CN109551319A - A kind of ultra-deep hole processing device - Google Patents
A kind of ultra-deep hole processing device Download PDFInfo
- Publication number
- CN109551319A CN109551319A CN201811449132.7A CN201811449132A CN109551319A CN 109551319 A CN109551319 A CN 109551319A CN 201811449132 A CN201811449132 A CN 201811449132A CN 109551319 A CN109551319 A CN 109551319A
- Authority
- CN
- China
- Prior art keywords
- lantern ring
- operating stick
- ultra
- superdeep holes
- deep hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000003780 insertion Methods 0.000 claims abstract description 4
- 230000037431 insertion Effects 0.000 claims abstract description 4
- 239000000428 dust Substances 0.000 claims description 4
- 244000273618 Sphenoclea zeylanica Species 0.000 claims description 3
- 230000007246 mechanism Effects 0.000 claims description 3
- 238000000034 method Methods 0.000 description 8
- 230000008569 process Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- BVPWJMCABCPUQY-UHFFFAOYSA-N 4-amino-5-chloro-2-methoxy-N-[1-(phenylmethyl)-4-piperidinyl]benzamide Chemical compound COC1=CC(N)=C(Cl)C=C1C(=O)NC1CCN(CC=2C=CC=CC=2)CC1 BVPWJMCABCPUQY-UHFFFAOYSA-N 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 206010028347 Muscle twitching Diseases 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B5/00—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor
- B24B5/36—Single-purpose machines or devices
- B24B5/48—Single-purpose machines or devices for grinding walls of very fine holes, e.g. in drawing-dies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/04—Headstocks; Working-spindles; Features relating thereto
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B45/00—Means for securing grinding wheels on rotary arbors
- B24B45/006—Quick mount and release means for disc-like wheels, e.g. on power tools
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Abstract
The invention discloses a kind of ultra-deep hole processing device, device includes: grinding head, operating stick and bracket, wherein grinding head is fixed on one end of operating stick insertion superdeep holes, and one end of superdeep holes is for being inserted into superdeep holes to be processed；The other end of operating stick passes through the center of bracket；Bracket includes: the first lantern ring, at least three connecting rods and the second lantern ring；First lantern ring is slidably socketed in operating stick, and the first lantern ring is connected on the second lantern ring by connecting rod；Connecting rod is flexibly connected with the first lantern ring and the second lantern ring respectively；Angle between two neighboring connecting rod is identical, and the length of connecting rod is greater than the spacing of the first lantern ring and the second lantern ring on the depth extending direction of superdeep holes；The setting coaxial with the first lantern ring of second lantern ring, and the outer diameter of the second lantern ring is greater than the outer diameter of the first lantern ring.Using the embodiment of the present invention, the efficiency-cost ratio of ultra-deep hole machined can be improved.
Description
Technical field
The present invention relates to a kind of machinery processing apparatus, are more particularly to a kind of ultra-deep hole processing device.
Background technique
With the quickening of CHINESE INDUSTRIES upgrading paces, accurate mechanical equipment, the special equipment of the production of China's machining industry
Quantity it is more and more.
There are a large amount of superdeep holes process requirements in accurate mechanical equipment, special equipment, currently used superdeep holes add
Work method is to be handled using boring machine the surface of superdeep holes.But after using boring machine equipment to carry out ultra-deep hole machined, ultra-deep
There may be the flaws on some surfaces inside hole.It is that practical fine boring machine is processed under normal conditions.But fine boring machine working hour expense
It is higher, the higher cost of the workpiece after causing right boring to be processed；And there are many purposes of fine boring machine, and fine boring machine is used for superdeep holes
Surface treatment, is a kind of waste for this high-end devices, and therefore, there are superdeep holes to be surface-treated efficiency-cost ratio for the prior art
Not high technical problem.
Summary of the invention
Technical problem to be solved by the present invention lies in a kind of ultra-deep hole processing device is provided, to solve in the prior art
The not high technical problem of existing superdeep holes surface treatment efficiency-cost ratio.
The present invention is to solve above-mentioned technical problem by the following technical programs:
The embodiment of the invention provides a kind of ultra-deep hole processing device, described device includes: grinding head, operating stick and branch
Frame, wherein
The grinding head is fixed on one end of the operating stick insertion superdeep holes, and one end of the superdeep holes is for being inserted into
Superdeep holes to be processed；
The other end of the operating stick passes through the center of the bracket；
The bracket includes: the first lantern ring, at least three connecting rods and the second lantern ring；First lantern ring is slidably socketed
In the operating stick, first lantern ring is connected on second lantern ring by the connecting rod；
The connecting rod is flexibly connected with first lantern ring and second lantern ring respectively；Two neighboring connecting rod it
Between angle it is identical, and the length of connecting rod is greater than first lantern ring and second lantern ring in the depth of the superdeep holes
Spacing on extending direction；
Second lantern ring setting coaxial with first lantern ring, and the outer diameter of second lantern ring is greater than the first set
The outer diameter of ring.
Optionally, the other end of the operating stick is equipped with the connector of connection power mechanism.
Optionally, second lantern ring has round boss structure；
The boss is inserted into the superdeep holes, and the outer diameter of the boss and the internal diameter of the superdeep holes match.
Optionally, the grinding head is detachably connected with the operating stick.
Optionally, the grinding head is threadedly coupled with the operating stick, the rotation direction of thread of the grinding head with it is described
The rotation direction of operating stick is opposite.
Optionally, the outer diameter of the grinding head and the internal diameter of the superdeep holes match.
Optionally, the operating stick is hollow stem, and the side wall of the operating stick is equipped with through-hole；
One end that the operating stick is located at outside the superdeep holes is connected with dust catcher.
The present invention has the advantage that compared with prior art
, can be relatively fixed by the side wall of operating stick and superdeep holes by the second lantern ring using the embodiment of the present invention, then,
First lantern ring is moved towards the second lantern ring, and then fixes two lantern rings by operating stick, and then operation rod end can be used
The grinding head in portion processes superdeep holes.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of ultra-deep hole processing device provided in an embodiment of the present invention；
Fig. 2 is the structural schematic diagram of bracket in a kind of ultra-deep hole processing device provided in an embodiment of the present invention.
Specific embodiment
It elaborates below to the embodiment of the present invention, the present embodiment carries out under the premise of the technical scheme of the present invention
Implement, the detailed implementation method and specific operation process are given, but protection scope of the present invention is not limited to following implementation
Example.
Fig. 1 is a kind of structural schematic diagram of ultra-deep hole processing device provided in an embodiment of the present invention, and Fig. 2 is that the present invention is implemented
The structural schematic diagram of bracket in a kind of ultra-deep hole processing device that example provides, as depicted in figs. 1 and 2, described device include: grinding
First 100, operating stick 200 and bracket 300, wherein
The grinding head 100 is fixed on one end that the operating stick 200 is inserted into superdeep holes, and one end of the superdeep holes is used
In insertion superdeep holes to be processed；
The other end of the operating stick 200 passes through the center of the bracket 300；
The bracket 300 includes: the first lantern ring 301, at least three connecting rods 303 and the second lantern ring 305；Described first
Lantern ring 301 is slidably socketed in the operating stick 200, and first lantern ring 301 is connected to described by the connecting rod 303
On two lantern rings 305；
The connecting rod 303 is flexibly connected with first lantern ring 301 and second lantern ring 305 respectively；Adjacent two
Angle between a connecting rod 303 is identical, and the length of connecting rod 303 is greater than first lantern ring 301 and second set described
Spacing of the ring 305 on the depth extending direction of the superdeep holes；
Second lantern ring 305 setting coaxial with first lantern ring 301, and the outer diameter of second lantern ring 305 is greater than
The outer diameter of first lantern ring 301.
When carrying out ultra-deep hole machined using the embodiment of the present invention, the second lantern ring 305 is first fixed on workpiece to be processed
On 10, the second lantern ring 305 can be fixed on to the inside of superdeep holes, or the second lantern ring 305 is fixed on to the end of superdeep holes,
Then operating stick 200 and the side wall of superdeep holes is relatively fixed, due to the first lantern ring 301 and the coaxial setting of the second lantern ring 305, because
This, can limit operating stick 200 by the first lantern ring 301 and the second lantern ring 305, and then operating stick 200 is fixed,
Finally, twitching or rotating operating stick 200 back and forth, and then grinding head 100 is driven to grind the inner wall of superdeep holes, can made
Superdeep holes are processed with the grinding head 100 of 200 end of operating stick.If necessary to grind the superdeep holes of different inner diameters, can replace not
Same operating stick 200, or the grinding head 100 of replacement various outer diameter.
In order to further increase the spacing between the first lantern ring 301 and the second lantern ring 305, operating stick 200 is determined in raising
Position effect, connecting rod 303 are telescopic rod.
In a kind of specific embodiment of the embodiment of the present invention, in order to drive operating stick 200 to rotate, and then grinding is driven
First 100 rotation, the other end of the operating stick 200 are equipped with the connector 500 of connection power mechanism.
In a kind of specific embodiment of the embodiment of the present invention, the second lantern ring 305 is fixed on superdeep holes for convenience
On, second lantern ring 305 has 3051 structure of round boss；
The boss 3051 is inserted into the superdeep holes, and the internal diameter phase of the outer diameter of the boss 3051 and the superdeep holes
Match.
In a kind of specific embodiment of the embodiment of the present invention, grinding head 100, the grinding head are replaced for convenience
100 are detachably connected with the operating stick 200.
In a kind of specific embodiment of the embodiment of the present invention, in order to avoid grinding head 100 in grinding and operates
Bar 200 is detached from, and the grinding head 100 is threadedly coupled with the operating stick 200, the rotation direction of thread of the grinding head 100 and
The rotation direction of the operating stick 200 is opposite.
In a kind of specific embodiment of the embodiment of the present invention, in order to grind the side wall of superdeep holes, the grinding head 100
The internal diameter of outer diameter and the superdeep holes match.
In a kind of specific embodiment of the embodiment of the present invention, produced in ultra-deep internal surface of hole process to be sucked out
Raw clast, the operating stick 200 is hollow stem, and the side wall of the operating stick 200 is equipped with through-hole；
One end that the operating stick 200 is located at outside the superdeep holes is connected with dust catcher.
In process, dust catcher is started to work, and generates negative pressure in the inside of operating stick 200, and then will be in superdeep holes
The clast in portion is sucked by through-hole, and then is discharged to except superdeep holes.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all in essence of the invention
Made any modifications, equivalent replacements, and improvements etc., should all be included in the protection scope of the present invention within mind and principle.
Claims (7)
1. a kind of ultra-deep hole processing device, which is characterized in that described device includes: grinding head, operating stick and bracket, wherein
The grinding head is fixed on one end of the operating stick insertion superdeep holes, and one end of the superdeep holes is to be added for being inserted into
The superdeep holes of work；
The other end of the operating stick passes through the center of the bracket；
The bracket includes: the first lantern ring, at least three connecting rods and the second lantern ring；First lantern ring is slidably socketed in institute
It states in operating stick, first lantern ring is connected on second lantern ring by the connecting rod；
The connecting rod is flexibly connected with first lantern ring and second lantern ring respectively；Between two neighboring connecting rod
Angle is identical, and the length of connecting rod is greater than first lantern ring and second lantern ring and extends in the depth of the superdeep holes
Spacing on direction；
Second lantern ring setting coaxial with first lantern ring, and the outer diameter of second lantern ring is greater than first lantern ring
Outer diameter.
2. a kind of ultra-deep hole processing device according to claim 1, which is characterized in that the other end of the operating stick is equipped with
Connect the connector of power mechanism.
3. a kind of ultra-deep hole processing device according to claim 1, which is characterized in that second lantern ring has round convex
Platform structure；
The boss is inserted into the superdeep holes, and the outer diameter of the boss and the internal diameter of the superdeep holes match.
4. a kind of ultra-deep hole processing device according to claim 1, which is characterized in that the grinding head and the operating stick
It is detachably connected.
5. a kind of ultra-deep hole processing device according to claim 4, which is characterized in that the grinding head and the operating stick
It is threadedly coupled, the rotation direction of thread of the grinding head is opposite with the rotation direction of the operating stick.
6. a kind of ultra-deep hole processing device according to claim 1, which is characterized in that the outer diameter of the grinding head with it is described
The internal diameter of superdeep holes matches.
7. a kind of ultra-deep hole processing device according to claim 1, which is characterized in that the operating stick is hollow stem, and
The side wall of the operating stick is equipped with through-hole；
One end that the operating stick is located at outside the superdeep holes is connected with dust catcher.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811449132.7A CN109551319A (en) | 2018-11-30 | 2018-11-30 | A kind of ultra-deep hole processing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811449132.7A CN109551319A (en) | 2018-11-30 | 2018-11-30 | A kind of ultra-deep hole processing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109551319A true CN109551319A (en) | 2019-04-02 |
Family
ID=65868034
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811449132.7A Withdrawn CN109551319A (en) | 2018-11-30 | 2018-11-30 | A kind of ultra-deep hole processing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109551319A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112247788A (en) * | 2020-09-30 | 2021-01-22 | 李萌 | Wafer etching deep hole residue cleaner |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20010001223A1 (en) * | 1999-06-28 | 2001-05-17 | Seiji Miyaura | Link-and-pin fixing structure for a crawler chain |
| KR100576499B1 (en) * | 2004-12-02 | 2006-05-10 | 두산중공업 주식회사 | Processing adapter of a big deep hole and hole processing method |
| CN201659466U (en) * | 2009-11-27 | 2010-12-01 | 中国直升机设计研究所 | Deep-hole grinding device |
| CN203936727U (en) * | 2014-07-02 | 2014-11-12 | 镇江市丹徒区甬润工具有限公司 | A kind of interior chip removal rose reamer honing device |
| CN104607690A (en) * | 2014-10-11 | 2015-05-13 | 武汉重工铸锻有限责任公司 | Machining device and method of deep hole annular oil tank |
| CN105345094A (en) * | 2015-11-13 | 2016-02-24 | 中北大学 | Deep-hole machining online deviation rectifying device based on laser detection principle |
| CN106985020A (en) * | 2017-04-19 | 2017-07-28 | 德阳六久科技有限公司 | A kind of sanding apparatus after deep hole machining |
| CN207534523U (en) * | 2017-04-19 | 2018-06-26 | 德阳六久科技有限公司 | Small-Deep Hole Machining multifunctional polishing device |
| CN207592863U (en) * | 2017-12-18 | 2018-07-10 | 台州市黄岩宏特精工模具有限公司 | The processing of ultra-deep position is lengthened with adjustable tools to be covered |
| CN209425122U (en) * | 2018-11-30 | 2019-09-24 | 安庆中船动力配套有限公司 | A kind of ultra-deep hole processing device |
-
2018
- 2018-11-30 CN CN201811449132.7A patent/CN109551319A/en not_active Withdrawn
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20010001223A1 (en) * | 1999-06-28 | 2001-05-17 | Seiji Miyaura | Link-and-pin fixing structure for a crawler chain |
| KR100576499B1 (en) * | 2004-12-02 | 2006-05-10 | 두산중공업 주식회사 | Processing adapter of a big deep hole and hole processing method |
| CN201659466U (en) * | 2009-11-27 | 2010-12-01 | 中国直升机设计研究所 | Deep-hole grinding device |
| CN203936727U (en) * | 2014-07-02 | 2014-11-12 | 镇江市丹徒区甬润工具有限公司 | A kind of interior chip removal rose reamer honing device |
| CN104607690A (en) * | 2014-10-11 | 2015-05-13 | 武汉重工铸锻有限责任公司 | Machining device and method of deep hole annular oil tank |
| CN105345094A (en) * | 2015-11-13 | 2016-02-24 | 中北大学 | Deep-hole machining online deviation rectifying device based on laser detection principle |
| CN106985020A (en) * | 2017-04-19 | 2017-07-28 | 德阳六久科技有限公司 | A kind of sanding apparatus after deep hole machining |
| CN207534523U (en) * | 2017-04-19 | 2018-06-26 | 德阳六久科技有限公司 | Small-Deep Hole Machining multifunctional polishing device |
| CN207592863U (en) * | 2017-12-18 | 2018-07-10 | 台州市黄岩宏特精工模具有限公司 | The processing of ultra-deep position is lengthened with adjustable tools to be covered |
| CN209425122U (en) * | 2018-11-30 | 2019-09-24 | 安庆中船动力配套有限公司 | A kind of ultra-deep hole processing device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112247788A (en) * | 2020-09-30 | 2021-01-22 | 李萌 | Wafer etching deep hole residue cleaner |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20190402 |
|
| WW01 | Invention patent application withdrawn after publication |