CN109595876A - A kind of modularization cooling capacity shared device - Google Patents
A kind of modularization cooling capacity shared device Download PDFInfo
- Publication number
- CN109595876A CN109595876A CN201811473325.6A CN201811473325A CN109595876A CN 109595876 A CN109595876 A CN 109595876A CN 201811473325 A CN201811473325 A CN 201811473325A CN 109595876 A CN109595876 A CN 109595876A
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- Prior art keywords
- cold air
- plate
- semiconductor chilling
- cold
- cooling capacity
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Links
- 238000001816 cooling Methods 0.000 title claims abstract description 43
- 239000004065 semiconductor Substances 0.000 claims abstract description 46
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 25
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 12
- 229910052802 copper Inorganic materials 0.000 claims description 12
- 239000010949 copper Substances 0.000 claims description 12
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 12
- 238000012216 screening Methods 0.000 claims description 6
- 235000005121 Sorbus torminalis Nutrition 0.000 claims description 3
- 244000152100 Sorbus torminalis Species 0.000 claims description 3
- 238000009413 insulation Methods 0.000 claims description 3
- 238000005057 refrigeration Methods 0.000 abstract description 25
- 230000000694 effects Effects 0.000 abstract description 24
- 238000009434 installation Methods 0.000 abstract description 5
- 230000005540 biological transmission Effects 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- 230000000903 blocking effect Effects 0.000 description 4
- 230000006870 function Effects 0.000 description 4
- 241000196324 Embryophyta Species 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000004378 air conditioning Methods 0.000 description 2
- 238000007664 blowing Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 238000007710 freezing Methods 0.000 description 2
- 230000008014 freezing Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000001568 sexual effect Effects 0.000 description 2
- 230000005679 Peltier effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 235000013305 food Nutrition 0.000 description 1
- 235000013611 frozen food Nutrition 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D31/00—Other cooling or freezing apparatus
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D17/00—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces
- F25D17/04—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating air, e.g. by convection
- F25D17/06—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating air, e.g. by convection by forced circulation
- F25D17/08—Arrangements for circulating cooling fluids; Arrangements for circulating gas, e.g. air, within refrigerated spaces for circulating air, e.g. by convection by forced circulation using ducts
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D19/00—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D23/00—General constructional features
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D23/00—General constructional features
- F25D23/003—General constructional features for cooling refrigerating machinery
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
- F25D2317/00—Details or arrangements for circulating cooling fluids; Details or arrangements for circulating gas, e.g. air, within refrigerated spaces, not provided for in other groups of this subclass
- F25D2317/06—Details or arrangements for circulating cooling fluids; Details or arrangements for circulating gas, e.g. air, within refrigerated spaces, not provided for in other groups of this subclass with forced air circulation
- F25D2317/067—Details or arrangements for circulating cooling fluids; Details or arrangements for circulating gas, e.g. air, within refrigerated spaces, not provided for in other groups of this subclass with forced air circulation characterised by air ducts
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The invention discloses a kind of modularization cooling capacity shared devices, including shell, the shell side is equipped with semiconductor chilling plate cold end, the survey of semiconductor chilling plate cold end one is equipped with fixed shared component, structure of the invention is scientific and reasonable, it is safe and convenient to use, it is provided with semiconductor chilling plate, pass through the effect of semiconductor chilling plate cold end and semiconductor chilling plate hot end, realize the purpose of refrigeration, recycle vent board, the effect of exhaust fan and the first cold air sharing channel, convenient for accelerating the transmitting of cold air, it is guided into the first cold air sharing channel for use to which the cold air for generating semiconductor chilling plate carries out transmission, reduce cooling time, reduce refrigeration cost, use scope is more extensive, it is provided with fixed shared component, pass through the first mounting plate, the effect of connecting groove and limiting slot, convenient for carrying out peace installation and dismantling to the first mounting plate It unloads, module and refrigeration module and multiple modules while being fixed, improve work efficiency consequently facilitating will blow a cold wind over.
Description
Technical field
The present invention relates to technical field of refrigeration equipment, specially a kind of modularization cooling capacity shared device.
Background technique
Refrigeration equipment is refrigeration machine and the combined device of facility using cooling capacity;Design and construction refrigerating plant,
It is in order to which cooling capacity is efficiently used and comes chilled food or other articles;The performance test and scientific research of product are carried out at low temperature
Test;Certain cooling procedures are realized in the industrial production, or carry out air conditioning;Most widely used is vapor compression refrigeration,
Capital equipment has compressor, condenser, evaporator and throttle valve;Compressor is used to compressing and conveying refrigerant vapour, wherein with
Piston type and centrifugal most widely used, wherein air-cooler is a kind of common refrigeration equipment, and it is cold that air-cooler is divided into refrigerating industry
Blower and Household air cooler, industrial air-cooler are generally used for freezer, in Cold Chain Logistics refrigerating environment, and Household air cooler is called water cooling
Air-conditioning is a kind of to integrate cooling, ventilation, dust-proof, taste removal evaporative cooling unit air-cooler (vaporation-type cold air
Machine), cool principle is: entering intracavitary generation negative pressure when fan operation, the wet curtain table for keeping the outer excessive hole of air stream of machine wet
Face forced the dry-bulb temperature of curtain air to be down to the wet-bulb temperature close to air outside machine, i.e. the dry-bulb temperature ratio of air-cooler outlet
Outdoor dry-bulb temperature is 5-12 DEG C low, and air is more xeothermic, and the temperature difference is bigger, and cooling effect is better, but existing air-cooler be by
Ice cube is placed in air-cooler, and the time of refrigeration is long, needs to make ice cube, expensive, at high cost, can be generated in process of refrigerastion big
The steam of amount influences the comfort level of user so that environment be become moist through, and is not suitable for the ground such as south, and common system
Air-cooler or refrigeration equipment have a single function, and the cooling capacity for generation of freezing is only available to single equipment and works, Bu Nengshi
Existing plurality of devices shares the cooling capacity of the same refrigerating plant simultaneously, and resource utilization is low, and the sexual valence of equipment is relatively low, cannot big model
Popularization and use etc. are enclosed, so being badly in need of a kind of modularization cooling capacity shared device to solve the above problems.
Summary of the invention
The present invention provides a kind of modularization cooling capacity shared device, can effectively solve mentioned above in the background art existing
Air-cooler be that ice cube is placed in air-cooler, time of refrigeration is long, needs to make ice cube, expensive, at high cost, freezes
Cheng Zhonghui, which generates a large amount of steam, influences the comfort level of user so that environment be become moist through, and is not suitable for the ground such as south,
And common refrigeration fan or refrigeration equipment has a single function, and the cooling capacity for generation of freezing is only available to single equipment and carries out
Work, can not achieve plurality of devices while sharing the cooling capacity of the same refrigerating plant, resource utilization is low, and the sexual valence of equipment compares
It is low, the problems such as cannot promoting the use of on a large scale.
To achieve the above object, the invention provides the following technical scheme: a kind of modularization cooling capacity shared device, including it is outer
Shell, the interior of shell are equipped with semiconductor chilling plate cold end, and semiconductor chilling plate cold end lower end is equipped with semiconductor system
Cold hot end, semiconductor chilling plate cold end two sides are mounted on vent board, and the vent board side is equipped with exhaust fan, institute
It states exhaust fan upper end and the first cold air sharing channel is installed, the first cold air sharing channel side is equipped with fixed shared group
Part, the fixation shares component and includes the first mounting plate, connecting groove, limiting slot, stripper plate, connecting spring and baffle, described
First mounting plate, the first cold air sharing channel and the first mounting plate corresponding position are installed between the first cold air sharing channel
Place offers connecting groove, and both ends offer limiting slot inside the connecting groove, is equipped with inside the connecting groove crowded
Pressing plate, is equipped with connecting spring between the stripper plate and connecting groove inner bottom, described connecting groove one end is equipped with gear
Plate, the first cold air sharing channel upper end are equipped with the second cold air sharing channel, the second cold air sharing channel side peace
Equipped with the second mounting plate;
The fixation shares component side and is equipped with cold air connection component, and the cold air connection component includes cold air connection
Head hides hawk, movable axis, cold air valve, connection screwed pipe and inner tube, and the first cold air sharing channel side is equipped with cold air company
Connector, cold air connector side are equipped with screening hawk, are equipped with movable axis between the screening hawk and cold air connector, institute
It states cold air connector side and inner tube is installed, cold air valve is installed on the outside of said inner tube, the cold air valve side is equipped with
Connect screwed pipe.
Preferably, the shell bottom end is equipped with water cooling component, and the water cooling component includes water-cooled plate, diversion trench, water inlet
Pipe, outlet pipe and conduction copper bottom, semiconductor chilling plate hot end one end are equipped with water-cooled plate, and the water-cooled plate side offers
Diversion trench, the diversion trench side are equipped with water inlet pipe, and the diversion trench other side is equipped with outlet pipe, the water-cooled plate and half
Conductor cooling piece is equipped with conduction copper bottom between hot end.
Preferably, described shell one end is equipped with support component, and the support component includes support column, adjustment axis, inclined plate
And pedestal, shell bottom end two sides are mounted on support column, the described support column one end of institute is equipped with adjustment axis, the adjustment axis
Two sides are mounted on inclined plate, and the inclined plate side is equipped with pedestal.
Preferably, thermal insulation board is installed inside the first cold air sharing channel.
Preferably, telescoping tube is installed inside the first cold air sharing channel, and telescoping tube top is equipped with handle.
Preferably, the width of the connecting groove is greater than the thickness of the first mounting plate, first mounting plate two sides and limit
Position slot corresponding position is equipped with limit card block.
Preferably, torque spring is installed inside the movable axis.
Preferably, described adjustment axis one end is equipped with adjusting knob.
Preferably, the pedestal bottom end is equipped with rubber pad, and rubber pad bottom end offers anti-skid chequer.
Compared with prior art, beneficial effects of the present invention: structure of the invention is scientific and reasonable, safe and convenient to use:
1, it is provided with semiconductor chilling plate, passes through the effect of semiconductor chilling plate cold end and semiconductor chilling plate hot end, benefit
With the Peltier effect of semiconductor material, semiconductor chilling plate cold end and semiconductor chilling plate hot end absorb respectively heat and
It releases heat and generates the Refrigeration Technique of negative thermal resistance using semiconductor chilling plate to realize the purpose of refrigeration, avoid movement portion
The installation of part improves the reliability of device, using the effect of vent board, exhaust fan and the first cold air sharing channel, convenient for adding
The transmitting of fast cold air, thus by the cold air that semiconductor chilling plate generates carry out transmission guidance into the first cold air sharing channel to
With easy to use, fast refrigeration reduces cooling time, reduces refrigeration cost, and use scope is more extensive.
2, it is provided with fixed shared component, by the effect of the first mounting plate, connecting groove and limiting slot, convenient for first
Mounting plate is mounted and dismounted, consequently facilitating module will blow a cold wind over and refrigeration module is supported fixation, by stripper plate and
The effect of connecting spring, convenient for carrying out extruding fixation to the first mounting plate, the first mounting plate shakes when avoiding device, improves
The stability of device, recycles the effect of baffle, blocks convenient for the opening to connecting groove, impurity is avoided to enter connection
Inside grooves.
3, it is provided with cold air connection component, by connecting the effect of screwed pipe and inner tube, convenient for by outside multiple equipment and the
One cold air sharing channel is attached, so that cold air in shared first cold air sharing channel, improves the utilization rate of resource, reduce at
This, improves work efficiency, recycles the effect of cold air valve, convenient for opening and closing to inner tube, control the defeated of cold air
Out, by the effect of cold air connector, screening hawk and movable axis, convenient for when not in use, being carried out to the opening of cold air connector
Block, avoid extraneous dust from entering inside cold air connector and pollute blocking, when pipeline connection when, convenient for connecting pipe into
Row is auxiliarily fixed, and improves and is connected and fixed effect.
4, water cooling component is set, by the effect at conduction copper bottom and water-cooled plate, convenient for by the heat in semiconductor chilling plate hot end
Amount is absorbed, so that the heat in semiconductor chilling plate hot end be evacuated, improves the refrigeration effect of semiconductor chilling plate, is led to
The effect of diversion trench, water inlet pipe and outlet pipe is crossed, the heat convenient for absorbing conduction copper bottom is flowed by the effect of water flow
It absorbs, accelerates the rate of volatilization of heat, use is more convenient.
5, it is provided with support component, by the effect of support column, adjustment axis, inclined plate and pedestal, convenient for according to actual needs
The angle between inclined plate is adjusted, so that device work is more stable.
Detailed description of the invention
Attached drawing is used to provide further understanding of the present invention, and constitutes part of specification, with reality of the invention
It applies example to be used to explain the present invention together, not be construed as limiting the invention.
In the accompanying drawings:
Fig. 1 is structural schematic diagram of the invention;
Fig. 2 is the structural schematic diagram of semiconductor refrigerating of the present invention;
Fig. 3 is the structural schematic diagram of the fixed shared component of the present invention;
Fig. 4 is the structural schematic diagram of cold air connection component of the present invention;
Fig. 5 is the structural schematic diagram of water cooling component of the present invention;
Fig. 6 is the structural schematic diagram of support component of the present invention;
Figure label: 1, shell;2, semiconductor chilling plate cold end;3, semiconductor chilling plate hot end;4, vent board;5, it is vented
Fan;6, the first cold air sharing channel;7, fixed shared component;701, the first mounting plate;702, connecting groove;703, limiting slot;
704, stripper plate;705, connecting spring;706, baffle;707, the second cold air sharing channel;708, the second mounting plate;8, cold air connects
Connected components;801, cold air connector;802, hawk is hidden;803, movable axis;804, cold air valve;805, screwed pipe is connected;806, interior
Pipe;9, water cooling component;901, water-cooled plate;902, diversion trench;903, water inlet pipe;904, outlet pipe;905, conduction copper bottom;10, it props up
Support component;1001, support column;1002, adjustment axis;1003, inclined plate;1004, pedestal.
Specific embodiment
Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings, it should be understood that preferred reality described herein
Apply example only for the purpose of illustrating and explaining the present invention and is not intended to limit the present invention.
Embodiment: as shown in figures 1 to 6, the present invention provides a kind of technical solution, a kind of modularization cooling capacity shared device, including
Shell 1 is equipped with semiconductor chilling plate cold end 2 inside shell 1, and 2 lower end of semiconductor chilling plate cold end is equipped with semiconductor refrigerating
Piece hot end 3,2 two sides of semiconductor chilling plate cold end are mounted on vent board 4, and 4 side of vent board is equipped with exhaust fan 5, exhaust fan 5
Upper end is equipped with the first cold air sharing channel 6, in order to avoid the cold air inside the first cold air sharing channel 6 is by the shadow of external environment
It rings, for the ease of realizing multiple modules shared cold air simultaneously, telescoping tube is installed inside the first cold air sharing channel 6, and flexible
Tube top end is equipped with handle, and thermal insulation board, the installation of 6 side of the first cold air sharing channel are equipped with inside the first cold air sharing channel 6
There is fixed shared component 7, fixed shared component 7 includes the first mounting plate 701, connecting groove 702, limiting slot 703, stripper plate
704, connecting spring 705 and baffle 706, the first mounting plate 701 is equipped between the first cold air sharing channel 6, and the first cold air is total
It enjoys channel 6 and 701 corresponding position of the first mounting plate offers connecting groove 702,702 inside both ends of connecting groove offer
Limiting slot 703, in order to avoid the first mounting plate 701 skids off connecting groove 702, the width of connecting groove 702 is greater than the first installation
The thickness of plate 701,701 two sides of the first mounting plate and 703 corresponding position of limiting slot are equipped with limit card block, connecting groove 702
Inside is equipped with stripper plate 704, is equipped with connecting spring 705 between 702 inner bottom of stripper plate 704 and connecting groove, connection
702 one end of groove is equipped with baffle 706, and 6 upper end of the first cold air sharing channel is equipped with the second cold air sharing channel 707, described
Second cold air sharing channel, 707 side is equipped with the second mounting plate 708, for the ease of by the heat in semiconductor chilling plate hot end 3
The heat for being absorbed, while conduction copper bottom 905 being absorbed carries out flowing evacuation by the effect of water flow, accelerates waving for heat
Rate is sent out, use is more convenient, and 1 bottom end of shell is equipped with water cooling component 9, and water cooling component 9 includes water-cooled plate 901, diversion trench
902, water inlet pipe 903, outlet pipe 904 and conduction copper bottom 905,3 one end of semiconductor chilling plate hot end are equipped with water-cooled plate 901, water
901 side of cold plate offers diversion trench 902, and 902 side of diversion trench is equipped with water inlet pipe 903, and 902 other side of diversion trench is equipped with
Outlet pipe 904 is equipped with conduction copper bottom 905, for the ease of according to reality between water-cooled plate 901 and semiconductor chilling plate hot end 3
Demand adjusts the angle between inclined plate 1003, so that device work is more stable, 1 one end of shell is equipped with support component 10, branch
Support component 10 includes support column 1001, adjustment axis 1002, inclined plate 1003 and pedestal 1004, and 1 bottom end two sides of shell are mounted on branch
Dagger 1001, support column 1001 are adjusted for the ease of the angle to inclined plate 1003, and 1002 one end of adjustment axis is equipped with adjusting
Knob, 1001 one end of support column are equipped with adjustment axis 1002, and 1002 two sides of adjustment axis are mounted on inclined plate 1003, inclined plate 1,003 1
Side is equipped with pedestal 1004, in order to increase the frictional force between 1004 bottom of pedestal and ground, pedestal when avoiding device works
1004 slide, and 1004 bottom end of pedestal is equipped with rubber pad, and rubber pad bottom end offers anti-skid chequer.
Fixed shared 7 side of component is equipped with cold air connection component 8, cold air connection component 8 include cold air connector 801,
Hide hawk 802, movable axis 803, cold air valve 804, connection screwed pipe 805 and inner tube 806,6 side of the first cold air sharing channel peace
Equipped with cold air connector 801,801 side of cold air connector, which is equipped with, hides hawk 802, hide hawk 802 and cold air connector 801 it
Between movable axis 803 is installed, for the ease of when not in use, blocking to the opening of cold air connector 801, avoid extraneous ash
Dirt, which enters inside cold air connector 801, pollutes blocking, when pipeline connection, convenient for connecting pipe is auxiliarily fixed,
It improves and is connected and fixed effect, torque spring is installed inside movable axis 803,801 side of cold air connector is equipped with inner tube
806, cold air valve 804 is installed, 804 side of cold air valve is equipped with connection screwed pipe 805 on the outside of inner tube 806.
The working principle of the invention and process for using: when device carries out refrigeration work, first according to realization working environment
The angle between inclined plate 1003 is adjusted, to improve the stability of device work, is imitated followed by the Peltier of semiconductor material
It answers, when direct current passes through semiconductor chilling plate cold end 2 and semiconductor chilling plate hot end 3, in semiconductor chilling plate cold end 2 and half
3 two sides of conductor cooling piece hot end absorb heat respectively and release heat, to realize the purpose of refrigeration, generate negative heat by a kind of
The Refrigeration Technique of resistance eliminates the installation of moving component, improves the reliability of device, when semiconductor chilling plate cold end 2 generates
When cold air, cold air is transmitted using the effect of exhaust fan 5, accelerates cold air and enters in the first cold air sharing channel 6, work as demand
When blowing a cold wind over, the first mounting plate 701 is pushed into connecting groove 702 first, utilizes the work of stripper plate 704 and connecting spring 705
With the first mounting plate 701 is carried out extruding fixation, is then switched off baffle 706, so that the first mounting plate 701 is fixedly mounted on
Between two the first cold air sharing channels 6, the module that will then blow a cold wind over is fixed on 701 upper end of the first mounting plate, then will blow cold
Inside the connecting tube insertion cold air connector 801 of wind module, squeezes screening hawk 802 and rotate, continue into connecting tube, until
Connecting tube is contacted with inner tube 806, is then connect connecting tube with inner tube 806 by connecting screwed pipe 805, is then opened cold air valve
804, the cold air in the first cold air sharing channel 6 is passed to module use of blowing a cold wind over, utilizes screening hawk 802 and movable axis 803
Effect acted on when not in use by torque spring inside movable axis 803, hawk 802 will be hidden and closed, thus will
The opening of cold air connector is blocked, and is avoided extraneous dust from entering inside cold air connector and is polluted blocking, using more
It is convenient;
When needing to carry out frozen foods function simultaneously in use, first with the handle of 6 upper end of the first cold air sharing channel
Hand stretches the first cold air sharing channel 6, so that the second cold air sharing channel 707 be pulled out, then repeats above-mentioned
Work, is fixed on 708 upper end of the second mounting plate for refrigeration module, to realize that plurality of devices shares the function of cold air, drop
Low refrigeration cost, economizes on resources, and carries out in process of refrigerastion in device, semiconductor transfers heat to semiconductor chilling plate first
Hot end 3, and accumulated in semiconductor chilling plate hot end 3, then pass through the effect at conduction copper bottom 905, by semiconductor chilling plate
The heat in hot end 3 is guided to 901 side of water-cooled plate, then by water inlet pipe 903 to being passed through cold water inside water-cooled plate 901,
Then cold water memory in diversion trench 902 flows, so that the heat that conduction copper bottom 905 is transmitted be absorbed, then absorbs heat
Water flow after amount is flowed out by outlet pipe 904, so that the heat in semiconductor chilling plate hot end 3 be evacuated, is improved
The refrigeration effect of device is freezed quicker, is improved work efficiency.
Finally, it should be noted that being not intended to restrict the invention the foregoing is merely preferred embodiment of the invention, to the greatest extent
Present invention has been described in detail with reference to the aforementioned embodiments for pipe, for those skilled in the art, still can be with
It modifies the technical solutions described in the foregoing embodiments or equivalent replacement of some of the technical features.It is all
Within the spirit and principles in the present invention, any modification, equivalent replacement, improvement and so on should be included in guarantor of the invention
Within the scope of shield.
Claims (9)
1. a kind of modularization cooling capacity shared device, including shell (1), it is characterised in that: be equipped with inside the shell (1) and partly lead
Body cooling piece cold end (2), semiconductor chilling plate cold end (2) lower end is equipped with semiconductor chilling plate hot end (3), described partly to lead
Body cooling piece cold end (2) two sides are mounted on vent board (4), and vent board (4) side is equipped with exhaust fan (5), the row
Gas fan (5) upper end is equipped with cold air sharing channel (6), and cold air sharing channel (6) side is equipped with fixed shared component
(7), it includes the first mounting plate (701), connecting groove (702), limiting slot (703), stripper plate that component (7) are shared in the fixation
(704), connecting spring (705) and baffle (706) are equipped with the first mounting plate between the first cold air sharing channel (6)
(701), the first cold air sharing channel (6) and the first mounting plate (701) corresponding position offer connecting groove (702),
The internal both ends of the connecting groove (702) offer limiting slot (703), are equipped with extruding inside the connecting groove (702)
Plate (704) is equipped with connecting spring (705), the company between the stripper plate (704) and connecting groove (702) inner bottom
It connects groove (702) one end to be equipped with baffle (706), it is shared that the first cold air sharing channel (6) upper end is equipped with the second cold air
Channel (707), the second cold air sharing channel (707) side are equipped with the second mounting plate (708);
The fixation is shared component (7) side and is equipped with cold air connection component (8), and the cold air connection component (8) includes cold air
Connector (801) hides hawk (802), movable axis (803), cold air valve (804), connection screwed pipe (805) and inner tube (806), institute
It states first cold air sharing channel (6) side to be equipped with cold air connector (801), cold air connector (801) side is equipped with
It hides hawk (802), is equipped with movable axis (803) between the screening hawk (802) and cold air connector (801), the cold air connects
Connector (801) side is equipped with inner tube (806), is equipped with cold air valve (804) on the outside of said inner tube (806), the cold air valve
Door (804) side is equipped with connection screwed pipe (805).
2. a kind of modularization cooling capacity shared device according to claim 1, it is characterised in that: shell (1) the bottom end peace
Equipped with water cooling component (9), the water cooling component (9) includes water-cooled plate (901), diversion trench (902), water inlet pipe (903), outlet pipe
(904) and conduction copper bottom (905), described semiconductor chilling plate hot end (3) one end are equipped with water-cooled plate (901), the water-cooled plate
(901) side offers diversion trench (902), and diversion trench (902) side is equipped with water inlet pipe (903), the diversion trench
(902) other side is equipped with outlet pipe (904), is equipped with and is led between the water-cooled plate (901) and semiconductor chilling plate hot end (3)
Hot copper bottom (905).
3. a kind of modularization cooling capacity shared device according to claim 1, it is characterised in that: shell (1) one end peace
Equipped with support component (10), the support component (10) includes support column (1001), adjustment axis (1002), inclined plate (1003) and bottom
Seat (1004), shell (1) the bottom end two sides are mounted on support column (1001), and described support column (1001) one end is equipped with tune
Nodal axisn (1002), adjustment axis (1002) two sides are mounted on inclined plate (1003), and inclined plate (1003) side is equipped with bottom
Seat (1004).
4. a kind of modularization cooling capacity shared device according to claim 1, it is characterised in that: first cold air is shared logical
Thermal insulation board is installed inside road (6).
5. a kind of modularization cooling capacity shared device according to claim 1, it is characterised in that: first cold air is shared logical
Telescoping tube is installed inside road (6), and telescoping tube top is equipped with handle.
6. a kind of modularization cooling capacity shared device according to claim 1, it is characterised in that: the connecting groove (702)
Width be greater than the thickness of the first mounting plate (701), the first mounting plate (701) two sides and limiting slot (703) corresponding position
Place is equipped with limit card block.
7. a kind of modularization cooling capacity shared device according to claim 2, it is characterised in that: in the movable axis (803)
Portion is equipped with torque spring.
8. a kind of modularization cooling capacity shared device according to claim 3, it is characterised in that: the adjustment axis (1002) one
End is equipped with adjusting knob.
9. a kind of modularization cooling capacity shared device according to claim 3, it is characterised in that: pedestal (1004) bottom end
Rubber pad is installed, and rubber pad bottom end offers anti-skid chequer.
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CN201811473325.6A CN109595876B (en) | 2018-12-29 | 2018-12-29 | Modular cold capacity sharing equipment |
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CN201811473325.6A CN109595876B (en) | 2018-12-29 | 2018-12-29 | Modular cold capacity sharing equipment |
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CN109595876A true CN109595876A (en) | 2019-04-09 |
CN109595876B CN109595876B (en) | 2020-07-24 |
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ID=65960642
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CN201811473325.6A Expired - Fee Related CN109595876B (en) | 2018-12-29 | 2018-12-29 | Modular cold capacity sharing equipment |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113827100A (en) * | 2021-11-05 | 2021-12-24 | 广东美芝制冷设备有限公司 | Cooking appliance, control method, control device and computer-readable storage medium |
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ES2442444R1 (en) * | 2012-08-10 | 2014-04-07 | Thyssenkrupp Airport Services, S.L. | DRIVING FOR THE TRANSPORTATION OF FLUIDS TO AIRCRAFT |
CN208139484U (en) * | 2018-03-29 | 2018-11-23 | 宁波高新区卓尔化工科技有限公司 | A kind of air-cooler |
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SU932865A1 (en) * | 1978-07-31 | 1983-06-07 | Предприятие П/Я В-2763 | Method of controlling operation of thermoelectric air drier |
JPH10288391A (en) * | 1997-04-10 | 1998-10-27 | G Ee Shi Kk | Connecting structure for air conditioning duct, air conditioning duct and air conditioner |
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