variety of.In this way, setting element can prompt the location of user's piezoelectricity mould group, so that user can be quickly found out pressure The location of electric mould group, is easy accurate touch-control.Meanwhile the structure of setting element described above is simply and convenient for production.

In some embodiments, the quantity of the piezoelectricity mould group is multiple, and multiple piezoelectricity mould groups are along the interior table The length direction in face is alternatively arranged.Multiple piezoelectricity mould groups are alternatively arranged the manufacturing process that can simplify housing unit on an internal surface, And keep the shape of housing unit more beautiful.

In some embodiments, multiple piezoelectricity modular arrangements are in alignment, and multiple described piezoelectricity mould groups etc. Spacing arrangement.Equidistant piezoelectricity mould group arranged in a straight line can prevent the mistake of user from manipulating, and make the touch control operation (example of user Such as, linear slide touch-control etc.) more smooth simplicity.

In some embodiments, multiple piezoelectricity mould groups form two groups, first group of multiple piezoelectricity mould group rows First straight line is arranged into, for second group of multiple piezoelectricity modular arrangements at second straight line, the first straight line is straight with described second Line is parallel, the gap alignment between each of the second group piezoelectricity mould group and first group of the two neighboring piezoelectricity mould group. Two groups of spaced modes of piezoelectricity mould group can prevent the mistake of user from manipulating, and make the touch control operation of user (for example, straight line is sliding Dynamic touch-control etc.) more smooth simplicity.

The electronic device of embodiment of the present invention includes:

Housing unit described in above-mentioned any one embodiment；With

Display screen, the display screen are mounted on the roof and cover the accommodating chamber.

First is formed through in piezoelectric layer in the electronic device of embodiment of the present invention, housing unit and piezoelectric element The conducting element of surface and second surface is respectively set in first surface and second surface and is electrically connected the first electricity with conducting element Pole and connection electrode, first electrode is broken in bending place when avoiding for first electrode being bent on second surface from side, Thus first electrode is electrically connected more stable with connection electrode.Meanwhile piezoelectric layer be an integral molding structure make conducting element and pressure Binding force between electric ontology is larger, can be avoided conducting element and is stripped out from piezoelectric body.Embodiment of the present invention Electronic device and housing unit incude the touch control operation of user by piezoelectricity mould group.Wherein housing unit is arranged in piezoelectricity mould group Inside, therefore no setting is required for the outer surface of housing unit physical button, realize the integrated design of housing unit, improve shell The waterproof and anti-dust performance of body component.

Additional aspect and advantage of the invention will be set forth in part in the description, and will partially become from the following description Obviously, or practice through the invention is recognized.

Detailed description of the invention

Above-mentioned and/or additional aspect and advantage of the invention will become from the following description of the accompanying drawings of embodiments Obviously and it is readily appreciated that, in which:

Fig. 1 is the cross-sectional view of the piezoelectric element of certain embodiments of the present invention.

Fig. 2 is the cross-sectional view of the piezoelectric element of certain embodiments of the present invention.

Fig. 3 is that the production method flow diagram of the piezoelectric element of certain embodiments of the present invention and production method process are shown It is intended to.

Fig. 4 is the structural schematic diagram of the housing unit of certain embodiments of the present invention.

Fig. 5 is the structural schematic diagram of the housing unit of certain embodiments of the present invention.

Fig. 6 is the structural schematic diagram of the electronic device of certain embodiments of the present invention.

Fig. 7 is the structural schematic diagram of the housing unit of certain embodiments of the present invention.

Fig. 8 is the structural schematic diagram of the housing unit of certain embodiments of the present invention.

Fig. 9 is the partial sectional view of the housing unit of certain embodiments of the present invention.

Figure 10 is the partial sectional view of the housing unit of certain embodiments of the present invention.

Figure 11 is the partial sectional view of the housing unit of certain embodiments of the present invention.

Figure 12 is the partial sectional view of the housing unit of certain embodiments of the present invention.

Figure 13 is the partial sectional view of the housing unit of certain embodiments of the present invention.

Figure 14 is the partial sectional view of the housing unit of certain embodiments of the present invention.

Figure 15 is the partial sectional view of the housing unit of certain embodiments of the present invention.

Figure 16 is the partial sectional view of the housing unit of certain embodiments of the present invention.

Figure 17 is the schematic diagram of the piezoelectricity modular arrangements mode of certain embodiments of the present invention.

Figure 18 is the distribution schematic diagram of the touch area of certain embodiments of the present invention.

Specific embodiment

The embodiment of the present invention is described below in detail, examples of the embodiments are shown in the accompanying drawings, wherein from beginning to end Same or similar label indicates same or similar element or element with the same or similar functions.Below with reference to attached The embodiment of figure description is exemplary, it is intended to is used to explain the present invention, and is not considered as limiting the invention.

Referring to Fig. 1, the piezoelectric element 20 of embodiment of the present invention includes piezoelectric layer 21, first electrode 23, second electrode 24 and connection electrode 25.Piezoelectric layer 21 includes piezoelectric body 211 and conducting element 215.Piezoelectric body 211 includes first opposite to each other Surface 212 and second surface 214.Conducting element 215 and piezoelectric body 211 are integrally formed to be embedded in piezoelectric body 211, are led Electric device 215 runs through first surface 212 and second surface 214.First electrode 23 is arranged on first surface 212 and and conductive element Part 215 is electrically connected.Second electrode 24 is arranged on second surface 214.Connection electrode 25 be arranged on second surface 214 and with lead Electric device 215 is electrically connected, and connection electrode 25 is spaced apart from each other with second electrode 24.

First surface 212 is located at the opposite two sides of piezoelectric layer 21 with second surface 214, and piezoelectric layer 21 further includes surrounding first Surface 212 and second surface 214 and the side 213 being all connected with first surface 212 and second surface 214.Piezoelectric layer 21 is one Body structure, that is to say, that piezoelectric layer 21 is obtained by piezoelectric body 211 and the integrated molding of conducting element 215.For example, piezoelectric layer 21 It is formed after the surrounding of conducting element 215 and solidification can be set by piezoelectric material；Alternatively, piezoelectric layer 21 can also be by conductive material It is embedded in piezoelectric material and is integrally formed to obtain.Wherein, piezoelectric body 211 is formed by piezoelectric material, and conducting element 215 is by leading Electric material is formed.Piezoelectric material includes piezoelectric ceramics or Kynoar (Polyvinylidene fluoride, PVDF).It leads Electric material includes gold, silver, any one or more in copper, in this way, the electric conductivity of conducting element 215 is good.First electrode 23, the material of second electrode 24 and connection electrode 25 may respectively be gold, silver, any one or more in copper, in this way, the first electricity The electric conductivity of pole 23, second electrode 24 and connection electrode 25 is good.In other embodiments, the 215, first electricity of conducting element Pole 23, second electrode 24 and connection electrode 25 are all made of identical material and are made, in this way, being convenient for conducting element 215, first electrode 23, the production of second electrode 24 and connection electrode 25.

Mechanical deformation can occur when piezoelectric element 20 is by external force, the piezoelectric element 20 after mechanical deformation will appear Symbol is positive and negative bound charge, to generate electric signal.In this way, piezoelectric element 20 after the touch control operation for sensing user i.e. It can produce the electric signal of the touch control operation of response user.

If piezoelectric element 20 is applied with high frequency voltage (for example, electric voltage frequency is greater than 50KHZ), piezoelectric element 20 can be to outgoing Penetrate ultrasonic wave；When user's touch-control piezoelectric element 20, user can reflect the ultrasonic wave emitted by piezoelectric element 20 and be transmitted to pressure On electric device 20, deformation occurs and generates electric signal for meeting after piezoelectric element 20 receives the ultrasonic wave that user is reflected.In this way, piezoelectricity Element 20 can produce the electric signal of the touch-control of response user after the touch-control for sensing user, in other words, in the touching of user When control does not cause piezoelectric element 20 to generate mechanical deformation, piezoelectric element 20 can also generate the electric signal of the touch-control of response user.

First surface 212 and the second table are formed through in piezoelectric layer 21 in the piezoelectric element 20 of embodiment of the present invention The conducting element 215 in face 214 is respectively set in first surface 212 and second surface 214 and is electrically connected with conducting element 215 One electrode 23 and connection electrode 25, first electrode 23 when avoiding for first electrode 23 being bent on second surface 214 from side 213 Be broken in bending place, thus first electrode 23 be electrically connected with connection electrode 25 it is more stable.Meanwhile piezoelectric layer 21 is integrated Molding structure keeps the binding force between conducting element 215 and piezoelectric body 211 larger, can be avoided conducting element 215 from piezoelectricity It is stripped out on ontology 215.

In some embodiments, piezoelectric layer 21 is made of PVDF.In this way, the piezoelectric element 20 made of PVDF can be done Thinner, touch control detection sensitivity is higher, the piezoelectric element 20 as made of PVDF without lead thus piezoelectric element 20 also more Add environmental protection.

Referring to Fig. 2, in some embodiments, the piezoelectric layer 21 of above embodiment may also include insulating layer 217, absolutely Edge layer 217 is embedded in piezoelectric body 211 and wraps conducting element 215, that is to say, that insulating layer 217 is arranged in conductive element Between part 215 and piezoelectric layer 21.Piezoelectric layer 21 is structure as a whole, that is to say, that piezoelectric layer 21 is by piezoelectric body 211, conductive element Part 215 and the integrated molding of insulating layer 217 obtain.For example, being initially formed conducting element 211, secondly insulating materials setting is being led Insulating layer 217 is formed after the surrounding of electric device 215 and solidification, which wraps conducting element 215, then by piezoelectricity Material forms piezoelectric layer 21 after the surrounding of conducting element 215 and solidification is arranged in；Alternatively, piezoelectric layer 21 can also be by conductive material It is embedded in insulating materials, and insulating materials and conductive material is embedded in piezoelectric material and are integrally formed to obtain.Wherein, it presses Electric ontology 211 has piezoelectric material to be formed, and conducting element 215 is formed by conductive material, and insulating layer 217 is formed by insulating materials.This Embodiment can be avoided by being provided with insulating layer 217 between conducting element 215 and piezoelectric layer 21 in 20 machine of piezoelectric element The negative electrical charge generated after tool deformation flows to the positive charge of the generation of piezoelectric element 20 along conducting element 215 and leads to positive and negative charge Neutralization reaction, to influence the use of piezoelectric element 20.

Referring to Fig. 3, the production method of the piezoelectric element 20 of embodiment of the present invention includes:

S1 provides piezoelectric material and conductive material；

Conductive material is embedded in piezoelectric material and is integrally formed to obtain piezoelectric layer 21 by S2, and piezoelectric layer 21 includes by pressing The piezoelectric body 211 and the conducting element 215 that is formed by conductive material that electric material is formed, piezoelectric body 211 include the opposite to each other One surface 212 and second surface 214, conducting element 215 are embedded in piezoelectric body 211, and conducting element 215 runs through first surface 212 and second surface 214；

S3, forms first electrode 23 on first surface 212, and first electrode 23 is electrically connected with conducting element 215；

S4 forms second electrode 24 on second surface 214；And

S5 forms connection electrode 25 in second surface 214, and connection electrode 25 is electrically connected with conducting element 215 and with second Electrode 24 is spaced apart from each other.

The production method of piezoelectric element 20 of the invention can successively be executed according to step S1-S5；Alternatively, piezoelectric element 20 It can be according to step S1, S2, S3, S5, S4；Alternatively, piezoelectric element 20 can also be according to step S1, S2, S4, S5, S3；Alternatively, Piezoelectric element 20 can also be according to step S1, S2, S5, S4, S3.Wherein step S5 synchronous can be executed with step S6.

Piezoelectric layer 21 is integrally formed and makes conducting element 215 and piezoelectric body 211 by the piezoelectric element 20 of present embodiment Between binding force it is larger, can be avoided conducting element 215 and be stripped out from piezoelectric body 215.Meanwhile directly in the first table Face 212 is respectively formed the first electrode 23 and connection electrode 25 being electrically connected with conducting element 215 with second surface 214, avoids First electrode 23 is broken in bending place when first electrode 23 is bent on second surface 214 from side 213, thus first Electrode 23 is electrically connected more stable with connection electrode 25.

Referring to Fig. 4, the housing unit 100 of embodiment of the present invention includes shell 10 and piezoelectricity mould group 30.

Shell 10 includes roof 12, bottom wall 16 and side wall 14.Roof 12 is opposite with bottom wall 16, and receiving is offered on roof 12 Chamber 122.Side wall 14 connects roof 12 and bottom wall 16, and side wall 14 includes opposite inner surface 142 and outer surface 144.

Fig. 1 and Fig. 4 is please referred to, piezoelectricity mould group 30 includes the piezoelectric element of circuit board 31 and any one embodiment of the present invention 20, piezoelectric element 20 is attached on inner surface 142 and circuit board 31, and inner surface 142 is located at 20 phase of piezoelectric element with circuit board 31 The two sides of back.

Piezoelectric element 20 includes piezoelectric layer 21, first electrode 23, second electrode 24 and connection electrode 25.Piezoelectric layer 21 includes Piezoelectric body 211 and conducting element 215.Piezoelectric body 211 includes opposite first surface 212 and second surface 214, the first table Face 212 is located at the opposite two sides of piezoelectric layer 21 with second surface 214, and piezoelectric layer 21 further includes surrounding first surface 212 and second Surface 214 and the side 213 being all connected with first surface 212 and second surface 214.Conducting element 215 and piezoelectric body 211 1 It is body formed to be embedded in piezoelectric body 211, conducting element 215 run through first surface 212 and second surface 214.First electrode 23 are arranged on first surface 212 and are electrically connected with conducting element 215.Second electrode 24 is arranged on second surface 214.Connection Electrode 25 is arranged on second surface 214 and is electrically connected with conducting element 215, and connection electrode 25 and second electrode 24 are mutual Every.

The quantity of piezoelectricity mould group 30 can be one or more, when the quantity of piezoelectricity mould group 30 includes multiple, circuit board 31 with the quantity of piezoelectric element 20 be it is multiple, multiple circuit boards 31 are corresponded with multiple piezoelectric elements 20, each circuit board 31 form a piezoelectricity mould group 30 with corresponding piezoelectric element 20.Multiple circuit boards 31 can be mutually separated (as shown in Figure 5), multiple The signal of circuit board 31 can eventually flow to the same circuit main board 60.Multiple circuit boards 31 can also interconnect It is electrically connected again with circuit main board 60 after (as shown in Figure 4).Circuit board 31 can be rigid circuit board or flexible circuit board.Pressure Electric device 20 is made of PVDF.

If piezoelectric element 20 is applied with high frequency voltage (for example, electric voltage frequency is greater than 50KHZ), piezoelectric element 20 can be to outgoing Penetrate ultrasonic wave；When the position on user's touch-control side wall 14 with piezoelectric element 20, user can be reflected to be emitted by piezoelectric element 20 Ultrasonic wave and be transmitted on piezoelectric element 20, piezoelectric element 20 can deformation occurs and produces after receiving the ultrasonic wave of user's reflection Raw electric signal.In this way, piezoelectric element 20 can produce the electric signal of the touch-control of response user after the touch-control for sensing user, I other words piezoelectric element 20 can also generate response user when the touch-control of user does not cause piezoelectric element 20 to generate mechanical deformation Touch-control electric signal.

Referring to Fig. 6, the electronic device 200 of embodiment of the present invention includes the shell group of any one embodiment of the present invention Part 100 and display screen 201.Display screen 201 is mounted on roof 12 and covers accommodating chamber 122.Display screen 201 includes liquid crystal display One of with Organic Light Emitting Diode (Organic Light-Emitting Diode, OLED) display screen.Electronic device 200 It can be any in mobile phone, tablet computer, laptop, Intelligent bracelet, smartwatch, intelligent glasses, intelligent helmet etc. It is a kind of.

Piezoelectricity mould group 30 can be used for controlling according to the electric signal that the touch control operation of user generates electronic device 200 booting, Shutdown, volume adjustment, slide page, return, application program switching in any one or more.

Incorporated by reference to Fig. 4, majority electronic device 200 is provided with physical button at present.It takes the mobile phone as an example, the side wall 14 of mobile phone It is usually provided with volume adjustment key and ON/OFF switch, is usually provided with application program switch key etc. below the roof 12 of mobile phone. The setting of physical button not only influences the integrated design of electronic device 200, so that the waterproof and anti-dust performance of electronic device 200 Weaken, also limits the installation space of the display screen 201 of electronic device 200.And the electronic device 200 of embodiment of the present invention makes The touch control operation of user is sensed with the piezoelectricity mould group 30 being arranged in inside the side wall 14 of housing unit 100.In this way, electronic device 200 no setting is required that the operation to electronic device 200 can be realized in physical button, and physical button and side wall 14 is avoided to form gap, The integrated design of electronic device 200 is realized, the waterproof and anti-dust performance of electronic device 200 are improved, and increases display The installation space of screen 201.

It is formed in piezoelectric layer 21 in the electronic device 200 of embodiment of the present invention, housing unit 100 and piezoelectric element 20 There is the conducting element 215 through first surface 212 and second surface 214, is set respectively in first surface 212 and second surface 214 It sets and is electrically connected first electrode 23 and connection electrode 25 with conducting element 215, avoid for first electrode 23 being bent to from side 213 First electrode 23 is broken in bending place when on second surface 214, thus first electrode 23 is electrically connected more with connection electrode 25 Add stabilization.Meanwhile piezoelectric layer 21 is an integral molding structure and keeps the binding force between conducting element 215 and piezoelectric body 211 larger, It can be avoided conducting element 215 to be stripped out from piezoelectric body 215.The electronic device 200 and shell of embodiment of the present invention Component 100 incudes the touch control operation of user by piezoelectricity mould group 30.Wherein piezoelectricity mould group 30 is arranged in housing unit 100 Portion, therefore no setting is required for the outer surface 144 of housing unit 100 physical button, realize the integrated design of housing unit 100, Improve the waterproof and anti-dust performance of housing unit 100.

The electronic device 200 and housing unit 100 of embodiment of the present invention also have the advantages that compared to circuit Plate 31 is arranged between piezoelectric element 20 and inner surface 142, the setting of the piezoelectric element 20 of present embodiment circuit board 31 with it is interior Between surface 142, make piezoelectric element 20 closer to user, so that the deformation quantity that piezoelectric element 20 occurs is bigger, the telecommunications of generation It is number stronger, so piezoelectricity mould group 30 sense touch control operation sensitivity it is higher.

Referring to Fig. 7, in some embodiments, piezoelectricity mould group 30 includes circuit board 31 and piezoelectric element 20, piezoelectricity member Part 20 is attached on circuit board 31, and circuit board 31 is attached on inner surface 142, and inner surface 142 is located at piezoelectric element 20 The opposite two sides of circuit board 31.It is directly attached on inner surface 142 compared to by piezoelectric element 20, present embodiment can be avoided When piezoelectric element 20 is attached on inner surface 142, piezoelectric element 20 is torn down from circuit board 31.

Referring to Fig. 8, in some embodiments, the circuit board 31 in piezoelectricity mould group 30 is substituted by route 33, that is, piezoelectricity Mould group 30 includes piezoelectric element 20 and route 33, and route 33 is produced on inner surface 142, and piezoelectric element 20 is attached to inner surface It is electrically connected on 142 and with route 33.The quantity of piezoelectricity mould group 30 can be one or more, when the quantity of piezoelectricity mould group 30 includes When multiple, the quantity of route 33 and piezoelectric element 20 be it is multiple, multiple routes 33 are corresponded with multiple piezoelectric elements 20, often A route 33 forms a piezoelectricity mould group 30 with corresponding piezoelectric element 20.Multiple routes 33 can be mutually separated, multiple routes 33 Signal can eventually flow to the same circuit main board 60.Multiple routes 33 can also interconnect after again with circuit Mainboard 60 is electrically connected.Route 33 is produced on inner surface 142 by present embodiment, is avoided using circuit board, to reduce pressure Electric mould group 30 occupies the space of accommodating chamber 122.

Referring to Fig. 9, in some embodiments, fluted 143 are opened up on inner surface 142, route 33 is produced on interior table In face 142 and groove 143, route 33 is continuously distributed on groove 143 and inner surface 142.At this point, piezoelectric element 20 can accommodate It is electrically connected in groove 143 and with route 33, so that the space that piezoelectric element 20 occupies accommodating chamber 122 is smaller, consequently facilitating Layout other elements (for example, circuit main board 60) or structure (for example, location structure, support construction) in accommodating chamber 122.Groove 143 quantity is consistent with the quantity of piezoelectricity mould group 30.

Referring to Fig. 10, in some embodiments, route 33 is embedded in completely in inner surface 142.For example, inner surface 142 offer container 141, and route 33 is produced on container 141, and route 33 is housed in completely in container 141.Line Road 33 is embedded in completely in inner surface 142, and the space for reducing the occupancy accommodating chamber 122 of route 33 is smaller, consequently facilitating accommodating Chamber 122 is laid out other elements (for example, circuit main board 60) or structure (for example, location structure, support construction)；It is convenient for route simultaneously 33 are adhered on inner surface 142.

Figure 11 is please referred to, in some embodiments, a part of route 33 is embedded on inner surface 142, route 33 Another part exposes from inner surface 142.For example, inner surface 142 offers container 141, route 33 is produced on container 141 On.Specifically, a part of route 33 is housed in container 141, and another part projection of route 33 is outside container 141. A part of route 33 is housed in and reduces the space that route 33 occupies accommodating chamber 122 in container 141, meanwhile, route 33 Another part projection is electrically connected outside container 141 convenient for route 33 and piezoelectricity mould group 30.

Figure 12 is please referred to, in some embodiments, the route 33 of above embodiment exposes from inner surface 142 completely. In this way, being produced on inner surface 142 convenient for route 33, to reduce the cost that route 33 is produced on inner surface 142.

Figure 13 is please referred to, in some embodiments, the route 33 of above embodiment is embedded in the interior of groove 143 completely In wall.Specifically, the inner wall of groove 143 includes the recess sidewall 1433 of groove bottom wall 1431 and circular groove bottom wall 1431, recessed Groove sidewall 1433 extends from 1431 inner surface 142 of groove bottom wall.Route 33 in groove 143 is embedded in groove completely In bottom wall 1431 and recess sidewall 1433, the route 33 outside groove 143 exposes from inner surface 142 completely.Certainly, it is located at recessed Route 33 outside slot 143 can also be embedded in completely within inner surface 142 (with shown in Figure 10), can also partially be embedded in interior table Within face 142, partially expose from inner surface 142 (with shown in 11).It is embedded in completely due to route 33 in the inner wall of groove 143, The space that route 33 occupies groove 143 is reduced, has vacateed more installation spaces for piezoelectric element 20.

Figure 14 is please referred to, in some embodiments, a part of the route 33 of above embodiment is embedded in groove 143 Inner wall on, another part of route 33 exposes from the inner wall of groove 143.Specifically, the inner wall of groove 143 includes groove bottom wall 1431 and around groove bottom wall 1431 recess sidewall 1433, recess sidewall 1433 prolongs from 1431 inner surface 142 of groove bottom wall It stretches.33 a part of route in groove 143 is embedded in groove bottom wall 1431 and recess sidewall 1433, and another part is from recessed Groove bottom wall 1431 and recess sidewall 1433 are exposed, and the route 33 outside groove 143 exposes from inner surface 142 completely.Certainly, position It can also be embedded in completely within inner surface 142 in the route 33 outside groove 143 (with shown in Figure 10), can also partially be embedded in Within inner surface 142, partially expose from inner surface 142 (with shown in 11).33 a part of route in groove 143 is embedded in In groove bottom wall 1431 and recess sidewall 1433, the space that route 33 occupies groove 143 is reduced, is vacateed for piezoelectric element 20 More installation spaces；Another part of route 33 in groove 143 reveals from groove bottom wall 1431 and recess sidewall 1433 Out, it is electrically connected convenient for route 33 and piezoelectricity mould group 30.

Figure 15 is please referred to, in some embodiments, the route 33 of above embodiment reveals from the inner wall of groove 143 completely Out.Specifically, the inner wall of groove 143 includes groove bottom wall 1431 and the recess sidewall 1433 around groove bottom wall 1431, groove Side wall 1433 extends from 1431 inner surface 142 of groove bottom wall.Route 33 is formed in groove bottom wall 1431 and groove bottom wall 1431 Above and from groove bottom wall 1431 and groove bottom wall 1431 it is completely exposed.In this way, the inner wall of groove 143 does not need to open up slot, from And the processing technology of shell 10 is reduced, it is produced on inner wall convenient for route 33.

Figure 16 is please referred to, in some embodiments, the piezoelectricity mould group 30 of above embodiment includes 20 He of piezoelectric element Route 33, route 33 are produced on inner surface 142, and piezoelectric element 20 is attached on inner surface 142 and connect with route 33.Shell Component 100 further includes encapsulating structure 40, and encapsulating structure 40 covers piezoelectric element 20 and contacted with completely cutting off piezoelectric element 20 with air, from And encapsulate piezoelectric element 20.Encapsulating structure 40 can be sprayed by encapsulating material or be formed coated in 30 surface of piezoelectricity mould group, be encapsulated Material includes epoxy resin.The encapsulating structure 40 of present embodiment has completely cut off piezoelectric element 20 and has contacted with air, avoids oxygen oxygen Change piezoelectricity mould group 30 and piezoelectricity mould group 30 is caused to fail.In other embodiments, encapsulating structure 40 can also be by conduction material Expect the shielded layer formed, shielded layer is for shielding other electronic components (for example, the elements such as circuit board, capacitor) to piezoelectricity mould group 30 Electrically interference is generated, to promote the detection accuracy of piezoelectricity mould group 30.

Referring to Fig. 8, in some embodiments, housing unit 100 further includes conducting element 50 and circuit main board 60, lead At least one end of route 33,50 connection line 33 of conducting element and circuit main board 60 is arranged in electric device 50.Circuit main board 60 can Think that printed circuit board or flexible circuit board, circuit main board 60 can be used for being electrically connected piezoelectricity mould group 30 and other electronic components, example As settable for handling the processor 202 of electric signal on circuit main board 60, as a result, piezoelectricity mould group 30 can by route 33, Conducting element 50 and circuit main board 60 are electrically connected with processor 202.Circuit main board 60 may be provided on bottom wall 16 and be housed in In cavity 122.In other embodiments, circuit main board 60 is settable on the side wall 14.

Please continue to refer to Fig. 8, in some embodiments, the housing unit 100 of above embodiment further includes positioning member Part 70, the setting of setting element 70 are on outer surface 144 and corresponding with piezoelectricity mould group 30.In this way, setting element 70 can prompt to use The location of family piezoelectricity mould group 30 is easy accurate touch-control so that user can be quickly found out the location of piezoelectricity mould group 30.

Please continue to refer to Fig. 8, in some embodiments, the housing unit 100 of above embodiment further includes positioning member Part 70, the setting of setting element 70 are on outer surface 144 and corresponding with piezoelectricity mould group 30.Setting element 70 includes groove, protrusion, text Word, figure, any one or more in symbol.The structure of setting element 70 described above is simple and convenient for production.

Please refer to Figure 17, in some embodiments, the quantity of the piezoelectricity mould group 30 of above embodiment be it is multiple, it is multiple Piezoelectricity mould group 30 is alternatively arranged along the length direction of inner surface 142.Multiple piezoelectricity mould groups 30 are arranged at can on inner surface 142 Simplify the manufacturing process of housing unit 100, and keeps the shape of housing unit 100 more beautiful.

Figure 17 is please referred to, in some embodiments, multiple piezoelectricity mould groups 30 of above embodiment are arranged in one directly Line, and multiple piezoelectricity mould groups 30 equidistantly arrange.In certain embodiments, multiple piezoelectricity mould groups 30 can be respectively induced the touching of user Control operates and in response to different function services, and function services can only include machine open/close, volume adjustment, slide page, return Return, application program switching one of.In further embodiments, multiple piezoelectricity mould groups 30 can cooperate with the operation of induction user simultaneously In response to a function services.Wherein, the touch control operation of user is respectively induced for responding difference in multiple piezoelectricity mould groups 30 Function services when, spaced mode can accidentally contact other piezoelectricity adjoining with target piezo-electric mould group 30 to avoid user Mould group 30；When multiple piezoelectricity mould groups 30 are used to cooperate with the touch control operation of induction user to respond identical function services, straight line Multiple piezoelectricity mould groups 30 of arrangement make touch control operation (for example, linear slide touch-control etc.) more smooth simplicity of user, smooth Touch control operation piezoelectricity mould group 30 can also be made to respond much sooner to the touch control operation of user.

Figure 17 is please referred to, in some embodiments, two groups of multiple piezoelectricity mould groups 30 formation of above embodiment, first Multiple piezoelectricity mould groups 30 of group are arranged in first straight line, and second group of multiple piezoelectricity mould groups 30 are arranged in second straight line, and first is straight Line is parallel with second straight line, the gap between second group of each piezoelectricity mould group 30 and first group of two neighboring piezoelectricity mould group 30 146 alignments.In this way, piezoelectricity mould group 30 is arranged above gap 146 between adjacent piezoelectricity mould group 30, on the one hand when multiple pressures When electric mould group 30 is respectively induced the touch control operation of user to respond different function services, due between each piezoelectricity mould group 30 still Old there are gaps 146, it can thus be avoided user accidentally contacts other piezoelectricity mould groups 30 neighbouring with target piezo-electric mould group 30；Separately On the one hand when multiple piezoelectricity mould groups 30 are used to cooperate with the touch control operation of induction user to respond identical function services, between two groups The touch control operation of user can be more fully sensed every the piezoelectricity mould group 30 of arrangement, sensitivity is higher, and piezoelectricity mould group 30 can The touch control operation of user is responded much sooner.

Referring again to Fig. 6, in some embodiments, electronic device 200 may also include processor 202.Processor 202 is used Function services corresponding with the touch control operation of user are triggered in the electric signal generated according to piezoelectricity mould group 30.Function services include Machine open/close, volume adjustment, slide page, return, application program switching in any one or more.Wherein, volume adjustment packet It includes and increases volume and reduction volume.

In other words, function services can only include machine open/close, volume adjustment, slide page, return, application program is cut One of change；Alternatively, function services can include both machine open/close and volume adjustment, volume adjustment and slide page simultaneously The two, return and application program switching both, slide page and returns the two etc.；Alternatively, function services can simultaneously include open/ Shutdown, volume adjustment and the three that slides page, machine open/close, sliding page switches three, volume adjustment, return with application program Switch three etc. with application program；Alternatively, function services can include simultaneously machine open/close, volume adjustment, slide page, return With application program switching.

In this way, the corresponding multiple function services of physical button are triggered by touch-control piezoelectricity mould group 30, so that electric Sub-device 200 can integrated design, promote waterproof and anti-dust performance, increase the installation space of display screen 201.

In some embodiments, when deformation occurs and generates the electric signal of touch-control by external force for piezoelectricity mould group 20 When, the trigger condition for triggering function services corresponding with the touch control operation of user includes the pressing force of user's pressing piezoelectricity mould group 30 Degree is greater than or equal to preset pressure value and/or user presses the compressing time of piezoelectricity mould group 30 more than or equal to preset time.

In other words, piezoelectricity mould group 30, which senses, needs to meet certain trigger condition after the touch control operation of user and could touch Send out function services corresponding.Trigger condition, which can be, is greater than or equal to preset pressure value in the dynamics that user presses piezoelectricity mould group 30 When ability Trigger Function service；Either just touched when the compressing time that user presses piezoelectricity mould group 30 is greater than or equal to preset time Send out function services；Either it is greater than or equal to preset pressure value in the pressing dynamics that user presses piezoelectricity mould group 30, and user presses Ability Trigger Function service when the compressing time of piezoelectricity mould group 30 being pressed to be greater than preset time or be equal to；Or in electronic device 200 A part of 30 Trigger Function service of piezoelectricity mould group trigger condition be user press piezoelectricity mould group 30 pressing dynamics be greater than or Equal to preset pressure value, the trigger condition of 30 Trigger Function service of another part piezoelectricity mould group is that user presses piezoelectricity mould group 30 Compressing time is greater than or equal to preset time.

Take the mobile phone as an example, user usually using when mobile phone sometimes for holding the side wall 14 of mobile phone gently to prevent mobile phone from falling It falls, at this point, piezoelectricity mould group 30 can still sense the touch control operation of user, but actually user does not think Trigger Function service. Therefore, to prevent user's false triggering the case where, set preset pressure value or with the trigger condition of preset time can to avoid because with The problem of maloperation at family causes function services to be triggered improves the usage experience of user.

In some embodiments, touch control operation includes: that user once presses piezoelectricity mould group 30；And/or user is with first Preset interval time repeatedly presses piezoelectricity mould group 30.

In other words, when user's touch control operation piezoelectricity mould group 30, can be once pressing one piezoelectricity mould group 30 and make by Surging or compressing time meet trigger condition to trigger corresponding function services；Alternatively, user's touch control operation piezoelectricity mould group 30 When, it can be repeatedly one piezoelectricity mould group 30 of pressing and meet the pressing dynamics for pressing piezoelectricity mould group 30 every time or compressing time Trigger condition is to trigger corresponding function services, wherein the time interval between adjacent pressing twice is between the first preset time Every, the value of the first prefixed time interval should not be too large, for example, the value of the first prefixed time interval can be equivalent for 0.5s, 1s, In this way, influencing the usage experience of user to avoid overlong time needed for a certain function services of triggering.

Specifically, the corresponding relationship illustrated between touch control operation and function services is taken the mobile phone as an example.For example, when mobile phone is in When off-mode, user once presses piezoelectricity mould group 30 relevant to machine open/close and is greater than or equal to pressing dynamics in advance If can trigger mobile phone power-on when pressure value；When mobile phone is in open state, user once presses relevant to machine open/close one A piezoelectricity mould group 30 simultaneously makes pressing dynamics can trigger mobile phone shutdown when being greater than or equal to preset pressure value.Or for example, work as mobile phone When in off-mode, user once presses piezoelectricity mould group 30 relevant to machine open/close and compressing time is made to be greater than or wait It can trigger mobile phone power-on when preset time；When mobile phone is in open state, user once presses relevant to machine open/close One piezoelectricity mould group 30 simultaneously makes compressing time can trigger mobile phone shutdown when being greater than or equal to preset time.Or for example, work as mobile phone When in off-mode, user's continuous several times press piezoelectricity mould group 30 relevant to machine open/close and make to press piezoelectricity every time The pressing dynamics of mould group 30 can trigger mobile phone power-on when being greater than or equal to preset pressure value；When mobile phone is in open state, User's continuous several times press piezoelectricity mould group 30 relevant to machine open/close and make the pressing dynamics for pressing piezoelectricity mould group 30 every time It can trigger mobile phone shutdown when more than or equal to preset pressure value.Or for example, user is continuously more when mobile phone is in off-mode It is secondary to press piezoelectricity mould group 30 relevant to machine open/close and be greater than or equal to the compressing time for pressing piezoelectricity mould group 30 every time It can trigger mobile phone power-on when preset time；When mobile phone is in open state, the pressing of user's continuous several times is related to machine open/close A piezoelectricity mould group 30 and keep the compressing time for pressing piezoelectricity mould group 30 every time i.e. triggerable when being greater than or equal to preset time Mobile phone shutdown.

Similarly, volume adjustment, slide page, return, application program can also be by once pressing a piezoelectricity mould group 30 Or press a piezoelectricity mould group 30 repeatedly to realize.

In this way, user can be realized by pressing the multiple touch control operation of primary or continuous pressing to a piezoelectricity mould group 30 The triggering of function services.

In some embodiments, the quantity of piezoelectricity mould group 30 includes multiple, and touch control operation includes: user while pressing is more A piezoelectricity mould group 30；And/or user once presses multiple piezoelectricity mould groups 30 with the second preset interval time timesharing.

In other words, when user's touch control operation piezoelectricity mould group 30, can once simultaneously press multiple piezoelectricity mould groups 30 and make by It presses the pressing dynamics of each piezoelectricity mould group 30 or compressing time while meeting trigger condition to trigger corresponding function services；Or Person, when user's touch control operation piezoelectricity mould group 30, can timesharing repeatedly press multiple piezoelectricity mould groups 30 and make to press piezoelectricity mould group every time 30 pressing dynamics or compressing time are all satisfied trigger condition to trigger corresponding function services, wherein adjacent to press it twice Between time interval be the second prefixed time interval, the value of the second prefixed time interval should not be too large, for example, second it is default when Between the value that is spaced can be equivalent for 0.01s, 0.05s, 0.1s.

Specifically, the corresponding relationship illustrated between touch control operation and function services is taken the mobile phone as an example.Wherein, with user towards For the display screen 201 of mobile phone, the touch control operation for incuding user is provided on the side wall 14 on the right side of mobile phone to realize ON/OFF Two piezoelectricity mould groups 30 of machine are provided with the touch control operation for incuding user to realize volume tune on the side wall 14 on the left of mobile phone Four piezoelectricity mould groups 30 of section.For example, user can press two pressures of right sidewall 14 simultaneously when mobile phone is in off-mode Electric mould group 30 simultaneously makes the pressing dynamics for pressing the two piezoelectricity mould groups 30 simultaneously greater than or can trigger when being equal to preset pressure value Mobile phone power-on；When mobile phone is in open state, user can press simultaneously two piezoelectricity mould groups 30 of right sidewall 14 and make by It presses the pressing dynamics of the two piezoelectricity mould groups 30 simultaneously greater than or can trigger mobile phone shutdown when being equal to preset pressure value.Or example Such as, when mobile phone is in off-mode, user can press two piezoelectricity mould groups 30 of right sidewall 14 simultaneously and make piezoelectricity mould group 30 compressing time simultaneously greater than or when being equal to preset time can trigger mobile phone power-on；When mobile phone is in open state, use Family can press two piezoelectricity mould groups 30 of right sidewall 14 and making simultaneously and press the compressing time of the two piezoelectricity mould groups 30 simultaneously It can trigger mobile phone shutdown when more than or equal to preset time.Or for example；When mobile phone is in open state, user is on a mobile phone left side Slide from top to bottom is executed on the side wall 14 of side, user's finger meeting timesharing is successively pressed into left side during slide Four piezoelectricity mould groups 30 on side wall 14, and the pressing dynamics for pressing piezoelectricity mould group 30 are all larger than or are equal to preset pressure value, this When can trigger reduce volume function services；User executes slide from the bottom to top on the side wall 14 on the left of mobile phone, User's finger can successively be pressed into four piezoelectricity mould groups 30 on the side wall 14 of left side during slide, and press piezoelectricity mould group 30 pressing dynamics are all larger than or are equal to preset pressure value, can trigger the function services for increasing volume at this time.Or for example, work as hand When machine is in open state, user from top to bottom successively quickly clicks four piezoelectricity mould groups 30 on the side wall 14 on the left of mobile phone, And the pressing dynamics for pressing piezoelectricity mould group 30 every time is made to be all larger than or be equal to preset pressure value, it can trigger reduce volume at this time Function services；User successively quickly clicks four piezoelectricity mould groups 30 from the bottom to top on the side wall 14 on the left of mobile phone, and makes every time When the pressing dynamics of pressing piezoelectricity mould group 30 are all larger than or are equal to preset pressure value, it can trigger the function clothes for increasing volume at this time Business.

Similarly, volume adjustment, slide page, return, application program switching function services can by and meanwhile press Multiple piezoelectricity mould groups 30 are realized.In addition, the function services to slide page can also successively press multiple piezoelectricity mould groups 30 by timesharing It realizes.

In this way, user realizes the triggering of function services by the multiple piezoelectricity mould groups 30 of touch control operation.

In some embodiments, the touch control operation direction (for example, from top to bottom, from the bottom to top etc.) of user can be by Reason device 202 is perceived.In other words, processor 202 can be used for obtaining user's touch control operation piezoelectricity mould group 30 by electric signal Pressure, the direction of touch control operation is judged according to the change of the position of piezoelectricity mould group 30, and true according to the direction of touch control operation Fixed function services corresponding with the direction of touch control operation.

Specifically, the touching that multiple piezoelectricity mould groups 30 are used to cooperate with the touch control operation of induction user to realize corresponding function service When hair, since the position of each piezoelectricity mould group 30 setting is different, when piezoelectricity mould group 30 senses the touch control operation of user simultaneously When the electric signal of generation is sent to processor 202, processor 202 is according to the sequencings of the multiple electric signals received The position for the piezoelectricity mould group 30 that user successively operates during judgement pressing, so that it is determined that the direction of place's touch control operation.In this way, with Family can realize volume adjustment, slide page etc. functions clothes in such a way that sliding or timesharing repeatedly press multiple piezoelectricity mould groups 30 Business.

In some embodiments, processor 202 is also used to obtain user's touch control operation piezoelectricity mould group 30 by electric signal Pressure trigger function corresponding from different pre-set pressure ranges and when pressure falls into different pre-set pressure ranges Service.

In other words, the same piezoelectricity mould group 30 or multiple cooperates with the piezoelectricity mould group 30 of triggering identical function service that can lead to The difference of the pressure of user's touch control operation is crossed to trigger different function services.Specifically, for example, a piezoelectricity mould group 30 can be real The function services of existing machine open/close and application program switching, then in the case where mobile phone is in open state, when user is pre- to fall in first If can trigger the function services of application program switching when the first pressure in pressure limit presses above-mentioned piezoelectricity mould group 30, at this time Application program switch window can be shown on display screen 201；When user with the second pressure that falls in the second pre-set pressure range by Press the function services that can trigger shutdown when above-mentioned piezoelectricity mould group 30.Wherein, first pressure is less than second pressure and first pressure Greater than preset pressure value, the maximum pressure value of the first pre-set pressure range less than the second pre-set pressure range minimum pressure values and The minimum pressure values of first pre-set pressure range are greater than preset pressure value.For another example two piezoelectricity mould groups 30 can be pressed at the same time The function services returned with application program switching are realized in the state of pressure, then are in open state in mobile phone and mobile phone is not in master When under interface, when user is with the first pressure that falls in the first pre-set pressure range while pressing above-mentioned two piezoelectricity mould group 30 The function services that can trigger application program switching, can show the window of reference program switching at this time on display screen 201；Work as user When with the second pressure fallen in the second pre-set pressure range while pressing two above-mentioned piezoelectricity mould groups 30, that is, it can trigger and return Function services.

In this way, piezoelectricity mould group 30 can trigger different function services according to the difference of pressing dynamics, piezoelectricity mould group 30 is answered With the manufacturing cost for reducing housing unit 100 and electronic device 200.

Figure 18 is please referred to, in some embodiments, side wall 14 is divided into multiple touch areas.Each touch area setting There is at least one piezoelectricity mould group 30.Each touch area corresponds to different function services.

Specifically, for example, side wall 14 is divided into the first touch area, the second touch area, third touch area, the 4th touching Control region and the 5th touch area.Wherein, there are four piezoelectricity mould groups 30 for the setting of the first touch area, for realizing volume adjustment Function.There are four piezoelectricity mould groups 30 for the setting of second touch area, for realizing the function of sliding page.The setting of third touch area There is a piezoelectricity mould group 30, for realizing machine open/close function.4th touch area is provided with a piezoelectricity mould group 30, for real Now return to function.5th touch area is provided with a piezoelectricity mould group 30, for realizing application program handoff functionality.

In this way, realize that the piezoelectricity mould group 30 of different function service is separately positioned in the different touch areas of side wall 14, it can To facilitate the operation of user.

In the description of this specification, reference term " one embodiment ", " some embodiments ", " example ", " specifically show The description of example " or " some examples " etc. means specific features, structure, material or spy described in conjunction with this embodiment or example Point is included at least one embodiment or example of the invention.In the present specification, schematic expression of the above terms are not It must be directed to identical embodiment or example.Moreover, particular features, structures, materials, or characteristics described can be in office It can be combined in any suitable manner in one or more embodiment or examples.In addition, without conflicting with each other, the skill of this field Art personnel can tie the feature of different embodiments or examples described in this specification and different embodiments or examples It closes and combines.

In addition, term " first ", " second " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance Or implicitly indicate the quantity of indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or Implicitly include at least one this feature.In the description of the present invention, the meaning of " plurality " is at least two, such as two, three It is a etc., unless otherwise specifically defined.

Although the embodiments of the present invention has been shown and described above, it is to be understood that above-described embodiment is example Property, it is not considered as limiting the invention, those skilled in the art within the scope of the invention can be to above-mentioned Embodiment is changed, modifies, replacement and variant.

Claims

1. a kind of piezoelectric element characterized by comprising

Piezoelectric layer, the piezoelectric layer include piezoelectric body and conducting element, the piezoelectric body include opposite first surface and Second surface, the conducting element and the piezoelectric body are integrally formed to be embedded in the piezoelectric body, the conductive element Part runs through the first surface and the second surface；

Second electrode, the second electrode are arranged on the second surface；And

Connection electrode, the connection electrode are arranged on the second surface and are electrically connected with the conducting element, the connection Electrode is spaced apart from each other with the second electrode.

2. piezoelectric element according to claim 1, which is characterized in that the conducting element includes gold, silver, any in copper It is one or more.

3. a kind of production method of piezoelectric element, which is characterized in that the production method includes:

Piezoelectric material and conductive material are provided；

The conductive material is embedded in the piezoelectric material and is integrally formed to obtain piezoelectric layer, the piezoelectric layer includes by institute The conducting element stating the piezoelectric body of piezoelectric material formation and being formed by the conductive material, the piezoelectric body includes opposite First surface and second surface, the conducting element are embedded in the piezoelectric body, and the conducting element runs through described first Surface and the second surface；

Second electrode is formed on the second surface；And

Form connection electrode in the second surface, the connection electrode be electrically connected with the conducting element and with it is described second electric Pole is spaced apart from each other.

4. a kind of housing unit, which is characterized in that the housing unit includes:

Shell, the shell include roof, bottom wall and side wall, and the roof is opposite with the bottom wall, offers on the roof Accommodating chamber, the side wall connect the roof and the bottom wall, and the side wall includes opposite inner surface and outer surface；With

Piezoelectricity mould group, the piezoelectricity mould group are installed on the internal surface and are housed in the accommodating chamber, the piezoelectricity mould group For generating electric signal according to the touch control operation of user, the piezoelectricity mould group includes piezoelectric element, and the piezoelectric element includes:

Second electrode, second electrode are arranged on the second surface；And

5. housing unit according to claim 4, which is characterized in that the piezoelectricity mould group further includes circuit board,

The piezoelectric element is arranged on the inner surface and the circuit board, and the inner surface is located at the circuit board The opposite two sides of the piezoelectric element；Or

The piezoelectric element is arranged on the circuit board, the circuit board setting on the internal surface, the inner surface with The piezoelectric element is located at the opposite two sides of the circuit board.

6. housing unit according to claim 4, which is characterized in that the piezoelectricity mould group further includes route, the route Production on the internal surface, piezoelectric element setting on the internal surface and with the connection.

7. housing unit according to claim 6, which is characterized in that the inner surface opens up fluted, the route system Make in the inner surface and the groove, the route is continuously distributed.

8. housing unit according to claim 4, which is characterized in that the housing unit further includes setting element, described Setting element setting is on the outer surface and corresponding with the piezoelectricity mould group, and the setting element includes groove, protrusion, text Word, figure, any one or more in symbol.

9. housing unit according to claim 4, which is characterized in that the quantity of the piezoelectricity mould group is multiple, Duo Gesuo The length direction that piezoelectricity mould group is stated along the inner surface is alternatively arranged.

10. housing unit according to claim 9, which is characterized in that multiple piezoelectricity modular arrangements are in alignment, And multiple piezoelectricity mould groups equidistantly arrange.

11. housing unit according to claim 9, which is characterized in that multiple piezoelectricity mould groups form two groups, first group Multiple piezoelectricity modular arrangements at first straight line, second group of multiple piezoelectricity modular arrangements are described at second straight line First straight line is parallel with the second straight line, each of the second group piezoelectricity mould group and first group of the two neighboring piezoelectricity Gap alignment between mould group.

12. a kind of electronic device, which is characterized in that the electronic device includes:

Housing unit described in claim 4-11 any one；With