CN109554696B - Copper alloy strip surface treatment process and copper alloy strip surface treatment equipment - Google Patents

Copper alloy strip surface treatment process and copper alloy strip surface treatment equipment Download PDF

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CN109554696B
CN109554696B CN201811511171.5A CN201811511171A CN109554696B CN 109554696 B CN109554696 B CN 109554696B CN 201811511171 A CN201811511171 A CN 201811511171A CN 109554696 B CN109554696 B CN 109554696B
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alloy strip
copper alloy
tank
liquid
treatment
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CN109554696A (en
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招俊
刘斌
罗钧
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Guangzhou Copper Factory Co ltd
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Guangzhou Copper Factory Co ltd
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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/82After-treatment
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/82After-treatment
    • C23C22/83Chemical after-treatment
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F11/00Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
    • C23F11/08Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)

Abstract

The invention discloses a copper alloy strip surface treatment process, which comprises the following steps of A) unreeling, corrosion inhibition-passivation treatment, surface cleaning treatment, surface curing treatment and reeling; the process has the advantages of few steps, environmental protection, complete treatment of tiny gaps on the surface of the copper alloy strip, high qualification rate and high resistance to high temperature and salt spray corrosion. The invention also discloses equipment for realizing the copper alloy strip treatment process, which comprises a strip unreeling device, a chemical reaction tank, an ultrasonic washing tank, a high-pressure spray flushing device, a passivation hot water tank, a drying device and a strip reeling device.

Description

Copper alloy strip surface treatment process and copper alloy strip surface treatment equipment
Technical Field
The invention relates to the field of metal material surface chemical treatment and mechanical automation, in particular to a copper alloy strip surface treatment process and copper alloy strip surface treatment equipment.
Background
At present, copper alloy is widely applied to the fields of instruments and meters and communication, however, when the copper alloy is applied to the technical field of communication and used as a shielding piece product to shield and protect signals of core components of a PCB, the copper alloy shielding piece is welded on the PCB by soldering, and yellowing and blackening phenomena still occur at the welding part; meanwhile, when used in cases such as electrical component cases, salt spray resistance and durability are not generally high. In order to improve the high-temperature oxidation discoloration resistance and the salt spray durability of the copper alloy, a passivation film layer needs to be prepared on the surface of the copper alloy. The traditional copper alloy high-temperature oxidation discoloration prevention method adopts a series of procedures such as full-oil rolling, surface degreasing, purified water flushing, scouring pad surface polishing, inert gas low-temperature tempering treatment and the like, and has the advantages of complex process flow, low production efficiency, high cost, no effective passivation film layer on the surface of the formed copper alloy, unstable high-temperature oxidation discoloration prevention performance, low salt spray resistance and durability, more interference factors in the surface treatment process flow, difficulty in achieving stable and continuous finished product output, high rejection rate and certain limitation on large-scale production.
The prior art produces the copper alloy strip capable of preventing color change, mainly through improving the surface polishing and brushing links of the material cleaning process, namely through strengthening the grinding of the material surface, brush marks or grooves on the copper alloy surface are reduced as much as possible, so that residues of harmful impurity ions and the like in the cleaning process are reduced, the surface cleaning effect is achieved, and the copper alloy is not easy to oxidize and yellow when heated and baked at a higher temperature. Although the high-mesh scouring pad roller brush is used, the surface smoothness is improved, and the existence of surface brush marks and grooves is greatly reduced, the copper alloy strips with each inch are difficult to treat completely due to uneven stress, and the quality and the surface roughness of the roller brush cannot be controlled particularly in the later use period, so that the cost of the roller brush is extremely high; the cleaning water prepared by the deionized water system still has impurity ions with certain concentration, the uncertainty is enhanced, the surface cleaning effect can be further affected, and the longer the service time is, the higher the risk is; the technology has no real protective film layer formed on the surface of the copper alloy, and the surface of the copper alloy still has the possibility of contacting with external pollution sources in the subsequent production process, such as the inevitable contact process of finishing equipment, stretch bending straightening process, operators and the like, and the phenomenon of heating and local yellowing still exists in the use of materials.
Chinese patent CN201410338998.6 discloses a copper plate surface treatment process, which comprises the following steps: removing oil; step two: primary persulfuric acid; step three: washing copper; step four: secondary persulfuric acid; step five: passivating; step six: spin-drying; step seven: and (5) drying. The process uses a large amount of sulfuric acid to remove metal impurities on the surface of the copper alloy, increases the cost of post-treatment of sulfuric acid wastewater, has multiple process steps, and increases the production time. The Chinese patent CN201710033315.X discloses a copper alloy surface treatment process, which uses magnetic polishing to replace the traditional steps of acid washing, mechanical friction polishing (sand blasting, scouring pad polishing) and the like, solves the problem of poor size of a workpiece in the acid washing process, but has higher equipment requirement and production cost.
At present, researchers want to form a passivation layer on the surface of a copper alloy by a surface chemical treatment method, but the problems that passivation is uneven, passivation concentration cannot be accurately controlled, passivation solution is easy to pollute or interfere, the use effect is seriously influenced and the like exist, and a certain-scale industry is difficult to form.
Disclosure of Invention
The invention aims to provide a copper alloy surface treatment process which has the advantages of few process steps, environmental protection, high qualification rate, high temperature resistance, salt spray corrosion resistance and the like of a processed copper alloy strip.
Another object of the invention is to provide an apparatus for operating the copper alloy strip surface treatment process.
The invention is realized by the following technical scheme:
a copper alloy strip surface treatment process comprises the following steps:
a) Unreeling: unreeling the copper alloy strip;
b) Corrosion inhibition-passivation treatment: immersing the copper alloy strip into a corrosion inhibition-passivation treatment liquid, and carrying out corrosion inhibition-passivation reaction on the surface of the copper alloy strip by the corrosion inhibition-passivation treatment liquid;
c) Surface cleaning treatment: carrying out ultrasonic vibration rinsing treatment on the copper alloy strip subjected to corrosion inhibition-passivation reaction in water, and then carrying out high-pressure spray rinsing on the copper alloy strip by using water;
d) Surface curing treatment: immersing the copper alloy strip into passivation hot water with the temperature of more than or equal to 75 ℃ for surface curing treatment;
e) And (3) rolling: and (5) rolling the copper alloy strip after drying.
After corrosion inhibition-passivation treatment, a layer of protective film is formed on the surface of the alloy, and before surface curing treatment, the protective film is fragile and needs to be cleaned. The surface cleaning treatment process is that the residual corrosion inhibition-passivation solution is washed out through high-pressure spraying after ultrasonic oscillation rinsing treatment. And (3) carrying out surface curing treatment and drying on the cleaned copper alloy strip to obtain the copper alloy strip with the surface provided with the protective film, wherein the protective film on the surface is resistant to high temperature and salt spray corrosion. In addition, each inch of copper alloy strip is subjected to corrosion inhibition-passivation treatment in the treatment process, so that the product yield is high.
In the step B), the reaction time of immersing the copper alloy in the corrosion inhibition-passivation treatment liquid is 15-20 seconds, and the temperature of the corrosion inhibition-passivation treatment liquid is 50-60 ℃; too low a temperature, low reactivity, results in increased processing time and even reduced yields, and too high a temperature increases equipment maintenance costs and increases power consumption.
In the step B), the surface speed of the copper alloy strip flushed by the corrosion inhibition-passivation treatment liquid is 0.35-0.45 m/s. In the chemical reaction tank, the corrosion inhibition-passivation treatment liquid flows to fully wash the surface of the copper alloy strip, so that the fine gaps on the surface of the copper alloy strip can be fully washed, the corrosion inhibition-passivation treatment liquid on the surface of the copper alloy strip can be quickly replaced, and the treatment efficiency and the qualification rate are improved. The flushing speed is too slow, so that the reaction time of the copper alloy strip needs to be increased, the yield per unit time is reduced, and the impact force of water flow is insufficient to flush the fine gaps, so that the qualification rate is reduced; if the flushing speed is too high, too many bubbles at the interface of the copper alloy and the corrosion inhibition-passivation treatment liquid can reduce the reaction efficiency, and the small gaps can not be sufficiently flushed and reacted, so that the qualification rate is reduced, excessive load can be brought to equipment due to too high flow speed, and the energy consumption and the equipment maintenance cost are increased.
In the step C), water used for ultrasonic vibration rinsing treatment and water used for high-pressure spray rinsing are common filtered tap water. The common filtered tap water is water body for removing large particulate matters such as suspended particles, sediment and the like in water quality, the filtering precision is 5 mu m, and the tap water can be filtered by using a 5 mu m combined PP cotton filtering device. The invention does not need to use high-purity water, reduces the energy consumed in the water filtering process and the equipment maintenance cost, and further reduces the production cost.
In the step D), the passivated hot water is coarse filtration tap water with the conductivity less than 30 mu s/cm. When the temperature of the passivated hot water is lower than 75 ℃, the covering film layer generated on the surface of the copper alloy cannot be sufficiently solidified, the surface layer of the copper alloy strip can generate a moisture absorption phenomenon in the storage process of the finished product, the storage period of the finished product is seriously influenced, and a slight high-temperature oxidation discoloration phenomenon can also be generated; meanwhile, the squeezing and drying in the continuous generation process are greatly influenced, the actual production efficiency is reduced, and the finished product output is influenced. When the temperature of the passivation hot water is higher than 75 ℃, the method has great benefits on the squeezing and drying effects in the continuous generation process; the practical maintenance cost of the production system needs to be considered besides the factors of the passivation hot water temperature in the range of 75-85 ℃ and the film curing and energy consumption: when the temperature of the passivated hot water is higher than 85 ℃, the aging phenomenon of the equipment is seriously influenced, the replacement period of the equipment is shortened, the production progress is influenced, and the actual production cost is increased.
The copper alloy strip surface treatment equipment for running the process comprises a strip unreeling device, wherein the strip unreeling device is connected with a chemical reaction tank, the copper alloy strip outlet end of the chemical reaction tank is connected with an ultrasonic water washing tank, the copper alloy strip outlet end of the ultrasonic water washing tank is connected with a high-pressure spray tank, the copper alloy strip outlet end of the high-pressure spray tank is connected with a passivation hot water tank, the copper alloy strip outlet end of the passivation hot water tank is connected with a dryer, and the copper alloy strip outlet end of the dryer is connected with a winder.
The invention has the following beneficial effects:
the copper alloy surface treatment process disclosed by the invention does not need to use a traditional scouring pad to polish the surface of the copper alloy strip, and can ensure that fine gaps on the surface of the copper alloy can be properly treated, so that the copper alloy strip treated by the process disclosed by the invention is smooth in surface, high in qualification rate, simple in process, environment-friendly and low in cost. The copper alloy surface treatment equipment is used for executing the copper alloy surface treatment process, can realize various requirements of copper alloy strip surface treatment procedures, and the treated copper alloy strip surface is provided with a protective film resistant to high temperature and salt spray corrosion.
Drawings
Fig. 1: the copper alloy strip surface treatment equipment is schematically shown in the specification, and reference numerals 1-11 are an unreeling device, a strip sewing device, a guide roller, a chemical reaction tank, an ultrasonic oscillation rinsing tank, a high-pressure spraying tank, a passivation hot water tank, a dryer, a reeling and tension-building S roller, a centering device and a reeling machine in sequence.
Fig. 2: the chemical reaction tank is schematically shown in the specification, wherein the reference numeral 4-1 is a tank body, the reference numeral 4-2 is a guide roller, the reference numeral 4-3 is a tank liquor circulating system, the reference numeral 4-3-1 is a nozzle, the reference numeral 4-3-2 is a tank liquor circulating system liquid suction pipeline, the reference numeral 4-3-3 is an upper liquid spraying pipe, the reference numeral 4-3-4 is a lower liquid spraying pipe, the reference numeral 4-4 is a tank liquor circulating filter system, the reference numeral 4-4-1 is a tank liquor circulating filter system liquid suction pipeline, the reference numeral 4-4-2 is a tank liquor circulating filter system liquid discharge pipeline, the reference numeral 4-5 is a tank liquor temperature control system, the reference numeral 4-5-1 is a tank liquor temperature probe, the reference numeral 4-5-2 is a tank liquor temperature control system liquid suction pipeline, the reference numeral 4-6 is a tank liquor concentration control system, the reference numeral 4-6-1 is a tank liquor concentration probe, and the reference numeral 4-6-2 is an automatic liquid supplementing device liquid conveying pipeline.
Fig. 3: the ultrasonic oscillation rinsing tank and the high-pressure spraying tank are schematically shown, wherein the reference numeral 5 is an ultrasonic oscillation rinsing tank, the reference numeral 5-1 is a first guide roller, the reference numeral 5-2 is a water outlet, the reference numeral 6 is a high-pressure spraying tank, the reference numeral 6-1 is a second guide roller, the reference numeral 6-2 is a high-pressure nozzle, the reference numeral 12-1 is a third guide roller, and the reference numeral 12 is a guide roller.
Fig. 4: reference numeral 12' is a schematic diagram of an ultrasonic oscillation rinse tank and a high-pressure spray tank when the guide roller is pressed.
Detailed Description
The present invention will be further described by the following specific embodiments, which are preferred embodiments of the present invention, but the embodiments of the present invention are not limited by the following examples.
The surface treatment process of the copper alloy strip comprises the following steps:
example 1: immersing the copper alloy strip in a corrosion inhibition-passivation treatment solution after unreeling, wherein the reaction time is 15-20 seconds, the temperature of the corrosion inhibition-passivation treatment solution is 55 ℃, and the surface speed of the copper alloy strip is 0.4 m/s; then carrying out ultrasonic vibration rinsing treatment on the copper alloy strip subjected to corrosion inhibition-passivation reaction in common filtered tap water, and then carrying out high-pressure spray rinsing on the copper alloy strip subjected to corrosion inhibition-passivation reaction by using the common filtered tap water; then immersing the copper alloy strip into passivation hot water with the temperature of 80 ℃ for surface curing treatment, wherein the passivation hot water is coarse filtration tap water with the conductivity of less than 30 mu s/cm; and (5) rolling the copper alloy strip after drying.
Example 2: the difference from example 1 is that the surface speed of the copper alloy strip is 0.45 m/s by scouring the corrosion inhibition-passivation treatment liquid;
example 3: the difference from example 1 is that the surface speed of the copper alloy strip is 0.55 m/s by scouring the corrosion inhibition-passivation treatment liquid;
comparative example 1: the difference from example 1 is that the surface curing treatment is not performed;
comparative example 2: the difference from example 1 is that the high-pressure spray treatment was not performed;
comparative example 3: the difference from example 1 is that the temperature of the passivation hot water is 70 ℃;
comparative example 4: the difference from example 1 is that the temperature of the corrosion inhibition-passivation treatment solution is 45 ℃;
comparative example 5: the difference from example 1 is that the surface speed of the copper alloy strip is 0.3 m/s by the corrosion inhibition-passivation treatment liquid.
Process evaluation method
(1) Copper alloy surface treatment qualification rate: at treated 5 blocks 0.3 x 1m 2 Randomly taking 20 copper alloy strips with 10cm x 10cm 2 And (3) carrying out a high-temperature-resistant color-changing test and a salt spray-resistant test on the small area of the steel plate, and examining the passing probability of the two tests, wherein the higher the passing rate is, the higher the process qualification rate is. Wherein, high temperature resistant test of discolouring: performing 290 ℃/5min high temperature resistance color change test to verify, and performing data comparison on the surface glossiness before and after the test by adopting a glossiness meter to judge the high temperature resistance color change performance, wherein the evaluation standard is 'pass' or 'fail'; salt spray resistance durability: according to GB/T2423.17-2008 "basic environmental test protocol for Electrical and electronic products test Ka: salt spray test methods, the evaluation criteria are "pass" or "fail".
(2) Copper alloy surface finish: randomly taking 20 pieces of 10 x 10cm on a treated copper alloy strip 2 The surface roughness and the surface glossiness are measured in small areas of the substrate, the values of the two measured parameters are examined, and the higher the passing rate is, the moreThe higher the process qualification rate is, the data comparison is carried out on the sampled film thickness by adopting a step meter measurement value to judge the uniformity of the film thickness and the coverage area; and (3) evaluating the uniformity of the thickness of the film layer by combining the surface roughness, the surface glossiness and the evaluation standards of excellent, good and poor.
(3) Copper alloy surface film layer binding force: randomly taking 20 pieces of 10 x 10cm on a treated copper alloy strip 2 Film binding force test is carried out on the small area of the film, and the scratch instrument is adopted to carry out data comparison on the sampled surface film binding force so as to judge the anti-stripping performance of the film, and the evaluation standards are 'excellent', 'good', 'bad'.
Table 1: test results of respective properties of copper alloy strips treated in examples and comparative examples
Example 1 Example 2 Example 3 Comparative example 1 Comparative example 2 Comparative example 3 Comparative example 4 Comparative example 5
Copper alloySurface treatment yield, percent of 100 100 100 0 0 50 0 0
Copper alloy surface finish Excellent (excellent) Excellent (excellent) Good grade (good) Difference of difference Difference of difference Difference of difference Difference of difference Difference of difference
Binding force of copper alloy surface film layer Excellent (excellent) Good grade (good) Good grade (good) Difference of difference Difference of difference Difference of difference Difference of difference Difference of difference
As can be seen from the examples 1/2/3, the copper alloy surface treatment process has the advantages that all parameters are strictly optimized, the qualification rate of the treated copper alloy surface can reach 100%, and when the flow rate of the bath solution is too fast, the bonding force of the copper alloy surface film layer is not good enough. As can be seen from comparative example 1, the surface curing treatment is a step necessary for forming the film layer. As can be seen from comparative example 2, the high-pressure spraying treatment can spray out the residual bath solution on the surface of the copper alloy, and the residual bath solution can disqualify the subsequent surface curing treatment, so that a qualified surface film layer cannot be obtained. As can be seen from comparative example 3, the temperature of the passivation hot water is critical for improving the binding force of the copper alloy surface protection film layer, the low temperature can lead to poor scratch resistance and peeling resistance, and the uneven surface film layer can lead to poor surface glossiness. As can be seen from comparative examples 4/5, each parameter in the corrosion inhibition-passivation process was optimized for the reaction conditions required for the copper alloy surface treatment, and when the parameter was out of the scope of the present invention, the copper alloy surface failed to obtain a satisfactory protective film.
As shown in fig. 1, the copper alloy strip surface treatment equipment comprises a strip unreeling device 1, wherein the strip unreeling device is connected with a chemical reaction tank 4, the outlet end of the copper alloy strip in the chemical reaction tank is connected with an ultrasonic water washing tank 5, the outlet end of the copper alloy strip in the ultrasonic water washing tank is connected with a high-pressure spray tank 6, the outlet end of the copper alloy strip in the high-pressure spray tank is connected with a passivation hot water tank 7, the outlet end of the copper alloy strip in the passivation hot water tank is connected with a dryer 8, and the outlet end of the copper alloy strip in the dryer is connected with a winder 11.
The copper alloy strip surface treatment equipment is characterized in that the copper alloy strip surface treatment equipment is subjected to unreeling, corrosion inhibition-passivation treatment, surface cleaning treatment, surface curing treatment, drying and reeling to obtain a treated copper alloy strip. The surface of the copper alloy strip obtained by the treatment of the equipment is provided with a layer of high-temperature-resistant, salt-fog-corrosion-resistant and firm protective film.
As shown in fig. 2, the alloy strip surface treatment reaction tank comprises a tank body 4-1, a conveying device for conveying the alloy strip and a tank liquid circulating system 4-3, wherein the tank liquid circulating system comprises a circulating pump, a tank liquid circulating system liquid suction pipeline 4-3-2 communicated with an inlet of the circulating pump, an upper liquid spraying pipe 4-3-3 communicated with an outlet of the circulating pump and a lower liquid spraying pipe 4-3-4, and the conveying device comprises a guide roller 4-2 for guiding the alloy strip between the upper liquid spraying pipe and the lower liquid spraying pipe; nozzles 4-3-1 facing the alloy strip conveyed therebetween are respectively arranged on the upper liquid spraying pipe and the lower liquid spraying pipe; the tank liquor circulation system pumps out the tank liquor in the tank body and then sprays the tank liquor to the upper surface and the lower surface of the alloy strip through the nozzle, so that the tank liquor can evenly wash the surface of the alloy strip at a certain flow rate, and the effect of uniform reaction is achieved.
The distance between the lower surface of the alloy strip guided by the guide roller in the groove body and the lower liquid spraying pipe is smaller than the distance between the upper surface of the alloy strip and the upper liquid spraying pipe; therefore, the bearing of the guide roller in the groove body is higher than the groove body, so that the diameter of the guide roller is large, and the effective time for enabling the surface treatment reaction of the upper surface of the alloy strip is less than that of the lower surface. In order to achieve the same treatment effect on both the upper and lower surfaces of the alloy strip, the chemical treatment efficiency of the upper surface is increased at each instant, i.e. the total amount of bath solution at the upper surface of the strip is increased, so that the bath solution volume of the upper surface of the alloy strip is greater than the bath solution volume of the lower surface.
The included angle between the direction of the nozzle and the copper alloy strip is 45-60 degrees, and the direction of the nozzle is opposite to the trend of the copper alloy strip. Thus, the flowing direction of the bath solution is opposite to the advancing direction of the copper alloy strip, and the water flow and the advancing direction of the copper alloy strip form resultant force, so that the surface of the copper alloy strip can be washed and treated more effectively.
The upper liquid spraying pipe is in an inverted T-shaped arrangement, the nozzles are arranged below the inverted T-shaped transverse pipe, the lower liquid spraying pipe is in L-shaped distribution, and the nozzles are arranged above the L-shaped transverse pipe.
The space of the groove body can be effectively utilized by the arrangement, and the pipeline arrangement is facilitated.
The liquid suction port of the liquid suction pipeline of the tank liquid circulation system is arranged at the bottom of the alloy strip inlet end of the tank body. Because of the flow direction of the bath liquid, the bath liquid at the bottom of the inlet end of the bath alloy strip is the part with the lowest concentration, and the concentration of the bath liquid in the whole bath body can be ensured to be uniform as much as possible by pumping the bath liquid.
As shown in fig. 2, the chemical reaction tank also comprises a tank liquor circulating and filtering system 4-4; the groove liquid circulating filter system comprises a circulating filter system circulating pump, a groove liquid circulating filter system liquid suction pipeline 4-4-1 communicated with an inlet of the circulating filter system circulating pump, and a groove liquid circulating filter system liquid outlet pipeline 4-4-2 communicated with an outlet of the circulating filter system circulating pump, wherein a liquid suction port of the groove liquid circulating filter system liquid suction pipeline is positioned at the bottom of an alloy strip inlet end of the groove body, and a liquid outlet of the groove liquid circulating filter system liquid outlet pipeline is positioned at an alloy strip outlet end of the groove body. Because the flowing direction of the bath liquid is that the outlet end of the alloy strip flows towards the inlet end of the alloy strip, some impurities are easy to accumulate at the inlet end of the alloy strip of the bath body, and the water absorption pipeline of the bath liquid circulating and filtering system is arranged at the bottom of the inlet end of the alloy strip of the bath body, so that the bath liquid is pumped out and filtered and then is input from the outlet end of the alloy strip of the bath body, the cleaning of the bath liquid can be ensured most effectively, no solid particles are accumulated, and the long-time operation and the production efficiency of the equipment are ensured.
The chemical reaction tank also comprises a tank liquor temperature control system 4-5; the bath solution temperature control system comprises a bath solution heating-freezing device, a bath solution temperature probe 4-5-1 positioned at the inlet end of the alloy strip of the bath body, a bath solution temperature control system liquid suction pipeline 4-5-2 communicated with the inlet of the bath solution heating-freezing device, and a bath solution temperature control system liquid outlet pipeline 4-5-3 communicated with the outlet of the bath solution heating-freezing device, wherein the liquid outlet of the bath solution temperature control system liquid outlet pipeline is positioned at the outlet end of the alloy strip of the bath body, and the liquid suction port of the bath solution temperature control system liquid suction pipeline is positioned at the inlet end of the alloy strip of the bath body. The bath liquid temperature control system pumps out water for heating or cooling through a water suction pipeline of the bath liquid temperature control system according to the temperature detected by the bath liquid temperature probe, and the water is sent out from a water outlet pipeline groove of the bath liquid temperature control system so as to control and condition the bath liquid temperature.
The automatic fluid infusion device also comprises an automatic fluid infusion device 4-6, wherein the automatic fluid infusion device comprises a groove fluid concentration probe 4-6-1 arranged at the inlet end of the alloy strip of the groove body and an automatic fluid infusion pipeline 4-6-2 arranged at the outlet end of the alloy strip of the groove body. The concentration of reaction substances in the bath liquid can be reduced in the surface treatment reaction process of the copper alloy strip, and the automatic liquid supplementing device can supplement the bath liquid when the bath liquid concentration probe detects that the bath liquid concentration is lower than the limit, so that the concentration of the bath liquid is stabilized, and the product qualification rate is ensured. The bath solution at the inlet end of the copper alloy strip of the bath body is the part with the lowest concentration, so that the bath solution concentration probe is arranged at the inlet end of the copper alloy strip of the bath body, and the concentration of the bath solution in the whole bath body can be effectively ensured to be in a proper range.
As shown in fig. 3, the ultrasonic oscillation rinsing tank is communicated with the bottom of the high-pressure spraying tank, and comprises a conveying mechanism for sequentially conveying the alloy strip into the ultrasonic oscillation rinsing tank and the high-pressure spraying tank, wherein a high-pressure nozzle 6-2 facing the surface of the alloy strip is arranged in the high-pressure spraying tank; the conveying mechanism comprises a first guide roller 5-1 arranged in the ultrasonic oscillation rinsing tank, a second guide roller 6-1 arranged in the high-pressure spraying tank, and a third guide roller 12-1 positioned between the two rollers, wherein the third guide roller is positioned above the two tanks; the first guide roller is higher than the communicating part of the two tank bottoms, the second guide roller is higher than the first guide roller, a water outlet 5-2 is arranged on one side of the ultrasonic oscillation rinsing tank, and the height of the water outlet is between the first guide roller and the second guide roller. The alloy strip is tensioned through the lower part of the first guide roller, the upper part of the third guide roller and the lower part of the second guide roller, the copper alloy strip enters the ultrasonic oscillation rinsing tank through the guide of the guide roller, is immersed below the liquid level, is subjected to ultrasonic oscillation rinsing, enters the high-pressure spraying tank, is not in contact with the water surface in the high-pressure spraying tank, is only washed by water sprayed by the high-pressure nozzle, and is washed to remove residual impurities, so that the water can be recycled and cannot cause secondary pollution to the surface of the copper alloy strip, and the copper alloy strip has good cleaning performance, saves water and cannot damage a protective film layer on the surface.
The included angle between the high-pressure nozzle 6-2 and the copper alloy strip is 45-60 degrees, and the direction of the high-pressure nozzle is opposite to the direction of the copper alloy strip. The water flow sprayed by the high-pressure nozzle and the copper alloy strip advance to form resultant force, so that the surface of the copper alloy strip can be flushed more effectively, and the water cannot splash back to the high-pressure nozzle to interfere flushing.
The high-pressure nozzles 6-2 are distributed on two sides of the copper alloy strip, the distance between the high-pressure nozzles 6-2 and the copper alloy strip is 10cm, and the interval between the high-pressure nozzles 6-2 is 15cm. The arrangement mode of the nozzles can form a completely covered water curtain on the surface of the copper alloy strip without dead angles and can save water to the greatest extent.
The guide roller 12 is connected before the ultrasonic oscillation rinsing tank 5 and after the high-pressure spraying tank.
Further preferably, as shown in fig. 4, the guide roll 12' is a squeeze guide roll. The purpose of the extrusion guide roller is to extrude the residual liquid on the surface of the copper alloy strip in the previous step before entering the next step, so that the interference to the subsequent operation is reduced.
The strip unreeling device 1 and the chemical reaction tank are also provided with a strip sewing device 2 and a guide roller 3.
And a winding and tensioning S roller 9 and a centering device 10 are also sequentially connected between the dryer 8 and the winding machine 11.

Claims (10)

1. The equipment for the copper alloy strip surface treatment process is characterized by comprising a strip unreeling device (1), wherein the strip unreeling device is connected with a chemical reaction tank (4), the copper alloy strip outlet end of the chemical reaction tank is connected with an ultrasonic water washing tank (5), the copper alloy strip outlet end of the ultrasonic water washing tank is connected with a high-pressure spray tank (6), the copper alloy strip outlet end of the high-pressure spray tank is connected with a passivation hot water tank (7), the copper alloy strip outlet end of the passivation hot water tank is connected with a dryer (8), and the copper alloy strip outlet end of the dryer is connected with a winder (11); the alloy strip surface treatment reaction tank comprises a tank body (4-1), a conveying device for conveying the alloy strip and a tank liquid circulation system (4-3), wherein the tank liquid circulation system comprises a circulation pump, a tank liquid circulation system liquid suction pipeline (4-3-2) communicated with an inlet of the circulation pump, an upper liquid spraying pipe (4-3-3) and a lower liquid spraying pipe (4-3-4) communicated with an outlet of the circulation pump, and the conveying device comprises a guide roller (4-2) in the reaction tank for guiding the alloy strip into a space between the upper liquid spraying pipe and the lower liquid spraying pipe; nozzles (4-3-1) for feeding alloy strips between the upper and lower spray pipes are respectively arranged on the upper and lower spray pipes; the distance between the lower surface of the alloy strip guided by the guide roller in the groove body and the lower liquid spraying pipe is smaller than the distance between the upper surface of the alloy strip and the upper liquid spraying pipe; the included angle between the direction of the nozzle and the copper alloy strip is 45-60 degrees, and the direction of the nozzle is opposite to the trend of the copper alloy strip; the liquid suction port of the liquid suction pipeline of the tank liquid circulation system is arranged at the bottom of the alloy strip inlet end of the tank body; the upper liquid spraying pipe is in an inverted T-shaped arrangement, the nozzles are arranged below the inverted T-shaped transverse pipe, the lower liquid spraying pipe is in L-shaped distribution, and the nozzles are arranged above the L-shaped transverse pipe.
2. The apparatus of claim 1, wherein the chemical reaction tank further comprises a tank liquor circulation filtration system (4-4); the groove liquid circulating filter system comprises a circulating filter system circulating pump, a groove liquid circulating filter system liquid suction pipeline (4-4-1) communicated with an inlet of the circulating filter system circulating pump, and a groove liquid circulating filter system liquid outlet pipeline (4-4-2) communicated with an outlet of the circulating filter system circulating pump, a liquid suction port of the groove liquid circulating filter system liquid suction pipeline is positioned at the bottom of an alloy strip inlet end of the groove body, and a liquid outlet of the groove liquid circulating filter system liquid outlet pipeline is positioned at an alloy strip outlet end of the groove body.
3. The apparatus of claim 1, wherein the chemical reaction tank further comprises a tank liquor temperature control system (4-5); the bath solution temperature control system comprises a bath solution heating-freezing device, a bath solution temperature probe (4-5-1) positioned at the inlet end of the alloy strip of the bath body, a bath solution temperature control system liquid suction pipeline (4-5-2) communicated with the inlet of the bath solution heating-freezing device, and a bath solution temperature control system liquid outlet pipeline (4-5-3) communicated with the outlet of the bath solution heating-freezing device, wherein the liquid outlet of the bath solution temperature control system liquid outlet pipeline is positioned at the outlet end of the alloy strip of the bath body, and the liquid suction port of the bath solution temperature control system liquid suction pipeline is positioned at the inlet end of the alloy strip of the bath body; the automatic liquid supplementing device comprises a groove liquid concentration probe (4-6-1) arranged at the inlet end of the alloy strip of the groove body and an automatic liquid supplementing device infusion pipeline (4-6-2) arranged at the outlet end of the alloy strip of the groove body.
4. The device according to claim 1, characterized in that the ultrasonic oscillation rinsing tank is communicated with the bottom of the high-pressure spraying tank, and comprises a conveying mechanism for conveying the alloy strip into the ultrasonic oscillation rinsing tank and the high-pressure spraying tank in sequence, wherein a high-pressure nozzle (6-2) facing the surface of the alloy strip is arranged in the high-pressure spraying tank; the conveying mechanism comprises a first guide roller (5-1) arranged in the ultrasonic oscillation rinsing tank, a second guide roller (6-1) arranged in the high-pressure spraying tank, and a third guide roller (12-1) arranged between the two rollers, wherein the third guide roller is arranged above the two tanks; the first guide roller is higher than the communication part of the two tank bottoms, the second guide roller is higher than the first guide roller, a water outlet (5-2) is arranged on one side of the ultrasonic oscillation rinsing tank, and the height of the water outlet is between the first guide roller and the second guide roller; the included angle between the high-pressure nozzle and the copper alloy strip is 45-60 degrees, and the direction of the high-pressure nozzle is opposite to the trend of the copper alloy strip; the high-pressure nozzles are distributed on two sides of the copper alloy strip, the distance between the high-pressure nozzles and the copper alloy strip is 10cm, and the interval between the high-pressure nozzles is 15cm.
5. The apparatus according to claim 1, characterized in that a single-roll guide roll (12) is connected before the ultrasonic oscillation rinse tank and after the high-pressure spray tank.
6. The apparatus according to claim 1, characterized in that a twin-roll extrusion guiding roll (12') is connected before the ultrasonic oscillation rinsing tank and after the high-pressure spraying tank.
7. The apparatus according to claim 1, characterized in that between the web unreeling device and the chemical reaction tank there are also included a web sewing device (2) and a web sewing device guide roller (3); the drying machine and the winding machine are also connected with a winding and tension building S roller (9) and a centering device (10) in sequence.
8. Process for treating the surface of a copper alloy strip according to any one of claims 1 to 7, characterized in that it comprises the following steps:
a) Unreeling: unreeling the copper alloy strip;
b) Corrosion inhibition-passivation treatment: immersing the copper alloy strip into a corrosion inhibition-passivation treatment liquid, and carrying out corrosion inhibition-passivation reaction on the surface of the copper alloy strip by the corrosion inhibition-passivation treatment liquid;
c) Surface cleaning treatment: carrying out ultrasonic vibration rinsing treatment on the copper alloy strip subjected to corrosion inhibition-passivation reaction in water, and then carrying out high-pressure spray rinsing on the copper alloy strip by using water;
d) Surface curing treatment: immersing the copper alloy strip into passivation hot water with the temperature of more than or equal to 75 ℃ for surface curing treatment;
e) And (3) rolling: and (5) rolling the copper alloy strip after drying.
9. The process of claim 8, wherein in step B), the copper alloy is immersed in the corrosion-inhibiting and passivating treatment fluid for 15 to 20 seconds, and the temperature of the corrosion-inhibiting and passivating treatment fluid is 50 to 60 ℃; in the step B), the surface speed of the copper alloy strip flushed by the corrosion inhibition-passivation treatment liquid is 0.35-0.45 m/s.
10. The process according to claim 8, wherein in the step C), the water used for the ultrasonic vibration rinsing treatment and the water used for the high-pressure spray rinsing are tap water which is commonly filtered; in the step D), the passivated hot water is coarse filtration tap water with the conductivity less than 30 mu s/cm; in the step D), the temperature of the passivation hot water is 75-85 ℃.
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CN113083897B (en) * 2021-04-07 2022-12-27 太原晋西春雷铜业有限公司 Preparation method of high-uniformity surface of copper or copper alloy strip
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