CN109570773B - Laser cutting method and device - Google Patents
Laser cutting method and device Download PDFInfo
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- CN109570773B CN109570773B CN201811393023.8A CN201811393023A CN109570773B CN 109570773 B CN109570773 B CN 109570773B CN 201811393023 A CN201811393023 A CN 201811393023A CN 109570773 B CN109570773 B CN 109570773B
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- 238000003698 laser cutting Methods 0.000 title claims abstract description 98
- 238000000034 method Methods 0.000 title claims abstract description 42
- 239000000758 substrate Substances 0.000 claims abstract description 117
- 239000011247 coating layer Substances 0.000 claims abstract description 115
- 239000010410 layer Substances 0.000 claims abstract description 101
- 238000005520 cutting process Methods 0.000 claims abstract description 88
- 238000004140 cleaning Methods 0.000 claims abstract description 26
- 239000000463 material Substances 0.000 claims abstract description 22
- 230000007246 mechanism Effects 0.000 claims description 34
- 239000011248 coating agent Substances 0.000 claims description 26
- 238000000576 coating method Methods 0.000 claims description 26
- 239000011888 foil Substances 0.000 claims description 9
- 230000001678 irradiating effect Effects 0.000 claims description 7
- 238000004804 winding Methods 0.000 claims description 4
- 239000000428 dust Substances 0.000 abstract description 20
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 22
- 229910001416 lithium ion Inorganic materials 0.000 description 22
- 239000002699 waste material Substances 0.000 description 8
- 238000007599 discharging Methods 0.000 description 7
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 5
- GELKBWJHTRAYNV-UHFFFAOYSA-K lithium iron phosphate Chemical compound [Li+].[Fe+2].[O-]P([O-])([O-])=O GELKBWJHTRAYNV-UHFFFAOYSA-K 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 2
- 239000003575 carbonaceous material Substances 0.000 description 2
- 238000009831 deintercalation Methods 0.000 description 2
- 239000003792 electrolyte Substances 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 238000009499 grossing Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 230000002687 intercalation Effects 0.000 description 2
- 238000009830 intercalation Methods 0.000 description 2
- 229910052744 lithium Inorganic materials 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 239000013543 active substance Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Abstract
The invention discloses a laser cutting method and a device, wherein the method comprises the following steps: providing a substrate comprising: the middle layer, the upper coating layer set up in the upper surface of the said middle layer, and the lower coating layer set up in the lower surface of the said middle layer; cleaning the upper layer coating layer or the lower layer coating layer in the laser cutting area of the base material to form an upper layer bare area or a lower layer bare area; the laser irradiates the laser cutting area of the substrate and cuts the substrate along the cutting track to form a finished product. Before laser cutting, the upper layer coating layer or the lower layer coating layer in the laser cutting area of the base material is firstly cleaned, and then laser is irradiated to the laser cutting area of the base material to cut the base material to form a finished product. In the whole process, one layer of the upper layer coating layer or the lower layer coating layer in the laser cutting area is reduced, so that dust generated during laser cutting is correspondingly reduced.
Description
Technical Field
The application relates to the technical field of laser cutting, in particular to a laser cutting method and device.
Background
In the existing laser cutting process of the pole piece of the lithium ion battery, the upper and lower coating layers of the pole piece and the upper and lower coating layers of the pole piece coated with aluminum oxide are mainly cut directly. When the upper coating layer and the lower coating layer of the pole piece are directly cut, a large amount of dust is generated in the process of cutting the pole piece by laser, and the heat influence on the pole piece is generated due to a large amount of heat generated in the cutting process by the laser, so that the heat affected zone of the product is large. When the upper and lower coating layers coated with the aluminum oxide are cut, the purpose of the coated aluminum oxide is to reduce dust generated in the cutting process and reduce the occurrence of a heat affected zone, but the coated aluminum oxide also increases the production cost, and the coated aluminum oxide also reduces the reaction area of the coating layer of the lithium ion battery pole piece, thereby reducing the capacity of the battery.
Accordingly, there is a need for improvement and advancement in the art.
Disclosure of Invention
The application aims to provide a laser cutting method and device for reducing dust generated in a cutting process.
According to a first aspect of the present application, there is provided a laser cutting method comprising the steps of:
providing a substrate comprising: the middle layer, the upper coating layer set up in the upper surface of the said middle layer, and the lower coating layer set up in the lower surface of the said middle layer;
cleaning the upper layer coating layer or the lower layer coating layer in the laser cutting area of the base material to form an upper layer bare area or a lower layer bare area;
the laser irradiates the laser cutting area of the substrate and cuts the substrate along the cutting track to form a finished product.
In the laser cutting method, in the step of cleaning the upper layer coating or the lower layer coating in the laser cutting area of the substrate to form an upper layer exposed area or a lower layer exposed area, the upper layer coating or the lower layer coating in the laser cutting area of the substrate is cleaned by laser to form an upper layer exposed area or a lower layer exposed area.
In the laser cutting method, in the step of irradiating the laser to the laser cutting area of the substrate and cutting the substrate along the cutting track to form the finished product, the laser irradiates the upper layer exposed area and cuts the substrate along the cutting track, or irradiates the lower layer exposed area and cuts the substrate along the cutting track, or irradiates the upper layer coating layer in the laser cutting area and cuts the substrate along the cutting track, or irradiates the lower layer coating layer in the laser cutting area and cuts the substrate along the cutting track, so as to form the finished product.
The laser cutting method comprises the steps that the base material is provided with a coating area and a blank area, the blank area is arranged on at least one side edge of the coating area in the width direction, the middle layer, the upper layer coating layer and the lower layer coating layer form the coating area, and the middle layer extends to at least one side edge of the coating area in the width direction to form the blank area.
The base material is a positive electrode plate strip or a negative electrode plate strip, and the intermediate layer is a positive electrode foil or a negative electrode foil; the finished product is a positive pole piece belt after cutting the tab or a negative pole piece belt after cutting the tab.
In the laser cutting method, the laser cutting area of the substrate is a preset area containing a cutting track.
In the step of providing the base material, the base material is provided by unreeling and discharging.
The laser cutting method further comprises the step of collecting the finished product after the step of irradiating the laser to the laser cutting area of the substrate and cutting the substrate along the cutting track to form the finished product.
According to the laser cutting method, the step of collecting the finished product adopts a rolling and receiving mode for collecting.
According to a second aspect of the present application, there is also provided a laser cutting device based on the method, comprising: the unreeling mechanism, the cleaning mechanism and the cutting mechanism are sequentially arranged along the conveying direction of the base material; the unreeling mechanism is used for providing the substrate, the substrate includes: the middle layer, the upper coating layer set up in the upper surface of the said middle layer, and the lower coating layer set up in the lower surface of the said middle layer; the cleaning mechanism is used for cleaning an upper layer coating layer or a lower layer coating layer in the laser cutting area of the substrate so as to form an upper layer exposed area or a lower layer exposed area; the cutting mechanism is used for irradiating laser into a laser cutting area of the substrate and cutting the substrate along a cutting track to form a finished product.
The beneficial effects of the invention are as follows:
in the laser cutting method and device provided by the application, the method comprises the following steps: providing a substrate comprising: the middle layer, the upper coating layer set up in the upper surface of the said middle layer, and the lower coating layer set up in the lower surface of the said middle layer; cleaning the upper layer coating layer or the lower layer coating layer in the laser cutting area of the base material to form an upper layer bare area or a lower layer bare area; the laser irradiates the laser cutting area of the substrate and cuts the substrate along the cutting track to form a finished product. Before laser cutting, the upper layer coating layer or the lower layer coating layer in the laser cutting area of the base material is firstly cleaned, and then laser is irradiated to the laser cutting area of the base material to cut the base material to form a finished product. In the whole process, one layer of the upper layer coating layer or the lower layer coating layer in the laser cutting area is reduced, so that dust generated during laser cutting is correspondingly reduced.
Drawings
FIG. 1 is a flow chart of a laser cutting method provided by the invention;
FIG. 2 is a schematic illustration of a substrate and laser cut regions of the substrate provided by the present invention;
FIG. 3 is a cross-sectional view taken along A-A of FIG. 2;
FIG. 4 is a schematic illustration of an upper bare area formed after cleaning of an upper coating layer;
FIG. 5 is a schematic illustration of the formation of an underlying bare area after cleaning of the underlying coating layer;
FIG. 6 is a schematic diagram of a laser cutting device according to the present invention;
fig. 7 is a schematic structural diagram of a cleaning mechanism in the laser cutting device provided by the invention;
fig. 8 is a schematic structural diagram of a cutting mechanism in the laser cutting device provided by the invention.
Detailed Description
The present application is described in further detail below with reference to the accompanying drawings by way of specific embodiments.
Embodiment 1,
The embodiment provides a laser cutting method, in particular to a laser cutting method for cutting a pole piece of a lithium ion battery to form a pole lug. The method comprises the steps of firstly cleaning an upper layer coating layer or a lower layer coating layer in a laser cutting area of the lithium ion battery pole piece, so that an upper layer exposed area or a lower layer exposed area is formed in the laser cutting area of the lithium ion battery pole piece, then irradiating laser into the laser cutting area and cutting along a cutting track, and finally cutting out a pole lug in the laser cutting area to form a finished battery pole piece. The coating layers coated on the upper surface and the lower surface of the pole piece of the lithium ion battery are active substances of the pole piece, a large amount of dust can be generated in the laser cutting process, the dust is composed of coating layer particles and foil scraps, the damage to a human body can be caused, and meanwhile, if the dust falls back onto the pole piece, the quality of a product can be influenced. The laser cutting method reduces the cutting of one layer of coating layer, thereby reducing the generation of dust in the cutting process, and a small amount of generated dust is sucked by a dust suction device.
Referring to fig. 1, the laser cutting method provided in this embodiment specifically includes the following steps:
substrate providing step 100: a substrate 10 is provided, as shown in fig. 3, the substrate 10 comprising: an intermediate layer 14, an upper coating layer 13 provided on the upper surface of the intermediate layer 14, and a lower coating layer 15 provided on the lower surface of the intermediate layer 14.
In the above substrate providing step 100, the substrate 10 is specifically a positive electrode tab tape or a negative electrode tab tape. When the lithium ion battery pole piece is produced, at least one side edge of the positive pole piece belt and the negative pole piece belt in the width direction is provided with a blank area, and the blank area is an area for manufacturing the pole lug. Specifically, as shown in fig. 2, the substrate 10 has a coating region B and a blank region, the blank region is located on at least one side of the coating region B in the width direction, i.e., the up-down direction in fig. 2, the intermediate layer 14, the upper coating layer 13 and the lower coating layer 15 of the substrate 10 form the coating region B, the intermediate layer 14 extends toward at least one side of the coating region B in the width direction, so as to form the blank region, and the regions 11 and 12 in fig. 2 are the blank region.
The substrate 10 is a positive pole piece belt, the middle layer 14 is a positive pole foil, and the finished product is a positive pole piece belt after cutting the tab. The substrate 10 is a negative electrode plate strip, the middle layer 14 is a negative electrode foil, and the finished product is a negative electrode plate strip after cutting the tab. The positive pole piece belt and the negative pole piece belt are provided in an unreeling and discharging mode. When the substrate 10 is a positive pole piece strip, both the upper and lower coating layers are ternary or lithium iron phosphate, and only two coating layers are ternary or lithium iron phosphate at the same time; when the substrate 10 is a negative electrode tab strip, the upper or lower coating layer is a carbon material, such as graphite or the like. The coating layer on the positive electrode plate strip can play a role in intercalation and deintercalation of lithium ions, specifically, when discharging, the lithium ions intercalate and release an electron, and when charging, the lithium ions deintercalate to obtain an electron. The coating on the negative pole piece belt can play a role in inserting and removing lithium ions, specifically, after the lithium ions are removed from the positive pole during charging, the lithium ions are inserted into the negative pole through the electrolyte, and the negative pole is in a lithium-rich state and is opposite during discharging. The insertion and the extraction of lithium ions generate current for external electric equipment.
Substrate cleaning step 200: the upper coating layer 13 or the lower coating layer 15 in the laser cut region of the substrate 10 is washed away, as shown in fig. 4 and 5, so that the upper coating layer 13 or the lower coating layer 15 in the laser cut region is washed to form an upper bare region 131 or a lower bare region 151. It should be noted that the cleaning of the upper coating layer 13 or the lower coating layer 15 in the laser cut region of the substrate 10 includes three cases: only the upper coating layer 13, only the lower coating layer 15, and both the upper coating layer 13 and the lower coating layer 15 are washed away.
In the above substrate cleaning step 200, the upper coating layer 13 or the lower coating layer 15 in the laser cut region of the substrate 10 is cleaned by laser to form the upper exposed region 131 or the lower exposed region 151. With continued reference to fig. 2, since the substrate 10 has a coating region B and a blank region formed by a region 11 and a region 12, and the upper and lower surfaces of the blank region are not coated, the laser-cleaned region is a region within the coating region B, may be a strip-shaped structure formed by a region C and a region D in fig. 2, or may be a shadow region C only, and it should be noted that the width of the strip-shaped structure formed by the region C and the region D is small, typically set to 1-2mm. The laser cut regions of the substrate are region C and region 11 in fig. 2, and region D and region 12 are tabs formed after cutting.
In another embodiment, if the substrate does not have a blank area, i.e., the upper and lower surfaces of the middle layer of the substrate are uniformly coated with the coating layer, the laser cutting area of the substrate is a strip-shaped structure formed by the area C, the area D, the area 11 and the area 12, and the laser cutting area of the substrate is a preset area including a cutting track, in other words, the cutting track passes through the upper exposed area 131 or the lower exposed area 151, and the upper exposed area 131 or the lower exposed area 151 is the area C and the area 11, so that the laser cuts on the exposed middle layer, thereby reducing dust generation. The principle of the preset area is that at least one surface of the upper surface and the lower surface of the middle layer is free of coating layers during laser cutting. For example, as shown in fig. 2, the preset area may be one side area (area c+area d+area 11+area 12) of the pole piece band of the uncut tab, and may of course also be two side areas of the pole piece band of the uncut tab. The preset area can also be an area with a size larger than or equal to a closed graph (11 or 12) formed by a cutting track and the pole piece strip without cutting the pole lug. The preset area may also be an area formed by a cutting track, and the cutting track is a dotted line on the area C and the area 12. Continuing to combine with the illustration in fig. 2, fig. 2 shows a schematic view of the substrate 10 and the laser cutting area of the substrate 10, after the upper coating layer or the lower coating layer of the laser cutting area is cleaned, the tab on the substrate 10 is exposed, and when the laser cutting area is cleaned, the strip-shaped area composed of the area 11 and the area 12 in fig. 2 can be cleaned, or only the area slightly larger than the area 11 can be cleaned, or only the area slightly larger than the area 12 can be cleaned, and the area 12 is the cut tab. In this way, the substrate can be cleaned and cut, and then a coating layer can be applied again to the cleaned surface.
Substrate cutting step 300: the laser irradiates into the laser cut region of the substrate 10 and cuts the substrate along the cut trajectory to form a finished product. Referring to fig. 2, the cutting trajectory is indicated by the dotted lines on the areas C and 12 in fig. 2.
In the above substrate cutting step 300, the laser may be irradiated to the upper exposed region and cut the substrate along the cutting track, or the laser may be irradiated to the lower exposed region and cut the substrate along the cutting track, or the laser may be irradiated to the upper coating layer in the laser cutting region and cut the substrate along the cutting track, or the laser may be irradiated to the lower coating layer in the laser cutting region and cut the substrate along the cutting track, thereby forming a finished product, specifically, the positive electrode tab strip after cutting the tab and the negative electrode tab strip after cutting the tab.
The laser cutting method provided in this embodiment further includes a step of collecting the finished product after the substrate cutting step. The step of collecting the finished product is specifically to collect the finished product in a rolling and receiving mode.
Embodiment II,
Referring to fig. 6, the present embodiment provides a laser cutting apparatus usable for implementing the laser cutting method, the laser cutting apparatus including: the unreeling mechanism 20, the cleaning mechanism 30, the cutting mechanism 40 and the reeling mechanism 50, wherein the unreeling mechanism 20, the cleaning mechanism 30, the cutting mechanism 40 and the reeling mechanism 50 are sequentially arranged along the conveying direction of the base material. A plurality of rollers are provided between the mechanisms for passing the substrate 10.
The unwind mechanism 20 is used to provide a substrate 10, as shown in connection with fig. 3, the substrate 10 comprising: an intermediate layer 14, an upper coating layer 13 provided on the upper surface of the intermediate layer 14, and a lower coating layer 15 provided on the lower surface of the intermediate layer 14. Reference is made in particular to prior art unreeling.
In the unreeling mechanism 20, the base material 10 is specifically a positive electrode sheet tape or a negative electrode sheet tape. When the lithium ion battery pole piece is produced, at least one side edge of the positive pole piece belt and the negative pole piece belt in the width direction is provided with a blank area, and the blank area is an area for manufacturing the pole lug. Specifically, as shown in fig. 2, the substrate 10 has a coating region B and a blank region, the blank region is located on at least one side of the coating region B in the width direction, i.e., the up-down direction in fig. 2, the intermediate layer 14, the upper coating layer 13 and the lower coating layer 15 of the substrate 10 form the coating region B, the intermediate layer 14 extends toward at least one side of the coating region B in the width direction, so as to form the blank region, and the regions 11 and 12 in fig. 2 are the blank region.
The substrate 10 is a positive pole piece belt, the middle layer 14 is a positive pole foil, and the finished product is a positive pole piece belt after cutting the tab. The substrate 10 is a negative electrode plate strip, the middle layer 14 is a negative electrode foil, and the finished product is a negative electrode plate strip after cutting the tab. The positive pole piece belt and the negative pole piece belt are provided in an unreeling and discharging mode. When the substrate 10 is a positive pole piece strip, both the upper and lower coating layers are ternary or lithium iron phosphate, and only two coating layers are ternary or lithium iron phosphate at the same time; when the substrate 10 is a negative electrode tab strip, the upper or lower coating layer is a carbon material, such as graphite or the like. The coating layer on the positive electrode plate strip can play a role in intercalation and deintercalation of lithium ions, specifically, when discharging, the lithium ions intercalate and release an electron, and when charging, the lithium ions deintercalate to obtain an electron. The coating on the negative pole piece belt can play a role in inserting and removing lithium ions, specifically, after the lithium ions are removed from the positive pole during charging, the lithium ions are inserted into the negative pole through the electrolyte, and the negative pole is in a lithium-rich state and is opposite during discharging. The insertion and the extraction of lithium ions generate current for external electric equipment.
The cleaning mechanism 30 is used for cleaning the upper coating layer 13 or the lower coating layer 15 in the laser cutting area of the substrate 10, as shown in fig. 4 and 5, so that the upper coating layer 13 or the lower coating layer 15 in the laser cutting area is cleaned to form an upper bare area 131 or a lower bare area 151. It should be noted that the cleaning of the upper coating layer 13 or the lower coating layer 15 in the laser cut region of the substrate 10 includes three cases: only the upper coating layer 13, only the lower coating layer 15, and both the upper coating layer 13 and the lower coating layer 15 are washed away.
In the cleaning mechanism 30, the upper coating layer 13 or the lower coating layer 15 in the laser cut region of the substrate 10 is cleaned by laser to form an upper bare area 131 or a lower bare area 151. With continued reference to fig. 2, since the substrate 10 has a coating region B and a blank region formed by a region 11 and a region 12, and the upper and lower surfaces of the blank region are not coated, the laser-cleaned region is a region within the coating region B, may be a strip-shaped structure formed by a region C and a region D in fig. 2, or may be a shadow region C only, and it should be noted that the width of the strip-shaped structure formed by the region C and the region D is small, typically set to 1-2mm. The laser cut regions of the substrate are region C and region 11 in fig. 2, and region D and region 12 are tabs formed after cutting.
In another embodiment, if the substrate does not have a blank area, i.e., the upper and lower surfaces of the middle layer of the substrate are uniformly coated with the coating layer, the laser cutting area of the substrate is a strip-shaped structure formed by the area C, the area D, the area 11 and the area 12, and the laser cutting area of the substrate is a preset area including a cutting track, in other words, the cutting track passes through the upper exposed area 131 or the lower exposed area 151, and the upper exposed area 131 or the lower exposed area 151 is the area C and the area 11, so that the laser cuts on the exposed middle layer, and dust is reduced. The principle of the preset area is that at least one surface of the upper surface and the lower surface of the middle layer is free of coating layers during laser cutting. For example, as shown in fig. 2, the preset area may be one side area (area c+area d+area 11+area 12) of the pole piece band of the uncut tab, and may of course also be two side areas of the pole piece band of the uncut tab. The preset area can also be an area with a size larger than or equal to a closed graph (11 or 12) formed by a cutting track and the pole piece strip without cutting the pole lug. The preset area may also be an area formed by a cutting track, and the cutting track is a dotted line on the area C and the area 12. Continuing to combine with the illustration in fig. 2, fig. 2 shows a schematic view of the substrate 10 and the laser cutting area of the substrate 10, after the upper coating layer or the lower coating layer of the laser cutting area is cleaned, the tab on the substrate 10 is exposed, and when the laser cutting area is cleaned, the strip-shaped area composed of the area 11 and the area 12 in fig. 2 can be cleaned, or only the area slightly larger than the area 11 can be cleaned, or only the area slightly larger than the area 12 can be cleaned, and the area 12 is the cut tab. In this way, the substrate can be cleaned and cut, and then a coating layer can be applied again to the cleaned surface.
The cutting mechanism 40 is used to irradiate laser into the laser cutting area of the substrate 10 and cut the substrate along the cutting track to form a finished product. Referring to fig. 2, the cutting trajectory is indicated by the dotted lines on the areas C and 12 in fig. 2.
In the cutting mechanism 40, the laser may be irradiated to the upper exposed region and cut the substrate along the cutting track, or the laser may be irradiated to the lower exposed region and cut the substrate along the cutting track, or the laser may be irradiated to the upper coating layer in the laser cutting region and cut the substrate along the cutting track, or the laser may be irradiated to the lower coating layer in the laser cutting region and cut the substrate along the cutting track, thereby forming the finished product. The cutting mechanism 40 cuts the positive pole piece strip into the tab, cuts the negative pole piece strip into the tab, and the finished product is specifically the positive pole piece strip after the tab is cut and the negative pole piece strip after the tab is cut.
The winding mechanism 50 is used for collecting the finished product formed after cutting by the cutting mechanism 40 in a winding and receiving manner, and the winding manner in the prior art can be referred to specifically.
Referring to fig. 7, the cleaning mechanism 30 provided in the present embodiment includes: a mounting base 31, two support rollers 32 arranged in parallel, a driving assembly 33, a scanning head (not shown in the figure), and a table 34. The workbench 34 is fixed on the mounting base 31, the same ends of the two supporting rollers 32 are fixed on the mounting base 31, the two supporting rollers 32 are respectively arranged at two ends of the workbench 34, the two supporting rollers 32 are used for supporting the substrate 10, the driving component 33 is used for driving the two supporting rollers 32 to reciprocate along the axial direction perpendicular to the supporting rollers, and particularly the driving component 33 drives the mounting base 31 to reciprocate along the axial direction perpendicular to the supporting rollers 32. The scanning head is disposed away from the support roller in a direction perpendicular to the axial direction of the support roller 32, and is used for emitting laser, and the emitting ends of the scanning head face the laser cutting area of the substrate 10, so as to clean the upper coating layer 13 and the lower coating layer 15 in the laser cutting area of the substrate 10.
The driving assembly 33 includes: drive screw 331, positioning member 332, and drive screw adjustment nut 333. The driving screw adjusting nut 333 is fixedly connected with the mounting base 31, the driving screw 331 is matched in the driving screw adjusting nut 333, and the driving screw 331 can be driven to reciprocate relative to the driving screw 331 by rotating the driving screw 331 so as to drive the mounting base 31 to reciprocate along the axial direction perpendicular to the supporting roller. The positioning member 332 is sleeved on the driving screw 331, and is used for reciprocating the mounting base 31 to fix the position of the mounting base 31.
Referring to fig. 8, the cutting mechanism 40 provided in this embodiment includes: two pass rods 41, a smoothing rod 42, a waste collection assembly 43, a laser emitter 44 and a dust removal assembly 45. The two passing rollers 41 are arranged in sequence, the two passing rollers 41 are used for conveying the substrate 10, and the area for conveying the substrate 10 between the two passing rollers 41 is the laser cutting area of the substrate. The dust removal subassembly 45 sets up the same side at two roller 41 that cross, and laser emitter 44 sets up in the outside of dust removal subassembly 44, and has offered the opening that is used for supplying laser that laser emitter 44 sent to incident to the polar plate laser cutting region on this dust removal subassembly 45, smoothes the roller 42 and lies in the below of the roller that crosses of bottommost, receives useless subassembly 43 and lies in the below of smootheing the roller 42. The laser emitter 44 is used for emitting laser to cut the pole piece, the dust removal component 45 is used for absorbing dust generated in the laser cutting process, the waste collection component 43 is used for generating negative pressure to absorb waste generated in the cutting process, the smoothing roller 42 is used for eliminating shake of the waste collection component 43 on the base material 10 or waste when absorbing the waste, and the waste is guided to the waste collection component 43.
In summary, according to the laser cutting method and device provided by the application, before the process of forming the tab by cutting the battery pole piece by laser, the upper layer coating layer or the lower layer coating layer in the laser cutting area is cleaned, so that dust generation in the cutting process is reduced.
The foregoing is a further detailed description of the present application in connection with the specific embodiments, and it is not intended that the practice of the present application be limited to such descriptions. It will be apparent to those skilled in the art from this disclosure that several simple deductions or substitutions can be made without departing from the inventive concepts of the present application.
Claims (10)
1. A laser cutting method, comprising the steps of:
providing a substrate comprising: the middle layer, the upper coating layer set up in the upper surface of the said middle layer, and the lower coating layer set up in the lower surface of the said middle layer;
cleaning the upper layer coating layer or the lower layer coating layer in the laser cutting area of the base material to form an upper layer bare area or a lower layer bare area;
the laser irradiates the laser cutting area of the substrate and cuts the substrate along the cutting track to form a finished product.
2. The laser cutting method according to claim 1, wherein in the step of cleaning the upper coating layer or the lower coating layer in the laser cut region of the substrate to form the upper bare region or the lower bare region, the upper coating layer or the lower coating layer in the laser cut region of the substrate is cleaned by laser to form the upper bare region or the lower bare region.
3. The laser cutting method according to claim 1, wherein in the step of irradiating the laser to the laser cut region of the substrate and cutting the substrate along the cut track to form the finished product, the laser is irradiated to the upper exposed region and cutting the substrate along the cut track, or the laser is irradiated to the lower exposed region and cutting the substrate along the cut track, or the laser is irradiated to the upper coating layer in the laser cut region and cutting the substrate along the cut track, or the laser is irradiated to the lower coating layer in the laser cut region and cutting the substrate along the cut track to form the finished product.
4. The laser cutting method according to claim 1, wherein the substrate has a coating region and a margin region, the margin region being provided on at least one side in a width direction of the coating region, the intermediate layer, the upper layer coating layer, and the lower layer coating layer forming the coating region, the intermediate layer extending toward at least one side in the width direction of the coating region to form the margin region.
5. The laser cutting method according to claim 4, wherein the substrate is a positive electrode sheet strip or a negative electrode sheet strip, and the intermediate layer is a positive electrode foil or a negative electrode foil; the finished product is a positive pole piece belt after cutting the tab or a negative pole piece belt after cutting the tab.
6. The laser cutting method of claim 5, wherein the laser cut area of the substrate is a predetermined area comprising a cut track.
7. The laser cutting method according to claim 1, wherein in the step of providing the base material, the base material is provided by unreeling.
8. The laser cutting method of claim 1, further comprising the step of collecting the finished product after the step of irradiating the laser to the laser cut area of the substrate and cutting the substrate along the cutting trajectory to form the finished product.
9. The laser cutting method of claim 8, wherein the step of collecting the finished product is performed by winding and collecting materials.
10. A laser cutting device based on the method of any one of claims 1-9, comprising: the unreeling mechanism, the cleaning mechanism and the cutting mechanism are sequentially arranged along the conveying direction of the base material; the unreeling mechanism is used for providing the substrate, the substrate includes: the middle layer, the upper coating layer set up in the upper surface of the said middle layer, and the lower coating layer set up in the lower surface of the said middle layer; the cleaning mechanism is used for cleaning an upper layer coating layer or a lower layer coating layer in the laser cutting area of the substrate so as to form an upper layer exposed area or a lower layer exposed area; the cutting mechanism is used for irradiating laser into a laser cutting area of the substrate and cutting the substrate along a cutting track to form a finished product.
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