CN109560686A - Radiator, the air conditioner of power device - Google Patents
Radiator, the air conditioner of power device Download PDFInfo
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- CN109560686A CN109560686A CN201710868018.7A CN201710868018A CN109560686A CN 109560686 A CN109560686 A CN 109560686A CN 201710868018 A CN201710868018 A CN 201710868018A CN 109560686 A CN109560686 A CN 109560686A
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- chilling plate
- semiconductor chilling
- power device
- radiator
- power
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- 239000004065 semiconductor Substances 0.000 claims abstract description 147
- 235000012149 noodles Nutrition 0.000 claims abstract description 27
- 239000000463 material Substances 0.000 claims description 29
- 238000005070 sampling Methods 0.000 claims description 10
- 239000012774 insulation material Substances 0.000 claims description 8
- 239000002470 thermal conductor Substances 0.000 claims description 5
- 238000003032 molecular docking Methods 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 2
- 210000001367 artery Anatomy 0.000 claims 1
- 210000003462 vein Anatomy 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 abstract description 26
- 238000005057 refrigeration Methods 0.000 abstract description 6
- 238000005516 engineering process Methods 0.000 abstract description 5
- 230000007547 defect Effects 0.000 abstract description 3
- 238000010438 heat treatment Methods 0.000 abstract description 3
- 238000001816 cooling Methods 0.000 description 14
- 239000003507 refrigerant Substances 0.000 description 11
- 238000000034 method Methods 0.000 description 10
- 238000004378 air conditioning Methods 0.000 description 9
- 230000008569 process Effects 0.000 description 9
- 230000000694 effects Effects 0.000 description 7
- 230000008901 benefit Effects 0.000 description 6
- 238000009434 installation Methods 0.000 description 5
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 229910002601 GaN Inorganic materials 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 239000008269 hand cream Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/38—Cooling arrangements using the Peltier effect
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Air Conditioning Control Device (AREA)
Abstract
The invention proposes a kind of radiator of power device for air conditioner and a kind of air conditioners.The radiator of power device includes: semiconductor chilling plate, and the huyashi-chuuka (cold chinese-style noodles) of power device and semiconductor chilling plate contacts with each other；DC power supply is electrically connected with semiconductor chilling plate, for powering to semiconductor chilling plate；Control module, for controlling size of the DC power supply to semiconductor chilling plate input current according to the size of semiconductor chilling plate internal operating current, to control the coldface temperature of semiconductor chilling plate and then control the operating temperature of power device.The radiator of power device of the invention solves air-conditioner controller in appearance structure constraint, it is unable to satisfy the defect of heating device heat dissipation, the semiconductor refrigeration radiating technology of offer, the more preferable heat dissipation problem for solving power device, and without installing temperature-detecting device, under the premise of save the cost, the service life of critical power ratio device ensure that, improve the reliability and running quality of controller.
Description
Technical field
The present invention relates to air conditioner technical fields, radiator, air conditioner in particular to a kind of power device.
Background technique
In air-conditioning electric control system, the utilization of too busy to get away power device and power electronic devices etc., especially becomes
Frequency air-conditioning.As silicon-controlled, rectifier bridge, the IGBT of pfc circuit and fastly restore FRD, compressor variable frequency control IPM module, Yi Jizhi
In the process of running, the transmitting and converting of energy can generate heat, need for flow fan control module these high current high power devices
Consider cooling measure.Whether the heat-removal modalities of air-conditioner control system are good, directly will affect the runnability of core power device,
The reliability of power device determines that air-conditioning uses the quality of quality.Current air-cooled form and refrigerant pipe (water cooling) heat dissipation are in air-conditioning
Middle utilization is the most extensive.Air cooling way produces the features such as easy for installation since its structure is simple, and most of air-conditioning manufacturers are main
Or based on wind-cooling heat dissipating.Wind-cooling heat dissipating has strict requirements, the design of flow direction and radiator shape to air flow direction
Directly affect the effect of heat dissipation.This mode is installed simply, but the heaviness that radiator compares, low efficiency.Refrigerant pipe heat dissipation (belongs to
In water cooling one kind) flowing that relies primarily on air-conditioning refrigerant itself conducts heat, and refrigerant pipe and radiator directly contact, low
The flowing of warm refrigerant can be very good to play heat dissipation effect rapidly.Since the flowing of refrigerant depends on system itself, refrigerant pipe is big
After small determination, refrigerant flowing is difficult to adjust at any time, and another aspect copper pipe production welding quality also will affect the effect of refrigerant pipe heat dissipation
Fruit.With the development trend of miniaturization, compact spatial design makes control panel be in completely enclosed or semi-closed structure, in addition
The diversity of air-conditioning use environment, both cooling measures are subject to certain restrictions.
Therefore, air-conditioner controller how is solved in appearance structure constraint, is unable to satisfy lacking for heating device heat dissipation
Falling into becomes urgent problem to be solved.
Summary of the invention
The present invention is directed to solve at least one of the technical problems existing in the prior art or related technologies.
For this purpose, first aspect of the present invention is to propose a kind of radiator of power device.
The second aspect of the invention is to propose a kind of air conditioner.
In view of this, being used for air-conditioning according to an aspect of the present invention, it proposes a kind of radiator of power device
Device, comprising: the huyashi-chuuka (cold chinese-style noodles) of semiconductor chilling plate, power device and semiconductor chilling plate contacts with each other；DC power supply, with semiconductor system
Cold electrical connection, for powering to semiconductor chilling plate；Control module, for according to semiconductor chilling plate internal operating current
Size controls size of the DC power supply to semiconductor chilling plate input current, to control the coldface temperature of semiconductor chilling plate in turn
Control the operating temperature of power device.
The radiator of power device provided by the invention carries out the power device of air conditioner using with air conditioner
Heat dissipation, including semiconductor chilling plate, semiconductor chilling plate are respectively formed hot face and huyashi-chuuka (cold chinese-style noodles) in two sides when being powered, make power device with
The huyashi-chuuka (cold chinese-style noodles) of semiconductor chilling plate contacts with each other, using rapidity and high efficiency that semiconductor chilling plate freezes, so that power device
Heat dissipation effect it is better；The radiator of the power device further includes DC power supply, DC power supply and semiconductor chilling plate
Electrical connection, for powering to semiconductor chilling plate, realize formed after semiconductor chilling plate is powered huyashi-chuuka (cold chinese-style noodles) with to power device into
Capable heat dissipation；The radiator of the power device further includes control module, and control module is electrically connected with semiconductor chilling plate, is passed through
The electric current of semiconductor chilling plate is controlled to control the temperature of semiconductor chilling plate, and then controls the operating temperature of power device,
Because semiconductor chilling plate belongs to current control device, change the temperature that electric current is changeable semiconductor chilling plate huyashi-chuuka (cold chinese-style noodles), electricity
There are corresponding relationships for stream and temperature, and control simply, and tracing property is good, movement-less part, reliability in semiconductor refrigerating technology
Height, this installs and uses it flexibly, largely gets rid of the heat dissipation of air-cooled and refrigerant pipe by installation space and the limit of position
System, so, control module of the invention directly controls the temperature of power device, nothing according to the operating current of semiconductor chilling plate
The temperature-detecting device for needing installation power device or semiconductor chilling plate realizes under the premise of save the cost, solves air-conditioning
Controller is unable to satisfy the defect of heating device heat dissipation, the semiconductor refrigeration radiating skill provided in appearance structure constraint situation
Art, the more preferable heat dissipation problem for solving power device, ensure that the service life of critical power ratio device, improves the reliable of controller
Property and running quality.
The radiator of above-mentioned power device according to the present invention, can also have following technical characteristic:
In the above-mentioned technical solutions, it is preferable that control module specifically includes switching device, setting DC power supply with partly lead
Between body cooling piece, start and stop from DC power supply to semiconductor chilling plate that power for controlling；Wide cut pulse modulation module is used for root
The duty ratio of the control wave of switching device is sent to according to the big minor adjustment of the operating current inside semiconductor chilling plate, with
The movement for opening or closing switching device according to control wave.
In the technical scheme, the control module in the radiator of power device specifically includes switching device, in direct current
Switching device is additionally provided between power supply and semiconductor chilling plate, when switching device is closed, DC power supply stops to semiconductor
Cooling piece power supply restores power supply of the DC power supply to semiconductor chilling plate when switching device is opened；Wide cut pulse modulation module
It is connect with switching device, the control for being sent to switching device is adjusted according to the size of the operating current of the inside of semiconductor chilling plate
The duty ratio of pulse signal processed, the movement that switching device is opened or closed according to control wave realize pair
The control of semiconductor chilling plate input current size directly controls input semiconductor system with the operating current of semiconductor chilling plate
Cold electric current is thusly-formed a closed loop feedback, and control process is more direct, and control is simpler, and tracing property is more preferable.
In any of the above-described technical solution, it is preferable that current sampling module, current sampling module are used for collecting work electric current
And operating current is sent to wide cut pulse modulation module, so that wide cut pulse modulation module adjusts duty ratio.
In the technical scheme, the radiator of power device further includes current sampling module, the work of semiconductor chilling plate
Make electric current using current sampling module to obtain, without installing temperature-detecting device, on the one hand saves cost, on the other hand,
Without by temperature inversion operating current, input current is controlled further according to operating current, control process is more direct, and control is more
Simply, tracing property is more preferable.
In any of the above-described technical solution, it is preferable that input filter module, input filter module setting DC power supply with
Between switching device, it is filtered for the electric current to input switch device.
In the technical scheme, the radiator of power device further includes input filter module, setting DC power supply with
Between switching device, the electric current of input switch device is filtered, essence is filtered to electric current in control module,
It realizes and the frequency other than specific frequency point or the frequency point is effectively filtered out, so that control process is more accurate.
In any of the above-described technical solution, it is preferable that output filter module, input filter module setting switching device with
Between semiconductor chilling plate, it is filtered for the electric current to output switching device.
In the technical scheme, the radiator of power device further includes output filter module, setting switching device with
Between semiconductor chilling plate, the electric current of output switching device is filtered, essence is to being input to semiconductor chilling plate
Electric current is filtered, and is realized and is filtered out noise, and the electric current for being input to semiconductor chilling plate is the electric current of " pure ".
In any of the above-described technical solution, it is preferable that heat-conducting insulation material, heat-conducting insulation material are filled in semiconductor refrigerating
Between the huyashi-chuuka (cold chinese-style noodles) and power device of piece.
In the technical scheme, in general semiconductor chilling plate and power device be all shape fix, surface it is harder
Solid, even if so the two be close to, can also have certain gap, the temperature that will lead to semiconductor chilling plate huyashi-chuuka (cold chinese-style noodles) cannot
It is utilized well, heat-conducting insulation material, such as thermal grease, a side is filled between the huyashi-chuuka (cold chinese-style noodles) and power device of semiconductor chilling plate
Face reduces the gap between the huyashi-chuuka (cold chinese-style noodles) of semiconductor chilling plate and power device, improves the benefit of semiconductor chilling plate cryogenic temperature
With rate, on the other hand, material itself has thermal diffusivity, thermal conductivity, can also be improved the heat dissipation effect of power device.
In any of the above-described technical solution, it is preferable that semiconductor chilling plate includes: the relatively parallel potsherd of two panels, folder
Hold the p-type semiconductor material and N-type semiconductor material docked between potsherd.
In the technical scheme, semiconductor chilling plate be the relatively parallel potsherd of two panels, be clamped in it is right between potsherd
The p-type semiconductor material and N-type semiconductor material connect, semiconductor material such as silicon carbide (Sic) or gallium nitride (GaN),
The calorific value of body has been very low, special GaN semiconductor, and for conduction voltage drop almost close to zero, the heat of generation is very little, heat dissipation
It is of less demanding, cooling piece radiate the advantages of it is clearly visible.
In any of the above-described technical solution, it is preferable that the p-type semiconductor material and N-type semiconductor material of docking are to connect
The mode of circuit connects.
In the technical scheme, the p-type semiconductor material and N-type semiconductor material connected in a manner of series circuit is logical
When electric, the movement of carrier, which makes N-terminal absorb energy, becomes huyashi-chuuka (cold chinese-style noodles), and the end P releases energy as hot face, realizes and utilize semiconductor refrigerating
Piece huyashi-chuuka (cold chinese-style noodles) radiates to power device.
In any of the above-described technical solution, it is preferable that the hot face of semiconductor chilling plate is hanging or contacts with each other with thermal conductor.
In the technical scheme, it while being radiated using semiconductor chilling plate huyashi-chuuka (cold chinese-style noodles) to power device, is kept according to energy
Perseverance, semiconductor chilling plate another side can generate heat, and the radiating treatment in hot face is it is also contemplated that therefore, the heat of semiconductor chilling plate
Face is hanging as needed or contacts with each other with thermal conductor, for example is mounted on AC gold metal plate part to radiate, so cooling piece
Refrigeration work consumption cannot be very big.
In any of the above-described technical solution, it is preferable that power device includes following one kind: rectifier bridge, insulated gate bipolar are brilliant
Body pipe (IGBT), power diode, compressor control module, fan control module.
In the technical scheme, the type of power device, rectifier bridge, insulated gate bipolar transistor are specifically listed
(IGBT), power diode, compressor control module, fan control module are all the core power device of air conditioner, these devices
The reliability of part all determines that air conditioner uses the quality of quality, and biggish heat can be all generated in air conditioner operational process
Amount, therefore, it is necessary to these power devices into heat dissipation, certainly, however it is not limited to the power device of the above-mentioned air conditioner enumerated.
According to the second aspect of the invention, the present invention provides a kind of air conditioners, including at least one power device with
And the radiator such as the power device in any of the above-described technical solution, for radiating at least one power device.
Air conditioner provided by the invention, the radiator including the power device in any of the above-described technical solution, therefore have
There are whole beneficial effects of the radiator of the power device, details are not described herein.
Additional aspect and advantage of the invention will become obviously in following description section, or practice through the invention
Recognize.
Detailed description of the invention
Above-mentioned and/or additional aspect of the invention and advantage will become from the description of the embodiment in conjunction with the following figures
Obviously and it is readily appreciated that, in which:
Fig. 1 shows the structural schematic block diagram of the radiator of the power device of one embodiment of the present of invention；
Fig. 2 shows the structural representations of semiconductor chilling plate in the radiator of one embodiment of the present of invention power device
Figure；
Fig. 3 shows the schematic block diagram of the air conditioner of one embodiment of the present of invention.
Appended drawing reference:
Wherein, the appended drawing reference in Fig. 2 and the corresponding relationship between component names are as follows:
10 semiconductor chilling plates, 102 first potsherds, 104 second potsherds, 106P type semiconductor material, 108N type half
Conductor material.
Specific embodiment
It is with reference to the accompanying drawing and specific real in order to be more clearly understood that aforementioned aspect of the present invention, feature and advantage
Applying mode, the present invention is further described in detail.It should be noted that in the absence of conflict, the implementation of the application
Feature in example and embodiment can be combined with each other.
In the following description, numerous specific details are set forth in order to facilitate a full understanding of the present invention, still, the present invention may be used also
To be implemented using other than the one described here other modes, therefore, protection scope of the present invention is not limited to following public affairs
The limitation for the specific embodiment opened.
The embodiment of first aspect present invention proposes a kind of radiator of power device, is used for air conditioner, and Fig. 1 shows
The structural schematic block diagram of the radiator of the power device of one embodiment of the present of invention is gone out.Wherein, the heat dissipation of power device
Device includes:
Semiconductor chilling plate 10, power device A and the huyashi-chuuka (cold chinese-style noodles) of semiconductor chilling plate 10 contact with each other；
DC power supply 20, is electrically connected with semiconductor chilling plate, for powering to semiconductor chilling plate；
Control module 30, control module 30 are electrically connected with semiconductor chilling plate 10, for controlling in semiconductor chilling plate 10
The operating current in portion is to control the coldface temperature of semiconductor chilling plate 10 and then control the operating temperature of power device A.
The radiator of power device provided by the invention carries out the power device A of air conditioner using with air conditioner
Heat dissipation, including semiconductor chilling plate 10, semiconductor chilling plate 10 are respectively formed hot face and huyashi-chuuka (cold chinese-style noodles) in two sides when being powered, make power device
Part A and the huyashi-chuuka (cold chinese-style noodles) of semiconductor chilling plate 10 contact with each other, using rapidity and high efficiency that semiconductor chilling plate 10 freezes, so that
The heat dissipation effect of power device A is better；The radiator of power device A further includes DC power supply 20, DC power supply 20
It is electrically connected with semiconductor chilling plate 10, for powering to semiconductor chilling plate 10, realizes and formed after semiconductor chilling plate 10 is powered
Huyashi-chuuka (cold chinese-style noodles) is with the heat dissipation of the progress to power device A；The radiator of the power device further includes control module 30, control module 30
It is electrically connected with semiconductor chilling plate 10, controls the temperature of semiconductor chilling plate 10 by controlling the electric current of semiconductor chilling plate 10
Degree, and then control the operating temperature of power device A, because semiconductor chilling plate belongs to current control device, change electric current
The temperature of i.e. changeable semiconductor chilling plate huyashi-chuuka (cold chinese-style noodles), there are corresponding relationships for electric current and temperature, and control simply, and tracing property is good,
Movement-less part, high reliablity in semiconductor refrigerating technology, this installs and uses it flexibly, largely get rid of it is air-cooled and
Refrigerant pipe heat dissipation is limited by installation space and position, so, control module 30 of the invention is directly according to semiconductor refrigerating
The operating current of piece 10 controls the temperature of power device A, examines without the temperature of installation power device A or semiconductor chilling plate 10
Device is surveyed, is realized under the premise of save the cost, is solved air-conditioner controller in appearance structure constraint situation, be unable to satisfy hair
The defect of thermal device heat dissipation, the semiconductor refrigeration radiating technology provided, the more preferable heat dissipation problem for solving power device ensure that pass
The service life of key power device improves the reliability and running quality of controller.
In one embodiment of the invention, it is preferable that such as Fig. 1, control module 30 is specifically included: switching device 302, if
It sets between DC power supply 20 and semiconductor chilling plate 10, is opened for controlling DC power supply 20 to what semiconductor chilling plate 10 was powered
Stop；Wide cut pulse modulation module 304, for being sent to out according to the big minor adjustment of the operating current inside semiconductor chilling plate 10
The duty ratio for closing the control wave of device 302, so that switching device 302 is opened or closed according to control wave
Movement.
In this embodiment, the control module 30 in the radiator of power device specifically includes switching device 302, power
Device A is additionally provided with switching device 302 between DC power supply 20 and semiconductor chilling plate 10, when switching device 302 is closed,
DC power supply 20 stops powering to semiconductor chilling plate 10, when switching device 302 is opened, restores DC power supply 20 to semiconductor
The power supply of cooling piece 10；Wide cut pulse modulation module 304 is connect with switching device 302, according to the inside of semiconductor chilling plate 10
The size of operating current adjust the duty ratio of the control wave for being sent to switching device 302,302 basis of switching device
Control wave realizes the control to 10 input current size of semiconductor chilling plate come the movement opened or closed
System directly controls the electric current of input semiconductor chilling plate 10 with the operating current of semiconductor chilling plate 10, is thusly-formed one
Closed loop feedback, control process is more direct, and control is simpler, and tracing property is more preferable.
In one embodiment of the invention, it is preferable that such as Fig. 1, current sampling module 40, current sampling module 40 is used for
Operating current is simultaneously sent to wide cut pulse modulation module 304 by collecting work electric current, so that wide cut pulse modulation module 304 is adjusted
Duty ratio.
In this embodiment, the radiator of power device further includes current sampling module 40, semiconductor chilling plate 10
Operating current is obtained using current sampling module 40, without installing temperature-detecting device, on the one hand saves cost, another party
Face controls input current further according to operating current without by temperature inversion operating current, and control process is more direct, control
Simpler, tracing property is more preferable.
In one embodiment of the invention, it is preferable that such as Fig. 1, input filter module 50, input filter module 50 is arranged
Between DC power supply 20 and switching device 302, it is filtered for the electric current to input switch device 302.
In this embodiment, the radiator of power device further includes input filter module 50, is arranged in DC power supply 20
Between switching device 302, the electric current of input switch device 302 is filtered, essence is to electric in control module 30
Stream is filtered, and is realized and is effectively filtered out to the frequency other than specific frequency point or the frequency point, so that control process is more
It is accurate to add.
In one embodiment of the invention, it is preferable that such as Fig. 1, output filter module 60, input filter module 50 is arranged
Between switching device 302 and semiconductor chilling plate 10, it is filtered for the electric current to output switching device 302.
In this embodiment, the radiator of power device further includes output filter module 60, is arranged in switching device 302
Between semiconductor chilling plate 10, the electric current of output switching device 302 is filtered, essence is to the semiconductor system of being input to
Cold 10 electric current is filtered, and is realized and is filtered out noise, and the electric current for being input to semiconductor chilling plate 10 is the electric current of " pure ".
In one embodiment of the invention, it is preferable that heat-conducting insulation material, heat-conducting insulation material are filled in semiconductor system
Between cold 10 huyashi-chuuka (cold chinese-style noodles) and power device A.
In this embodiment, in general semiconductor chilling plate 10 and power device A be all shape fix, surface it is harder
Solid, even if so the two be close to, can also have certain gap, will lead to the temperature of 10 huyashi-chuuka (cold chinese-style noodles) of semiconductor chilling plate not
It can be utilized well, fill heat-conducting insulation material between the huyashi-chuuka (cold chinese-style noodles) and power device A of semiconductor chilling plate 10, such as radiate
On the one hand cream reduces the gap between the huyashi-chuuka (cold chinese-style noodles) of semiconductor chilling plate 10 and power device A, improve semiconductor chilling plate 10
The utilization rate of cryogenic temperature, on the other hand, material itself has thermal diffusivity, thermal conductivity, can also be improved power device A's
Heat dissipation effect.
In one embodiment of the invention, it is preferable that such as Fig. 2, semiconductor chilling plate 10 includes: relatively parallel first
Potsherd 102 and the second potsherd 104 are clamped in the p-type docked between the first potsherd 102 and the second potsherd 104 and partly lead
Body material 106 and N-type semiconductor material 108.
In this embodiment, semiconductor chilling plate 10 is relatively parallel the first potsherd 102 and the second potsherd of two panels
104, it is clamped in the p-type semiconductor material 106 docked between the first potsherd 102 and the second potsherd 104 and N-type semiconductor material
Material 108, semiconductor material such as silicon carbide (Sic) or gallium nitride (GaN), the calorific value of itself have been very low, special GaN
The advantages of semiconductor, conduction voltage drop is almost close to zero, and the heat of generation is very little, and cooling requirements are not high, and cooling piece radiates is bright
Show visible.
In one embodiment of the invention, it is preferable that the p-type semiconductor material and N-type semiconductor material of docking are to go here and there
The mode of connection circuit connects.
In this embodiment, the p-type semiconductor material and N-type semiconductor material connected in a manner of series circuit is being powered
When, the movement of carrier, which makes N-terminal absorb energy, becomes huyashi-chuuka (cold chinese-style noodles), and the end P releases energy as hot face, realizes and utilize semiconductor chilling plate
10 huyashi-chuuka (cold chinese-style noodles) radiate to power device A.
In one embodiment of the invention, it is preferable that the hot face of semiconductor chilling plate 10 is hanging or mutual with thermal conductor
Contact.
In this embodiment, it while being radiated using 10 huyashi-chuuka (cold chinese-style noodles) of semiconductor chilling plate to power device A, is kept according to energy
Perseverance, 10 another side of semiconductor chilling plate can generate heat, and the radiating treatment in hot face is it is also contemplated that therefore, semiconductor chilling plate 10
Hot face it is hanging as needed or contact with each other with thermal conductor, for example AC gold metal plate part is mounted on to radiate, so refrigeration
The refrigeration work consumption of piece cannot be very big.
In one embodiment of the invention, it is preferable that power device A includes following one kind: rectifier bridge, insulated gate bipolar
Transistor (IGBT), power diode, compressor control module, fan control module.
In this embodiment, specifically list the type of power device A, rectifier bridge, insulated gate bipolar transistor (IGBT),
Power diode, compressor control module, fan control module are all the core power device A of air conditioner, these devices can
It all determines that air conditioner uses the quality of quality by property, and can all generate biggish heat in air conditioner operational process, therefore,
It needs to these power devices into heat dissipation, certainly, however it is not limited to the power device of the above-mentioned air conditioner enumerated.
The embodiment of second aspect of the present invention proposes a kind of air conditioner 300, as shown in figure 3, include power device A and
The radiator 302 of power device in such as above-mentioned any embodiment, for radiating to power device A.
Air conditioner 300 provided by the invention, the radiator 302 including the power device in any of the above-described embodiment, because
This has whole beneficial effects of the radiator 302 of the power device, and details are not described herein.
In the description of this specification, the description of term " one embodiment ", " some embodiments ", " specific embodiment " etc.
Mean that particular features, structures, materials, or characteristics described in conjunction with this embodiment or example are contained at least one reality of the invention
It applies in example or example.In the present specification, schematic expression of the above terms are not necessarily referring to identical embodiment or reality
Example.Moreover, description particular features, structures, materials, or characteristics can in any one or more of the embodiments or examples with
Suitable mode combines.
The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention, for the skill of this field
For art personnel, the invention may be variously modified and varied.All within the spirits and principles of the present invention, made any to repair
Change, equivalent replacement, improvement etc., should all be included in the protection scope of the present invention.
Claims (11)
1. a kind of radiator of power device is used for air conditioner characterized by comprising
The huyashi-chuuka (cold chinese-style noodles) of semiconductor chilling plate, the power device and the semiconductor chilling plate contacts with each other；
DC power supply is electrically connected with the semiconductor chilling plate, for powering to the semiconductor chilling plate；
Control module, the size for the internal operating current according to the semiconductor chilling plate control the DC power supply to institute
The size of semiconductor chilling plate input current is stated, to control the coldface temperature of the semiconductor chilling plate and then control the power
The operating temperature of device.
2. the radiator of power device according to claim 1, which is characterized in that
The control module specifically includes:
Switching device, be arranged between the DC power supply and the semiconductor chilling plate, for control the DC power supply to
The start and stop of the semiconductor chilling plate power supply；
Wide cut pulse modulation module is sent to the control arteries and veins of the switching device for the big minor adjustment according to the operating current
The duty ratio of signal is rushed, so that the movement that the switching device is opened or closed according to the control wave.
3. the radiator of power device according to claim 2, which is characterized in that further include:
Current sampling module, the current sampling module is for acquiring the operating current and the operating current being sent to institute
Wide cut pulse modulation module is stated, so that the wide cut pulse modulation module adjusts the duty ratio.
4. the radiator of power device according to claim 2, which is characterized in that further include:
Input filter module, the input filter module are arranged between the DC power supply and the switching device, for pair
The electric current for inputting the switching device is filtered.
5. the radiator of power device according to claim 2, which is characterized in that further include:
Output filter module, the input filter module are arranged between the switching device and the semiconductor chilling plate, use
It is filtered in the electric current for exporting the switching device.
6. the radiator of power device according to claim 1, which is characterized in that further include:
Heat-conducting insulation material, the heat-conducting insulation material be filled in the semiconductor chilling plate huyashi-chuuka (cold chinese-style noodles) and the power device it
Between.
7. the radiator of power device according to claim 1, which is characterized in that
The semiconductor chilling plate includes: the relatively parallel potsherd of two panels, is clamped in the p-type half docked between the potsherd
Conductor material and N-type semiconductor material.
8. the radiator of power device according to claim 7, which is characterized in that
The p-type semiconductor material of the docking is connected in a manner of series circuit with N-type semiconductor material.
9. the radiator of power device according to claim 1, which is characterized in that
The hot face of the semiconductor chilling plate is hanging or contacts with each other with thermal conductor.
10. the radiator of power device according to any one of claim 1 to 9, which is characterized in that
The power device includes following one kind: rectifier bridge, insulated gate bipolar transistor (IGBT), power diode, compressor
Control module, fan control module.
11. a kind of air conditioner characterized by comprising
At least one power device；And
The radiator of power device as described in any one of claims 1 to 10, for at least one described power device
Part radiates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710868018.7A CN109560686A (en) | 2017-09-22 | 2017-09-22 | Radiator, the air conditioner of power device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710868018.7A CN109560686A (en) | 2017-09-22 | 2017-09-22 | Radiator, the air conditioner of power device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109560686A true CN109560686A (en) | 2019-04-02 |
Family
ID=65861769
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710868018.7A Pending CN109560686A (en) | 2017-09-22 | 2017-09-22 | Radiator, the air conditioner of power device |
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| Country | Link |
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| CN (1) | CN109560686A (en) |
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| CN112285452A (en) * | 2020-09-10 | 2021-01-29 | 河北工业大学 | Device and method for measuring low-temperature characteristics of electrical parameters |
| CN113412037A (en) * | 2021-07-20 | 2021-09-17 | 曾健明 | Semiconductor heat dissipation device and method for mobile terminal electronic product |
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| CN113412037A (en) * | 2021-07-20 | 2021-09-17 | 曾健明 | Semiconductor heat dissipation device and method for mobile terminal electronic product |
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