CN109565946A - The heat being used together with power converter removes component - Google Patents
The heat being used together with power converter removes component Download PDFInfo
- Publication number
- CN109565946A CN109565946A CN201780047963.9A CN201780047963A CN109565946A CN 109565946 A CN109565946 A CN 109565946A CN 201780047963 A CN201780047963 A CN 201780047963A CN 109565946 A CN109565946 A CN 109565946A
- Authority
- CN
- China
- Prior art keywords
- shell
- outflux
- evaporator
- flat surfaces
- inflow entrance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000012530 fluid Substances 0.000 claims abstract description 28
- 238000004891 communication Methods 0.000 claims abstract description 7
- 238000001704 evaporation Methods 0.000 claims description 4
- 230000008020 evaporation Effects 0.000 claims description 4
- 230000005611 electricity Effects 0.000 description 11
- 238000001816 cooling Methods 0.000 description 10
- 238000000034 method Methods 0.000 description 7
- 238000010248 power generation Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 3
- 238000010276 construction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000010992 reflux Methods 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20936—Liquid coolant with phase change
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20309—Evaporators
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20318—Condensers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
Abstract
A kind of heat removal component being used together with power converter comprising condenser and the evaporator coupled in flow communication with condenser.Evaporator is configured to guide working fluid therebetween.Evaporator includes at least one the expansion shell for supplying shell, receiving shell and extending between supply shell and reception shell.At least one expansion shell includes the outflux for being limited to the inflow entrance at supply shell and being limited at the reception shell, and inflow entrance is sized to be less than outflux on cross sectional dimensions.
Description
Technical field
The disclosure relates generally to electric power transducer, and relate more specifically to one kind be configured to limitation evaporator parch
Two-phase heat remove component.
Background technique
Many known semiconductor devices are for electrical power conversion (such as rectifier and inverter).It is most known whole
Stream device is converted to direct current (DC) for that will exchange (AC), and most known inverter is used to being converted to DC electric current into AC electricity
Stream.Some in these rectifiers and inverter are integrated into for renewable power generating equipment (such as solar electricity generation field and wind-force
Turbine field) in total power transition components (i.e. power converter) in.Typically, it during the operation of power converter, partly leads
Body device generates a large amount of heat.At least some known power converters realize two-phase liquid-cooling system, and two-phase liquid is cold
But system includes the evaporator for extracting heat from semiconductor device, and the condenser for making to dissipate the heat into ambient enviroment.
Two-phase liquid-cooling system is sometimes prone to parch, and wherein all working fluid in evaporator has been converted into steam, and steams
Hair device is no longer accommodated the working fluid of boiling.Cooling system can be caused to shut down in this way, evaporator parches.Cause when to evaporator
When quick thermic load variation, two-phase liquid-cooling system is especially susceptible to parch.
Summary of the invention
In one aspect, a kind of heat removal component being used together with power converter is provided.Heat removes component
Condenser and the evaporator coupled in flow communication with condenser.Evaporator is configured to guide working fluid therebetween.It steams
Hair device includes at least one the expansion shell for supplying shell, receiving shell and extending between supply shell and reception shell.
At least one expansion shell includes the outflux for being limited to the inflow entrance at supply shell and being limited at the reception shell, and
And inflow entrance is sized to be less than outflux on cross sectional dimensions.
On the other hand, a kind of evaporator being used together with hot removal component is provided.Evaporator include supply shell,
At least one the expansion shell for receiving shell and extending between supply shell and reception shell.At least one expansion shell packet
It includes the inflow entrance being limited at supply shell and is limited to the outflux received at shell, and inflow entrance is sized to transversal
Face is smaller in dimension than outflux.
It yet still another aspect, providing a kind of power converter.Power converter includes multiple electronic components, and heat removes
Component, heat remove the evaporator that component includes condenser and couples in flow communication with condenser.Evaporator is configured to
Working fluid is guided therebetween, and is thermally coupled with multiple electronic components.Evaporator includes supply shell, receives shell and supplying
It answers shell and receives at least one the expansion shell extended between shell.At least one expansion shell includes being limited to supply shell
The inflow entrance at place and the outflux being limited at reception shell, and inflow entrance is sized to be less than outflow on cross sectional dimensions
Mouthful.
Detailed description of the invention
When detailed description below is read with reference to the drawings, be better understood with the disclosure these and other feature,
Aspect and advantage spread attached drawing, the same component of same character representation in the accompanying drawings, in which:
Fig. 1 is the schematic diagram of exemplary power generation system；
Fig. 2 is the perspective view of the exemplary evaporator in the power converter for the electricity generation system that can be used for showing in Fig. 1；
Fig. 3 is the cross sectional side view of the evaporator shown in Fig. 2；And
Fig. 4 is the perspective view of the alternative evaporator in the power converter for the electricity generation system that can be used for showing in Fig. 1.
Unless otherwise instructed, otherwise attached drawing provided herein is intended to show the feature of embodiment of the disclosure.These features
It is considered can be applied to including in the broad category of system of one or more other embodiments of the present disclosure.In this way, attached drawing is not intended to
Including practicing all conventional features needed for embodiment disclosed herein known to those skilled in the art.
Specific embodiment
In following description and claims, many terms will be mentioned, they should be defined with following meanings.
Singular " one ", "an" and "the" include a plurality of reference objects, unless otherwise clearly specified in the context.
" optional " or " optionally " mean that the event then described or situation can occur or can not occur, and describes packet
Include event there is a situation where and event not there is a situation where.
As being applicable to modify tolerable variation throughout the approximating language that specification and claims use herein
Any quantificational expression, without the change for the basic function for causing it to be related to.Correspondingly, by such as " about ", " substantially " and " base
In sheet " one or more terms modification value be not limited to specified exact value.In at least some cases, approximating language can
Precision corresponding to the instrument for measuring the value.Herein and specification and claims are spread, scope limitation can combine
And/or it exchanges.Such range is identified, and all subranges including being included in, unless context or language are in addition
Instruction.
Embodiment of the disclosure is related to a kind of two-phase heat removal component, is designed to that limitation evaporator parches.More specifically,
The component includes condenser and the evaporator that couples in flow communication with condenser.Evaporator includes expansion shell, is used
In the heat that reception is transmitted from heat load.In addition, expansion shell includes inflow entrance and outflux, they are for guiding working fluid
It neutralizes to expansion shell from expansion shell and derives.The size of inflow entrance is less than outflux, to quick caused by evaporator
Thermic load step limits working fluid during changing and is flowed back by inflow entrance.For example, quickly increasing to heat caused by evaporator
Load can make all working fluid evaporator in evaporator.It has also been found that evaporation working fluid it is sometimes reflowable, which has limited
Extra work fluid is sucked in evaporator, so that cooling system be caused to shut down.The size of inflow entrance is set to be less than outflux and shape
Help to push the working fluid of evaporation to outflux at the expansion shell with asymmetric design, so that extra work fluid
Expansion shell can be entered.
Fig. 1 is the schematic diagram of exemplary power generation system 100, and electricity generation system 100 includes one or more generator units, such as
The solar array 102 formed by multiple solar panels (not shown)s.Alternatively, electricity generation system 100 includes any suitable number
With the generator unit of type, such as multiple wind turbines, fuel cell, geothermal generator, hydroelectric generator and/or with renewable
And/or non-renewable energy power generation other devices.
In the exemplary embodiment, solar array 102 includes any number of solar panels, helps to make power generation system
System 100 is run with desired power output.In one embodiment, electricity generation system 100 includes multiple solar panels and/or too
Positive energy array 102, they are linked together with the construction of serial-parallel, to help to generate desired electricity from electricity generation system 100
Stream and/or voltage output.Solar panels include electro-optical package, solar thermal collector or convert the solar into any other of electric energy
One or more of device.In the exemplary embodiment, the solar panels of solar array 102 are electro-optical packages, due to
Solar energy is received at solar panels and generates direct current (DC) power.
In the exemplary embodiment, solar array 102 is connected to the power that DC power is converted to exchange (AC) power
Transition components, such as power converter 104.More specifically, power converter 104 includes for DC power to be converted to AC power
One or more electronic components 108.Electronic component 108 includes one or more semiconductor devices, such as DC-AC inverter
(not shown) will be converted into AC power from the received DC power of solar array 102, to be used for transmission distribution network 106.
The amplitude adjusted of the voltage and or current of converted AC power is to be suitable for being made by distribution network 106 by power converter 104
Amplitude, and the AC power under the frequency and phase of the frequency and phase that are substantially equal to distribution network 106 is provided.This
Outside, in the exemplary embodiment, power converter 104 provides three-phase AC power to distribution network 106.Alternatively, power is converted
Device 104 provides the AC power of the phase of single phase AC power or any other number to distribution network 106.
Typically, during the operation of power converter 104, electronic component 108 generates heat.In this way, power converter 104
Component 110 is removed including the heat for making heat dissipate from electronic component 108.In the exemplary embodiment, heat, which removes component 110, is
Two-phase liquid-cooling system comprising evaporator 112 and condenser 114.Evaporator 112 is thermally coupled to electronic component 108, and
Condenser 114 couples with condenser 114 in flow communication, for making to dissipate the heat into example by what electronic component 108 generated
Such as ambient enviroment 116.More specifically, guiding working fluid 118, between evaporator 112 and condenser 114 to be used for from electronics
Component 108 removes heat, as described in greater detail below.
Fig. 2 is the exemplary evaporator in the power converter 104 (being respectively shown in Fig. 1) for can be used for electricity generation system 100
112 perspective view, and Fig. 3 is the cross sectional side view of evaporator 112.In the exemplary embodiment, evaporator 112 includes supply
Shell 120, the expansion shell 124 for receiving shell 122 and extending between supply shell 120 and reception shell 122.Expanding shell
Body 124 includes the outflux 128 for being limited to the inflow entrance 126 at supply shell 120 and being limited at reception shell 122.In addition,
Supplying shell 120 includes first-class opening 130 defined therein, and receiving shell 122 includes defined therein second
Stream opening 132.
In the exemplary embodiment, it supply shell 120 and receives shell 122 and is oriented so that first-class opening 130 and the
It is second-rate opening 132 relative to each other and on the contrary towards.In this way, in one embodiment, multiple evaporators 112 are opened first-class
It is linked together end-to-endly at mouth 130 and second opening 132, to increase the cooling capacity that heat removes component 110.Alternatively
Ground, as described in greater detail below, multiple evaporators 112 are formed integrally as whole structure.In addition, alternative
Embodiment in, supply shell 120 and receive shell 122 in each at least part perpendicular to expansion shell 124 and phase
It instead orients, so that multiple evaporators 112 can self ground vertical stacking.
As described above, working fluid 118 is guided through heat and removes component 110 (being respectively shown in Fig. 1).More
Specifically, working fluid 118 is guided to supply shell from condenser 114 (being shown in Fig. 1) by first-class opening 130
In 120, and supplies shell 120 and supply working fluid 118 to expansion shell 124 by inflow entrance 126.In addition, receiving
The working fluid 118 being discharged by outflux 128 from expansion shell 124 is received in shell 122, and it is logical to receive shell 122
It crosses second opening 132 and working fluid 118 is discharged towards condenser 114.In one embodiment, 124 heat connection of expansion shell
It is connected to heat load 134, the electronic component 108 (being respectively shown in Fig. 1) of such as power converter 104.In this way, from heat load 134
The working fluid 118 that the heat of transmitting helps to make to be guided through expansion shell 124 evaporates, so that heat dissipates from heat load 134.
In the exemplary embodiment, expansion shell 124 has asymmetrical design, and the size for flowing into mouth 126 is less than
Outflux 128.More specifically, expansion shell 124 is designed so that inflow entrance 126 has than the smaller cross section of outflux 128
Area.For example, referring to Fig. 3, expanding shell 124 includes inside 136, dimensionally from inflow entrance 126 towards outflux 128
It is gradually increased (that is, increasing on volume capacity).As described above, from the heat that heat load 134 is transmitted help to make by
The working fluid 118 for being directed through expansion shell 124 evaporates.When being evaporated from liquid condition, the volume of working fluid 118 according to
Perfect gas law and increase.In this way, the size for being gradually increased expansion shell 124 helps to adapt to be guided through expansion shell
The volume of the increase of 124 working fluid 118, so that the working fluid 118 of evaporation is pushed to outflux 128, and limitation passes through
The reflux of inflow entrance 126.In one embodiment, cross section face of the cross-sectional area of inflow entrance 126 relative to outflux 128
Long-pending ratio is less than or equal to about 0.5.
In addition, the inside 136 of expansion shell 124 is limited between the first flat surfaces 138 and the second flat surfaces 140,
First flat surfaces 138 and the second flat surfaces 140 respectively extend between inflow entrance 126 and outflux 128.First flat surfaces
138 and second flat surfaces 140 it is relative to each other and angled with angle, θ.Angle, θ be limited to about 0 degree with about 90 degree it
Between in the range of.Facilitate the first flat surfaces 138 and the second flat surfaces 140 angled from inflow entrance relative to each other
126 towards outflux 128 and be gradually increased inside 136 size.In alternative embodiment, the second flat surfaces 140 have
Stepped design, be used for from inflow entrance 126 towards outflux 128 and with predetermined spacing come increase inside 136 ruler
It is very little.
Fig. 4 is the alternative evaporator 142 in the power converter 104 (being respectively shown in Fig. 1) for can be used for electricity generation system 100
Perspective view.In the exemplary embodiment, evaporator 142 include be parallelly arranged supply shell 120 and receive shell 122 it
Between multiple expansion shells 124.In this way, the cooling capacity of evaporator 142 is greater than evaporator 112 (being shown in Fig. 2).In addition,
Supply shell 120 and receive shell 122 it is multiple expansion shells 124 in it is each between extend.In this way, supply 120 He of shell
It receives shell 122 and serves as manifold, for supplying and receiving from multiple expansions simultaneously during the operation of power converter 104
The working fluid of shell 124.
The example technique effect of system and method described herein includes at least one of lower person: (a) limiting two-phase
Reflux in the evaporator of liquid-cooling system；(b) reduce a possibility that parching in two-phase liquid-cooling system；(c) increase
The heat for merging evaporator described herein removes the performability of component；And (d) reduce the expansion fluid being discharged from evaporator
Stream oscillation.
The hot exemplary embodiment for removing component and associated components has been described in detail above.The system is not limited to retouch herein
The specific embodiment stated, and on the contrary, the step of the component and/or method of system can relative to other components described herein and/
Or step and independently and individually use.For example, the construction of component described herein can be also combined with other processes to use,
And it is not limited to only practice together with power plant as described herein and correlation technique.On the contrary, exemplary embodiment is in combination with expectation
Make heat from many applications of heat load dissipation to implement and use.
Although the specific features of the various embodiments of the disclosure can show in some drawings and not show in other attached drawings
Show, but this is merely for convenience.Any feature of principle according to an embodiment of the present disclosure, attached drawing can be with any other attached drawing
Any feature combination is to quote and/or be claimed.
This written description uses examples to disclose embodiment of the disclosure (including optimal mode), and also makes in this field
Any technical staff being capable of embodiment of the disclosure (including any device or system of manufacture and use, and executing any
Combined method).Embodiment described herein patentable range be defined by the claims, and may include this field
In the other examples expected of technical staff.If such other examples have not different from the literal language of claims
Structural detail, or if they include the equivalent structural elements with the literal language of claims without substantial differences,
Such other examples are intended in the range of claims.
Claims (20)
1. a kind of heat being used together with power converter removes component, the heat removes component and includes:
Condenser；And
The evaporator coupled in flow communication with the condenser, the evaporator are configured to guide workflow therebetween
Body, the evaporator include:
Supply shell；
Receive shell；And
It is described supply shell and it is described receive shell between extend at least one expansion shell, wherein it is described at least one
Expansion shell includes the outflux for being limited to the inflow entrance at the supply shell and being limited at the reception shell, the stream
Entrance is sized to be less than the outflux on cross sectional dimensions.
2. component according to claim 1, which is characterized in that at least one described expansion shell includes inside, described interior
Portion is dimensionally gradually increased from the inflow entrance towards the outflux.
3. component according to claim 1, which is characterized in that at least one described expansion shell has asymmetrical set
Meter, so that the inflow entrance has cross-sectional area more smaller than the outflux.
4. component according to claim 1, which is characterized in that the cross-sectional area of the inflow entrance is relative to the outflow
The ratio of the cross-sectional area of mouth is less than or equal to about 0.5.
5. component according to claim 1, which is characterized in that at least one described expansion shell is configured to be thermally coupled to heat
Load, so that making the working fluid at least portion for being guided through at least one expansion shell from the heat that the heat load is transmitted
Divide ground evaporation.
6. component according to claim 1, which is characterized in that the expansion shell includes by the first flat surfaces and second
The inside that flat surfaces limit, first flat surfaces and second flat surfaces are respectively in the inflow entrance and the outflow
Extend between mouthful, wherein first flat surfaces and second flat surfaces are at an angle of relative to each other.
7. component according to claim 1, which is characterized in that at least one described expansion shell includes being parallelly arranged
The supply shell and the multiple expansion shells received between shell.
8. a kind of evaporator being used together with hot removal component, the evaporator include:
Supply shell；
Receive shell；And
It is described supply shell and it is described receive shell between extend at least one expansion shell, wherein it is described at least one
Expansion shell includes the outflux for being limited to the inflow entrance at the supply shell and being limited at the reception shell, the stream
Entrance is sized to be less than the outflux on cross sectional dimensions.
9. evaporator according to claim 8, which is characterized in that at least one described expansion shell includes inside, described
Inside is dimensionally gradually increased from the inflow entrance towards the outflux.
10. evaporator according to claim 8, which is characterized in that at least one described expansion shell has asymmetrical
Design, so that the inflow entrance has cross-sectional area more smaller than the outflux.
11. evaporator according to claim 8, which is characterized in that the cross-sectional area of the inflow entrance is relative to described
The ratio of the cross-sectional area of outflux is less than or equal to about 0.5.
12. evaporator according to claim 8, which is characterized in that at least one described expansion shell is configured to be thermally coupled
To heat load so that from the heat that the heat load is transmitted make to be guided through the working fluid of at least one expansion shell to
Partially evaporate.
13. evaporator according to claim 8, which is characterized in that the expansion shell include by the first flat surfaces and
The inside that second flat surfaces limit, first flat surfaces and second flat surfaces respectively the inflow entrance with it is described
Extend between outflux, wherein first flat surfaces and second flat surfaces are at an angle of relative to each other.
14. a kind of power converter comprising:
Multiple electronic components；And
Heat removes component comprising:
Condenser；And
The evaporator coupled in flow communication with the condenser, the evaporator are configured to guide workflow therebetween
Body, the evaporator are further thermally coupled with the multiple electronic component, and the evaporator includes:
Supply shell；
Receive shell；And
It is described supply shell and it is described receive shell between extend at least one expansion shell, wherein it is described at least one
Expansion shell includes the outflux for being limited to the inflow entrance at the supply shell and being limited at the reception shell, the stream
Entrance is sized to be less than the outflux on cross sectional dimensions.
15. power converter according to claim 14, which is characterized in that at least one described expansion shell includes interior
Portion, the inside are dimensionally gradually increased from the inflow entrance towards the outflux.
16. power converter according to claim 14, which is characterized in that it is non-right that at least one described expansion shell has
The design of title, so that the inflow entrance has cross-sectional area more smaller than the outflux.
17. power converter according to claim 14, which is characterized in that the cross-sectional area of the inflow entrance relative to
The ratio of the cross-sectional area of the outflux is less than or equal to about 0.5.
18. power converter according to claim 14, which is characterized in that at least one described expanding shell body heat is connected to
The multiple electronic component, so that making to be guided through at least one described expanding shell from the heat that the multiple electronic component transmits
The working fluid of body at least partly evaporates.
19. power converter according to claim 14, which is characterized in that the expansion shell includes by the first flat table
The inside that face and the second flat surfaces limit, first flat surfaces and second flat surfaces respectively the inflow entrance with
Extend between the outflux, wherein first flat surfaces and second flat surfaces are at an angle of relative to each other.
20. power converter according to claim 14, which is characterized in that at least one described expansion shell includes parallel
Ground is arranged in the supply shell and the multiple expansion shells received between shell.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15/231,136 US9894815B1 (en) | 2016-08-08 | 2016-08-08 | Heat removal assembly for use with a power converter |
| US15/231136 | 2016-08-08 | ||
| PCT/US2017/040728 WO2018031147A1 (en) | 2016-08-08 | 2017-07-05 | Heat removal assembly for use with a power converter |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109565946A true CN109565946A (en) | 2019-04-02 |
| CN109565946B CN109565946B (en) | 2020-11-27 |
Family
ID=59523221
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201780047963.9A Active CN109565946B (en) | 2016-08-08 | 2017-07-05 | Heat removal assembly for use with a power converter |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US9894815B1 (en) |
| EP (1) | EP3498063B1 (en) |
| CN (1) | CN109565946B (en) |
| ES (1) | ES2877812T3 (en) |
| WO (1) | WO2018031147A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10104814B2 (en) | 2014-11-03 | 2018-10-16 | General Electric Company | System and method for cooling electrical components of a power converter |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110192574A1 (en) * | 2008-10-29 | 2011-08-11 | Minoru Yoshikawa | Cooling structure, electronic device using same, and cooling method |
| WO2011149216A2 (en) * | 2010-05-24 | 2011-12-01 | 한국과학기술원 | Flat heat spreader and manufacturing method therefor |
| CN103517620A (en) * | 2012-06-20 | 2014-01-15 | Abb技术有限公司 | Two-phase cooling system for electronic components |
| US8879259B2 (en) * | 2010-08-31 | 2014-11-04 | Hitachi, Ltd. | Cooling system for onboard electrical power converter, and electrical power converter for railway vehicle |
| EP2801780A1 (en) * | 2012-01-04 | 2014-11-12 | NEC Corporation | Cooling device and electronic equipment using same |
| US20150257303A1 (en) * | 2011-06-27 | 2015-09-10 | Ebullient, Llc | Method of cooling multiple processors using series-connected heat sinks |
Family Cites Families (63)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6152215A (en) | 1998-12-23 | 2000-11-28 | Sundstrand Corporation | High intensity cooler |
| AU2358800A (en) | 1999-05-18 | 2000-12-05 | 3M Innovative Properties Company | Two-phase heat transfer without de-gassing |
| US6993926B2 (en) | 2001-04-26 | 2006-02-07 | Rini Technologies, Inc. | Method and apparatus for high heat flux heat transfer |
| US6498725B2 (en) | 2001-05-01 | 2002-12-24 | Mainstream Engineering Corporation | Method and two-phase spray cooling apparatus |
| US6536510B2 (en) | 2001-07-10 | 2003-03-25 | Thermal Corp. | Thermal bus for cabinets housing high power electronics equipment |
| US7073567B2 (en) * | 2001-08-14 | 2006-07-11 | Global Cooling Bv | Condenser evaporator and cooling device |
| NO320664B1 (en) | 2001-12-19 | 2006-01-16 | Sinvent As | System for heating and cooling vehicles |
| AU2003216085A1 (en) | 2002-01-22 | 2003-09-02 | Rini Technologies, Inc. | Method and apparatus for high heat flux heat transfer |
| US6772603B2 (en) | 2002-12-20 | 2004-08-10 | Ut-Battelle, Llc | Methods and apparatus for thermal management of vehicle systems and components |
| US7013955B2 (en) | 2003-07-28 | 2006-03-21 | Thermal Corp. | Flexible loop thermosyphon |
| US6993924B2 (en) | 2004-02-12 | 2006-02-07 | Ut-Battelle, Llc | Floating loop system for cooling integrated motors and inverters using hot liquid refrigerant |
| US7958935B2 (en) | 2004-03-31 | 2011-06-14 | Belits Computer Systems, Inc. | Low-profile thermosyphon-based cooling system for computers and other electronic devices |
| DE102004028037B4 (en) * | 2004-06-09 | 2009-04-02 | Airbus Deutschland Gmbh | Evaporator assembly for an air conditioning system of an aircraft |
| US7848624B1 (en) | 2004-10-25 | 2010-12-07 | Alliant Techsystems Inc. | Evaporator for use in a heat transfer system |
| FR2877078B1 (en) | 2004-10-25 | 2007-02-02 | Snecma Moteurs Sa | ENERGY SYSTEM USING STORED NATURAL GAS IN LIQUID FORM AND THERMOELECTRIC MACHINES |
| US7266969B2 (en) | 2005-01-06 | 2007-09-11 | Ut-Batelle, Llc | Refrigerant directly cooled capacitors |
| US7273357B2 (en) | 2005-08-10 | 2007-09-25 | Mitsubishi Heavy Industries, Ltd. | Control device for electric compressor |
| US20070095087A1 (en) | 2005-11-01 | 2007-05-03 | Wilson Michael J | Vapor compression cooling system for cooling electronics |
| EP1863085A3 (en) | 2006-06-01 | 2008-03-05 | Abb Research Ltd. | Two-phase cooling system for cooling power electronic components |
| US20080060371A1 (en) | 2006-09-08 | 2008-03-13 | John David Jude | Compact refrigeration apparatus |
| ATE519360T1 (en) | 2006-12-23 | 2011-08-15 | Abb Research Ltd | FLEXIBLE HEATING CABLE DEVICE |
| US8056615B2 (en) | 2007-01-17 | 2011-11-15 | Hamilton Sundstrand Corporation | Evaporative compact high intensity cooler |
| DE602008002507D1 (en) | 2007-08-27 | 2010-10-28 | Abb Research Ltd | Heat exchanger for power electronics components |
| EP2119993A1 (en) | 2008-05-14 | 2009-11-18 | ABB Research Ltd. | Two-phase cooling circuit |
| US20120087088A1 (en) | 2008-08-05 | 2012-04-12 | Pipeline Micro, Inc. | Microscale heat transfer systems |
| US8258664B2 (en) | 2008-10-03 | 2012-09-04 | Johnson Controls Technology Company | Permanent magnet synchronous motor and drive system |
| DE202009019071U1 (en) | 2009-02-17 | 2016-03-17 | Gudrun Stemke | Evaporator and cooler using such evaporator |
| FR2945337B1 (en) | 2009-05-06 | 2012-05-25 | Commissariat Energie Atomique | THERMAL EXCHANGE DEVICE WITH INCREASED THERMAL EXCHANGE COEFFICIENT AND METHOD OF MAKING SAME |
| WO2010138664A1 (en) | 2009-05-29 | 2010-12-02 | Parker Hannifin Corporation | Pumped loop driven vapor compression cooling system |
| US8976526B2 (en) | 2009-06-30 | 2015-03-10 | Teco-Westinghouse Motor Company | Providing a cooling system for a medium voltage drive system |
| EP2282624B1 (en) | 2009-08-05 | 2012-04-18 | ABB Research Ltd. | Evaporator and cooling circuit |
| EP2284846A1 (en) | 2009-08-13 | 2011-02-16 | ABB Research Ltd. | Dry transformer cooled by means of a compact thermosyphon air to air heat exchanger |
| RU2524058C2 (en) | 2009-09-28 | 2014-07-27 | Абб Рисерч Лтд | Cooling module for cooling of electronic elements |
| WO2011044445A1 (en) | 2009-10-09 | 2011-04-14 | Parker Hannifin Corporation | Two phase cooling pump module |
| DK2543242T3 (en) | 2010-03-03 | 2014-06-10 | Parker Hannificn Corp | Capacitor bypass for two-phase electronic cooling system |
| WO2011159251A1 (en) | 2010-06-18 | 2011-12-22 | Gatekeeper Laboratories Pte Ltd | Thermosyphon for cooling electronic components |
| DE102010042127B4 (en) | 2010-10-07 | 2020-09-17 | Audi Ag | Refrigerant circuit of an air conditioning system of a motor vehicle |
| US9879891B2 (en) | 2011-02-17 | 2018-01-30 | Mahle International Gmbh | Unitary heat pump air conditioner having a compressed vapor diversion loop |
| US20120227429A1 (en) | 2011-03-10 | 2012-09-13 | Timothy Louvar | Cooling system |
| WO2012131709A1 (en) | 2011-03-28 | 2012-10-04 | Praveen Shankar JAMBHOLKAR | Adaptive speed control of compressor motor |
| CN103460828B (en) | 2011-04-04 | 2016-03-23 | 丹佛斯硅动力股份有限公司 | For the cooling system of power model |
| US20120312037A1 (en) | 2011-06-08 | 2012-12-13 | Hamilton Sundstrand Corporation | Vapor cycle system with de-superheater |
| US9807908B2 (en) | 2011-06-30 | 2017-10-31 | Parker-Hannifin Corporation | Pumped liquid cooling system using a phase change fluid with additional subambient cooling |
| WO2013023279A1 (en) | 2011-08-12 | 2013-02-21 | Captherm Systems Inc. | Two-phase heat transfer apparatus |
| EP2568789B1 (en) | 2011-09-06 | 2014-04-16 | ABB Research Ltd. | Heat exchanger |
| AU2012232967B2 (en) | 2011-10-31 | 2015-01-15 | Abb Technology Ag | Cabinet with modules having a thermosiphon cooler arrangement |
| AU2012232968B2 (en) * | 2011-10-31 | 2014-11-13 | Abb Technology Ag | Thermosiphon cooler arrangement in modules with electric and/or electronic components |
| US8711565B2 (en) | 2011-11-02 | 2014-04-29 | General Electric Company | System and method for operating an electric power converter |
| DE102011118873A1 (en) | 2011-11-18 | 2013-05-23 | Airbus Operations Gmbh | Vehicle with a cooling system for cooling and method for cooling in a vehicle |
| US9179575B1 (en) | 2012-03-13 | 2015-11-03 | Rockwell Collins, Inc. | MEMS based device for phase-change autonomous transport of heat (PATH) |
| EP2645040B1 (en) | 2012-03-28 | 2017-06-21 | ABB Research Ltd. | Heat exchanger for traction converters |
| DE102013105747B4 (en) | 2012-07-18 | 2022-06-09 | Hanon Systems | Devices for distributing heat in a motor vehicle |
| EP2703763A1 (en) | 2012-09-03 | 2014-03-05 | ABB Technology AG | Evaporator with integrated pre-heater for power electronics cooling |
| WO2014048680A1 (en) | 2012-09-26 | 2014-04-03 | Abb Technology Ag | Isolating conduit for a dielectric fluid |
| WO2014049805A1 (en) * | 2012-09-28 | 2014-04-03 | 株式会社 日立製作所 | Cooling system and electric device using same |
| EP2734020B1 (en) | 2012-11-19 | 2017-07-12 | ABB Schweiz AG | Cooling arrangement with a two-phase thermosyphon for cooling a multiplicity of electric devices |
| US9835363B2 (en) | 2013-01-14 | 2017-12-05 | Massachusetts Institute Of Technology | Evaporative heat transfer system |
| US20140251585A1 (en) | 2013-03-05 | 2014-09-11 | The Boeing Company | Micro-lattice Cross-flow Heat Exchangers for Aircraft |
| US9363930B2 (en) | 2013-03-11 | 2016-06-07 | Teco-Westinghouse Motor Company | Passive two phase cooling solution for low, medium and high voltage drive systems |
| US9153374B2 (en) | 2013-06-28 | 2015-10-06 | Teco-Westinghouse Motor Company | Cooling arrangements for drive systems |
| JP6549588B2 (en) | 2013-09-16 | 2019-07-24 | フォノニック インコーポレイテッド | Improved heat transfer system for refrigerator and cooling surface |
| US10104814B2 (en) | 2014-11-03 | 2018-10-16 | General Electric Company | System and method for cooling electrical components of a power converter |
| EP3115729B1 (en) * | 2015-07-09 | 2018-12-05 | ABB Schweiz AG | Heat exchanger |
-
2016
- 2016-08-08 US US15/231,136 patent/US9894815B1/en active Active
-
2017
- 2017-07-05 CN CN201780047963.9A patent/CN109565946B/en active Active
- 2017-07-05 EP EP17748964.8A patent/EP3498063B1/en active Active
- 2017-07-05 ES ES17748964T patent/ES2877812T3/en active Active
- 2017-07-05 WO PCT/US2017/040728 patent/WO2018031147A1/en unknown
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110192574A1 (en) * | 2008-10-29 | 2011-08-11 | Minoru Yoshikawa | Cooling structure, electronic device using same, and cooling method |
| WO2011149216A2 (en) * | 2010-05-24 | 2011-12-01 | 한국과학기술원 | Flat heat spreader and manufacturing method therefor |
| US8879259B2 (en) * | 2010-08-31 | 2014-11-04 | Hitachi, Ltd. | Cooling system for onboard electrical power converter, and electrical power converter for railway vehicle |
| US20150257303A1 (en) * | 2011-06-27 | 2015-09-10 | Ebullient, Llc | Method of cooling multiple processors using series-connected heat sinks |
| EP2801780A1 (en) * | 2012-01-04 | 2014-11-12 | NEC Corporation | Cooling device and electronic equipment using same |
| CN103517620A (en) * | 2012-06-20 | 2014-01-15 | Abb技术有限公司 | Two-phase cooling system for electronic components |
Also Published As
| Publication number | Publication date |
|---|---|
| US20180042145A1 (en) | 2018-02-08 |
| US9894815B1 (en) | 2018-02-13 |
| EP3498063B1 (en) | 2021-03-31 |
| EP3498063A1 (en) | 2019-06-19 |
| WO2018031147A1 (en) | 2018-02-15 |
| CN109565946B (en) | 2020-11-27 |
| ES2877812T3 (en) | 2021-11-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| Jones-Jackson et al. | Jet impingement cooling in power electronics for electrified automotive transportation: Current status and future trends | |
| CN103094226B (en) | System and method for operating electric power transducer | |
| US20220053673A1 (en) | Heat dissipation system and an associated method thereof | |
| Mueller et al. | Medium-voltage power converter interface for multigenerator marine energy conversion systems | |
| US10590916B2 (en) | Multisiphon passive cooling system | |
| CN109565946A (en) | The heat being used together with power converter removes component | |
| Reeser et al. | Energy efficient two-phase microcooler design for a concentrated photovoltaic triple junction cell | |
| US20080185031A1 (en) | Focused type solar plate assembly having heat-dissipating module | |
| Tang et al. | Development of a compact and efficient liquid cooling system with silicon microcooler for high-power microelectronic devices | |
| Kribus | Thermal integral micro-generation systems for solar and conventional use | |
| JP2019511894A (en) | Photovoltaic system and method including unevenly cooled solar cells | |
| US20230313782A1 (en) | Multisiphon passive cooling system with liquid bridge | |
| CN210380765U (en) | Solar photovoltaic power generation system | |
| Mosobi et al. | Performance Analysis of Hybrid Solar-Wind-Microhydro System in Islanded Mode | |
| Baudoin et al. | Thermal rating of a submerged substation for wave power | |
| Freiche et al. | A 70 kw next generation three-phase solar inverter with multiple mppts using advanced cooling concept and stacked-pcb architecture | |
| Erdman et al. | 4500 volt Si/SiC hybrid module qualification for modern megawatt scale wind energy inverters | |
| EP3517777A1 (en) | Multisiphon passive cooling system | |
| CN220234242U (en) | Heat abstractor of dc-to-ac converter subassembly | |
| Ačanski et al. | Thermal modeling of the module integrated DC-DC converter for thin-film PV modules | |
| CN206441720U (en) | Radiator | |
| JPH07166815A (en) | Compound generation equipment | |
| Mantellini et al. | Design and Testing of a Modular Back-to-Back Power Electronics Converter for Wave Energy Harvesting | |
| Kim et al. | Application of 10kV IGCT in 5-level ANPC Inverters Employed for 20MW Wind Turbine Systems | |
| Rachmildha et al. | Study on Conversion Losses of Several Converter Topologies Used in Grid Connected Photovoltaic System |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20240318 Address after: American Georgia Patentee after: General Electric Grid Solutions LLC Guo jiahuodiqu after: Mei Guo Address before: New York, United States Patentee before: General Electric Co. Guo jiahuodiqu before: Mei Guo |