CN109582164A - Touch screen, preparation method thereof and touch screen terminal - Google Patents
Touch screen, preparation method thereof and touch screen terminal Download PDFInfo
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- CN109582164A CN109582164A CN201710912048.3A CN201710912048A CN109582164A CN 109582164 A CN109582164 A CN 109582164A CN 201710912048 A CN201710912048 A CN 201710912048A CN 109582164 A CN109582164 A CN 109582164A
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- lead
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- electrode
- touch screen
- conductive
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/0412—Digitisers structurally integrated in a display
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
Abstract
The invention provides a touch screen, a preparation method thereof and a touch screen terminal. In the touch screen structure, a first electrode layer and a second electrode layer are respectively arranged on two opposite sides of a substrate; the first electrode lead comprises a first sub-lead and a second sub-lead, and the first sub-lead is connected with the first electrode layer; the second electrode lead is connected with the second electrode layer; the touch screen is provided with a through hole penetrating through the substrate, the first electrode layer, the second sub-lead and the second electrode lead, conductive materials are filled in the through hole, the conductive materials form a conductive structure, two ends of the conductive structure are respectively in contact with and conducted with the second sub-lead and the second electrode lead, and the first sub-lead and the second sub-lead are connected with the flexible circuit board. According to the touch screen provided by the invention, the second sub-lead and the second electrode lead which are respectively positioned on the two sides of the substrate are electrically connected, so that the first sub-lead and the second sub-lead can be connected through one FPC.
Description
Technical field
The present invention relates to touch screen fields, more specifically, are related to a kind of touch screen and preparation method thereof and including the touching
Touch the touch screen terminal of screen.
Background technique
Common film touch screen includes the following categories: built in GFF, GF1, GF2, GG, OGS etc. and the touch-control in later period
To On-cell the and In-cell scheme of LCM.Actually above-described touch scheme structure is similar, the reality of touch function
Now it is divided into two big mac functions, the area AA and line areas.The area AA (as shown in figure 1 shown in A) is mainly responsible for perception and touches, and is really to anticipate
The input block of mobile phone or Pad in justice.Conduction is responsible in line areas (as shown in figure 1 shown in B), and the signal transduction of perception is gone out
It is analyzed for calculating.
For GF2 (DITO) scheme, in Fig. 2, touch screen includes first electrode layer 10 ', the second electrode lay 20 ', substrate
30 ', first electrode lead 40 ', second electrode lead 50 ', flexible circuit board 60 ', due to being the system of one layer of substrate Double-side line
Journey, finally route is exported from touch-control Sensor go also will point two sides carry out.Or using two flexible circuit boards (FPC) into
Row carries out hot pressing using a two sides FPC to realize.DITO divides two sides to carry out hot pressing connects, and trivial operations need to distinguish
It carries out carrying out 2-3 hot pressing binding again after 2-3 ACF attaching.Technics comparing complexity is bound in hot pressing, and repeatedly binding is so that raw
Producing efficiency reduces, and reduces product yield.
Summary of the invention
The present invention is directed at least solve one of the technical problems existing in the prior art.
For this purpose, the first aspect of the invention is designed to provide a kind of touch screen.
The second aspect of the invention is designed to provide a kind of preparation method for being used to prepare above-mentioned touch screen.
Third aspect of the present invention is designed to provide a kind of touch screen terminal including above-mentioned touch screen.
To achieve the above object, the embodiment of the first aspect of the invention provides a kind of touch screen, comprising: substrate；
First electrode layer and the second electrode lay are separately positioned on the opposite two sides of the substrate；First electrode lead is located at described first
Side of the electrode layer far from the substrate, including the first sub- lead and the second sub- lead, the first sub- lead and described first
Electrode layer is connected；Second electrode lead, side positioned at the second electrode lay far from the substrate and with second electricity
Pole layer connection；And flexible circuit board；Wherein, the touch screen is equipped with through the substrate, the first electrode layer, described the
The through-hole of two electrode layers, the second sub- lead and second electrode lead, the through-hole is interior filled with conductive layer conductive material, described to lead
Electric material formed conductive structure, and the both ends of the conductive structure respectively with the described second sub- lead and the second electrode lead
It contacts and is connected, the first sub- lead and the second sub- lead are connected with the flexible circuit board.
The touch screen that the above embodiment of the present invention provides only includes a FPC hot pressing connects on the same face, is avoided existing
Have and need to carry out hot pressing using two FPC or on the two sides of a FPC in technology, to improve the production efficiency of touch screen.
Furthermore the first sub- lead and the second sub- lead are made in the same face of substrate, are conducive to improve the precision aligned when binding.
In addition, the touch screen that the above embodiment of the present invention provides also has following additional technical feature:
In above-mentioned technical proposal, it is preferable that the quantity of the flexible circuit board is one；And/or the first sub- lead
It is connected with the described second sub- lead with the same face of the flexible circuit board.
The second electrode lead of second surface is connected to first surface by the conductive structure in through-hole, the
One sub- lead and the second sub- lead are electrically connected in first surface with FPC.And using a FPC can also reduce touch screen at
This, while promoting the preparation efficiency of touch screen, improves the precision of touch screen.
In above-mentioned technical proposal, it is preferable that the conductive structure is at least partially disposed at the described second sub- lead far from institute
The side of substrate is stated, and at least part of cross-sectional area of the conductive structure is greater than the cross-sectional area of the through-hole.
Preferably, conductive material is filled in through-hole using printing technology, and further the hole on printing screen plate is greater than logical
Hole, even if being printed with deviation in this way, it is also possible that conductive material can completely be stuffed entirely with through-hole.
In above-mentioned technical proposal, it is preferable that the conductive material is filled in described logical by printing technology or gluing process
In hole.
Further, conductive material can be using being printed on one side or double face printing process is filled in through-hole.
In above-mentioned technical proposal, it is preferable that the conductive material includes silver paste, graphite or carbon.
Preferably, conductive structure is silver slurry layer, graphite linings or carbon-coating.Certainly, conductive material, which can also be, can be realized
Other conductive materials of two sub- leads and the electrical connection of second electrode lead.
In above-mentioned technical proposal, it is preferable that the quantity of the through-hole is not less than the quantity of the second electrode lead, so that
The one second electrode lead is connected by through-hole described at least one with a second sub- lead.
The quantity of through-hole can be equal with the quantity of the second sub- lead or second electrode lead, i.e. through-hole and the second sub- lead
Or second electrode lead corresponds.The quantity for being also possible to through-hole is greater than the quantity of the second sub- lead or second electrode lead,
In this way, a second electrode lead is connected by least one through-hole with one second sub- lead, at this point it is possible to increase contact surface
Product reduces resistance, and can prevent caused touch screen failure after a through-hole failure.
In above-mentioned technical proposal, it is preferable that the substrate includes viewing area (i.e. functional areas) and rim area, the through-hole position
In the rim area.
In above-mentioned technical proposal, it is preferable that the flexible circuit board passes through anisotropic conductive adhesive paste and the first sub- lead
It is connected with the described second sub- lead.
Flexible circuit board is by the sub- lead of ACF and first or the second sub- lead hot pressing connects, thus when the quantity of FPC is one
When a, one of hot pressing process can be saved, promotes the manufacture efficiency of touch screen.
In above-mentioned technical proposal, it is preferable that the first electrode layer includes ITO electrode；And/or the second electrode lay
Including ITO electrode；And/or the substrate includes pet substrate, PC substrate or glass substrate.
First electrode layer or the second electrode lay can also be Metal Mesh (metal grill) conductive film.
The second aspect of the present invention is designed to provide a kind of preparation method, is used to prepare described in any of the above-described embodiment
Touch screen, the preparation method includes: step S10, makes the first conductive film and the second conductive film respectively in the two sides of substrate；
The first metal film and the second metal film is respectively set on first conductive film and second conductive film in step S20；Step
S30, setting run through first conductive film, second conductive film, the substrate, first metal film and second gold medal
Belong to the through-hole of film；Step S40, fills conductive material in the through-hole, and the conductive material forms conductive structure；Step S50,
Using etching technics respectively by first conductive film, second conductive film, first metal film, second metal film
Etching is first electrode layer, the second electrode lay, first electrode lead, second electrode lead, and the first electrode lead includes the
One sub- lead and the second sub- lead, and the both ends of the conductive structure are drawn with the described second sub- lead and the second electrode respectively
Line is contacted and is connected, wherein step S40 is located at after the step S30；Alternatively, step S10, makes respectively in the two sides of substrate
Make the first conductive film and the second conductive film；Step S20 is respectively set on first conductive film and second conductive film
One metal film and the second metal film；Step S30, using etching technics respectively by first conductive film, second conductive film,
First metal film, second metal film etching are first electrode layer, the second electrode lay, first electrode lead, the second electricity
Pole lead, wherein the first electrode lead includes the first sub- lead and the second sub- lead；Step S40, setting run through the base
The through-hole of plate, wherein step S40 is located at after step S30；Step S50 fills conductive material in the through-hole, described to lead
Electric material formed conductive structure, and the both ends of the conductive structure respectively with the described second sub- lead and the second electrode lead
It contacts and is connected.
The embodiment of the second aspect of the present invention provides a kind of preparation method, comprising: sputters one respectively in the two sides of substrate
The first conductive film of layer and the second conductive film, plate the first metal film and the second metal on the first conductive film and the second conductive film respectively
Film, after having plated the first metal film and the second metal film, punching press (Punching) through-hole, through-hole is led through the first conductive film, second
Electrolemma, substrate, the first metal film and the second metal film, after the complete through-hole of punching press, using printing technology or gluing process in through-hole
Conductive material is filled, the conductive material forms conductive structure, after the filling for completing conductive material, using the technique of wet etching
First conductive film is etched as first electrode layer, the second conductive film is etched as the second electrode lay, is by the first metal film etching
First electrode lead, the second metal film etching are second electrode lead, wherein the first metal film etches the first sub- lead and the
Two sub- leads, the corresponding second sub- lead of through-hole and the setting of second electrode lead, through the second sub- lead, first electrode layer, substrate,
The second electrode lay, second electrode lead enable and conductive structure and the second sub- lead and second electrode wire contacts and are connected.
Alternatively, the preparation method includes: to sputter one layer of first conductive film and the second conductive film respectively in the two sides of substrate,
The first metal film and the second metal film are plated respectively on first conductive film and the second conductive film, have plated the first metal film and the second metal
After film, uses the technique of wet etching to etch the first conductive film for first electrode layer, be the second electricity by the second conductive film etching
First metal film etching is the first sub- lead and the second sub- lead by pole layer, and the second metal film etching is second electrode lead, is carved
After etching technique, setting runs through the through-hole of substrate on substrate by the way of punching press (Punching), it is preferable that through-hole corresponding the
Two sub- leads and the setting of second electrode lead, run through the second sub- lead, first electrode layer, substrate, the second electrode lay, second electrode
Lead.After the complete through-hole of punching press, conductive material is filled in through-hole using printing technology or gluing process, completes conduction material in through-hole
The filling of material, to form conductive structure, and conductive structure can with the second sub- lead and second electrode wire contacts and be connected.
Third aspect of the present invention is designed to provide a kind of touch screen terminal, including described in any of the above-described embodiment
Touch screen.
The touch screen terminal that the embodiment of third aspect of the present invention provides, because including touching described in any of the above-described embodiment
Screen, thus all beneficial effects with touch screen described in any of the above-described embodiment are touched, details are not described herein.
Additional aspect and advantage of the invention will become obviously in following description section, or practice through the invention
Recognize.
Detailed description of the invention
Above-mentioned and/or additional aspect of the invention and advantage will become from the description of the embodiment in conjunction with the following figures
Obviously and it is readily appreciated that, in which:
Fig. 1 is the structural schematic diagram of touch screen in the related technology；
Fig. 2 is the structural schematic diagram of touch screen in the related technology.
Wherein, the corresponding relationship in Fig. 1 and Fig. 2 between appended drawing reference and component names are as follows:
10 ' first electrode layers, 20 ' the second electrode lays, 30 ' substrates, 40 ' first electrode leads, 50 ' second electrode leads,
60 ' flexible circuit boards.
Fig. 3 is the structural schematic diagram of touch screen described in one embodiment of the present of invention；
Fig. 4 is the enlarged structure schematic diagram in the portion C in Fig. 3；
Fig. 5 is the structural representation in touch screen preparation process described in one embodiment of the present of invention after punch forming through-hole
Figure；
Fig. 6 is after filling conductive structure in through-holes in touch screen preparation process described in one embodiment of the present of invention
Structural schematic diagram；
Fig. 7 is the structural schematic diagram after etching in touch screen preparation process described in one embodiment of the present of invention；
Fig. 8 is the flow chart of touch screen preparation method described in one embodiment of the present of invention；
Fig. 9 is the flow chart of touch screen preparation method described in another embodiment of the invention.
Wherein, corresponding relationship of the Fig. 3 into Fig. 7 between appended drawing reference and component names are as follows:
10 substrates, 20 first electrode layers, 30 first electrode leads, 301 first sub- leads, 302 second sub- leads, 40 second
Electrode layer, 50 second electrode leads, 60 through-holes, 70FPC, 80 conductive structures.
Specific embodiment
To better understand the objects, features and advantages of the present invention, with reference to the accompanying drawing and specific real
Applying mode, the present invention is further described in detail.It should be noted that in the absence of conflict, the implementation of the application
Feature in example and embodiment can be combined with each other.
In the following description, numerous specific details are set forth in order to facilitate a full understanding of the present invention, still, the present invention may be used also
Implement in a manner of using other than the one described here, therefore, protection scope of the present invention is not by following public tool
The limitation of body embodiment.
Touch screen according to some embodiments of the invention and preparation method thereof and touch screen terminal are described with reference to the accompanying drawings.
As shown in Fig. 3, Fig. 4 and Fig. 7, a kind of touch screen for providing according to some embodiments of the invention, comprising: substrate 10,
First electrode layer 20, the second electrode lay 40, first electrode lead 30, second electrode lead 50 and flexible circuit board 70.First electricity
Pole layer 20 and the second electrode lay 40 are separately positioned on the opposite two sides of substrate 10；It is remote that first electrode lead 30 is located at first electrode layer
Side from the substrate, including the first sub- lead 301 and the second sub- lead 302, the first sub- lead 301 and first electrode layer 20
It is connected；Second electrode lead 50 is located at side of the second electrode lay far from substrate and connect with the second electrode lay 40；Wherein, base
Plate 10 is equipped with the through-hole 60 through substrate 10, and conductive material is filled in through-hole 60, and conductive material forms conductive structure 80, and
The both ends of conductive structure 80 contact and are connected with the second sub- lead 302 and second electrode lead 50 respectively；Flexible circuit board 70 with
First sub- lead 301 is connected with the second sub- lead 302.
The touch screen that the above embodiment of the present invention provides, substrate 10 include first surface and are oppositely arranged with first surface
Second surface, first electrode layer 20 are arranged on the first surface, and the second electrode lay 40 is arranged on a second surface, it is preferable that the
One electrode layer 20 and the second electrode lay 40 are capacitance electrode, i.e., touch screen includes substrate 10 and the electricity that 10 two sides of substrate are arranged in
Hold electrode, first electrode layer 20 and the second electrode lay 40 include electrode pattern, and form the sensor of touch screen, by being located at base
The first electrode layer 20 on plate two sides and 40 mutual induction of the second electrode lay generate capacitance, and finger touch can change capacitance, lead to
Cross detection knots modification can detected touch point position, and first electrode layer and the second electrode lay respectively with first electrode lead 30 and
Second electrode lead 50 is connected, and first electrode lead 30 includes that the first sub- lead 301 and the second sub- lead 302, the first son draw
Line 301 is connected with first electrode layer, and the second sub- lead 302 is connected by conductive structure 80 with second electrode lead 50, by
It is as made from first procedure in the first sub- lead 301 of first electrode lead 30 and the second sub- lead 302, second electrode is drawn
Line 50 is by first procedure, i.e. first electrode lead 30 and second electrode lead 50 is worked it out in two times, Bu Nengyi
It is secondary to make simultaneously, so the location error between first electrode lead 30 and second electrode lead 50 is very big, and the first sub- lead
301 and second sub- lead 302 be to be worked it out by first procedure, so the position of the first sub- lead 301 and the second sub- lead 302
Set precision height.Substrate 10 is equipped with the through-hole for running through substrate 10 along the direction of first electrode layer 20, substrate 10, the second electrode lay 40
60 (in such as Fig. 7, through-hole runs through substrate along the vertical direction), through-hole is interior to fill conductive material, and conductive material forms at least partly position
In the conductive structure in through-hole, the second sub- lead 302 is connected with second electrode lead 50 by conductive structure 80, then by the
Two sub- leads 302 are connected on flexible circuit board 70 (FPC 70), realize the connection of second electrode lead 50 Yu FPC 70, into
And realize the connection of the second electrode lay 40 Yu FPC 70, wherein first electrode layer 20 passes through the first sub- lead 301 and FPC 70
Connection, so as to improve the precision that first electrode lead 30 and second electrode lead 50 are connect with FPC 70.Wherein, the first son
Lead 301 and the second sub- lead 302 pass through the connection of FPC 70 IC.
Furthermore it should be noted that contact conductor of the invention is the electrode layer material and metal layer material by electrically conducting transparent
Double-layer structure made of etching, i.e. electrode layer in addition to include as the touch control electrode layer of touch function other than there are also be partially as drawing
Line, it is to be located at first electrode lead 30, second electrode lead that specific first electrode layer 20, the second electrode lay 40, which have part,
50 lower layer.
As shown in figure 3, the area AA (as shown in E in Fig. 3) be mainly responsible for perception touch, be truly mobile phone or
The input block of Pad.Conduction is responsible in line areas (as shown in D in Fig. 3), and the signal transduction of perception is gone out to analyze for calculating.
First electrode lead and second electrode lead can be copper lead or silver paste lead etc..
Preferably, as shown in Figure 3 and Figure 4, the quantity of flexible circuit board 70 is one.
Preferably, the first sub- lead 301 and the second sub- lead 302 are connected with the same face of flexible circuit board 70.
Since the second sub- lead 302 is connected with second electrode lead 50 by the conductive structure 80 in through-hole 60, so that
Touch screen can include a FPC 70, and first electrode lead 30 and 50 hot pressing connects of second electrode lead are in flexible circuit board
On 70 the same face, avoids and need to carry out hot pressing on 70 two sides of flexible circuit board in the prior art, to improve touch screen
Production efficiency.
The second electrode lead 50 of second surface is connected to first surface, the first son by the conductive structure in through-hole 60
Lead 301 and the second sub- lead 302 are electrically connected in first surface with FPC 70.And touch can also be reduced using a FPC 70
The cost of screen while promoting the preparation efficiency of touch screen, improves the precision of touch screen.
Preferably, conductive structure 80 is at least partially disposed at the second sub- side of the lead 302 far from substrate 10, and conductive knot
At least part of cross-sectional area of structure 80 is greater than the cross-sectional area of through-hole 60, as shown in fig. 7, the upper end of conductive structure is higher than second
Sub- lead, and the cross-sectional area of the upper end of conductive structure is greater than the cross-sectional area of through-hole.
Preferably, conductive material is filled in through-hole 60 using printing technology, and further the hole on printing screen plate is greater than
Through-hole 60, even if being printed with deviation in this way, it is also possible that conductive material can completely be stuffed entirely with through-hole 60.
Preferably, conductive material is filled in through-hole 60 by printing technology or gluing process.
Further, conductive material can be using being printed on one side or double face printing process is filled in through-hole 60.
Preferably, conductive material includes silver paste, graphite or carbon.
Preferably, conductive structure is silver slurry layer, graphite linings or carbon-coating, and when conductive structure is silver slurry layer, conductive structure exists
Filling in through-hole forms silver paste grouting.Certainly, conductive material, which can also be, can be realized the second sub- lead 302 and second electrode
Other conductive materials that lead 50 is electrically connected.
Preferably, the quantity of through-hole 60 is not less than the quantity of second electrode lead 50, so that a second electrode lead 50 is logical
At least one through-hole 60 is crossed to be connected with one second sub- lead 302.
The quantity of through-hole 60 can be equal with the quantity of the second sub- lead 302 or second electrode lead 50, i.e., through-hole 60 with
Second sub- lead 302 or second electrode lead 50 correspond.Be also possible to through-hole 60 quantity be greater than the second sub- lead 302 or
The quantity of second electrode lead 50, in this way, a second electrode lead 50 passes through at least one through-hole 60 and one second sub- lead
302 are connected, at this point it is possible to increase contact area, reduce resistance, and can prevent caused touch after the failure of through-hole 60
Screen failure.As shown in figure 4, touch screen includes the multiple second sub- metal lead wires and second electrode lead, and the number of the second sub- lead
It measures equal with the quantity of second electrode lead.
Preferably, substrate 10 includes viewing area (i.e. functional areas) and rim area, and through-hole 60 is located at rim area.
Preferably, flexible circuit board 70 passes through anisotropic conductive adhesive paste (ACF) and the first sub- lead 301 and the second sub- lead
302 are connected.
FPC is by the sub- lead 301 of ACF and first and the second sub- 302 hot pressing connects of lead, so that the quantity as FPC 70 is
At one, one of hot pressing process can be saved, promotes the manufacture efficiency of touch screen.
Preferably, first electrode layer 20 includes ITO electrode；And/or the second electrode lay 40 includes ITO electrode；And/or base
Plate 10 includes pet substrate 10, PC substrate 10 or glass substrate 10.
First electrode layer 20 or the second electrode lay 40 can also be Metal Mesh (metal grill) conductive film.
The second aspect of the present invention is designed to provide a kind of preparation method, is used to prepare the touching of any of the above-described embodiment
Touch screen.
As shown in figure 8, in a specific embodiment, which includes:
Step S10 makes the first conductive film and the second conductive film in the two sides of substrate 10 respectively；
The first metal film and the second metal film is respectively set on the first conductive film and the second conductive film in step S20；
Step S30, setting is through the first conductive film, the second conductive film, substrate 10, the first metal film and the second metal film
Through-hole 60, as shown in Figure 5；
Step S40 fills conductive material in through-hole 60, and the conductive material forms conductive structure 80, as shown in Figure 6；
Step S50, using etching technics respectively by the first conductive film, the second conductive film, the first metal film, the second metal film
Etching is first electrode layer 20, the second electrode lay 40, first electrode lead 30, second electrode lead 50, first electrode lead 30
Including the first sub- lead 301 and the second sub- lead 302, and the both ends of conductive structure 80 respectively with the second sub- lead 302 and second
Contact conductor 50 is contacted and is connected, wherein step S50 is located at after step S340.
The embodiment of the second aspect of the present invention provides a kind of preparation method, comprising: sputters respectively in the two sides of substrate 10
One layer of first conductive film and the second conductive film plate the first metal film and the second gold medal on the first conductive film and the second conductive film respectively
Belong to film, after plate the first metal film and the second metal film, punching press (Punching) through-hole 60, through-hole 60 run through the first conductive film,
Second conductive film, substrate 10, the first metal film and the second metal film, after the complete through-hole 60 of punching press, using printing technology or dispensing work
Skill fills conductive material in through-hole 60, and conductive material forms conductive structure 80, after the filling for completing conductive material, using wet process
The technique of etching etches the first conductive film for first electrode layer 20, the second conductive film is etched as the second electrode lay 40, by
One metal film etching is first electrode lead 30, and the second metal film etching is second electrode lead 50, wherein the first metal film is carved
The first sub- lead 301 and the second sub- lead 302 out are lost, the corresponding second sub- lead 302 of through-hole 60 and second electrode lead 50 are arranged,
Through the second sub- lead 302, first electrode layer 20, substrate 10, the second electrode lay 40, second electrode lead 50, so that conductive knot
Structure 80 can be contacted and be connected with the second sub- lead 302 and second electrode lead 50.
As shown in figure 9, in second specifically embodiment, which includes:
Step S10 makes the first conductive film and the second conductive film in the two sides of substrate 10 respectively；
The first metal film and the second metal film is respectively set on the first conductive film and the second conductive film in step S20；
Step S30, using etching technics respectively by the first conductive film, the second conductive film, the first metal film, the second metal film
Etching is first electrode layer 20, the second electrode lay 40, first electrode lead 30, second electrode lead 50, wherein first electrode is drawn
Line 30 includes the first sub- lead 301 and the second sub- lead 302；
Step S40, setting run through the through-hole 60 of substrate 10, wherein step S40 is located at after step S30；
Step S50 fills conductive material, conductive material formation conductive structure 80, and conductive structure 80 in through-hole 60
Both ends contact and are connected with the second sub- lead 302 and second electrode lead 50 respectively.
The preparation method includes: to sputter one layer of first conductive film and the second conductive film respectively in the two sides of substrate 10,
The first metal film and the second metal film are plated respectively on one conductive film and the second conductive film, have plated the first metal film and the second metal film
Afterwards, it uses the technique of wet etching to etch the first conductive film for first electrode layer 20, is the second electricity by the second conductive film etching
Pole layer 40, is the first sub- lead 301 and the second sub- lead 302 by the first metal film etching, and the second metal film etching is the second electricity
Pole lead 50, after etching technics, setting runs through the through-hole 60 of substrate 10 on the substrate 10 by the way of punching press (Punching),
Preferably, the corresponding second sub- lead 302 of through-hole 60 and second electrode lead 50 are arranged, and run through the second sub- lead 302, first electrode
Layer 20, substrate 10, the second electrode lay 40, second electrode lead 50.After the complete through-hole 60 of punching press, using printing technology or gluing process
Conductive material is filled in through-hole 60, the filling of conductive material in through-hole 60 is completed, to form conductive structure, and conductive structure 80
It can contact and be connected with the second sub- lead 302 and second electrode lead 50.
Furthermore it should be noted that the first, second contact conductor of the invention is as made of conductive film and metal film etching
Double-layer structure.
Third aspect of the present invention is designed to provide a kind of touch screen terminal, the touch including any of the above-described embodiment
Screen.
The touch screen terminal that the embodiment of third aspect of the present invention provides, because of the touch including any of the above-described embodiment
Screen, thus all beneficial effects of the touch screen with any of the above-described embodiment, details are not described herein.
In conclusion touch screen provided in an embodiment of the present invention, is located at second sub- 302 He of lead on 10 two sides of substrate
Second electrode lead 50 realizes electrical connection, so as to pass through the connection first electrode of FPC 70 lead 30 and second electrode
Lead 50.
In the description of the present invention unless specifically defined or limited otherwise, term " multiple " refer to two or two with
On；Unless otherwise prescribed or illustrate, term " connection ", " fixation " etc. shall be understood in a broad sense, for example, " connection " can be fixation
Connection, may be a detachable connection, or be integrally connected, or electrical connection；It can be directly connected, intermediate matchmaker can also be passed through
Jie is indirectly connected.For the ordinary skill in the art, above-mentioned term can be understood in the present invention as the case may be
In concrete meaning.
In the description of this specification, it is to be understood that the instruction such as term " on ", "lower", "front", "rear", "left", "right"
Orientation or positional relationship be based on the orientation or positional relationship shown in the drawings, be merely for convenience of description the present invention and simplification retouch
It states, rather than the device or unit of indication or suggestion meaning must have specific direction, be constructed and operated in a specific orientation,
It is thus impossible to be interpreted as limitation of the present invention.
In the description of this specification, the description of term " one embodiment ", " some embodiments ", " specific embodiment " etc.
Mean that particular features, structures, materials, or characteristics described in conjunction with this embodiment or example are contained at least one reality of the invention
It applies in example or example.In the present specification, schematic expression of the above terms are not necessarily referring to identical embodiment or reality
Example.Moreover, description particular features, structures, materials, or characteristics can in any one or more of the embodiments or examples with
Suitable mode combines.
The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention, for the skill of this field
For art personnel, the invention may be variously modified and varied.All within the spirits and principles of the present invention, made any to repair
Change, equivalent replacement, improvement etc., should all be included in the protection scope of the present invention.
Claims (10)
1. a kind of touch screen characterized by comprising
Substrate；
First electrode layer and the second electrode lay are separately positioned on the opposite two sides of the substrate；
First electrode lead, the side positioned at the first electrode layer far from the substrate, including the first sub- lead and the second son
Lead, the first sub- lead are connected with the first electrode layer；
Second electrode lead, side positioned at the second electrode lay far from the substrate and connect with the second electrode lay；
With
Flexible circuit board；
Wherein, the touch screen, which is equipped with, runs through the substrate, the first electrode layer, the second electrode lay, described second
The through-hole of sub- lead and the second electrode lead, the through-hole is interior to be filled with conductive material, and the conductive material forms conduction
Structure, and the both ends of the conductive structure respectively with the described second sub- lead and the second electrode wire contacts and be connected, institute
It states the first sub- lead and the second sub- lead is connected with the flexible circuit board.
2. touch screen according to claim 1, which is characterized in that
The quantity of the flexible circuit board is one；And/or
The first sub- lead and the second sub- lead are connected with the same face of the flexible circuit board.
3. touch screen according to claim 1, which is characterized in that
The conductive structure is at least partially disposed at the described second side of the sub- lead far from the substrate, and the conductive structure
At least part of cross-sectional area be greater than the through-hole cross-sectional area.
4. touch screen according to claim 1, which is characterized in that
The conductive material is filled in the through-hole by printing technology or gluing process.
5. touch screen according to claim 1, which is characterized in that
The conductive material includes silver paste, graphite or carbon.
6. touch screen according to any one of claim 1 to 5, which is characterized in that
The quantity of the through-hole is not less than the quantity of the second electrode lead, so that a second electrode lead is by least
One through-hole is connected with a second sub- lead.
7. touch screen according to any one of claim 1 to 5, which is characterized in that
The substrate includes viewing area and rim area, and the through-hole is located at the rim area.
8. touch screen according to any one of claim 1 to 5, which is characterized in that
The flexible circuit board is connected by anisotropic conductive adhesive paste with the described first sub- lead with the described second sub- lead.
9. a kind of preparation method is used to prepare such as touch screen described in any item of the claim 1 to 8, which is characterized in that packet
It includes:
Step S10 makes the first conductive film and the second conductive film in the two sides of substrate respectively；
The first metal film and the second metal film is respectively set on first conductive film and second conductive film in step S20；
Step S30, setting run through first conductive film, second conductive film, the substrate, first metal film and institute
State the through-hole of the second metal film；
Step S40, fills conductive material in the through-hole, and the conductive material forms conductive structure；
Step S50, using etching technics respectively by first conductive film, second conductive film, first metal film, institute
Stating the second metal film etching is first electrode layer, the second electrode lay, first electrode lead, second electrode lead, first electricity
Pole lead include the first sub- lead and the second sub- lead, and the both ends of the conductive structure respectively with the described second sub- lead and institute
It states second electrode wire contacts and is connected；Alternatively,
Step S10 makes the first conductive film and the second conductive film in the two sides of substrate respectively；
The first metal film and the second metal film is respectively set on first conductive film and second conductive film in step S20；
Step S30, using etching technics respectively by first conductive film, second conductive film, first metal film, institute
Stating the second metal film etching is first electrode layer, the second electrode lay, first electrode lead, second electrode lead, wherein described the
One contact conductor includes the first sub- lead and the second sub- lead；
Step S40, setting run through the through-hole of the substrate；
Step S50, fills conductive material in the through-hole, and the conductive material forms conductive structure, and the conductive structure
Both ends respectively with the described second sub- lead and the second electrode wire contacts and be connected.
10. a kind of touch screen terminal, which is characterized in that including touch screen such as described in any item of the claim 1 to 8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710912048.3A CN109582164A (en) | 2017-09-29 | 2017-09-29 | Touch screen, preparation method thereof and touch screen terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710912048.3A CN109582164A (en) | 2017-09-29 | 2017-09-29 | Touch screen, preparation method thereof and touch screen terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109582164A true CN109582164A (en) | 2019-04-05 |
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ID=65919262
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710912048.3A Pending CN109582164A (en) | 2017-09-29 | 2017-09-29 | Touch screen, preparation method thereof and touch screen terminal |
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| Country | Link |
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| CN (1) | CN109582164A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111538440A (en) * | 2020-04-27 | 2020-08-14 | 南昌欧菲显示科技有限公司 | Touch panel, preparation method of touch panel and electronic equipment |
-
2017
- 2017-09-29 CN CN201710912048.3A patent/CN109582164A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111538440A (en) * | 2020-04-27 | 2020-08-14 | 南昌欧菲显示科技有限公司 | Touch panel, preparation method of touch panel and electronic equipment |
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