CN109545074A - A kind of adhesive label process for making - Google Patents
A kind of adhesive label process for making Download PDFInfo
- Publication number
- CN109545074A CN109545074A CN201910009623.8A CN201910009623A CN109545074A CN 109545074 A CN109545074 A CN 109545074A CN 201910009623 A CN201910009623 A CN 201910009623A CN 109545074 A CN109545074 A CN 109545074A
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- China
- Prior art keywords
- adhesive
- production method
- lattice
- melting
- film layer
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F3/00—Labels, tag tickets, or similar identification or indication means; Seals; Postage or like stamps
- G09F3/02—Forms or constructions
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F3/00—Labels, tag tickets, or similar identification or indication means; Seals; Postage or like stamps
- G09F3/02—Forms or constructions
- G09F2003/023—Adhesive
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Making Paper Articles (AREA)
Abstract
A kind of adhesive label production method includes the following steps: that (1) coats the first gluing oxidant layer on label substrate, and first its center height is higher than height on both sides；(2) the second adhesive is coated in the two sides lower than intermediate altitude of the first gluing oxidant layer, second adhesive is electron beam (EB) cured adhesive；(3) fused film layer is set outside the second adhesive；(4) lattice is attached to outside melting film layer, is printed in lattice and substrate；(5) lattice is penetrated by electron beam and irradiates the second adhesive, keep the second adhesive and the first adhesive mixing cured；(6) melting film layer is heated, melts the melting film layer；(7) the mixing cured part of the second adhesive and the first adhesive is cut off after cooling down；(8) cured portion of cutting is removed.
Description
Technical field
The present invention relates to a kind of label fabrication process, more particularly, to a kind of adhesive label process for making.
Background technique
Label provides the attribute of identification commodity to people, it reflects commodity with the printing that excellent design and exquisite dress are drilled
Interior quality.Label is long-standing, many kinds of, but adhesive label is a kind of label being widely used at present, it is packet
The dress decoration common material of industry.
Adhesive label is also referred to as self-adhesive label, posting in time, Sticky Note etc., be using paper, film or special material as fabric,
The back side is coated with adhesive, to apply a kind of composite material of the silicon protection sheet as base stock, becomes finished product after the processing such as being printed and being die cut
Label.Using when can be with hand paste to the surface of various substrates, it is possible to use labelling machine automatic labeling in the production line.It does not do
Glue material with its production flexibly, the advantages that adapting to the print request of exquisite label, meeting designer's a variety of demands and gradually by state
Interior market is received, and is largely used in the industries such as daily use chemicals, logistics, medicine, electronics, and gradually gos deep into each neck of people's life
Domain.
Compared with traditional label, adhesive label does not have to brush coating, pollution-free, can conveniently be applied to various fields
It closes, it may be said that adhesive label is a kind of omnipotent label.Pressure-sensitive table printing is more complicated in technique compared with traditional printing,
There are requirements at the higher level to the quality of equipment performance and operator.
In the production of adhesive label, cross cutting is a very important link, and the quality for being die cut quality directly affects
The quality of final products.Cross cutting Darts refer to the phenomenon that label is taken up with waste discharge side in die cutting process.It is die cut Darts
The phenomenon that it is very common in daily production, will cause the waste of raw material and bring many troubles to subsequent handling.Cause to be die cut
One of the reason of Darts, is gradually accumulate residue glue in knife version during die-cutting production, if residue glue accumulation is to a certain extent
The marginal belt of label will be got up, to be easy to that label tape gets up and causes cross cutting Darts when waste discharge.
In order to solve to reduce cross cutting Darts, the patent of invention of CN20120020788.1 proposes one kind not in the prior art
Dry glue label producing method, wherein the crosscutting part of gluing oxidant layer is solidified in advance by the cured adhesive of UV, thus knife version
Adhesive will not be bonded when crosscutting, avoid being die cut Darts situation caused by knife version accumulation residue glue.However, the technical solution of the invention
In, cause not removing after cutting off since adhesive can be fixed to be bonded on lattice when solidifying, needs to solidify in adhesive
After lattice is attached in gluing oxidant layer again, but adhesive solidification after volume can generate contraction, cause substrate to generate
Deformation influences the effect of substrate printing.
Summary of the invention
The present invention provides a kind of adhesive label manufacture craft, can after substrate is printed resolidification gluing oxidant layer
Crosscutting part, thus will not be because of the effect for solidifying influence printing.
As one aspect of the present invention, a kind of adhesive label production method is provided, includes the following steps: that (1) is being marked
The first gluing oxidant layer is coated on label substrate, the center height of the first gluing oxidant layer is higher than height on both sides；(2) in the first gluing
The two sides lower than intermediate altitude of oxidant layer coat the second adhesive, and second adhesive is electron beam (EB) cured adhesive；
(3) fused film layer is set outside the second adhesive；(4) lattice is attached to outside melting film layer, lattice and substrate into
Row printing；(5) lattice is penetrated by electron beam and irradiates the second adhesive, mix the second adhesive with the first adhesive solid
Change；(6) melting film layer is heated, melts the melting film layer；(7) the second adhesive and the first glue are cut off after cooling down
The mixing cured part of stick；(8) cured portion of cutting is separated.
Further, the thickness of the second adhesive of coating is slightly less than the first gluing in the step (1) in the step (2)
The difference of oxidant layer center height and height on both sides.
Further, the fused film is prepared using resin material.
Further, the resin material is polypropylene.
Further, the melting temperature is 170 ~ 180 degree.
Further, the thickness of the fused film is about 1 μm.
Further, the lattice uses the release film preparation of PET, is greater than adding in the step (7) using temperature
Hot temperature.
Detailed description of the invention
Fig. 1 is the adhesive label manufacturing process cross-sectional view of the embodiment of the present invention.
Specific embodiment
In order to illustrate more clearly of technical solution of the present invention, embodiment will be used simply to be situated between the present invention below
Continue, it should be apparent that, be described below in be only one embodiment of the present of invention, for those of ordinary skill in the art come
It says, without any creative labor, other technical solutions can also be obtained according to these embodiments, also belonged to
Disclosure of the invention range.
A kind of adhesive label production method of the embodiment of the present invention referring first to Fig. 1 (a), is being marked as shown in fig. 1
The first gluing oxidant layer 20 is coated on label substrate 10, wherein the center height of the first gluing oxidant layer 20 is higher than height on both sides.First glue
Adhesive layer center height thickness can be at 15 μm~20 μm, and height on both sides can be at 10 μm~15 μm；First adhesive can be
Propylene adhesive, is also possible to rubber series adhesive or silicon systems adhesive, and preferred first adhesive is with higher change
The adhesive of matter temperature.
Then, as shown in Figure 1 (b), the second gluing is coated in the two sides lower than intermediate altitude of the first gluing oxidant layer 20
Agent 30, the second adhesive 30 are electron beam (EB) cured adhesive, can be consolidated when by 8 ~ 20 bold and unconstrained ladd electron beam irradiation
Change.Second adhesive 30 is only able to use electron beam (EB) cured adhesive and cannot use ultraviolet light (UV) cured adhesive,
Because electron beam (EB) has penetration capacity, the second adhesive 30 can be irradiated to through insulation.Coat the second adhesive
Thickness is slightly less than the difference of the first gluing oxidant layer center height and height on both sides in Fig. 1 (a).
Then, as shown in Figure 1 (c), fused film layer 40 is set outside the second adhesive 30, makes to melt the covering of film layer 40 the
Two adhesive 30.Melting film layer 40 includes left side and right side, is covered each by the second glue of 20 two sides of the first gluing oxidant layer
Stick 30.Melting film layer 40 can be melted when reaching its melting temperature contacts the second adhesive 30 with the lattice 50 outside it.
Melt film layer 40 thickness be about 1 μm, can be used polyacrylic resin material preparation melting film layer 40, melting temperature be 170 ~
180 degree.
Then, as shown in Figure 1 (d), it is attached to outside melting film layer 40 in lattice 50, PET can be used in lattice 50
Release film preparation is greater than the melting temperature in melting film layer 40 using temperature.Printed label day can be carried out in lattice 50
Phase etc., in 10 printed label information of substrate.Common ink printing or the printing of UV ink can be used.
Then, as shown in Fig. 1 (e), lattice 50 is penetrated by electron beam and irradiates the second adhesive 30, makes the second gluing
Agent and the first adhesive 20 are mixing cured, form mixing cured part 31.As shown in Fig. 1 (f), melting film layer 40 is carried out
Heating reaches the melting temperature of melting film layer 40, makes to melt the melting of film layer 40, makes mixing cured part 31 and point outside it
It is contacted every portion 50.As shown in Fig. 1 (g), the mixing of the second adhesive 30 and the first adhesive 20 is cut off after cooling by knife version
Cured portion 31.As shown in Fig. 1 (h), the mixing cured part 31 of cutting is separated.Embodiment through the invention, not
After dry glue label finishes printing, then the solidification of place of incision is carried out, so that adhesive sticker will not be influenced because of the solidification of place of incision
The effect of label printing.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the scope of the present invention.This hair
Relative size in bright attached drawing needs and is arranged merely to showing, is not specifically limited it.Such as it is melted in the present invention
Melt film thickness can be relative to other elements it is very thin.Specific features described in the present invention, structure, material or
Feature may be combined in any suitable manner in any one or more of the embodiments or examples.In addition, in not conflicting situation
Under, those skilled in the art can be by different embodiments or examples described in this specification and different embodiments or examples
Feature be combined.Any modification, equivalent substitution and improvement done within the spirit and principles of the present invention
Deng being included within the scope of protection of the present invention.
Claims (7)
1. a kind of adhesive label production method includes the following steps: that (1) coats the first gluing oxidant layer, institute on label substrate
The center height for stating the first gluing oxidant layer is higher than height on both sides；(2) it is applied in the two sides lower than intermediate altitude of the first gluing oxidant layer
The second adhesive is covered, second adhesive is electron beam (EB) cured adhesive；(3) fused film is set outside the second adhesive
Layer；(4) lattice is attached to outside melting film layer, is printed in lattice and substrate；(5) separation is penetrated by electron beam
The second adhesive is irradiated in portion, keeps the second adhesive and the first adhesive mixing cured；(6) melting film layer is heated, is made
The melting film layer melting；(7) the mixing cured part of the second adhesive and the first adhesive is cut off after cooling down；It (8) will cutting
Cured portion removing.
2. adhesive label production method according to claim 1, it is characterised in that: coating second in the step (2)
The thickness of adhesive is slightly less than the difference of the first gluing oxidant layer center height and height on both sides in the step (1).
3. adhesive label production method according to claim 2, it is characterised in that: the fused film uses resin material
Preparation.
4. adhesive label production method according to claim 3, it is characterised in that: the resin material is polypropylene.
5. adhesive label production method according to claim 3, it is characterised in that: the melting temperature is about 170 ~
180 degree.
6. adhesive label production method according to claim 3, it is characterised in that: the thickness of the fused film is about 1 μ
m。
7. adhesive label production method according to claim 3, it is characterised in that: the lattice is release using PET
Film preparation is greater than the heating temperature in the step (7) using temperature.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910009623.8A CN109545074B (en) | 2019-01-05 | 2019-01-05 | Adhesive label manufacturing process method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910009623.8A CN109545074B (en) | 2019-01-05 | 2019-01-05 | Adhesive label manufacturing process method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109545074A true CN109545074A (en) | 2019-03-29 |
| CN109545074B CN109545074B (en) | 2021-06-18 |
Family
ID=65834268
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910009623.8A Active CN109545074B (en) | 2019-01-05 | 2019-01-05 | Adhesive label manufacturing process method |
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| CN (1) | CN109545074B (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004317833A (en) * | 2003-04-17 | 2004-11-11 | Kindaisha:Kk | Label slip and its manufacturing method |
| CN101014676A (en) * | 2004-05-06 | 2007-08-08 | 三井化学株式会社 | Adhesive film and method for manufacturing semiconductor device using same |
| CN101792644A (en) * | 2008-12-25 | 2010-08-04 | 仁宝电脑工业股份有限公司 | Heat bonding film |
| JP4574221B2 (en) * | 2004-05-06 | 2010-11-04 | 大阪シーリング印刷株式会社 | Label paper |
| CN103201780A (en) * | 2010-10-22 | 2013-07-10 | 佐藤控股株式会社 | Label and method for producing same |
| CN103354060A (en) * | 2013-07-24 | 2013-10-16 | 上海宏盾防伪材料有限公司 | Legal certificate visual anti-fake component and preparation method thereof |
| CN105765024A (en) * | 2013-11-26 | 2016-07-13 | 株式会社E-Tec | Photocurable adhesive composition, adhesive sheet and laminate |
| CN106433505A (en) * | 2011-04-28 | 2017-02-22 | 佐藤控股株式会社 | Label manufacturing method and label |
| JP6163656B2 (en) * | 2012-10-18 | 2017-07-19 | 株式会社フジシール | Hole closing label, hole closing label continuous body, and method for producing the continuous body |
| CN108806485A (en) * | 2018-07-11 | 2018-11-13 | 广州市丽宝包装有限公司 | A kind of production method of in-mold labels |
-
2019
- 2019-01-05 CN CN201910009623.8A patent/CN109545074B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004317833A (en) * | 2003-04-17 | 2004-11-11 | Kindaisha:Kk | Label slip and its manufacturing method |
| CN101014676A (en) * | 2004-05-06 | 2007-08-08 | 三井化学株式会社 | Adhesive film and method for manufacturing semiconductor device using same |
| JP4574221B2 (en) * | 2004-05-06 | 2010-11-04 | 大阪シーリング印刷株式会社 | Label paper |
| CN101792644A (en) * | 2008-12-25 | 2010-08-04 | 仁宝电脑工业股份有限公司 | Heat bonding film |
| CN103201780A (en) * | 2010-10-22 | 2013-07-10 | 佐藤控股株式会社 | Label and method for producing same |
| CN106433505A (en) * | 2011-04-28 | 2017-02-22 | 佐藤控股株式会社 | Label manufacturing method and label |
| JP6163656B2 (en) * | 2012-10-18 | 2017-07-19 | 株式会社フジシール | Hole closing label, hole closing label continuous body, and method for producing the continuous body |
| CN103354060A (en) * | 2013-07-24 | 2013-10-16 | 上海宏盾防伪材料有限公司 | Legal certificate visual anti-fake component and preparation method thereof |
| CN105765024A (en) * | 2013-11-26 | 2016-07-13 | 株式会社E-Tec | Photocurable adhesive composition, adhesive sheet and laminate |
| CN108806485A (en) * | 2018-07-11 | 2018-11-13 | 广州市丽宝包装有限公司 | A kind of production method of in-mold labels |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109545074B (en) | 2021-06-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20210603 Address after: 215000 1998 pangjin Road, Wujiang Economic and Technological Development Zone, Suzhou, Jiangsu Province Applicant after: SUZHOU JAN TAN PACKAGING & PRINTING Co.,Ltd. Address before: 102488 Beijing Fangshan District Liangxiang Triumph Street Jianshe Road 18 -D1948 Applicant before: BEIJING YIZHILIAN TECHNOLOGY Co.,Ltd. |
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| TA01 | Transfer of patent application right | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 215000 1998 pangjin Road, Wujiang Economic and Technological Development Zone, Suzhou, Jiangsu Province Patentee after: Suzhou Jiangtian Packaging Technology Co.,Ltd. Address before: 215000 1998 pangjin Road, Wujiang Economic and Technological Development Zone, Suzhou, Jiangsu Province Patentee before: SUZHOU JAN TAN PACKAGING & PRINTING Co.,Ltd. |
|
| CP01 | Change in the name or title of a patent holder |