CN109556445A - Heat transfer control device and method - Google Patents

Heat transfer control device and method Download PDF

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Publication number
CN109556445A
CN109556445A CN201811440193.7A CN201811440193A CN109556445A CN 109556445 A CN109556445 A CN 109556445A CN 201811440193 A CN201811440193 A CN 201811440193A CN 109556445 A CN109556445 A CN 109556445A
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CN
China
Prior art keywords
heat transfer
temperature
control
condensing
heat exchanger
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Pending
Application number
CN201811440193.7A
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Chinese (zh)
Inventor
雷威
夏卫华
张蕾
姚勇泉
盛化才
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Shanghai Zhixin Energy Saving Environmental Protection Co Ltd
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Shanghai Zhixin Energy Saving Environmental Protection Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Shanghai Zhixin Energy Saving Environmental Protection Co Ltd filed Critical Shanghai Zhixin Energy Saving Environmental Protection Co Ltd
Priority to CN201811440193.7A priority Critical patent/CN109556445A/en
Publication of CN109556445A publication Critical patent/CN109556445A/en
Pending legal-status Critical Current

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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F13/04Arrangements for modifying heat-transfer, e.g. increasing, decreasing by preventing the formation of continuous films of condensate on heat-exchange surfaces, e.g. by promoting droplet formation
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F27/00Control arrangements or safety devices specially adapted for heat-exchange or heat-transfer apparatus

Abstract

The present invention provides a kind of heat transfer control device and methods, are related to enhanced heat exchange technical field, which includes condensing heat exchanger, the control computer and signal generator being connected with condensing heat exchanger;Wherein, the centre of condensing heat exchanger is provided with hydrophobic substrate;Computer is controlled, the heat transfer parameter for acquiring condensing heat exchanger inlet and outlet is calculated, and the temperature control instruction based on heat transfer coefficient is obtained;Signal generator is connected, for according to the temperature control instruction output electric pulse signal based on heat transfer coefficient with control computer;Hydrophobic substrate, for generating the thermal energy of control droplet detachment using electric impulse signal.The control that falls off to condensing droplet may be implemented in the present invention, and then controls dropwise condensation heat transfer coefficient, to improve the heat transfer property of condensation heat transfer device.

Description

Heat transfer control device and method
Technical field
The present invention relates to enhanced heat exchange technical fields, more particularly, to a kind of heat transfer control device and method.
Background technique
The study found that super hydrophobic surface no longer has super-hydrophobicity in condensing condition.To lotus under the conditions of water recovery Leaf surface water droplet imbibition characteristic is studied, it is believed that whether lotus leaf surface can be presented super-hydrophobicity dependent on water droplet in super-hydrophobic table The generation type in face.Even if condensing drip can be still sticked on super hydrophobic surface when even vertical when inclination angle is more than 70 °, when For drop in a manner of steam condensation in lotus leaf surface formation, the fine droplet for the micro/nano level being initially formed can penetrate into micro-structure In, the extremely strong water droplet of viscosity is formed, super hydrophobic surface shows extremely strong hydrophily, i.e. very big contact angle hysteresis;In other words, Even super hydrophobic surface, condenses the drop of formation also and do not have hydrophobicity, drop is difficult to fall off from surface.It is how quickly extensive Multiple superhydrophobic surface behavior, the drop for keeping the extremely strong drop fast transition adhesiveness of viscosity faint, becomes the weight of industry research Want problem.
Summary of the invention
In view of this, may be implemented de- to condensing droplet the purpose of the present invention is to provide heat transfer control device and method Control is fallen, and then controls dropwise condensation heat transfer coefficient, to improve the heat transfer property of condensation heat transfer device.
In a first aspect, the embodiment of the invention provides a kind of heat transfer control devices, wherein including condensing heat exchanger, with institute State the control computer and signal generator that condensing heat exchanger is connected;Wherein, the centre of the condensing heat exchanger is provided with thin Water base plate;
The control computer, the heat transfer parameter for acquiring the condensing heat exchanger inlet and outlet are calculated, Obtain the temperature control instruction based on heat transfer coefficient;
The signal generator is connected with the control computer, for according to the temperature control based on heat transfer coefficient System instruction output electric pulse signal;
The hydrophobic substrate, for generating the thermal energy of control droplet detachment using the electric impulse signal.
With reference to first aspect, the embodiment of the invention provides the first possible embodiments of first aspect, wherein
The upper end of the condensing heat exchanger is provided with steam inlet, and lower end is provided with condensation water out, and left side upper end is provided with cooling Water inlet, left side lower end are provided with cooling water outlet.
With reference to first aspect, the embodiment of the invention provides second of possible embodiments of first aspect, wherein
It is respectively mounted at the steam inlet, the condensation water out, the cooling water inlet and the cooling water outlet There are temperature-detecting device and flow detector.
With reference to first aspect, the embodiment of the invention provides the third possible embodiments of first aspect, wherein
The temperature-detecting device and the flow detector pass through flow temperature feedback line and the control calculates Machine is connected.
With reference to first aspect, the embodiment of the invention provides the 4th kind of possible embodiments of first aspect, wherein
The hydrophobic substrate includes the tube sheet that multiple groups are discharged side by side, and multiple thermal resistances, institute have been alternatively arranged on the tube sheet It states thermal resistance surface and is connected with temperature sensor.
With reference to first aspect, the embodiment of the invention provides the 5th kind of possible embodiments of first aspect, wherein
The thermal resistance adjusts bus by temperature and is connected with the signal generator, and the temperature sensor passes through temperature Degree feedback bus is connected with the control computer.
With reference to first aspect, the embodiment of the invention provides the 6th kind of possible embodiments of first aspect, wherein
The temperature sensor is used to acquire the real time temperature of the thermal resistance, and the real time temperature is fed back to described Computer is controlled, so that the control computer generates temperature adjustment instructions according to the real time temperature.
With reference to first aspect, the embodiment of the invention provides the 7th kind of possible embodiments of first aspect, wherein
The surface of the hydrophobic substrate is micro- square column structure.
Second aspect, the embodiment of the present invention also provide a kind of heat transfer control method, are applied to control of conducting heat described in the next item up Device, wherein the described method includes:
The heat transfer parameter of condensing heat exchanger inlet and outlet is calculated by controlling computer, is obtained based on heat transfer The temperature control instruction of coefficient;
By signal generator according to the temperature control instruction output electric pulse signal based on heat transfer coefficient;
The thermal energy of control droplet detachment is generated using the electric impulse signal by hydrophobic substrate.
In conjunction with second aspect, the embodiment of the invention provides the first possible embodiments of second aspect, wherein institute Stating hydrophobic substrate includes thermal resistance, the method also includes:
The real time temperature of the thermal resistance is acquired, and the real time temperature is calculated by the control computer, Obtain temperature adjustment instructions.
The embodiment of the present invention bring it is following the utility model has the advantages that
A kind of heat transfer control device and method provided by the invention, which includes condensing heat exchanger, with condensing heat exchanger The control computer and signal generator being connected;Wherein, the centre of condensing heat exchanger is provided with hydrophobic substrate;Control calculates Machine, the heat transfer parameter for acquiring condensing heat exchanger inlet and outlet are calculated, and the temperature control based on heat transfer coefficient is obtained System instruction;Signal generator is connected with control computer, for exporting electric arteries and veins according to the temperature control instruction based on heat transfer coefficient Rush signal;Hydrophobic substrate, for generating the thermal energy of control droplet detachment using electric impulse signal.The present invention may be implemented to condensation Droplet detachment control, and then dropwise condensation heat transfer coefficient is controlled, to improve the heat transfer property of condensation heat transfer device.
Other features and advantages of the present invention will illustrate in the following description, also, partly become from specification It obtains it is clear that understand through the implementation of the invention.The objectives and other advantages of the invention are in specification, claims And specifically noted structure is achieved and obtained in attached drawing.
To enable the above objects, features and advantages of the present invention to be clearer and more comprehensible, preferred embodiment is cited below particularly, and cooperate Appended attached drawing, is described in detail below.
Detailed description of the invention
It, below will be to specific in order to illustrate more clearly of the specific embodiment of the invention or technical solution in the prior art Embodiment or attached drawing needed to be used in the description of the prior art be briefly described, it should be apparent that, it is described below Attached drawing is some embodiments of the present invention, for those of ordinary skill in the art, before not making the creative labor It puts, is also possible to obtain other drawings based on these drawings.
Fig. 1 is heat transfer control device schematic diagram provided in an embodiment of the present invention;
Fig. 2 is micro- square column surface texture figure provided in an embodiment of the present invention;
Fig. 3 is heat transfer control method flow chart provided in an embodiment of the present invention.
Icon:
101- condensing heat exchanger;102- controls computer;103- signal generator;104- hydrophobic substrate;105- steam into Mouthful;106- condenses water out;107- cooling water inlet;108- cooling water outlet;109- temperature-detecting device;110- flow detection Device;111- flow temperature feedback line;112- tube sheet;113- thermal resistance;114- temperature sensor;115- temperature adjusts bus; 116- temperature feedback bus.
Specific embodiment
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with attached drawing to the present invention Technical solution be clearly and completely described, it is clear that described embodiments are some of the embodiments of the present invention, rather than Whole embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art are not making creative work premise Under every other embodiment obtained, shall fall within the protection scope of the present invention.
It has now been found that super hydrophobic surface no longer has super-hydrophobicity in condensing condition.To water recovery condition Lower lotus leaf surface water droplet imbibition characteristic is studied, it is believed that whether lotus leaf surface can be presented super-hydrophobicity dependent on water droplet super thin The generation type of water surface.Even if condensing drip can still be sticked to super hydrophobic surface when even vertical when inclination angle is more than 70 ° On, when drop in a manner of steam condensation lotus leaf surface formation when, the fine droplet for the micro/nano level being initially formed can penetrate into micro- In structure, the extremely strong water droplet of viscosity is formed, super hydrophobic surface shows extremely strong hydrophily, i.e. very big contact angle hysteresis;It changes Yan Zhi condenses the drop of formation also and does not have hydrophobicity, drop is difficult to fall off from surface even super hydrophobic surface.How Fast quick-recovery superhydrophobic surface behavior, the drop for keeping the extremely strong drop fast transition adhesiveness of viscosity faint, becomes industry and grinds The major issue studied carefully.
Based on this, a kind of heat transfer control device and method provided in an embodiment of the present invention be may be implemented de- to condensing droplet Control is fallen, and then controls dropwise condensation heat transfer coefficient, to improve the heat transfer property of condensation heat transfer device.
For convenient for understanding the present embodiment, first to a kind of heat transfer control device disclosed in the embodiment of the present invention into Row is discussed in detail,
Embodiment one:
Fig. 1 is the heat transfer control device that the embodiment of the present invention one provides.
Referring to Fig.1, heat transfer control device mainly includes the following contents:
Condensing heat exchanger 101, the control computer 102 and signal generator 103 being connected with condensing heat exchanger;Wherein, The centre of condensing heat exchanger 101 is provided with hydrophobic substrate 104;Control computer 102 for acquire 101 import of condensing heat exchanger and The heat transfer parameter in exit is calculated, and the temperature control instruction based on heat transfer coefficient is obtained;Signal generator 103 and control are counted Calculation machine 102 is connected, for according to the temperature control instruction output electric pulse signal based on heat transfer coefficient;Hydrophobic substrate 104, is used for The thermal energy of control droplet detachment is generated using electric impulse signal.
Further, the upper end of condensing heat exchanger 101 is provided with steam inlet 105, and lower end is provided with condensation water out 106, left Side upper end is provided with cooling water inlet 107, and left side lower end is provided with cooling water outlet 108;In steam inlet 105, condensation water out 106, temperature-detecting device 109 and flow detector 110 are mounted at cooling water inlet 107 and cooling water outlet 108;Temperature Degree detection device 109 and flow detector 110 are connected by flow temperature feedback line 111 with control computer 102;It dredges Water base plate 104 includes the tube sheet 112 that multiple groups are discharged side by side, has been alternatively arranged multiple thermal resistances 113, thermal resistance 113 on tube sheet 112 Surface is connected with temperature sensor 114;Thermal resistance 113 adjusts bus 115 by temperature and is connected with signal generator 103, temperature Degree sensor 114 is connected by temperature feedback bus 116 with control computer 102;Temperature sensor 114 is for acquiring thermoelectricity The real time temperature of resistance 113, and real time temperature is fed back into control computer 102, so that control computer 102 is according to real time temperature Generate temperature adjustment instructions.
Specifically, the heat transfer parameter of 101 inlet and outlet of condensing heat exchanger is the temperature provided by temperature-detecting device 109 The flow value composition that angle value and flow detector 110 provide, temperature-detecting device 109 can be thermometer, flow detection Device 110 can be flowmeter, and control computer 102 calculates heat transfer parameter, obtain the temperature control based on heat transfer coefficient System, which instructs and is sent to signal generator 103 and sends electric impulse signal based on this instruction, adjusts bus marco thermoelectricity by temperature 113 surface temperatures are hindered, and then achieve the purpose that control droplet detachment;At the same time, control computer 102 can also be anti-by temperature The 113 surface real time temperature of thermal resistance that bus 116 is fed back is presented to generate temperature adjustment instructions, so that signal generator 103 is sent Matched electric impulse signal enables thermal resistance 113 generate the heat of control droplet detachment using the electric impulse signal after adjusting in turn Energy.
It is found through experiments that, when hydrophobic substrate 104 is heated to 210 °, the condensing droplet on 104 surface of hydrophobic substrate will The faint state of adhesiveness can be completely transformed by the extremely strong state of adhesiveness, fallen off conducive to condensing droplet, realize droplet detachment Control.
Further, referring to Fig. 2, the surface of hydrophobic substrate 104 is micro- square column structure.Micro- square column structure surface has super thin It is aqueous, it falls off conducive to condensing droplet.
Embodiment two:
Fig. 3 is heat transfer control method flow chart provided by Embodiment 2 of the present invention.
The present embodiment additionally provides a kind of heat transfer control method, is applied to heat transfer control dress provided by above-described embodiment It sets.Referring to Fig. 3, heat transfer control method mainly includes the following contents:
Step S101: the heat transfer parameter of condensing heat exchanger inlet and outlet is calculated by controlling computer, is obtained To the temperature control instruction based on heat transfer coefficient;
Step S102: by signal generator according to the temperature control instruction output electric pulse signal based on heat transfer coefficient;
Step S103: the thermal energy of control droplet detachment is generated using electric impulse signal by hydrophobic substrate.
Further, hydrophobic substrate includes thermal resistance, method further include: acquires the real time temperature of thermal resistance, and passes through control Computer processed calculates real time temperature, obtains temperature adjustment instructions.
The technical effect and aforementioned device embodiment phase of method provided by the embodiment of the present invention, realization principle and generation Together, to briefly describe, embodiment of the method part does not refer to place, can refer to corresponding contents in aforementioned device embodiment.
The embodiment of the present invention bring it is following the utility model has the advantages that
Heat transfer control device and method provided by the invention, the device include condensing heat exchanger, are connected with condensing heat exchanger The control computer and signal generator connect;Wherein, the centre of condensing heat exchanger is provided with hydrophobic substrate;Computer is controlled, is used It is calculated in the heat transfer parameter of acquisition condensing heat exchanger inlet and outlet, obtains the temperature control based on heat transfer coefficient and refer to It enables;Signal generator is connected with control computer, for according to the temperature control instruction output electric pulse letter based on heat transfer coefficient Number;Hydrophobic substrate, for generating the thermal energy of control droplet detachment using electric impulse signal.The present invention may be implemented to condensing droplet Fall off control, and then controls dropwise condensation heat transfer coefficient, to improve the heat transfer property of condensation heat transfer device.
The embodiment of the present invention also provides a kind of computer readable storage medium, and meter is stored on computer readable storage medium Calculation machine program, the step of heat transfer control method of above-described embodiment is executed when computer program is run by processor.
In the description of the embodiment of the present invention unless specifically defined or limited otherwise, term " installation ", " connects " connected " Connect " it shall be understood in a broad sense, for example, it may be being fixedly connected, it may be a detachable connection, or be integrally connected;It can be machine Tool connection, is also possible to be electrically connected;It can be directly connected, two members can also be can be indirectly connected through an intermediary Connection inside part.For the ordinary skill in the art, above-mentioned term can be understood in the present invention with concrete condition Concrete meaning.
In the description of the present invention, it should be noted that term " center ", "upper", "lower", "left", "right", "vertical", The orientation or positional relationship of the instructions such as "horizontal", "inner", "outside" be based on the orientation or positional relationship shown in the drawings, merely to Convenient for description the present invention and simplify description, rather than the device or element of indication or suggestion meaning must have a particular orientation, It is constructed and operated in a specific orientation, therefore is not considered as limiting the invention.In addition, term " first ", " second ", " third " is used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance.
The flow chart and block diagram in the drawings show the system of multiple embodiments according to the present invention, method and computer journeys The architecture, function and operation in the cards of sequence product.In this regard, each box in flowchart or block diagram can generation A part of one module, section or code of table, a part of the module, section or code include one or more use The executable instruction of the logic function as defined in realizing.It should also be noted that in some implementations as replacements, being marked in box The function of note can also occur in a different order than that indicated in the drawings.For example, two continuous boxes can actually base Originally it is performed in parallel, they can also be executed in the opposite order sometimes, and this depends on the function involved.It is also noted that It is the combination of each box in block diagram and or flow chart and the box in block diagram and or flow chart, can uses and execute rule The dedicated hardware based system of fixed function or movement is realized, or can use the group of specialized hardware and computer instruction It closes to realize.
It is apparent to those skilled in the art that for convenience and simplicity of description, the device of foregoing description It with the specific work process of method, can refer to corresponding processes in the foregoing method embodiment, details are not described herein.
In several embodiments provided herein, it should be understood that disclosed systems, devices and methods, it can be with It realizes by another way.The apparatus embodiments described above are merely exemplary, for example, the division of the unit, Only a kind of logical function partition, there may be another division manner in actual implementation, in another example, multiple units or components can To combine or be desirably integrated into another system, or some features can be ignored or not executed.Another point, it is shown or beg for The mutual coupling, direct-coupling or communication connection of opinion can be through some communication interfaces, device or unit it is indirect Coupling or communication connection can be electrical property, mechanical or other forms.
The unit as illustrated by the separation member may or may not be physically separated, aobvious as unit The component shown may or may not be physical unit, it can and it is in one place, or may be distributed over multiple In network unit.It can select some or all of unit therein according to the actual needs to realize the mesh of this embodiment scheme 's.
It, can also be in addition, the functional units in various embodiments of the present invention may be integrated into one processing unit It is that each unit physically exists alone, can also be integrated in one unit with two or more units.
It, can be with if the function is realized in the form of SFU software functional unit and when sold or used as an independent product It is stored in the executable non-volatile computer-readable storage medium of a processor.Based on this understanding, of the invention Technical solution substantially the part of the part that contributes to existing technology or the technical solution can be with software in other words The form of product embodies, which is stored in a storage medium, including some instructions use so that One computer equipment (can be personal computer, server or the network equipment etc.) executes each embodiment institute of the present invention State all or part of the steps of method.And storage medium above-mentioned includes: USB flash disk, mobile hard disk, read-only memory (ROM, Read- Only Memory), random access memory (RAM, Random Access Memory), magnetic or disk etc. are various can be with Store the medium of program code.
Finally, it should be noted that embodiment described above, only a specific embodiment of the invention, to illustrate the present invention Technical solution, rather than its limitations, scope of protection of the present invention is not limited thereto, although with reference to the foregoing embodiments to this hair It is bright to be described in detail, those skilled in the art should understand that: anyone skilled in the art In the technical scope disclosed by the present invention, it can still modify to technical solution documented by previous embodiment or can be light It is readily conceivable that variation or equivalent replacement of some of the technical features;And these modifications, variation or replacement, do not make The essence of corresponding technical solution is detached from the spirit and scope of technical solution of the embodiment of the present invention, should all cover in protection of the invention Within the scope of.Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims (10)

1. a kind of heat transfer control device, which is characterized in that including condensing heat exchanger, the control being connected with the condensing heat exchanger Computer and signal generator;Wherein, the centre of the condensing heat exchanger is provided with hydrophobic substrate;
The control computer, the heat transfer parameter for acquiring the condensing heat exchanger inlet and outlet are calculated, are obtained Temperature control instruction based on heat transfer coefficient;
The signal generator is connected with the control computer, for being referred to according to the temperature control based on heat transfer coefficient Enable output electric pulse signal;
The hydrophobic substrate, for generating the thermal energy of control droplet detachment using the electric impulse signal.
2. heat transfer control device according to claim 1, which is characterized in that
The upper end of the condensing heat exchanger is provided with steam inlet, and lower end is provided with condensation water out, left side upper end be provided with cooling water into Mouthful, left side lower end is provided with cooling water outlet.
3. heat transfer control device according to claim 2, which is characterized in that
Temperature is mounted at the steam inlet, the condensation water out, the cooling water inlet and the cooling water outlet Spend detection device and flow detector.
4. heat transfer control device according to claim 3, which is characterized in that
The temperature-detecting device and the flow detector pass through flow temperature feedback line and the control computer phase Connection.
5. heat transfer control device according to claim 1, which is characterized in that
The hydrophobic substrate includes the tube sheet that multiple groups are discharged side by side, and multiple thermal resistances, the heat have been alternatively arranged on the tube sheet Resistive surface is connected with temperature sensor.
6. heat transfer control device according to claim 5, which is characterized in that the thermal resistance by temperature adjust bus with The signal generator is connected, and the temperature sensor is connected by temperature feedback bus with the control computer.
7. heat transfer control device according to claim 6, which is characterized in that the temperature sensor is for acquiring the heat The real time temperature of resistance, and the real time temperature is fed back into the control computer, so that the control computer is according to institute It states real time temperature and generates temperature adjustment instructions.
8. heat transfer control device according to claim 1, which is characterized in that the surface of the hydrophobic substrate is micro- square column knot Structure.
9. a kind of heat transfer control method, applied to the control device that conducts heat as described in claim any one of 1-8, which is characterized in that The described method includes:
The heat transfer parameter of condensing heat exchanger inlet and outlet is calculated by controlling computer, is obtained based on heat transfer coefficient Temperature control instruction;
By signal generator according to the temperature control instruction output electric pulse signal based on heat transfer coefficient;
The thermal energy of control droplet detachment is generated using the electric impulse signal by hydrophobic substrate.
10. heat transfer control method according to claim 9, which is characterized in that the hydrophobic substrate includes thermal resistance, described Method further include:
The real time temperature of the thermal resistance is acquired, and the real time temperature is calculated by the control computer, is obtained Temperature adjustment instructions.
CN201811440193.7A 2018-11-28 2018-11-28 Heat transfer control device and method Pending CN109556445A (en)

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Application publication date: 20190402