CN109591277A - A kind of process units of conductive tape - Google Patents
A kind of process units of conductive tape Download PDFInfo
- Publication number
- CN109591277A CN109591277A CN201910067418.7A CN201910067418A CN109591277A CN 109591277 A CN109591277 A CN 109591277A CN 201910067418 A CN201910067418 A CN 201910067418A CN 109591277 A CN109591277 A CN 109591277A
- Authority
- CN
- China
- Prior art keywords
- conducting resinl
- shaping equipment
- adhesive tape
- process units
- molding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C53/00—Shaping by bending, folding, twisting, straightening or flattening; Apparatus therefor
- B29C53/02—Bending or folding
- B29C53/04—Bending or folding of plates or sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C31/00—Handling, e.g. feeding of the material to be shaped, storage of plastics material before moulding; Automation, i.e. automated handling lines in plastics processing plants, e.g. using manipulators or robots
- B29C31/04—Feeding of the material to be moulded, e.g. into a mould cavity
- B29C31/08—Feeding of the material to be moulded, e.g. into a mould cavity of preforms to be moulded, e.g. tablets, fibre reinforced preforms, extruded ribbons, tubes or profiles; Manipulating means specially adapted for feeding preforms, e.g. supports conveyors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/16—Cooling
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C53/00—Shaping by bending, folding, twisting, straightening or flattening; Apparatus therefor
- B29C53/80—Component parts, details or accessories; Auxiliary operations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Oral & Maxillofacial Surgery (AREA)
- Thermal Sciences (AREA)
- Robotics (AREA)
- Adhesive Tapes (AREA)
Abstract
The present invention relates to conductive material field shaping techniques, disclose a kind of process units of conductive tape, including the first discharging device, molding machine, shaping equipment, temperature regulating device and shear, and the first discharging device is set as carrying out folding and unfolding to conducting resinl；Molding machine includes molding assembly, and conducting resinl is formed by molding assembly, and makes conducting resinl there are gaps；Shaping equipment is provided with horn-like entrance, and molding conducting resinl is entered in shaping equipment by entrance, and adhesive tape is attached at the gap of conducting resinl；The lower section of shaping equipment is arranged in temperature regulating device, and is set as the temperature of control shaping equipment；Shear is set as shearing the conducting resinl for attaching adhesive tape.Conducting resinl is formed by molding machine, and makes conducting resinl there are gap, shaping equipment is then entered by the horn-like entrance of shaping equipment, so that conducting resinl is formed to attach adhesive tape at the gap of conducting resinl, prevents conducting resinl from getting stuck and deforming.
Description
Technical field
The present invention relates to conductive material field shaping technique more particularly to a kind of process units of conductive tape.
Background technique
3C Product is exactly computer (Computer), communication (Communication) and consumer electronics product
(Consumer Electronics) triplicity, also known as " information household appliances ".The future developing trend of 3C Product towards it is small, thin become
Gesture development, this requires that internal functionality part is also such.Such as: cricoid conductive tape (referring to Fig. 1 and Fig. 2) is led
Electric adhesive tape includes cricoid 100 ' of conducting resinl and 200 ' of adhesive tape, in order to reduce the thickness of 100 ' of conducting resinl, 100 ''s of conducting resinl
There are 102 ' of gap to overlap without selecting, and 200 ' of adhesive tape is attached to the bottom of 100 ' of conducting resinl.In order to reduce 100 ''s of conducting resinl
Thickness, the top design of 100 ' of conducting resinl have 101 ' of opening, and during the preparation process, 101 ' of opening are easy to produce to get stuck the structure
Phenomenon, and then 100 ' of conducting resinl is caused to be deformed.
Summary of the invention
It is an object of the invention to propose a kind of process units of conductive tape, it can be realized the molding of conducting resinl and determine
Type avoids getting stuck for conducting resinl, prevents the deformation of conducting resinl.
To achieve this purpose, the present invention adopts the following technical scheme:
The present invention provides a kind of process units of conductive tape, comprising:
First discharging device, first discharging device are set as carrying out folding and unfolding to conducting resinl；
The conducting resinl of molding machine, the first discharging device release is formed by the molding machine, and is made into
There are gaps for the conducting resinl of type；
Shaping equipment, the shaping equipment are provided with horn-like entrance, the molding conducting resinl by the entrance into
Enter in the shaping equipment, and attaches adhesive tape at the gap of the conducting resinl；
The lower section of the shaping equipment is arranged in temperature regulating device, the temperature regulating device, and is set as controlling the sizing dress
The temperature set；And
Shear, the shear are set as shearing the conducting resinl for attaching adhesive tape.
The process units of the conductive tape carries out material retractable to conducting resinl by the first discharging device, and molding machine will be conductive
Glue is formed, and makes conducting resinl there are gaps, then enters shaping equipment by the horn-like entrance of shaping equipment, thus
Adhesive tape is attached at the gap of conducting resinl, so that conducting resinl is formed, horn-like entrance can prevent conducting resinl in input process
It gets stuck, prevents the deformation of conducting resinl；Temperature regulating device can play good temperature control effect to the stickup of conducting resinl and adhesive tape；Then lead to
It crosses shear to shear the conducting resinl for attaching adhesive tape, to meet the needs of different conducting resinl length.
A kind of preferred embodiment of process units as above-mentioned conductive tape, the molding machine include molding assembly, institute
Stating molding assembly includes arcuate structure, plate structure and bulge-structure, and the plate structure is connected and interior with the arcuate structure
Portion forms molding cavity, and the bulge-structure is arranged in the molding cavity and is connected with the plate structure.Arcuate structure
Connection with plate structure makes its internal formation molding cavity, and for forming to conducting resinl, the setting of bulge-structure can
So that gap is formed on the bottom of conducting resinl.
A kind of preferred embodiment of process units as above-mentioned conductive tape, the molding cavity are flared structure.It should
Setting can play guiding role to conducting resinl, deform conducting resinl gradually, molding effect is preferable.
A kind of preferred embodiment of process units as above-mentioned conductive tape, the molding machine further include walk material type chamber and
Stop configurations, it is described walk material type chamber be connected to larger one end of size of the molding assembly, and it is described walk material type chamber and it is described at
Cavity is connected, stop configurations setting it is described walk material type chamber on.Walk material type chamber setting make conducting resinl enter at
It is introduced into away before cavity in material type chamber, conducting resinl is enabled to can smoothly enter into molding cavity.The setting of stop configurations
It can prevent conducting resinl abjection from walking material type intracavitary.
A kind of preferred embodiment of process units as above-mentioned conductive tape, the shaping equipment include the first shaping equipment
With the second shaping equipment, first shaping equipment and second shaping equipment are successively set along the transmission direction of the conducting resinl
It sets.
A kind of preferred embodiment of process units as above-mentioned conductive tape, first shaping equipment and described second are determined
Type device includes the adhesive tape input module and styling components being connected, and is provided with profiling grooves on the styling components, described
One end of profiling grooves is the entrance, and the profiling grooves and the adhesive tape input module form sizing cavity；The adhesive tape
Input hole is provided on input module, the input hole is connected with the sizing cavity, and the adhesive tape is stretched by the input hole
Enter in the sizing cavity.
Limit is arranged on the side wall of the input hole for a kind of preferred embodiment of process units as above-mentioned conductive tape
Slot, the adhesive tape protrude into the input hole along the limiting slot.The setting of limiting slot can limit adhesive tape, guarantee glue
It is accurate with the position attached.
A kind of preferred embodiment of process units as above-mentioned conductive tape, it is multiple described fixed to be arranged on the styling components
Type groove is provided on the adhesive tape input module and multiple profiling grooves limiting slot correspondingly.
A kind of preferred embodiment of process units as above-mentioned conductive tape, the temperature regulating device include heating device and cold
But device, the heating device are arranged below first shaping equipment, and the cooling device setting is in second sizing
Below device.Heating device can carry out heated for controlling temperature when conducting resinl attaches adhesive tape, be attached on conducting resinl convenient for adhesive tape；It is cold
But the setting of device can cool down conducting resinl and adhesive tape, prevent the deformation of conducting resinl and adhesive tape.
A kind of preferred embodiment of process units as above-mentioned conductive tape further includes roller conveying device, the roller
Conveying device is arranged between the shaping equipment and the shear, and the roller conveying device is set as leading described in driving
Electric glue output.The setting of roller conveying device can drive the output of conducting resinl.
Beneficial effects of the present invention:
The process units of conductive tape proposed by the present invention carries out material retractable to conducting resinl by the first discharging device, at
Type device forms conducting resinl, and makes conducting resinl there are gaps, is then entered by the horn-like entrance of shaping equipment
Shaping equipment makes conducting resinl be formed, horn-like entrance can prevent conducting resinl to attach adhesive tape at the gap of conducting resinl
It gets stuck in input process, prevents the deformation of conducting resinl；Temperature regulating device can play good control to the stickup of conducting resinl and adhesive tape
Temp effect；Then the conducting resinl for attaching adhesive tape is sheared by shear, to meet the needs of different conducting resinl length.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of conductive tape provided by the invention；
Fig. 2 is the sectional view of conductive tape provided by the invention；
Fig. 3 is the structural schematic diagram of the process units of conductive tape provided by the invention；
Fig. 4 is the structural schematic diagram of molding machine provided by the invention；
Fig. 5 is the right view of molding machine provided by the invention；
Fig. 6 is the structural schematic diagram of shaping equipment provided by the invention；
Fig. 7 is the explosive view of shaping equipment provided by the invention；
Fig. 8 is the partial enlargement diagram in Fig. 7 at A.
In figure:
1, the first discharging device；2, molding machine；3, shaping equipment；4, temperature regulating device；5, shear；6, roller conveys
Device；7, the second discharging device；8, support platform；
21, molding assembly；22, material type chamber is walked；23, stop configurations；31, adhesive tape input module；32, styling components；41, add
Thermal；42, cooling device；
211, arcuate structure；212, plate structure；213, bulge-structure；321, profiling grooves；311, input hole；312, it limits
Position slot；
3211, entrance；
100, conducting resinl；200, adhesive tape；
100 ', conducting resinl；101 ', opening；102 ', gap；200 ', adhesive tape.
Specific embodiment
To further illustrate the technical scheme of the present invention below with reference to the accompanying drawings and specific embodiments.
Present embodiment provides a kind of process units of conductive tape, as shown in figure 3, the process units of conductive tape includes
First discharging device 1, molding machine 2, shaping equipment 3, temperature regulating device 4 and shear 5, the first discharging device 1 are set as pair
Conducting resinl 100 carries out folding and unfolding；The conducting resinl 100 of first discharging device 1 release is formed by molding machine 2, and makes molding lead
There are gaps for electric glue 100；Shaping equipment 3 is provided with horn-like entrance 3211, and molding conducting resinl 100 is entered by entrance 3211
In shaping equipment 3, and adhesive tape 200 is attached at the gap of conducting resinl 100；The lower section of shaping equipment 3 is arranged in temperature regulating device 4,
And it is set as the temperature of control shaping equipment 3；Shear 5 is set as shearing the conducting resinl 100 for attaching adhesive tape 200.
Roller conveying device 6 is additionally provided between shaping equipment 3 and shear 5, roller conveying device 6 is set as driving
Conducting resinl 100 exports.Specifically, roller conveying device 6 includes two rollers setting up and down, passes through the phase reversal of two rollers
The dynamic conveying for driving conducting resinl 100.In present embodiment, two groups of rollers are arranged at intervals between shaping equipment 3 and shear 5
Conveying device 6, two groups of roller conveying devices 6 enable to the conducting resinl 100 of conveying to have certain relaxation effect, prevent conduction
The deformation of glue 100.In present embodiment, it is additionally provided with support platform 8 between two groups of roller conveying devices 6, for conducting resinl
100 are supported, and when conducting resinl 100 carries out attaching 200 release film of adhesive tape, are convenient for operating.
As shown in Figure 4 and Figure 5, molding machine 2 includes molding assembly 21, walks material type chamber 22 and stop configurations 23, molding group
Part 21 includes arcuate structure 211, plate structure 212 and bulge-structure 213, and plate structure 212 is connected and interior with arcuate structure 211
Portion forms molding cavity, and bulge-structure 213 is arranged in molding cavity and is connected with plate structure 212.Bulge-structure 213 is set
It sets and the bottom of conducting resinl 100 is enabled to form gap.Conduction can also can be adjusted by adjusting the size of bulge-structure 213
The size in the gap of the bottom of glue 100.The connection of arcuate structure 211 and plate structure 212 makes its internal formation molding cavity, uses
It is formed in conducting resinl 100.Preferably, in present embodiment, molding cavity is flared structure, can be to conducting resinl
100 play guiding role, deform conducting resinl 100 gradually, molding effect is preferable.
Larger one end of size that material type chamber 22 is connected to molding assembly 21 is walked, and walks material type chamber 22 and is connected with molding cavity
It is logical.Walk material type chamber 22 be globoidal structure, stop configurations 23 be arranged on walking material type chamber 22, can make conducting resinl 100 enter at
It is introduced into away before cavity in material type chamber 22, conducting resinl 100 is enabled to can smoothly enter into molding cavity.Stop configurations 23
Setting can prevent conducting resinl 100 abjection walk material type chamber 22 in.
As Figure 6-Figure 8, shaping equipment 3 include the first shaping equipment and the second shaping equipment, the first shaping equipment and
Second shaping equipment is set gradually along the transmission direction of conducting resinl 100.Specifically, the first shaping equipment and the second shaping equipment are equal
Including adhesive tape input module 31 and styling components 32, adhesive tape input module 31 is connected with styling components 32, in present embodiment, glue
Band input module 31 and styling components 32 are detachably connected by fixing piece realization.Further, it is provided on styling components 32
Profiling grooves 321, one end of profiling grooves 321 are entrance 3211, and profiling grooves 321 and adhesive tape input module 31 form sizing chamber
Body；Input hole 311 is provided on adhesive tape input module 31, input hole 311 is connected with sizing cavity, and adhesive tape 200 is by input hole
311 protrude into sizing cavity.
Limiting slot 312 is set on the side wall of input hole 311, and adhesive tape 200 protrudes into input hole 311 along limiting slot 312.Limit
The setting of slot 312 can limit adhesive tape 200, and the position for guaranteeing that adhesive tape 200 attaches is accurate.It is arranged on styling components 32 more
A profiling grooves 321 are provided with and the one-to-one limiting slot 312 of multiple profiling grooves 321 on adhesive tape input module 31.It is multiple
Profiling grooves 321 and multiple limiting slots 312 can meet the sizing of a plurality of conducting resinl 100 simultaneously, improve working efficiency.It is multiple fixed
Type groove 321 and multiple locating slots may be arranged as different sizes, can satisfy determining for the conducting resinl 100 of different model
Type, adaptation range are wider.
The process units of conductive tape further includes the second discharging device 7, and the second discharging device 7 can carry out adhesive tape 200
Material retractable.In present embodiment, the process units of conductive tape includes multiple second discharging devices 7, passes through the second discharging device 7
Release film on adhesive tape 200 can be furled.Specifically the position of the second discharging device 7 is arranged according to demand, this
In embodiment, the second discharging device 7 is identical as the structure of the first discharging device 1, and belongs to the prior art, no longer superfluous herein
It states.
As shown in figure 3, temperature regulating device 4 includes heating device 41 and cooling device 42, the setting of heating device 41 is fixed first
Below type device, cooling device 42 is arranged below the second shaping equipment.Heating device 41 can attach adhesive tape in conducting resinl 100
Heated for controlling temperature is carried out when 200, is attached on conducting resinl 100 convenient for adhesive tape 200, and heating device 41 is adjusted between 20 DEG C -300 DEG C
Temperature.The setting of cooling device 42 can cool down conducting resinl 100 and adhesive tape 200, prevent conducting resinl 100 and adhesive tape 200
Deformation.Cooling device 42 is 10 DEG C -30 DEG C adjustable.Heating device 41 and the electrically conductive glue 100 of cooling device 42 and adhesive tape 200
Different fitting demands are heated and are cooled down.Heating device 41 and cooling device 42 can also adjust heating and cooling according to demand
Temperature range, however it is not limited to above-mentioned temperature range.
Shear 5 shears the conducting resinl 100 for attaching adhesive tape 200 by cutter, the knot of specific shear 5
Structure belongs to the prior art, and details are not described herein.
The process units of the conductive tape carries out material retractable, molding machine 2 to conducting resinl 100 by the first discharging device 1
Conducting resinl 100 is formed, and makes conducting resinl 100 there are gap, then passes through the horn-like entrance 3211 of shaping equipment 3
Into shaping equipment 3, to attach adhesive tape 200 at the gap of conducting resinl 100, conducting resinl 100 is set to be formed, horn-like entrance
3211 can prevent conducting resinl 100 from getting stuck in input process, prevent the deformation of conducting resinl 100；Temperature regulating device 4 can be to conduction
Good temperature control effect is played in the stickup of glue 100 and adhesive tape 200；Then the conducting resinl of adhesive tape 200 will be attached by shear 5
100 are sheared, to meet the needs of different 100 length of conducting resinl.
Note that above are only presently preferred embodiments of the present invention.It will be appreciated by those skilled in the art that the present invention is not limited to here
The specific embodiment, be able to carry out for a person skilled in the art it is various it is apparent variation, readjust and substitution and
Without departing from the scope of protection of the present invention.Therefore, although the present invention has been described in more detail through the above examples,
But the present invention is not limited to the above embodiments only, without departing from the inventive concept, can also include it is more other
Equivalent embodiment, and the scope of the invention is determined by the scope of the appended claims.
Claims (10)
1. a kind of process units of conductive tape characterized by comprising
First discharging device (1), first discharging device (1) are set as carrying out folding and unfolding to conducting resinl (100)；
Molding machine (2), the conducting resinl (100) of first discharging device (1) release by the molding machine (2) at
Type, and make the molding conducting resinl (100) there are gaps；
Shaping equipment (3), the shaping equipment (3) are provided with horn-like entrance (3211), the molding conducting resinl (100)
Entered in the shaping equipment (3) by the entrance (3211), and attaches adhesive tape at the gap of the conducting resinl (100)
(200)；
Temperature regulating device (4), the temperature regulating device (4) are arranged in the lower section of the shaping equipment (3), and be set as controlling it is described fixed
The temperature of type device (3)；And
Shear (5), the shear (5) are set as cutting the conducting resinl (100) for attaching adhesive tape (200)
It cuts.
2. the process units of conductive tape according to claim 1, which is characterized in that the molding machine (2) includes into
Type component (21), the molding assembly (21) include arcuate structure (211), plate structure (212) and bulge-structure (213), institute
State plate structure (212) be connected with the arcuate structure (211) and it is internal form molding cavity, the bulge-structure (213) sets
It sets in the molding cavity and is connected with the plate structure (212).
3. the process units of conductive tape according to claim 2, which is characterized in that the molding cavity is tubaeform knot
Structure.
4. the process units of conductive tape according to claim 3, which is characterized in that the molding machine (2) further includes
Walk material type chamber (22) and stop configurations (23), it is described walk material type chamber (22) be connected to the size larger one of the molding assembly (21)
End, and it is described walk material type chamber (22) be connected with the molding cavity, the stop configurations (23) be arranged it is described walk material type chamber
(22) on.
5. the process units of conductive tape according to any one of claims 1-4, which is characterized in that the shaping equipment
It (3) include the first shaping equipment and the second shaping equipment, first shaping equipment and second shaping equipment are led described in
The transmission direction of electric glue (100) is set gradually.
6. the process units of conductive tape according to claim 5, which is characterized in that first shaping equipment and described
Second shaping equipment includes the adhesive tape input module (31) and styling components (32) being connected, and is set on the styling components (32)
Be equipped with profiling grooves (321), one end of the profiling grooves (321) is the entrance (3211), the profiling grooves (321) and
The adhesive tape input module (31) forms sizing cavity；It is provided with input hole (311) on the adhesive tape input module (31), it is described
Input hole (311) is connected with the sizing cavity, and the adhesive tape (200) protrudes into the sizing chamber by the input hole (311)
In vivo.
7. the process units of conductive tape according to claim 6, which is characterized in that the side wall of the input hole (311)
Upper setting limiting slot (312), the adhesive tape (200) are protruded into the input hole (311) along the limiting slot (312).
8. the process units of conductive tape according to claim 7, which is characterized in that be arranged on the styling components (32)
Multiple profiling grooves (321) are provided with multiple profiling grooves (321) one by one on the adhesive tape input module (31)
The corresponding limiting slot (312).
9. the process units of conductive tape according to claim 5, which is characterized in that the temperature regulating device (4) includes adding
Thermal (41) and cooling device (42), the heating device (41) are arranged below first shaping equipment, the cooling
Device (42) is arranged below second shaping equipment.
10. the process units of conductive tape according to any one of claims 1-4, which is characterized in that further include that roller is defeated
It send device (6), the roller conveying device (6) is arranged between the shaping equipment (3) and the shear (5), described
Roller conveying device (6) is set as that the conducting resinl (100) is driven to export.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910067418.7A CN109591277A (en) | 2019-01-24 | 2019-01-24 | A kind of process units of conductive tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910067418.7A CN109591277A (en) | 2019-01-24 | 2019-01-24 | A kind of process units of conductive tape |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109591277A true CN109591277A (en) | 2019-04-09 |
Family
ID=65965355
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910067418.7A Pending CN109591277A (en) | 2019-01-24 | 2019-01-24 | A kind of process units of conductive tape |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109591277A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114602698A (en) * | 2022-05-10 | 2022-06-10 | 南通康尔乐复合材料有限公司 | Production device of double-layer conductive adhesive tape |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201833602U (en) * | 2010-09-21 | 2011-05-18 | 深圳市中驰新材料有限公司 | Hollow closed-loop composite conductive rubber ring production system |
| CN107225751A (en) * | 2017-06-24 | 2017-10-03 | 深圳市金世冠不干胶制品有限公司 | A kind of high speed molding equipment of conducting foam and preparation method thereof |
| CN107910131A (en) * | 2017-11-14 | 2018-04-13 | 领胜城科技（江苏）有限公司 | Full-automatic conduction molding with cloth is posted poling equipment and technique |
| CN208148493U (en) * | 2018-04-20 | 2018-11-27 | 苏州柯裕电子材料有限公司 | A kind of conducting foam forming processes structure |
| CN209478932U (en) * | 2019-01-24 | 2019-10-11 | 昆山市飞荣达电子材料有限公司 | A kind of process units of conductive tape |
-
2019
- 2019-01-24 CN CN201910067418.7A patent/CN109591277A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201833602U (en) * | 2010-09-21 | 2011-05-18 | 深圳市中驰新材料有限公司 | Hollow closed-loop composite conductive rubber ring production system |
| CN107225751A (en) * | 2017-06-24 | 2017-10-03 | 深圳市金世冠不干胶制品有限公司 | A kind of high speed molding equipment of conducting foam and preparation method thereof |
| CN107910131A (en) * | 2017-11-14 | 2018-04-13 | 领胜城科技（江苏）有限公司 | Full-automatic conduction molding with cloth is posted poling equipment and technique |
| CN208148493U (en) * | 2018-04-20 | 2018-11-27 | 苏州柯裕电子材料有限公司 | A kind of conducting foam forming processes structure |
| CN209478932U (en) * | 2019-01-24 | 2019-10-11 | 昆山市飞荣达电子材料有限公司 | A kind of process units of conductive tape |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114602698A (en) * | 2022-05-10 | 2022-06-10 | 南通康尔乐复合材料有限公司 | Production device of double-layer conductive adhesive tape |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN209478932U (en) | A kind of process units of conductive tape | |
| CN109195419A (en) | Air conditioner electrical box and its radiator | |
| CN109591277A (en) | A kind of process units of conductive tape | |
| CN105946515B (en) | A kind of on-board air conditioner swing flap device of automatically controlled marmem driving | |
| US20230193910A1 (en) | Portable blowing device | |
| CN109159320A (en) | A kind of master-batch drying device | |
| CN206472993U (en) | Dry hair machine | |
| US20230280050A1 (en) | Wearable air conditioner | |
| CN212629914U (en) | Wearable flexible refrigerating device | |
| CN204604888U (en) | The film blowing device die head of energy local modulation bubble thickness | |
| CN208909701U (en) | The radiating subassembly and cooking apparatus of cooking apparatus | |
| CN201597181U (en) | Wind heat extension baking oven of packing belt | |
| CN110671771A (en) | Intelligent portable air conditioner adopting Peltier effect | |
| CN205413494U (en) | Ventilative sticky tape apparatus for producing | |
| CN209358917U (en) | Air conditioner electrical box and its radiator | |
| CN210925633U (en) | Improved piezoresistor packaging machine | |
| CN205811887U (en) | A kind of have the pwm control signal generation circuit that minimum duty cycle sets | |
| WO2022151621A1 (en) | Neck hanging type cooling and heating device | |
| CN201098253Y (en) | Semiconductor refrigeration type intelligent cicatrix therapeutic instruments | |
| CN208423102U (en) | A kind of temperature controlled bicycle electric power device of band | |
| CN109698606A (en) | A kind of intelligent heat dissipation frequency converter | |
| CN206282161U (en) | Dish-washing machine and its water temperature control device | |
| CN203015887U (en) | Garment warm in winter and cool in summer | |
| CN206908519U (en) | A kind of electric power cabinet frequency converter cooling device | |
| CN206568687U (en) | A kind of rubber transmission belting production cooling device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |