CN109545875A - A kind of processing method of solar panel - Google Patents
A kind of processing method of solar panel Download PDFInfo
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- CN109545875A CN109545875A CN201811386363.8A CN201811386363A CN109545875A CN 109545875 A CN109545875 A CN 109545875A CN 201811386363 A CN201811386363 A CN 201811386363A CN 109545875 A CN109545875 A CN 109545875A
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- solar panel
- assembly body
- panel assembly
- chip
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- 238000003672 processing method Methods 0.000 title claims abstract description 30
- 239000000758 substrate Substances 0.000 claims abstract description 28
- 238000010030 laminating Methods 0.000 claims abstract description 24
- 238000005520 cutting process Methods 0.000 claims abstract description 9
- 238000007596 consolidation process Methods 0.000 claims abstract description 6
- 238000005476 soldering Methods 0.000 claims abstract description 5
- 238000003556 assay Methods 0.000 claims abstract description 4
- 238000005498 polishing Methods 0.000 claims abstract description 4
- 239000010410 layer Substances 0.000 claims description 31
- 238000003475 lamination Methods 0.000 claims description 26
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 14
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 12
- 229920000728 polyester Polymers 0.000 claims description 11
- HCDGVLDPFQMKDK-UHFFFAOYSA-N hexafluoropropylene Chemical compound FC(F)=C(F)C(F)(F)F HCDGVLDPFQMKDK-UHFFFAOYSA-N 0.000 claims description 7
- -1 polytetrafluoroethylene Polymers 0.000 claims description 7
- 239000003795 chemical substances by application Substances 0.000 claims description 6
- 239000003822 epoxy resin Substances 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 6
- 229920000647 polyepoxide Polymers 0.000 claims description 6
- 239000002904 solvent Substances 0.000 claims description 6
- 239000012790 adhesive layer Substances 0.000 claims description 5
- 238000000465 moulding Methods 0.000 claims description 5
- 238000000748 compression moulding Methods 0.000 claims description 4
- 238000012797 qualification Methods 0.000 claims description 4
- 238000007711 solidification Methods 0.000 claims description 4
- 230000008023 solidification Effects 0.000 claims description 4
- 230000006835 compression Effects 0.000 claims description 3
- 238000007906 compression Methods 0.000 claims description 3
- 238000001816 cooling Methods 0.000 claims description 3
- 238000009434 installation Methods 0.000 claims description 3
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 3
- 238000002834 transmittance Methods 0.000 claims description 3
- 229910021421 monocrystalline silicon Inorganic materials 0.000 claims description 2
- 239000005341 toughened glass Substances 0.000 claims description 2
- 238000012545 processing Methods 0.000 abstract description 19
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 238000000034 method Methods 0.000 description 10
- 230000006872 improvement Effects 0.000 description 8
- 230000008569 process Effects 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 6
- 238000001723 curing Methods 0.000 description 4
- 230000035699 permeability Effects 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000004939 coking Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000007717 exclusion Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000036316 preload Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000006748 scratching Methods 0.000 description 1
- 230000002393 scratching effect Effects 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005496 tempering Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
- H01L31/049—Protective back sheets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1876—Particular processes or apparatus for batch treatment of the devices
- H01L31/188—Apparatus specially adapted for automatic interconnection of solar cells in a module
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Sustainable Energy (AREA)
- Manufacturing & Machinery (AREA)
- Photovoltaic Devices (AREA)
Abstract
The present invention provides a kind of processing methods of solar panel.The following steps are included: providing the muti-piece chip of well cutting, muti-piece chip is successively laid side by side, and to progress soldering, then consolidation service, the big chip of muti-piece is laid side by side the surface in transparent substrates and is sequentially connected in series connection by conductive paper and forms solar battery, in the head end of solar battery, anode tap is set, in the end of solar battery, cathode leg is set, notacoria is layed in the side backwards to transparent substrates of solar battery, form solar panel assembly body, polishing is carried out to solar panel assembly body, to the power of solar panel assembly body, electric current and voltage are tested, laminating operation is carried out to solar panel assembly body after the assay was approved by laminating machine, finally carry out assembling operation.Using the processing method of solar panel in the present invention, manufacturing procedure can simplify, improve the processing quality of solar panel.
Description
Technical field
The present invention relates to solar panel field, the processing method for relating in particular to a kind of solar panel.
Background technique
Solar panel is the core in solar power system, and effect is to convert the radianting capacity of the sun
Get up for power storage, therefore the quality of solar panel and cost directly determine the quality and cost of entire electricity generation system.
Traditional solar panels production has the following disadvantages, and specifically include: (1) thickness of solar panel is thicker, product
It is easy to produce bubble, product rejection rate is higher;(2) notacoria inoxidizability, moisture resistance and air exclusion performance are bad, have one
Fixed security risk;(3) processing technology is complicated, and production cost is higher.It is therefore desirable to existing solar panel processing side
Method improves, and improves the quality of solar panel, reduces production cost.
Summary of the invention
In view of the foregoing, the present invention provides a kind of processing method of solar panel, can with optimization processing technology,
Improve the processing quality of solar panel.
To achieve the above object, a kind of processing method of solar panel of the present invention, comprising the following steps:
The muti-piece chip of well cutting is provided;
Chip described in muti-piece is successively laid side by side, and soldering is carried out to adjacent two chip, it is big to form strip
Chip;
Consolidation service provides big chip described in transparent substrates, notacoria and muti-piece, by big chip described in muti-piece be laid side by side in
The surface of the transparent substrates is simultaneously sequentially connected in series connection by conductive paper and forms solar battery, the head of Yu Suoshu solar battery
End setting anode tap, the end of Yu Suoshu solar battery are arranged cathode leg, the notacoria are layed in the solar energy
The side backwards to the transparent substrates of battery, forms solar panel assembly body;
Detect operation, polishing carried out to the solar panel assembly body, to the power of solar panel assembly body,
Electric current and voltage are tested, and whether power, electric current and the voltage for detecting solar panel assembly body are qualified;
Laminating operation, laminating temperature 100 are carried out to solar panel assembly body after the assay was approved by laminating machine
DEG C -160 DEG C, lamination times 5min-10min, lamination vacuum degree is 100pa-15pa, lamination pressure 0.1Mpa-1.2Mpa;
Assembling operation, including being spelled to the solar panel assembly body installation frame after lamination and in solar panel
Cable concentrator is installed at the back side for filling body, is equipped with the battery for being electrically connected to solar battery in cable concentrator.
The beneficial effects of the present invention are: notacoria is laid with by rear surface of solar cell, it is ensured that after processing preparation
Solar panel has preferable permeability resistance, and steam, moisture is avoided to enter, and then extends the use longevity of solar panel
Life;Laminating temperature is 100 DEG C -160 DEG C, lamination times 5min-10min, can be to avoid due to temperature is excessively high or overlong time
Coking phenomenon occurs, is 100pa-15pa by setting lamination vacuum degree, air in solar panel assembly body can be taken out
Out, it avoids occurring in heat curing process damaging solar panel when the air heats in solar panel assembly body are gone out
Assembled body then guarantees the quality of final finished, solar battery plate surface after molding is avoided bubble occur.
A kind of processing method of solar panel of the present invention further improvement lies in that, in providing multiple crystalline substances of well cutting
In piece step, the edge of the chip of well cutting is smoothed.Guarantee that chip has preferable visual impression, keeps away simultaneously
Exempt to scratch staff during assembly, improves process safety.
A kind of processing method of solar panel of the present invention further improvement lies in that, the notacoria includes from inside to outside
Three-decker, outer layer is weathering layer, and middle layer is PET polyester, and internal layer is EVA layer, and the weathering layer includes following weight
The each component of part: 45-60 parts of polytetrafluoroethylene (PTFE), 6-10 parts of hexafluoropropene, 10-20 parts of epoxy resin, 4-8 parts of curing agent and solvent
12-22 parts.Notacoria has preferable weatherability, stretch-proof intensity and inoxidizability.
A kind of further improvement of processing method of solar panel of the present invention is, in the offer notacoria step
Before further include step, prepare notacoria;
Prepare notacoria comprising steps of
Weathering layer is prepared, polytetrafluoroethylene (PTFE), hexafluoropropene, epoxy resin and curing agent are added in solvent and is constantly stirred
Mix, it is to be mixed uniformly after pour into and carry out compression molding operation in mold;
PET polyester former material is provided;
EVA layer former material is provided;
The EVA layer former material, the PET polyester former material and the weathering layer are pressed and molded, notacoria is generated.
Compared with notacoria in the prior art, the processing technology of notacoria is simple in the present invention, and processing cost is low.
A kind of processing method of solar panel of the present invention further improvement lies in that, the notacoria includes stacking gradually
The ambroin and insulating paper of laying.
A kind of processing method of solar panel of the present invention further improvement lies in that, in by laminating machine to qualification after
Solar panel assembly body carry out laminating operation step in comprising steps of
Solar panel assembly body is placed in laminating machine;
Precompressed and the pre-heat treatment are carried out to the solar panel assembly body;
It carries out vacuumizing operation, the air in the solar panel assembly body be extracted out, so that vacuum degree is maintained at
Within the scope of 100pa-15pa;
The solar panel assembly body is heated, while the operation that carries out pneumatic compression, completes solar battery
The lamination and solidification of plate assembly body;
After cooling, solar panel assembly body after molding is taken out.
Using above-mentioned processing method, the air in solar panel assembly body can be drained, be further ensured that processing
The quality of solar panel after molding.
A kind of processing method of solar panel of the present invention further improvement lies in that, in consolidation service step,
Adhesive layer is set between the big chip and the transparent substrates, for bonding the big chip and the transparent substrates.It utilizes
Adhesive layer realizes the sealed connection between big chip and transparent substrates.
A kind of further improve of the processing method of solar panel of the present invention be, the light transmission of the transparent substrates
Rate is greater than 92%.By setting the transmitance of transparent substrates sunlight, guarantee the generating efficiency of solar panel.
A kind of further improvement of processing method of solar panel of the present invention is that the chip selects monocrystalline silicon
Chip or polycrystalline silicon wafer.
A kind of processing method of solar panel of the present invention further improvement lies in that, the transparent substrates select tempering
Glass.
Detailed description of the invention
Fig. 1 is a kind of flow chart of the processing method of solar panel of the present invention.
Specific embodiment
For the benefit of to understanding of the invention, it is illustrated with reference to the accompanying drawings and embodiments.
Referring to Fig. 1, the present invention provides a kind of processing methods of solar panel, comprising the following steps:
Step 101: the muti-piece chip of well cutting is provided;
Step 102: muti-piece chip successively being laid side by side, and soldering is carried out to adjacent two chip, it is big to form strip
Chip;
Step 103: consolidation service provides transparent substrates, notacoria and the big chip of muti-piece, by the big chip of muti-piece be laid side by side in
The surface of transparent substrates is simultaneously sequentially connected in series connection by conductive paper and forms solar battery, and sun is arranged in the head end of solar battery
Cathode leg is arranged in the end of solar battery in pole lead, and notacoria is layed in the transparent substrates backwards of solar battery
Side forms solar panel assembly body;
Step 104: detection operation carries out polishing to solar panel assembly body, to solar panel assembly body
Power, electric current and voltage are tested, and whether power, electric current and the voltage for detecting solar panel assembly body are qualified;
Step 105: laminating operation, lamination temperature are carried out to solar panel assembly body after the assay was approved by laminating machine
Degree is 100 DEG C -160 DEG C, lamination times 5min-10min, and lamination vacuum degree is 100pa-15pa, lamination pressure 0.1Mpa-
1.2Mpa;
Step 106: assembling operation, including to the solar panel assembly body installation frame after lamination and in solar energy
Cable concentrator is installed at the back side of solar panel assembly body, is equipped with the battery for being electrically connected to solar battery in cable concentrator.
In the present embodiment, (1) is by being laid with notacoria at the back side of solar battery, it is ensured that the solar-electricity after processing
Pond plate has good permeability resistance, effectively avoids steam, moisture from entering, and then extend the service life of solar panel;
It (2), can be to avoid because of temperature by setting 100 DEG C -160 DEG C for laminating temperature and setting 5min-10min for lamination times
Spending high or overlong time causes the component in solar panel assembly body that coking occurs;(3) by by solar panel
Air extraction in assembled body guarantees that lamination vacuum degree control for 100pa-15pa, avoids in solar panel assembly body
Air (including bubble) gone out because heated, and solar panel assembly body is caused to damage, then guarantees finished product after processing
Quality;(4) manufacturing procedure is simple, and processing cost is lower;(5) laminating machine selects the laminating machine of LYL-C 36*22 model.
Further, in by laminating machine to after qualification solar panel assembly body carry out laminating operation step in wrap
Include step:
Step 201: solar panel assembly body is placed in laminating machine;
Step 202: precompressed and the pre-heat treatment are carried out to solar panel assembly body;
Step 203: carrying out vacuumizing operation, the air in solar panel assembly body is extracted out, so that vacuum degree is protected
It holds within the scope of 100pa-15pa;
Step 204: solar panel assembly body being heated, while the operation that carries out pneumatic compression, complete solar energy
The lamination and solidification of solar panel assembly body;
Step 205: after cooling, taking out solar panel assembly body after molding.
In the present embodiment, the purpose of (1) precompressed and the pre-heat treatment is, by each component in solar panel assembly body it
Between and each component in air discharge, prevent the air in later period heating and inflating pressure operation in component from going out damage solar energy
Solar panel assembly body reduces rejection rate;Specifically, preload pressure be 0.1MPa-0.3MPa, squeeze time 1min-2min, in advance
Hot temperature is 100 DEG C -120 DEG C;(2) compared with prior art, inflating pressure (lamination) technique laminating efficiency with higher, together
When guarantee lamination process in solar panel assembly body uniform throughout stress, and then guarantee lamination quality;(3) step 204
In, the time of inflating pressure operation is 4min-8min, and pressurization (lamination) pressure is 0.3MPa-1.2MPa, heating temperature 120
℃-160℃。
Further, in step 101, the edge of the chip of well cutting is smoothed.In the present embodiment,
By being smoothed Waffer edge, avoid scratching staff during assembly, while can guarantee after smoothing processing
The accuracy of chip assembly position has preferable visual impression.
Further, it in step 102, when carrying out soldering to chip, is shifted to install between adjacent welds.This reality
It applies in example, raising shifts to install solder joint, electric pole short circuit phenomenon occurs after avoiding welding, improves yield rate.
Further, in step 103, adhesive layer is set between big chip and transparent substrates, for bonding big chip
And transparent substrates.In the present embodiment, the sealed connection between big chip and transparent substrates is realized by adhesive layer, and in later period layer
The solidification between big chip and transparent substrates is realized in pressure step.
Further, the light transmittance of transparent substrates is greater than 92%.In the present embodiment, by selecting the preferable light transmission of light transmittance
Substrate, it is ensured that the generating efficiency of solar panel improves qualification rate.
In the present invention, chip selects silicon single crystal wafer or polycrystalline silicon wafer;Transparent substrates select tempered glass.
Embodiment one:
Notacoria includes three-decker from inside to outside, and outer layer is weathering layer, and middle layer is PET polyester, internal layer EVA
Layer, weathering layer includes each component of following parts by weight: 45-60 parts of polytetrafluoroethylene (PTFE), 6-10 parts of hexafluoropropene, epoxy resin 10-
20 parts, 4-8 parts of curing agent and 12-22 parts of solvent.In the present embodiment, by weathering layer raw material add polytetrafluoroethylene (PTFE) and
Hexafluoropropene, it is ensured that the weathering layer prepared has preferable chemical resistance, good resilience and and PET polyester
Between preferable adhesiveness;By the way that PET polyester is arranged, it is ensured that notacoria has good anti-breakdown, with the prior art
Notacoria improves about 80% compared to its anti-breakdown performance, guarantees safety when solar panel uses.
Further, further include step before the notacoria step is provided, prepare notacoria;Wherein, preparing notacoria includes step
It is rapid:
Step 301: preparing weathering layer, polytetrafluoroethylene (PTFE), hexafluoropropene, epoxy resin and curing agent are added in solvent
And be stirred continuously, it is to be mixed uniformly after pour into and carry out compression molding operation in mold;
Step 302: PET polyester former material is provided;
Step 303: EVA layer former material is provided;
Step 304: by EVA layer former material, PET polyester former material and weather-proof compression molding, generating notacoria.
In the present embodiment, lamination process notacoria is not easy buckling phenomena occur, at the same have good anti-flammability and
The feature of environmental protection has better permeability resistance compared with common notacoria in the prior art, and steam, moisture can effectively be avoided to enter too
In positive energy battery, and then extend the service life of solar panel.
Embodiment two:
Notacoria includes the ambroin and insulating paper for stacking gradually laying.By the back side of chip be arranged ambroin and
Insulating paper can prevent steam, moisture from entering in solar panel, while play insulating effect, improve solar panel
Safety in use process.It is worn specifically, aligning to offer on ambroin and insulating paper for anode tap and cathode leg
If perforation, encapsulation process is passed through at punch position.
In the present invention, in assembling operation step, select aluminum alloy frame to the solar panel assembly body after lamination
Carry out edge sealing processing;Wherein, it in edge sealing processing, needs to do encapsulation process to solar panel assembly body surrounding;It is specific to use
Sealing ring or sealant.
In the present invention, big chip include one anode and a cathode, in assembled step, adjacent two big chip anode and it is negative
Pole laying is contrary, specific in 180 ° of layings;In the present embodiment, by by adjacent two big chip anode and cathode laying side
To on the contrary, reducing conductive paper usage amount convenient for realizing the series connection between adjacent big chip by conductive paper, reduction is processed into
This.
In the present invention, the storage to electric energy is realized by battery.
The beneficial effect of the processing method of an of the invention solar panel includes:
1. the solar panel after processing has good permeability resistance, steam, moisture is effectively avoided to enter, Jin Eryan
The service life of long solar panel.
2., can be to avoid in solar panel assembly body by extracting the air in solar panel assembly body out
Air ensure that the matter of solar battery board finished product after processing because damaging caused by heated go out to solar panel assembly body
Amount.
3. simplifying processing technology, processing cost is reduced.
The above is only presently preferred embodiments of the present invention, not do limitation in any form to the present invention, although this
Invention has been disclosed in a preferred embodiment above, and however, it is not intended to limit the invention, any person skilled in the art,
In the range of not departing from technical solution of the present invention, when the technology contents using the disclosure above make a little change or are modified to
With the equivalent embodiment of variation, but anything that does not depart from the technical scheme of the invention content, according to the technical essence of the invention to
Any simple modification, equivalent change and modification made by upper embodiment, all of which are still within the scope of the technical scheme of the invention.
It should be noted that this specification structure depicted in this specification institute accompanying drawings, ratio, size etc., only to cooperate
The bright revealed content of book is not intended to limit the invention enforceable limit so that those skilled in the art understands and reads
Fixed condition, therefore do not have technical essential meaning, the modification of any structure, the change of proportionate relationship or the adjustment of size, not
It influences still fall in disclosed technology contents under the effect of present invention can be generated and the purpose that can reach
In the range of capable of covering.
Claims (10)
1. a kind of processing method of solar panel, which comprises the following steps:
The muti-piece chip of well cutting is provided;
Chip described in muti-piece is successively laid side by side, and soldering is carried out to adjacent two chip, forms the big chip of strip;
Consolidation service provides big chip described in transparent substrates, notacoria and muti-piece, and big chip described in muti-piece is laid side by side in described
The surface of transparent substrates is simultaneously sequentially connected in series connection by conductive paper and forms solar battery, and the head end of Yu Suoshu solar battery is set
Anode tap is set, the end of Yu Suoshu solar battery is arranged cathode leg, the notacoria is layed in the solar battery
Backwards to the transparent substrates side, formed solar panel assembly body;
Operation is detected, polishing, power, electric current to solar panel assembly body are carried out to the solar panel assembly body
It is tested with voltage, whether power, electric current and the voltage for detecting solar panel assembly body are qualified;
By laminating machine to after the assay was approved solar panel assembly body carry out laminating operation, laminating temperature be 100 DEG C-
160 DEG C, lamination times 5min-10min, lamination vacuum degree is 100pa-15pa, lamination pressure 0.1Mpa-1.2Mpa;
Assembling operation, including to the solar panel assembly body installation frame after lamination and in solar panel assembly body
The back side cable concentrator is installed, the battery for being electrically connected to solar battery is installed in cable concentrator.
2. a kind of processing method of solar panel according to claim 1, it is characterised in that: in offer well cutting
In multiple chip steps, the edge of the chip of well cutting is smoothed.
3. a kind of processing method of solar panel according to claim 1, it is characterised in that: the notacoria includes certainly
Three-decker from inside to outside, outer layer are weathering layer, and middle layer is PET polyester, and internal layer is EVA layer, the weathering layer include with
The each component of lower parts by weight: 45-60 parts of polytetrafluoroethylene (PTFE), 6-10 parts of hexafluoropropene, 10-20 parts of epoxy resin, 4-8 parts of curing agent
With 12-22 parts of solvent.
4. a kind of processing method of solar panel according to claim 3, which is characterized in that in the offer notacoria
Further include step before step, prepares notacoria;
Prepare notacoria comprising steps of
Weathering layer is prepared, polytetrafluoroethylene (PTFE), hexafluoropropene, epoxy resin and curing agent are added in solvent and are stirred continuously,
It is to be mixed uniformly after pour into and carry out compression molding operation in mold;
PET polyester former material is provided;
EVA layer former material is provided;
The EVA layer former material, the PET polyester former material and the weathering layer are pressed and molded, notacoria is generated.
5. a kind of processing method of solar panel according to claim 1, it is characterised in that: the notacoria include according to
The ambroin and insulating paper of secondary stack paving.
6. a kind of processing method of solar panel according to claim 1, which is characterized in that in pass through laminating machine pair
Solar panel assembly body after qualification carry out in laminating operation step comprising steps of
Solar panel assembly body is placed in laminating machine;
Precompressed and the pre-heat treatment are carried out to the solar panel assembly body;
It carries out vacuumizing operation, the air in the solar panel assembly body be extracted out, so that vacuum degree is maintained at
Within the scope of 100pa-15pa;
The solar panel assembly body is heated, while the operation that carries out pneumatic compression, completes solar panel and spell
Fill the lamination and solidification of body;
After cooling, solar panel assembly body after molding is taken out.
7. a kind of processing method of solar panel according to claim 1, it is characterised in that: in consolidation service step
In, adhesive layer is set between the big chip and the transparent substrates, for bonding the big chip and the transparent substrates.
8. a kind of processing method of solar panel according to claim 1, it is characterised in that: the transparent substrates
Light transmittance is greater than 92%.
9. a kind of processing method of solar panel according to claim 1, it is characterised in that: the chip is selected single
Crystal silicon chip or polycrystalline silicon wafer.
10. a kind of processing method of solar panel according to claim 1, it is characterised in that: the transparent substrates
Select tempered glass.
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CN204834648U (en) * | 2015-08-21 | 2015-12-02 | 阿特斯(中国)投资有限公司 | Solar cell module |
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JP2001036108A (en) * | 1999-07-23 | 2001-02-09 | Bridgestone Corp | Solar battery |
CN101359695A (en) * | 2008-09-02 | 2009-02-04 | 中国乐凯胶片集团公司 | Back plate of solar cell |
CN104465883A (en) * | 2014-12-23 | 2015-03-25 | 常熟高嘉能源科技有限公司 | Method for producing polycrystalline silicon solar component |
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