CN109587298A - Rear cover and its processing method, the electronic device of electronic device - Google Patents
Rear cover and its processing method, the electronic device of electronic device Download PDFInfo
- Publication number
- CN109587298A CN109587298A CN201811463783.1A CN201811463783A CN109587298A CN 109587298 A CN109587298 A CN 109587298A CN 201811463783 A CN201811463783 A CN 201811463783A CN 109587298 A CN109587298 A CN 109587298A
- Authority
- CN
- China
- Prior art keywords
- electronic device
- rear cover
- lid portion
- frame section
- processing method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/0279—Improving the user comfort or ergonomics
- H04M1/0283—Improving the user comfort or ergonomics for providing a decorative aspect, e.g. customization of casings, exchangeable faceplate
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/18—Telephone sets specially adapted for use in ships, mines, or other places exposed to adverse environment
- H04M1/185—Improving the rigidity of the casing or resistance to shocks
Landscapes
- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
This application discloses a kind of rear cover of electronic device and its processing methods, electronic device, wherein the processing method of the rear cover of electronic device includes: the blank of machine-shaping rear cover, blank includes lid portion and frame section, frame section is annular and is arranged around lid portion that frame section and lid portion limit holding tank；In the outer surface of frame section, the first hyaline layer is set.The frame section of the rear cover of electronic device can be made to show glittering and translucent appearance, increase the aesthetics of the rear cover of electronic device by the way that the first hyaline layer is arranged in the outer surface of frame section according to the processing method of the rear cover of the electronic device of the application.
Description
Technical field
This application involves technical field of electronic device, rear cover and its processing method more particularly, to a kind of electronic device,
Electronic device.
Background technique
In the related technology, the rear cover of electronic device is the plastic cement material of metal material or integrated injection molding, electronic device
Rear cover be nontransparent material, lack glittering and translucent effect.
Summary of the invention
The application aims to solve at least one of the technical problems existing in the prior art.For this purpose, the application proposes a kind of electricity
The processing method of the rear cover of sub-device, the rear cover that the processing method is process are glittering and translucent.
The application also proposes that a kind of rear cover of electronic device, the rear cover of the electronic device are processed by above-mentioned processing method
It forms.
The application also proposes that a kind of electronic device, the electronic device include the rear cover of above-mentioned electronic device.
According to the processing method of the electronic device of the embodiment of the present application, comprising: the blank of rear cover described in machine-shaping, it is described
Blank includes lid portion and frame section, and the frame section is annular and is arranged around the lid portion, the frame section with it is described
Lid portion limits holding tank；In the outer surface of the frame section, the first hyaline layer is set.
According to the processing method of the electronic device of the embodiment of the present application, by transparent in the setting first of the outer surface of frame section
Layer, can make the frame section of the rear cover of electronic device show glittering and translucent appearance, increase the rear cover of electronic device
Aesthetics.
According to the rear cover of the electronic device of the embodiment of the present application, the rear cover of the electronic device passes through above-mentioned electronic device
The processing method of rear cover is process.
According to the rear cover of the electronic device of the embodiment of the present application, by the way that the first hyaline layer is arranged in the outer surface of frame section,
The frame section of the rear cover of electronic device can be made to show glittering and translucent appearance, increase the beauty of the rear cover of electronic device
The property seen.
According to the electronic device of the embodiment of the present application, including above-mentioned rear cover.
It can be made according to the electronic device of the embodiment of the present application by the way that the first hyaline layer is arranged in the outer surface of frame section
The frame section for obtaining the rear cover of electronic device shows glittering and translucent appearance, increases the aesthetics of the rear cover of electronic device.
The additional aspect and advantage of the application will be set forth in part in the description, and will partially become from the following description
It obtains obviously, or recognized by the practice of the application.
Detailed description of the invention
The above-mentioned and/or additional aspect and advantage of the application will become from the description of the embodiment in conjunction with the following figures
Obviously and it is readily appreciated that, in which:
Fig. 1 is the flow chart according to the processing method of the rear cover of the electronic device of the embodiment of the present application；
Fig. 2 is the main view according to the rear cover of the electronic device of the embodiment of the present application；
Fig. 3 is the cross-sectional view according to the blank of the rear cover of the electronic device of the embodiment of the present application；
Fig. 4 is the enlarged drawing in Fig. 3 at A；
Fig. 5 is the cross-sectional view according to the rear cover of the electronic device of the embodiment of the present application；
Fig. 6 is the enlarged drawing in Fig. 5 at B；
Fig. 7 is the cross-sectional view according to the rear cover of the electronic device of the application another embodiment；
Fig. 8 is the enlarged drawing in Fig. 7 at C；
Fig. 9 is the perspective view according to the electronic device of the embodiment of the present application.
Appended drawing reference:
Electronic device 100,
Rear cover 1, blank 11, lid portion 111, protrusion 1111, frame section 112, groove 1121, the first hyaline layer 12, second
Hyaline layer 13, holding tank 14,
Screen 2.
Specific embodiment
Embodiments herein is described below in detail, examples of the embodiments are shown in the accompanying drawings, wherein from beginning to end
Same or similar label indicates same or similar element or element with the same or similar functions.Below with reference to attached
The embodiment of figure description is exemplary, and is only used for explaining the application, and should not be understood as the limitation to the application.
In the description of the present application, it is to be understood that term " length ", " width ", " thickness ", "inner", "outside", " week
To " etc. instructions orientation or positional relationship be based on the orientation or positional relationship shown in the drawings, be merely for convenience of describing this Shen
It is please described with simplified, rather than the device or element of indication or suggestion meaning must have a particular orientation, with specific orientation
Construction and operation, therefore should not be understood as the limitation to the application.In addition, define " first ", the feature of " second " can be bright
Show or implicitly include one or more of the features.
Processing method, electricity below with reference to Fig. 1-Fig. 9 description according to the rear cover 1 of the electronic device 100 of the embodiment of the present application
The rear cover 1 and electronic device 100 of sub-device 100.
As Figure 1-Figure 4, according to the processing method of the rear cover 1 of the electronic device of the embodiment of the present application 100, comprising:
The blank 11 of machine-shaping rear cover 1, blank 11 include lid portion 111 and frame section 112, and frame section 112 is annular
And be arranged around lid portion 111, frame section 112 and lid portion 111 limit holding tank 14.Mainboard, the battery of electronic device 100
Etc. can be located in holding tank 14.
As shown in Figure 5-Figure 8, first hyaline layer 12 is set in the outer surface of frame section 112.First hyaline layer 12 can make
The frame section 112 for obtaining the rear cover 1 of electronic device 100 shows glittering and translucent appearance, increases the rear cover of electronic device 100
1 aesthetics.Wherein, first hyaline layer 12 can be arranged by Shooting Technique in the outer surface of frame section 112.Shooting Technique letter
It is single, the processing efficiency of 1 blank 11 of rear cover can be improved, to improve the production efficiency of the rear cover 1 of electronic device 100.First thoroughly
Bright layer 12 can be plastic parts.
According to the processing method of the rear cover 1 of the electronic device 100 of the embodiment of the present application, pass through the appearance in frame section 112
The first hyaline layer 12 is arranged in face, and the frame section 112 of the rear cover 1 of electronic device 100 can be made to show glittering and translucent appearance
Effect increases the aesthetics of the rear cover 1 of electronic device 100.
In some embodiments of the present application, as shown in Figure 5 and Figure 6, lid portion 111 and frame section 112 are plastic parts.
Cost is relatively low for plastic cement, and processing is more convenient, it is possible thereby to reduce the processing cost of the rear cover 1 of electronic device 100, improves production
Efficiency.Further, lid portion 111 and 112 integrated injection molding of frame section are the blank 11 of rear cover 1.Shooting Technique is simple, can
To improve the processing efficiency of 1 blank 11 of rear cover, to improve the production efficiency of the rear cover 1 of electronic device 100.
Further, as shown in Figure 5 and Figure 6, processing method further include: in the table of the separate holding tank 14 in lid portion 111
The second hyaline layer 13 is arranged in face.Second hyaline layer 13 can make the lid portion 111 of the rear cover 1 of electronic device 100 show crystalline substance
The exquisitely carved appearance of jade-like stone, increases the aesthetics of the rear cover 1 of electronic device 100.The wherein material and first of the second hyaline layer 13
The material of hyaline layer 12 can be identical, and brightness can also be identical.Second hyaline layer 13 can be plastic parts.
Wherein, second hyaline layer 13 is arranged by Shooting Technique on the surface of the separate holding tank 14 in lid portion 111.Injection molding
Simple process, can be improved the processing efficiency of 1 blank 11 of rear cover, to improve the production efficiency of the rear cover 1 of electronic device 100.
In addition, the material when the second hyaline layer 13 is identical as the material of the first hyaline layer 12, and when brightness is also identical, the first hyaline layer 12
Mold injection molding simultaneously can be passed through with the second hyaline layer 13.It is possible thereby to further increase the rear cover 1 of electronic device 100
Production efficiency.
In some embodiments of the present application, as shown in Figure 7 and Figure 8, lid portion 111 is glass workpiece, and frame section 112 is modeling
Glue part.The glittering and translucent effect of glass workpiece is preferable, the appearance of electronic device 100 can be improved, and without in lid portion 111
Separate holding tank 14 show be arranged hyaline layer, cost can be reduced.Wherein, lid portion 111 can be 2D, 2.5D or 3D etc.
The glass workpiece of form meets the needs of different user it is possible thereby to increase the diversity of the rear cover 1 of electronic device 100.Wherein glass
Glass part can be transparent glass part or translucent glass part.
Further, lid portion 111 and 112 integrated injection molding of frame section are the blank 11 of rear cover 1.In lid portion 111
During 112 machine-shaping of frame section, then can will in the lid portion 111 chosen in advance the type chamber of embedment mold
In the marking liquid injection mold cavity of frame section 112, after the cooling and shaping of frame section 112, lid portion 111 and frame section 112
It is injection moulded into integral structure.It is possible thereby to the connection talked between lid portion 111 and frame section 112, and lid portion can be increased
Bonding strength between 111 and frame section 112.
Further, processing method further include: before lid portion 111 and 112 integrated injection molding of frame section, in lid
The outer edge on the surface towards holding tank 14 in portion 111 is surface-treated to increase the combination in lid portion 111 and frame section 112
Power.The adhesive force on 111 surface of lid portion can be enhanced in surface treatment, to enhance the company between lid portion 111 and frame section 112
Intensity is connect, and then enhances the structural strength of the rear cover 1 of electronic device 100.The wherein outer edge of surface treatment region and lid portion
111 periphery wall is concordant, surface treatment region along lid portion 111 circumferential direction extension circularize with increase lid portion 111 with
Binding force between frame section 112.Optionally, the width of surface treatment region is the side from the inside in lid portion 111 to outside
Upwards, the width of surface treatment region is 0.3mm-0.5mm.
Optionally, surface treatment can be activated for the outer edge on the surface towards holding tank 14 in lid portion 111
Processing.It is activated the adhesive force that will increase 111 surface of lid portion, to enhance the company between lid portion 111 and frame section 112
Intensity is connect, and then enhances the structural strength of the rear cover 1 of electronic device 100.
Certainly, the application is without being limited thereto, and surface treatment can also be on the surface towards holding tank 14 in lid portion 111
Outer edge coats one layer of Waterborne hot-melt adhesive, and is dried.The lid portion 111 for being coated with Waterborne hot-melt adhesive is put into mold,
When the marking liquid injection type of the frame section 112 of heating is intracavitary, Waterborne hot-melt adhesive is heated fusing, and melts with frame section 112
It is integrated, to increase the reliability connected between lid portion 111 and frame section 112, and then enhances the rear cover of electronic device 100
1 structural strength.
In some embodiments of the present application, as shown in Figure 4 and Figure 8, the periphery wall in lid portion 111 is equipped with protrusion 1111,
The internal perisporium of frame section 112 is equipped with the groove 1121 with 1111 cooperation of protrusion.Wherein the groove 1121 on frame section 112 is injection molding
Self-assembling formation in the process.It is possible thereby to increase the contact area between lid portion 111 and frame section 112, to increase lid portion
Bonding strength between 111 and frame section 112, and then enhance the structural strength of the rear cover 1 of electronic device 100.
Further, circumferential direction extension of the protrusion 1111 along lid portion 111 circularizes.As a result, along lid portion 111
In circumferential direction, can increase the contact area in lid portion 111 Yu frame section 112, thus preferably enhancing lid portion 111 with
Bonding strength between frame section 112, and then enhance the structural strength of the rear cover 1 of electronic device 100.In addition, raised 1111 edges
The circumferential direction extension in lid portion 111 circularizes, and can also simplify the structure and processing technology in lid portion 111, improves production effect
Rate.
Certainly, the application is without being limited thereto, and protrusion 1111 is multiple to be spaced apart along the circumferential direction in lid portion 111.Thus
The bonding strength between lid portion 111 and frame section 112 not only can be enhanced, and then enhance the knot of the rear cover 1 of electronic device 100
Structure intensity can also save the material in lid portion 111, reduce production cost.
In the description of the present application, unless otherwise indicated, the meaning of " plurality " is two or more.
Optionally, on the thickness direction in lid portion 111, the thickness of protrusion 1111 can be the thickness in lid portion 111
1/3, the height of protrusion 1111, i.e. the distance between fixing end of protrusion 1111 to free end can be the thickness in lid portion 111
1/3.Thus it is not only convenient for the processing in lid portion 111, is also convenient for increasing the contact surface between lid portion 111 and frame section 112
Product to increase the bonding strength between lid portion 111 and frame section 112, and then enhances the knot of the rear cover 1 of electronic device 100
Structure intensity.The shape of protrusion 1111 can be formed generally as rectangle, triangle or semicircle etc..
According to the rear cover 1 of the electronic device 100 of the embodiment of the present application, pass through the processing of the rear cover 1 of above-mentioned electronic device 100
Method is process.
According to the rear cover 1 of the electronic device 100 of the embodiment of the present application, by being arranged first in the outer surface of frame section 112
Hyaline layer 12 can make the frame section 112 of the rear cover 1 of electronic device 100 show glittering and translucent appearance, increase electricity
The aesthetics of the rear cover 1 of sub-device 100.
As shown in figure 9, according to the electronic device 100 of the embodiment of the present application, the rear cover 1 including above-mentioned electronic device 100.
According to the electronic device 100 of the embodiment of the present application, by the way that the first hyaline layer is arranged in the outer surface of frame section 112
12, the frame section 112 of the rear cover 1 of electronic device 100 can be made to show glittering and translucent appearance, increase electronic device
The aesthetics of 100 rear cover 1.
In addition, electronic device 100 include screen 2, screen 2 be glass workpiece, when lid portion 111 be glass workpiece, or when lid
When body portion 111 is plastic parts and surface the second hyaline layer 13 of coating of the separate holding tank 14 in lid portion 111, entire electronic device
100 are wrapped up by transparent material, and glittering and translucent appearance is presented.
Illustratively, electronic device 100 can be various types of calculating that are mobile or portable and executing wireless communication
Any one of machine system equipment (only illustratively shows a kind of form) in Fig. 9.Specifically, electronic device 100 can be with
For mobile phone or smart phone (for example, being based on iPhone TM, the phone based on Android TM), portable gaming device
(such as Nintendo DS TM, PlayStation Portable TM, Gameboy Advance TM, iPhone TM), knee
Laptop, PDA, portable Internet appliance, music player and data storage device, other handheld devices and such as
Wrist-watch, In-Ear Headphones, pendant, headphone etc., electronic device 100 can also be other wearable devices (for example, all
As electronic glasses, electronics clothes, electronics bracelet, electronics necklace, electronics are tatooed, the headset equipment of electronic equipment or smartwatch
(HMD))。
Electronic device 100 can also be that any one of multiple electronic equipments, multiple electronic equipments include but is not limited to
Cellular phone, smart phone, other wireless telecom equipments, personal digital assistant, audio player, other media players, sound
Happy logger, video recorder, camera, other medium recorders, radio, Medical Devices, vehicle transport instrument, calculator, can
Program remote controler, pager, laptop computer, desktop computer, printer, netbook computer, personal digital assistant
(PDA), portable media player (PMP), Motion Picture Experts Group's (MPEG-1 or MPEG-2) audio layer 3 (MP3) play
Device, portable medical device and digital camera and combinations thereof.
In some cases, electronic device 100 can execute multiple functions and (for example, playing music, show video, storage
Picture and send and receive call).If desired, electronic device 100 can be such as cellular phone, media play
The portable device of device, other handheld devices, watch equipment, pendant equipment, receiver device or other compact portable equipment.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " illustrative examples ",
The description of " example ", " specific example " or " some examples " etc. means specific features described in conjunction with this embodiment or example, knot
Structure, material or feature are contained at least one embodiment or example of the application.In the present specification, to above-mentioned term
Schematic representation may not refer to the same embodiment or example.Moreover, specific features, structure, material or the spy of description
Point can be combined in any suitable manner in any one or more of the embodiments or examples.
While there has been shown and described that embodiments herein, it will be understood by those skilled in the art that: not
A variety of change, modification, replacement and modification can be carried out to these embodiments in the case where being detached from the principle and objective of the application, this
The range of application is defined by the claims and their equivalents.
Claims (16)
1. a kind of processing method of the rear cover of electronic device characterized by comprising
The blank of rear cover described in machine-shaping, the blank include lid portion and frame section, and the frame section is annular and circular
The lid portion setting, the frame section and the lid portion limit holding tank；
In the outer surface of the frame section, the first hyaline layer is set.
2. the processing method of the rear cover of electronic device according to claim 1, which is characterized in that the lid portion with it is described
Frame section is plastic parts.
3. the processing method of the rear cover of electronic device according to claim 2, which is characterized in that the lid portion with it is described
Frame section integrated injection molding is the blank of the rear cover.
4. the processing method of the rear cover of electronic device according to claim 2, which is characterized in that the processing method is also wrapped
It includes: the second hyaline layer is set on the surface far from the holding tank in the lid portion.
5. the processing method of the rear cover of electronic device according to claim 4, which is characterized in that in the remote of the lid portion
Second hyaline layer is arranged by Shooting Technique in surface from the holding tank.
6. the processing method of the rear cover of electronic device according to claim 1, which is characterized in that the lid portion is glass
Part, the frame section are plastic parts.
7. the processing method of the rear cover of electronic device according to claim 6, which is characterized in that the lid portion with it is described
Frame section integrated injection molding is the blank of the rear cover.
8. the processing method of the rear cover of electronic device according to claim 7, which is characterized in that the processing method is also wrapped
It includes: the table towards the holding tank before the lid portion and the frame section integrated injection molding, in the lid portion
The outer edge in face is surface-treated to increase the binding force in the lid portion and the frame section.
9. the processing method of the rear cover of electronic device according to claim 8, which is characterized in that be surface-treated as described
The outer edge on the surface towards the holding tank in lid portion is activated.
10. the processing method of the rear cover of electronic device according to claim 8, which is characterized in that be surface-treated as in institute
The outer edge for stating the surface towards the holding tank in lid portion coats one layer of Waterborne hot-melt adhesive, and is dried.
11. the processing method of the rear cover of electronic device according to claim 7, which is characterized in that outside the lid portion
Peripheral wall is equipped with protrusion, and the internal perisporium of the frame section is equipped with the groove with the male cooperation.
12. the processing method of the rear cover of electronic device according to claim 11, which is characterized in that the protrusion is along described
The circumferential direction extension in lid portion circularizes.
13. the processing method of the rear cover of electronic device according to claim 11, which is characterized in that the protrusion is along institute
State lid portion circumferential direction be spaced apart it is multiple.
14. the processing method of the rear cover of electronic device according to claim 1, which is characterized in that in the frame section
First hyaline layer is arranged by Shooting Technique in outer surface.
15. a kind of rear cover of electronic device, the rear cover passes through electronic device described in any one of -14 according to claim 1
The processing method of rear cover be process.
16. a kind of electronic device, which is characterized in that the rear cover including electronic device according to claim 15.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811463783.1A CN109587298A (en) | 2018-12-03 | 2018-12-03 | Rear cover and its processing method, the electronic device of electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811463783.1A CN109587298A (en) | 2018-12-03 | 2018-12-03 | Rear cover and its processing method, the electronic device of electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109587298A true CN109587298A (en) | 2019-04-05 |
Family
ID=65926883
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811463783.1A Pending CN109587298A (en) | 2018-12-03 | 2018-12-03 | Rear cover and its processing method, the electronic device of electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109587298A (en) |
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|---|---|---|---|---|
| CN201263259Y (en) * | 2008-08-19 | 2009-06-24 | 叶萌 | Shell structure for MP3 and MP4 |
| CN101854781A (en) * | 2009-04-02 | 2010-10-06 | 深圳富泰宏精密工业有限公司 | Shell |
| CN203194039U (en) * | 2013-03-27 | 2013-09-11 | 深圳市中创投资有限公司 | Protective shell for portable electronic device |
| CN205830204U (en) * | 2016-07-20 | 2016-12-21 | 惠州Tcl移动通信有限公司 | A kind of electronic equipment and middle frame structure thereof |
| CN205946417U (en) * | 2016-06-24 | 2017-02-08 | 益思有限公司 | Mobile device protective case sleeve structure with transparent bottom |
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2018
- 2018-12-03 CN CN201811463783.1A patent/CN109587298A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201263259Y (en) * | 2008-08-19 | 2009-06-24 | 叶萌 | Shell structure for MP3 and MP4 |
| CN101854781A (en) * | 2009-04-02 | 2010-10-06 | 深圳富泰宏精密工业有限公司 | Shell |
| CN203194039U (en) * | 2013-03-27 | 2013-09-11 | 深圳市中创投资有限公司 | Protective shell for portable electronic device |
| CN205946417U (en) * | 2016-06-24 | 2017-02-08 | 益思有限公司 | Mobile device protective case sleeve structure with transparent bottom |
| CN205830204U (en) * | 2016-07-20 | 2016-12-21 | 惠州Tcl移动通信有限公司 | A kind of electronic equipment and middle frame structure thereof |
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Application publication date: 20190405 |
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| RJ01 | Rejection of invention patent application after publication |