CN109540559A - A kind of stress resultant screening test method being applicable in on-board equipment - Google Patents
A kind of stress resultant screening test method being applicable in on-board equipment Download PDFInfo
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- CN109540559A CN109540559A CN201811427512.0A CN201811427512A CN109540559A CN 109540559 A CN109540559 A CN 109540559A CN 201811427512 A CN201811427512 A CN 201811427512A CN 109540559 A CN109540559 A CN 109540559A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M99/00—Subject matter not provided for in other groups of this subclass
- G01M99/008—Subject matter not provided for in other groups of this subclass by doing functionality tests
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Abstract
A kind of stress resultant screening test method being applicable in on-board equipment, stress resultant is temperature stress, the synthesis of mechanical oscillation stress and electric stress, stress resultant screening test method is comprising steps of whether the credit rating of confirmation test specimen, electrical fitting technology meet heaven flight requirement, if meeting execution following steps；It is arranged and meets temperature stress, mechanical oscillation stress and electric stress that test specimen meets heaven flight requirement；Whether after being powered up by electric stress to test specimen, integrated temperature stress and mechanical oscillation stress test the test specimen, broken down in the process with the test specimen that simulation satisfaction meets heaven flight claimed condition in stress resultant test.Relatively existing pilot project reduces pilot project and test period, and improves 1.3 times of experiment sieving rate or more simultaneously.
Description
Technical field
The present invention relates to the tests of satellite electron product, and in particular to a kind of stress resultant screening examination for being applicable in on-board equipment
Proved recipe method.
Background technique
As satellite model is fast-developing, the lead time shortens, and corresponding satellite development process need to optimize, especially
The test method for occupying the on-board equipment of lead time 1/5th also needs to optimize as one sees fit.
The pilot project of satellite equipment generally includes vibration, vacuum, heat, space environment compatibility test and reliability sieve
Choosing test.All the time, the screening test of satellite electron product implements " the electronic product environmental stress screening of national military standard GJB 1032
Method " requirement, usually mechanical stress power-up stress, thermal stress power-up stress method.With electronic component items ring
Border test, such as vibration, the implementation of humidity, temperature alternating comprehensive testing method, in order to adapt to the need of on-board equipment quick response
It asks, needs to carry out electric stress, Random vibration and temperature stress compbined test to on-board equipment.
Summary of the invention
The application provides a kind of stress resultant screening test method for being applicable in on-board equipment, and the stress resultant is answered for temperature
The synthesis of power, mechanical oscillation stress and electric stress, the stress resultant screening test method comprising steps of
Confirm whether the credit rating of test specimen, electrical fitting technology meet heaven flight and require, if meeting execution following steps；
It is arranged and meets temperature stress, mechanical oscillation stress and electric stress that test specimen meets heaven flight requirement；
After being powered up by electric stress to the test specimen, integrated temperature stress and mechanical oscillation stress to the test specimen into
Whether row test is broken down with the test specimen that simulation satisfaction meets heaven flight claimed condition in stress resultant test in the process.
In a kind of embodiment, the setting meets test specimen and meets the temperature stress that heaven flight requires, specifically: by point
Circuit board power consumption size in component proportion and test specimen is analysed in test specimen, selects temperature in preset cycle-index selection table
Cycle-index, the application of temperature stress.
In a kind of embodiment, the setting meets test specimen and meets the mechanical oscillation stress that heaven flight requires, specifically:
It is vibrated by low amounts grade sinusoidal low-frequency, searches out the most sensitive direction of circuit panel vibration in test specimen；
According to the most sensitive direction of vibration and vibration force direction installation test specimen in 90 °；
According to test specimen weight, the control of control point number is selected, control is spaced 90 ° of installation vibrations between points and passes
Sensor；
According to the mechanical oscillation stress test condition setting vibration stress of regulation.
In a kind of embodiment, the setting meets test specimen and meets the electric stress that heaven flight requires, specifically: according to test specimen
In-orbit different mode selects the maximum mode of power consumption as test specimen powered-up mode.
In a kind of embodiment, it is described the test specimen is powered up by electric stress after, integrated temperature stress and mechanical vibration
Dynamic stress tests the test specimen, specifically:
First apply temperature stress experimental condition, until first high-temperature residence end starts to accumulate temperature cycle times；
Apply vibration stress in the low-temperature zone that first recycles, test specimen is started to test；
It is recycled respectively according to first in the temperature cycle times of empirical value terminate to temperature cycle times later before
Mode adds vibration stress, to specimen test.
According to the stress resultant screening test method of above-described embodiment, relatively existing pilot project reduces pilot project
And the test period, and 1.3 times of experiment sieving rate or more are improved simultaneously.
Detailed description of the invention
Fig. 1 is stress resultant experiment process figure；
Fig. 2 is stress resultant experimental test figure；
Fig. 3 is that experimental condition implementation sectional view is tested in stress resultant.
Specific embodiment
Below by specific embodiment combination attached drawing, invention is further described in detail.
In order to adapt to the engineering development demand that the quick response satellite lead time is short, funds are nervous, the present invention provides one
It kind is applicable in the stress resultant screening test method of on-board equipment, what stress resultant test was taken is that temperature stress, mechanical oscillation are answered
Three kinds of stress resultants of power, electric stress.
In embodiments of the present invention, it in order to which the stress resultant test method for providing this example has certain representativeness, fits
Should before general electronic products mainly by discrete component (resistance, capacitor, normal integrated circuit etc.) and surface mounting component (CPU,
FPGA, RAM, ROM etc.) composition the characteristics of, devise fault simulation plate first, then carried out single stress and stress resultant test
Compare；Finally it is applied to spaceborne several pipe computer verification tests.
As it is known by the man skilled in the art that the electronic circuit board of Satellite Product is according to there are many functional characteristic reality of product
Type, including sorting device, surface mounting component and mass center are high, weight is big etc., in the following embodiments, just flown with a heaven
Illustrate specific implementation process for row backup single machine (number pipe computer).Selection can apply vibration stress and temperature stress simultaneously
Test specimen.
Based on above-mentioned setting, the flow chart of the stress resultant screening test method of this example is as shown in Figure 1, specifically include following
Step.
S1: confirming whether the credit rating of test specimen, electrical fitting technology meet heaven flight and require, if meeting the following step of execution
Suddenly.
Since this example is the test to meeting to go up to the sky the on-board equipment progress that flight requires, therefore, it is necessary to confirm test specimen
State will confirm test specimen specifically, to confirm that the test specimen credit rating of selection answers credit rating of going up to the sky as defined in component outline
Every electrical fitting technology be mature technology, make test specimen meet heaven flight require.
S2: setting meets test specimen and meets temperature stress, mechanical oscillation stress and electric stress that heaven flight requires.
Wherein, setting meets the concrete mode that test specimen meets the temperature stress that heaven flight requires are as follows: by analyzing test specimen
Circuit board power consumption size in middle component proportion and test specimen, the selection temperature cycles time in preset cycle-index selection table
Number, the application of temperature stress, wherein temperature stress presses temperature cycles stress sheet set temperature pulsating stress, temperature cycles
Number selects temperature cycle times by cycle-index selection table.
Temperature cycles stress sheet
Cycle-index selects table
By taking several pipe computers as an example, count pipe computer totally two pieces of circuit boards: (power panel is all direct insertion point to one piece of power panel
Class component, power consumption 7.8W), one piece of data communication board (most of data communication board is all surface mounting component, power consumption 3.5W)；Pass through
Component proportion and circuit board power size in test specimen are analyzed, selects temperature cycle times by " cycle-index selection table "
24.5 times.
It is arranged and meets the mechanical oscillation stress that test specimen meets heaven flight requirement, specifically:
It is vibrated by low amounts grade sinusoidal low-frequency, searches out the most sensitive direction of circuit panel vibration in test specimen, most sensitive direction is
Vertical board direction；
According to the most sensitive direction of vibration and vibration force direction installation test specimen in 90 °；
According to test specimen weight, the control of control point number is selected, control is spaced 90 ° of installation vibrating sensors between points；Tool
Body, number pipe computer weight 6.5kg selects 2 average controls, control is spaced 90 ° of installation vibrating sensors between points；
According to the mechanical oscillation stress test condition setting vibration stress of regulation.In this example, according to the form below mechanical oscillation stress
Vibration stress is arranged in experimental condition.
Mechanical oscillation stress sheet
It is arranged and meets the electric stress that test specimen meets heaven flight requirement, specifically: according to the in-orbit different mode of test specimen, selection
The maximum mode of power consumption is as test specimen powered-up mode；Number pipe computer divides real time data processing and first record post-processing in board pattern
Both of which；Wherein real time data processing mode power consumption is maximum, and when test selects single machine powered-up mode for real time data processing mould
Formula.
S3: after being powered up by electric stress to test specimen, integrated temperature stress and mechanical oscillation stress try test specimen
It tests, whether is broken down in the process with the test specimen that simulation satisfaction meets heaven flight claimed condition in stress resultant test.
Before step S3, test macro is also established by test specimen demand, and be adjusted to proper testing state, stress resultant examination
The schematic diagram of test test system is as shown in Fig. 2, include testboard, testboard is according to each stress data to the state of target detection plate
It is tested, it is to be checked when measuring failure, continue to test target detection plate by fault restoration, until being adjusted to proper testing
State.
Specifically, first starting to apply temperature stress experimental condition according to attached drawing 3, until first high temperature stops after test specimen power-up
End is stayed to start to accumulate times of thermal cycle；Apply vibration stress, while test specimen in the low-temperature zone (according to attached drawing 3) that first recycles
Start to test；It is recycled respectively according to first in the temperature cycle times of empirical value terminate to temperature cycle times later before
Mode adds vibration stress, to specimen test, specifically, later to the 7th time, the 14th time, the 21st time, the 24th time, according to first
The way of a circulation adds vibration stress.
Find that (3 leads disengage 10 failures in test altogether during the test；2 resistance pins disengage in test；
4 capacitor pins disengage in test；1 power supply voltage stabilizing chip circuit malfunction, test do not measure signal).During test and
When debug, until complete regulation test.
Use above specific case is illustrated the present invention, is merely used to help understand the present invention, not to limit
The system present invention.For those skilled in the art, according to the thought of the present invention, can also make several simple
It deduces, deform or replaces.
Claims (5)
1. a kind of stress resultant screening test method for being applicable in on-board equipment, which is characterized in that the stress resultant is answered for temperature
The synthesis of power, mechanical oscillation stress and electric stress, the stress resultant screening test method comprising steps of
Confirm whether the credit rating of test specimen, electrical fitting technology meet heaven flight and require, if meeting execution following steps；
It is arranged and meets temperature stress, mechanical oscillation stress and electric stress that test specimen meets heaven flight requirement；
After being powered up by electric stress to the test specimen, integrated temperature stress and mechanical oscillation stress try the test specimen
It tests, whether is broken down in the process with the test specimen that simulation satisfaction meets heaven flight claimed condition in stress resultant test.
2. stress resultant screening test method as described in claim 1, which is characterized in that the setting meets test specimen and meets
The temperature stress that its flight requires, specifically: it is big by circuit board power consumption in component proportion in analysis test specimen and test specimen
It is small, temperature cycle times, the application of temperature stress are selected in preset cycle-index selection table.
3. stress resultant screening test method as described in claim 1, which is characterized in that the setting meets test specimen and meets
The mechanical oscillation stress that its flight requires, specifically:
It is vibrated by low amounts grade sinusoidal low-frequency, searches out the most sensitive direction of circuit panel vibration in test specimen；
According to the most sensitive direction of vibration and vibration force direction installation test specimen in 90 °；
According to test specimen weight, selection control points, control is spaced 90 ° of installation vibrating sensors between points；
According to the mechanical oscillation stress test condition setting vibration stress of regulation.
4. stress resultant screening test method as described in claim 1, which is characterized in that the setting meets test specimen and meets
The electric stress that its flight requires, specifically: according to the in-orbit different mode of test specimen, the maximum mode of power consumption is selected to be powered on as test specimen
Mode.
5. stress resultant screening test method as claimed in claim 2, which is characterized in that it is described by electric stress to the examination
After part is powered up, integrated temperature stress and mechanical oscillation stress test the test specimen, specifically:
First apply temperature stress experimental condition, until first high-temperature residence end starts to accumulate temperature cycle times；
Apply vibration stress in the low-temperature zone that first recycles, test specimen is started to test；
Later to temperature cycle times terminate before in the temperature cycle times of empirical value respectively by first circulation in the way of
In addition vibration stress, to specimen test.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112362277A (en) * | 2020-10-28 | 2021-02-12 | 北京机电工程研究所 | Comprehensive test method for aircraft |
| CN114323600A (en) * | 2021-11-22 | 2022-04-12 | 北京机电工程研究所 | Comprehensive stress reliability strengthening test method |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112362277A (en) * | 2020-10-28 | 2021-02-12 | 北京机电工程研究所 | Comprehensive test method for aircraft |
| CN114323600A (en) * | 2021-11-22 | 2022-04-12 | 北京机电工程研究所 | Comprehensive stress reliability strengthening test method |
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Application publication date: 20190329 |