CN109530928A - A kind of method and device laser machining chip - Google Patents
A kind of method and device laser machining chip Download PDFInfo
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- CN109530928A CN109530928A CN201811607499.7A CN201811607499A CN109530928A CN 109530928 A CN109530928 A CN 109530928A CN 201811607499 A CN201811607499 A CN 201811607499A CN 109530928 A CN109530928 A CN 109530928A
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- laser
- groove
- galvanometer
- refrigeration mode
- chip
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
- B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The present invention provides a kind of method and device for laser machining chip, the described method includes: adjusting refrigeration mode infrared detecting chip to be processed position and angle so that groove is in a horizontal position with the laser facula plane of incidence immediately below mobile refrigeration mode infrared detecting chip to be processed center to the galvanometer of laser-processing system；The groove on one group of opposite two edges is successively processed through laser, galvanometer, the field flattening lens in laser-processing system；The worktable rotary for placing refrigeration mode infrared detecting chip is run 90 degree；Then the groove on another group of opposite two edges is successively processed through laser, galvanometer, the field flattening lens in laser-processing system again；Wherein, the groove on two groups of opposite two edges is set between the pixel layer of refrigeration mode infrared detecting chip and opposite two edges and forms a closed annular groove.The present invention can be principle by controlling time-sharing multiplex to galvanometer, disposably process two opposite grooves.Based on discontinuously processing for every groove, in the case where guaranteeing processing efficiency, heat history is effectively reduced.
Description
Technical field
The present invention relates to laser micro-machining technology field more particularly to a kind of method and devices for laser machining chip.
Background technique
Infrared detector either it is civilian or it is military all obtained good application, wherein refrigeration type infrared detector
Performance it is especially brilliant.Infrared detecting chip is often in the environment of high temperature variation in refrigeration type infrared detector, is
Guarantee that its working performance is normal, needs when working condition to carry out liquid nitrogen system to the infrared detecting chip in detector
Cold, temperature at this time is about -200 DEG C, but in the inoperative period, infrared detecting chip is an exposure under atmospheric temperature,
Such as maximum temperature can achieve 70 DEG C or so sometimes in desert, so environment temperature locating for infrared detecting chip be -
It is continually changing between 200 DEG C and 70 DEG C.
The structure of infrared detecting chip is divided into three layers, is followed successively by photosensitive layer, epoxy resin layer, chip circuit from top to bottom
Layer, photosensitive layer material includes mercury cadmium telluride, tellurium cadmium indium etc..Therefore, cadmium mercury telluride layer and epoxy resin layer are closely coupled, due to they
Thermal energy is swollen, and coefficient difference is larger, so under long-term environment temperature acute variation, it is inclined that they are easy to happen position between two layers
It moves.Positional shift caused by this thermal stress repeatedly causes the indium column connecting with cadmium mercury telluride layer to be broken, and the fracture of indium column is so that tellurium
Cadmium mercury layer (photosensitive layer) connect fracture with the chip circuit layer of chip bottom, directly contributes infrared detector and is not available.
The method of reply problem above is to prepare groove in the position close to chip edge at present, and groove can effectively delay
The thermal stress effect between cadmium mercury telluride layer and epoxy resin layer is rushed, influence of the thermal stress to infrared detecting chip structure is reduced.System
The narrower the width of standby groove the better, and depth just extends through bottom chip circuit layer.Traditional groove preparation method is mainly divided
For two major classes: wet etching and dry etching.
Wet etching prepares groove, sample is immersed in certain chemical reagent or reagent solution, makes not against corrosion
That a part of film surface of agent masking occurs chemical reaction with reagent and is removed.The advantages of this method: easy to operate, set
For requiring, low, Etch selectivity is good；Disadvantage: primary need carries out photoetching process to each chip, time-consuming and laborious, the second corrosion antimony
Cadmium mercury and epoxy resin need different corrosive liquids, and etching process is complicated, and precision is low, easy damaged bottom reading circuit.
Dry etching prepares groove, and under low vacuum specific gas environment, gas exists sample with plasmoid, leads to
It crosses the acceleration of electric field, bombards in the region that sample needs to process, plasma can chemically react with specimen material and by sample
The atom of material surface is hit, and achievees the purpose that etching removal.The advantages of dry etching: the first Etch selectivity and anisotropy
Good, the second etched features can accurately control and high resolution；Disadvantage: primary need is time-consuming and laborious to one single chip photoetching, and
Second is that damage bottom reading circuit.
Simultaneously as the height of refrigeration type infrared detector wafer is greater than 500 microns, it is therefore desirable to more using high frequency lasers
Secondary cutting has in up to thousand times repetition cuttings and is greatly likely to occur heat history situation, to change cold working effect
Fruit influences chip effective coverage.
Summary of the invention
The method and device of laser processing chip provided by the invention can be original by controlling time-sharing multiplex to galvanometer
Then, two opposite grooves are disposably processed.Based on discontinuously being processed for every groove, the case where guaranteeing processing efficiency
Under, effectively reduce heat history.
In a first aspect, the present invention provides a kind of method for laser machining chip, comprising:
Immediately below mobile refrigeration mode infrared detecting chip to be processed center to the galvanometer of laser-processing system, adjust to be processed
Refrigeration mode infrared detecting chip position and angle are so that groove is in a horizontal position with the laser facula plane of incidence；
The groove on one group of opposite two edges is successively processed through laser, galvanometer, the field flattening lens in laser-processing system；
The worktable rotary for placing refrigeration mode infrared detecting chip is run 90 degree；
Then another group of opposite two edges successively are processed through laser, galvanometer, the field flattening lens in laser-processing system again
On groove；Wherein, the groove on two groups of opposite two edges is set to the pixel layer and opposite two of refrigeration mode infrared detecting chip
Between edge and form a closed annular groove.
Optionally, described successively to process one group of opposite both sides through laser, galvanometer, the field flattening lens in laser-processing system
Groove on edge includes:
Starting galvanometer simultaneously opens laser, then again processes the laser beam of laser transmitting through galvanometer, field flattening lens
Groove on one group of opposite two edges is as first step；
Start galvanometer and the preset time that is delayed and open laser, then again by the laser beam of laser transmitting through galvanometer,
Field flattening lens processes the groove on one group of opposite two edges as the second step.
Optionally, the laser beam by laser transmitting is processed on one group of opposite two edges through galvanometer, field flattening lens
Groove include:
The laser beam that laser is emitted is through galvanometer, field flattening lens in the first position of groove to the groove of first edge
N times are processed, then to the groove processing n times of second edge；
The laser beam that laser is emitted is through galvanometer, field flattening lens in the second position of groove to the groove of first edge
N times are processed, then to the groove processing n times of second edge；
And it completes to carry out other positions preset on groove according to first position, second position processing method reciprocating
Processing is used as one group；
Then processing N group is repeated to groove；Wherein, n >=1, N >=2.
Optionally, movement refrigeration mode infrared detecting chip to be processed center to laser-processing system galvanometer just under
Side, adjusts refrigeration mode infrared detecting chip to be processed position and angle so that groove is in a horizontal position with the laser facula plane of incidence
Before or after, the method also includes:
The flute profile information of closed annular groove to be processed is obtained, and laser facula, energy are determined according to the flute profile information
It is distributed, galvanometer process velocity, one or any combination in the repetition rate of laser；
The preset time of delay needed for opening laser is determined according to laser facula.
Optionally, the laser facula magnitude range is 8 microns to 12 microns.
Optionally, the galvanometer process velocity is greater than 3000mm/s.
Optionally, the repetition rate of the laser is less than 200k.
Second aspect, the present invention provide a kind of device for laser machining chip, comprising:
Laser-processing system is built by laser, galvanometer, field flattening lens；
Workbench, for placing refrigeration mode infrared detecting chip to be processed, and by 90 degree of its rotating operation；
Mobile system, for move refrigeration mode infrared detecting chip to be processed center to laser-processing system galvanometer just under
Side adjusts refrigeration mode infrared detecting chip to be processed position and angle so that groove and the laser facula plane of incidence are in horizontal position
It sets；
Control system successively processes one group of phase through laser, galvanometer, the field flattening lens in laser-processing system for controlling
To the groove on two edges；Then again successively through laser, galvanometer, the flat field in laser-processing system after 90 degree of rotating operation
Lens process the groove on another group of opposite two edges；Wherein, it is infrared to be set to refrigeration mode for the groove on two groups of opposite two edges
Between the pixel layer of detection chip and opposite two edges and form a closed annular groove.
Optionally, the control system includes:
First step control unit, for starting galvanometer and opening laser, then again by the laser light of laser transmitting
Beam processes the groove on one group of opposite two edges as first step through galvanometer, field flattening lens；
The second step control unit, for starting galvanometer and the preset time opening laser that is delayed, then again by laser
The laser beam of transmitting processes the groove on one group of opposite two edges as the second step through galvanometer, field flattening lens.
Optionally, the control system further include:
Parameter determination unit, for obtaining the flute profile information of closed annular groove to be processed, and according to the flute profile information
Determine laser facula, Energy distribution, galvanometer process velocity, one or any combination in the repetition rate of laser；Then basis
Laser facula determines the preset time being delayed needed for opening laser；
Preferably, the laser facula magnitude range is 8 microns to 12 microns；
Preferably, the galvanometer process velocity is greater than 3000mm/s；
Preferably, the repetition rate of the laser is less than 200k.
The method and device of laser processing chip provided in an embodiment of the present invention is successively through laser processing in the method
Laser, galvanometer, field flattening lens in system process the groove on one group of opposite two edges, or again successively through laser-processing system
In laser, the groove processed on another group of opposite two edges of galvanometer, field flattening lens is mainly by controlling timesharing to galvanometer
It is multiplexed with principle, disposably processes two opposite grooves.Based on discontinuously processing for every groove, guaranteeing processing efficiency
In the case where, effectively reduce heat history.
Detailed description of the invention
Fig. 1 is the flow chart for the method that the embodiment of the present invention one laser machines chip；
Fig. 2 is that the closed annular groove structure that the embodiment of the present invention one laser machines on refrigeration mode infrared detecting chip is shown
It is intended to；
Fig. 3 is that the closed annular groove structure that the embodiment of the present invention one laser machines on refrigeration mode infrared detecting chip is shown
It is intended to；
Fig. 4 is the structural schematic diagram for the device that the embodiment of the present invention one laser machines chip；
Fig. 5 is the structural schematic diagram of one laser-processing system of the embodiment of the present invention；
Fig. 6 is the flow chart for the method that dual-laser of the embodiment of the present invention processes chip
Fig. 7 is the structural schematic diagram that dual-laser of the embodiment of the present invention processes groove；
Fig. 8 is the flow chart for the method that the embodiment of the present invention three laser machines chip；
Fig. 9 is the structural schematic diagram that the embodiment of the present invention three laser machines groove；
Figure 10 is the structural schematic diagram that the embodiment of the present invention three laser machines groove；
Figure 11 is jet orifice structure schematic diagram set by three workbench of the embodiment of the present invention；
Figure 12 is the flow chart for the method that the embodiment of the present invention four laser machines chip；
Figure 13 is the structural schematic diagram that the embodiment of the present invention four laser machines groove；
Figure 14 is the flow chart for the method that the embodiment of the present invention five laser machines chip；
Figure 15 is the flow chart that the embodiment of the present invention four laser machines groove.
Specific embodiment
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention
In attached drawing, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described embodiment is only
It is only a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, ordinary skill
Personnel's every other embodiment obtained without making creative work, shall fall within the protection scope of the present invention.
Embodiment one
The embodiment of the present invention provides a kind of method for laser machining chip, as shown in Figure 1, which comprises
S11, laser-processing system is built by laser, optical element；
S12, the location information for obtaining refrigeration mode infrared detecting chip work platform for placing；
S13, the machined parameters that laser-processing system is set according to location information, and joined by laser-processing system according to processing
Number generates laser processing beam；
S14, the relative position for changing laser processing beam and refrigeration mode infrared detecting chip, so that in the infrared spy of refrigeration mode
A closed annular groove is formed between the pixel layer and edge surveyed on chip.
Mainly pass through laser-processing system generates laser light to the method for laser processing chip provided in an embodiment of the present invention
Beam prepares closed annular groove in the pixel layer on refrigeration mode infrared detecting chip and the surface between edge, can utilize and swash
Light machining beams sharply increase the temperature of photosensitive layer and direct boiling, while controlling laser running track or sample displacement track
Realize the patterned purpose of refrigeration mode infrared detecting chip surface grooves, wherein carrying out processing using laser-processing system has
As follows a little: the first laser burst length is short, belongs to " cold working ", and heat-affected zone is small, will not change the characteristic of photosensitive layer；The
Dual-laser machining process is contactless with refrigeration mode infrared detecting chip to be processed, can reduce mechanical stress to processing pair
The damage of elephant；Third laser machines high degree of automation, and accuracy is high, and process velocity is fast.
It is followed in addition, the present embodiment the method can also uniformly reduce the filling glue that pixel layer surrounding is overflowed in temperature
The out-of-date traction of pullling to refrigeration mode infrared detecting chip of ring, and then it is infrared to refrigeration mode can to eliminate thermal stress to efficient uniform
Positional shift between the photosensitive layer and epoxy resin layer of detection chip influences, and prevents the indium column connecting with photosensitive layer to be broken, mentions
The service life of high IR detection chip, the narrower the groove width of preparation the better, and depth just extends through bottom chip circuit
Layer.
Meanwhile compared with existing improvement fills glue, fixing layer technology is added, the present embodiment the method does not introduce new
Material does not introduce new structure (refering in particular to add structure as one layer of fixing layer), has no effect on refrigeration mode infrared detecting chip
Original technique in manufacturing process, it is only necessary to be blended together in chip interconnection and a new grooving processes are added after filler.Therefore, originally
Embodiment the method is compared and other methods for improving reliability, research and development at low cost, high-efficient, effect simple with implementation
Good advantage.
Also, show by experimental result, the refrigeration mode infrared detecting chip after laser-processing system is processed,
Pixel layer on refrigeration mode infrared detecting chip and the closed annular ditch through photosensitive layer and sealing water layer is formed between edge
Slot, and the structure of closed annular groove is neatly smooth, does not have residue inside closed annular groove, heat-affected zone is smaller, slot
Around photosensitive layer material without micro-damage and the defects of micro-crack, control processing technology does not damage the chip circuit layer of bottom also, into
And the physical isolation of refrigeration mode infrared detecting chip nucleus Yu periphery Jiao Qiang can be realized based on the closed hoop groove, from
Fundamentally eliminate influence of the thermal stress to chip reliability.
Optionally, as shown in Figures 2 and 3, optionally, laser-processing system is built by laser, optical element described
Before, the method also includes:
Refrigeration mode infrared detecting chip information is obtained, laser facula is determined according to refrigeration mode infrared detecting chip information；Its
In, the laser facula includes Gaussian spot or flat-top hot spot.
For example, the present embodiment the method can be according to the chip structure, photosensitive in refrigeration mode infrared detecting chip information
Laser facula needed for layer material, chip manufacture demand free switching is processed；Wherein, the photosensitive layer material includes tellurium cadmium
Mercury, tellurium cadmium indium.
Optionally, after the location information for obtaining refrigeration mode infrared detecting chip work platform for placing, the method
Further include:
Process cavity is established, the processing environment of the process cavity is set；Wherein,
The process cavity is set as vacuum chamber or totally-enclosed non-vacuum chambers or semiclosed chamber.
Optionally, the processing environment of the setting process cavity assists gas so that institute to be passed through into process cavity
It states process cavity and is in low pressure state.
Specifically, the present embodiment the method by being passed through auxiliary gas into process cavity, on the one hand makes described add
Work chamber is in low pressure state, and the impurity that laser and a variety of materials effect generate effectively is blowed to the dead space of chip
Domain；Another aspect epoxy resin quickly reacts generation CO2 with the oxygen in auxiliary gas and discharges into the atmosphere, and then reduces and swash
Light mismachining tolerance.
Optionally, the machined parameters of the setting laser-processing system, and produced by laser-processing system according to machined parameters
Giving birth to laser processing beam includes:
Laser processing parameter is determined according to refrigeration mode infrared detecting chip information, groove information；
Corresponding laser processing beam is generated according to laser processing parameter by laser-processing system.
Optionally, the laser processing parameter include laser beam energy, it is repetition rate, pulsewidth, a kind of in optical maser wavelength
Or any combination.
Optionally, the range of the pulsewidth is 10fs-10ps；
Preferably, the optical maser wavelength is 200nm-400nm.
Optionally, the relative position for changing laser processing beam and refrigeration mode infrared detecting chip, so that freezing
Pixel layer on type infrared detecting chip and a closed annular groove is formed between edge include:
The galvanometer in laser-processing system is determined according to refrigeration mode infrared detecting chip information；
The motion profile of laser beam is controlled for each side of refrigeration mode infrared detecting chip according to groove information by the galvanometer
On pixel layer and edge between perform etching into groove, and the groove by being etched on each side forms closed annular groove.
Optionally, the groove information includes groove flute profile, groove width, one or any combination in trench depth.
Optionally, the refrigeration mode infrared detecting chip is followed successively by photosensitive layer, epoxy resin layer, chip circuit under upper
Layer；Wherein,
The trench depth D range is refrigeration mode infrared detecting chip surface photosensitive layer thickness D1 < D < infrared spy of refrigeration mode
Survey chip photosensitive layer thickness D1+ epoxy resin layer thickness D2.
Specifically, the present embodiment the method between the pixel layer and edge of refrigeration mode infrared detecting chip by processing
One closed annular groove, and the trench depth is to penetrate refrigeration mode pyroscan material layer, but do not reach chip electricity
Road floor does not damage the chip circuit layer of bottom while utmostly eliminating thermal stress.
The embodiment of the present invention also provides a kind of device for laser machining chip, and as shown in Figures 2 to 4, described device includes:
Workbench, for placing refrigeration mode infrared detecting chip to be processed；
Control system, for obtaining the location information of refrigeration mode infrared detecting chip work platform for placing, then according to position
The machined parameters of laser-processing system are arranged in information, and control laser-processing system and generate laser processing light according to machined parameters
Beam；
Laser-processing system is built and is formed by laser, beam-expanding collimation element, galvanometer, swashs for emit laser
Light machining beams are expanded through beam-expanding collimation element, are collimated, and then change laser processing beam and refrigeration mode by galvanometer again
The relative position of infrared detecting chip, so as to form in the pixel layer on refrigeration mode infrared detecting chip and between edge a closure
Ring-shaped groove.
Preferably, at least one laser is set in the laser-processing system, for according to refrigeration mode infrared acquisition core
The control of piece information is switched to various lasers and launches the laser beam of different wave length, and then improves the laser-processing system
Processing efficiency.
Optionally, as shown in Figures 2 to 5, the control system includes:
Subsystem is detected, obtains groove information for detecting；Wherein, the groove information includes groove flute profile, ditch groove width
One or any combination in degree, trench depth；
Host computer, for according to refrigeration mode infrared detecting chip information to be processed and through acquired in detection subsystem
Groove information determines laser processing parameter；Then control laser-processing system generates corresponding laser according to laser processing parameter and adds
Work light beam.
Optionally, the host computer includes:
First determining module, for according to refrigeration mode infrared detecting chip information to be processed and through detecting subsystem institute
The groove information or detection and localization information or Working position location information of acquisition determine laser processing parameter；
Second determining module, for determining the galvanometer in laser-processing system according to refrigeration mode infrared detecting chip information；
Control module, for controlling the motion profile of laser beam for refrigeration mode infrared acquisition according to groove information through galvanometer
Groove is performed etching between pixel layer and edge on each side of chip, and the groove by being etched on each side forms closed annular
Groove.
Optionally, described device further include:
Coaxial detection system, for detection and localization letter to be positioned and generated to the groove on refrigeration mode infrared detecting chip
Breath；
Paraxonic detection system, positioned for Working position of the galvanometer on refrigeration mode infrared detecting chip and generate plus
Station sets detection information；Wherein,
The host computer is according to groove information, detection and localization information, Working position detection information control laser beam to system
Each side outer of cold mould infrared detecting chip corresponds to the direction XY and keeps same predetermined direction and perform etching into ditch immediately below galvanometer
Slot simultaneously forms closed annular groove, wherein the refrigeration mode infrared detecting chip it is each while outer be it is each while on pixel layer and edge
Between position.
Optionally, the refrigeration mode infrared detecting chip is followed successively by photosensitive layer, epoxy resin layer, chip circuit under upper
Layer；Wherein,
The trench depth D range is refrigeration mode infrared detecting chip surface photosensitive layer thickness D1 < D < infrared spy of refrigeration mode
Survey chip photosensitive layer thickness D1+ epoxy resin layer thickness D2.
Optionally, the laser-processing system further include:
Shaping element, for laser processing beam to be shaped as laser light corresponding with refrigeration mode infrared detecting chip type
Spot；Wherein, the laser facula includes Gaussian spot or flat-top hot spot.
Optionally, the laser-processing system further include:
Beam splitter, for being detected to the laser processing beam shaping state after shaped component shaping.
Optionally, described device further include:
Dust-extraction unit is arranged between laser-processing system and workbench and establishes a process cavity on the table, uses
In be passed through gas into the process cavity so that the process cavity be in low pressure state and utilize process cavity and atmosphere
Generated dust is sucked out draught head between pressure.
Optionally, the laser processing parameter include laser beam energy, it is repetition rate, pulsewidth, a kind of in optical maser wavelength
Or any combination；
Shown in sum up, the present embodiment described device is by laser beam in laser-processing system by laser with direction of travel
0 ° of injection, reflexes on beam-expanding collimation element through reflecting mirror 1 and expands laser beam, then using beam splitter to laser light
Beam laser energy, laser status are detected, and laser beam is reflected on reflecting mirror 2 with 90 ° of directions；By reflecting
2 reflection laser light beam of mirror, laser beam is with 90 ° of direction reflections on reflecting mirror 3；By 3 reflection laser light beam of reflecting mirror, laser
Light beam is with -90 ° of direction reflections on reflecting mirror 4, and by 4 reflection laser light beam of reflecting mirror, laser beam is existed with 90 ° of direction reflections
On shaping element, then the laser beam shaping state after shaped component shaping is detected through antiradar reflectivity beam splitter,
Then laser beam is exposed into galvanometer, Working position is positioned and monitored on-line using paraxonic detection system；Finally
Laser beam focusing is cut to the refrigeration mode infrared detecting chip being fixed on the worktable.
The device of the present embodiment can be used for executing the technical solution of above method embodiment, realization principle and technology
Effect is similar, and details are not described herein again.
Embodiment two
The difference between this embodiment and the first embodiment lies in solve using single laser processing beam carry out laser cutting can not
The high cell bottom structure of planarization is obtained, therefore, the embodiment of the present invention provides a kind of method for laser machining chip, as shown in fig. 6,
The described method includes:
S41, laser-processing system is built by laser, optical element；
S42, the location information for obtaining refrigeration mode infrared detecting chip work platform for placing；
S43, the machined parameters that laser-processing system is set according to location information, and joined by laser-processing system according to processing
Number generates laser processing beam；
S44, the photosensitive layer of refrigeration type infrared detector chip is added by the laser processing beam with the first power
Work forms two parallel slots, then infrared to refrigeration mode between two parallel slots by the laser processing beam with the second power
Epoxy glue is processed inside detector chip, so as to be formed in the pixel layer on refrigeration mode infrared detecting chip and between edge
One closed annular groove.
The method of laser processing chip provided in an embodiment of the present invention is infrared in refrigeration mode for the cold and hot variation of dispensing device
It is red to refrigeration mode along discharge groove both sides using two beam beamlet of higher-wattage between the effective pixel layer of detection chip and edge
The photosensitive layer of outer detection chip is processed, and is removed later using low-power laser to chip interior epoxy glue, thus real
The smooth effect of existing slot bottom.For example, using the laser processing beam of the first power first by 8-10 microns of mercury cadmium telluride or 12-15
The indium antimonide layer of micron cuts (i.e. photosensitive layer), then by the laser beam of the second power between two parallel slots by 10 microns of left sides
Right epoxy adhesive layer reaches 8 microns positions, thus the stress release effect being optimal, due to removing photosensitive layer material
Laser ablation rate is different, is difficult to obtain relatively flat cell bottom structure with single cutting mode；Therefore, side described in the present embodiment
Method is acted on by larger laser power on channel both sides, and the cadmium mercury telluride layer on surface or indium antimonide layer are completely removed, and
Epoxy adhesive layer also realizes the cutting of certain depth, is finally tied internal epoxy adhesive layer with the laser of smaller energy, Jin Erben
Embodiment the method is obtained for the layered structure of refrigeration mode infrared detecting chip by realization different-energy laser in combination
Different trench structures, the present embodiment the method can be improved the groove bathtub construction of preparation, and effectively control laser machined
To the fuel factor region of groove, the further yields for optimizing refrigeration mode infrared detecting chip performance, improving preparation when journey.
Optionally, as shown in Figure 6 and Figure 7, described by having the laser processing beam of the first power to the infrared spy of refrigeration mode
The photosensitive layer for surveying device chip carries out paddle-tumble and forms two parallel slots, then by the laser processing beam with the second power at two
Paddle-tumble is carried out to epoxy glue inside refrigeration mode infrared detecting chip between parallel slot, so that on refrigeration mode infrared detecting chip
A closed annular groove is formed between pixel layer and edge includes:
Refrigeration mode infrared detecting chip position and angle are adjusted, so as to be located at immediately below galvanometer to paddle-tumble, and entirely wait draw
Slot and the hot spot plane of incidence of laser processing beam are in a horizontal position；
Mobile galvanometer is by the two beam first laser machining beams with the first power simultaneously to infrared detector chip
Photosensitive layer carries out processing and forms two parallel slots；Alternatively, mobile galvanometer is processed by a branch of first laser with the first power
Light beam carries out processing to the photosensitive layer of infrared detector chip respectively and forms two parallel slots；
Restore the work-table of placement refrigeration mode infrared detecting chip to initial position, keeps refrigeration mode infrared detecting chip
It is horizontal；
Then it is right between two parallel slots by a branch of second laser machining beams with the second power to move galvanometer
Epoxy glue is processed inside refrigeration mode infrared detecting chip, so that pixel layer and edge on refrigeration mode infrared detecting chip
Between form a closed annular groove.
Optionally, first power is greater than the second power；
Preferably, first power is greater than 300mw:
Preferably, second power bracket is 80mW-150mW.
Optionally, the laser processing beam width is 8um-12um.
Optionally, the refrigeration mode infrared detecting chip is followed successively by photosensitive layer, epoxy resin layer, chip circuit under upper
Layer；Wherein,
The trench depth D range is refrigeration mode infrared detecting chip surface photosensitive layer thickness D1 < D < infrared spy of refrigeration mode
Survey chip photosensitive layer thickness D1+ epoxy resin layer thickness D2.
Optionally, the process velocity of the laser-processing system is to be less than 5000mm/s greater than 3000mm/s.
The embodiment of the present invention also provides a kind of device for laser machining chip, and as shown in figs. 4 and 7, described device includes:
Workbench, for placing refrigeration mode infrared detecting chip to be processed；
Laser-processing system is built by laser, optical element, for by changing laser processing beam and refrigeration
The relative position of type infrared detecting chip laser machines refrigeration mode infrared detecting chip；
Control system, for obtaining the location information of refrigeration mode infrared detecting chip work platform for placing；According to location information
The machined parameters of laser-processing system are set, and generate laser processing beam according to machined parameters by laser-processing system；And it controls
Laser-processing system processed adds the photosensitive layer of refrigeration mode infrared detecting chip by the laser processing beam with the first power
Work forms two parallel slots, then infrared to refrigeration mode between two parallel slots by the laser processing beam with the second power
Epoxy glue is processed inside detection chip, so as in the pixel layer on refrigeration mode infrared detecting chip and form one between edge
Closed annular groove.
The device of laser processing chip provided in an embodiment of the present invention is infrared in refrigeration mode for the cold and hot variation of dispensing device
Two beam beamlet of higher-wattage is used by control system control laser-processing system between the effective pixel layer of detection chip and edge
It is processed along photosensitive layer of the discharge groove both sides to refrigeration mode infrared detecting chip, later using low-power laser to chip
Internal epoxy glue is removed, to realize the smooth effect of slot bottom.For example, using the first power laser processing beam first
8-10 microns of mercury cadmium telluride or 12-15 microns of indium antimonide layer are cut into (i.e. photosensitive layer), then pass through the laser light of the second power
The epoxy adhesive layer of 10 microns is reached 8 microns positions between two parallel slots by beam, so that the stress being optimal is released
Effect is put, since the laser ablation rate for removing photosensitive layer material is different, is difficult to obtain with single cutting mode relatively flat
Cell bottom structure；Therefore, the present embodiment described device is acted on by larger laser power on channel both sides, by the cadmium mercury telluride layer on surface
Or indium antimonide layer completely removes, and also realizes the cutting of certain depth in epoxy adhesive layer, finally uses the laser of smaller energy
Internal epoxy adhesive layer is tied, and then the present embodiment described device passes through for the layered structure of refrigeration mode infrared detecting chip
Realization obtains different trench structures with different-energy laser in combination, and the present embodiment described device is by improving the groove slot prepared
To the fuel factor region of groove when shape structure, effectively control laser processing procedure, the further refrigeration mode that optimizes optimizes infrared spy
The yields surveyed chip performance, improve preparation.
Optionally, the control system includes:
First step control unit processes light by the two beam first lasers with the first power for controlling mobile galvanometer
Beam carries out processing to the photosensitive layer of refrigeration mode infrared detecting chip simultaneously and forms two parallel slots；Alternatively, mobile galvanometer passes through tool
There are a branch of first laser machining beams of the first power to carry out processing formation to the photosensitive layer of refrigeration mode infrared detecting chip respectively
Two parallel slots；
The second step control unit processes light by a branch of second laser with the second power for controlling mobile galvanometer
Beam processes epoxy glue inside refrigeration mode infrared detecting chip between two parallel slots, so that in refrigeration mode infrared acquisition
Pixel layer on chip and a closed annular groove is formed between edge.
Optionally, the workbench includes:
Spray orifice is adsorbed, for adsorbing to refrigeration mode infrared detecting chip；
Adjustment of displacement module, for adjusting refrigeration mode infrared detecting chip position or restoring to place refrigeration mode infrared acquisition
The work-table of chip is to initial position；
Angle adjusts module, is set on workbench, for adjusting refrigeration mode infrared detecting chip angle.
Optionally, first power is greater than the second power；
Preferably, first power is greater than 300mw:
Preferably, second power bracket is 80mW-150mW.
The device of the present embodiment can be used for executing the technical solution of above method embodiment, realization principle and technology
Effect is similar, and details are not described herein again.
Embodiment three
The difference of the present embodiment and above-described embodiment is since the narrower the width for preparing groove the better, and depth is just passed through
Chip circuit layer is read through bottom, flute profile both sides are precipitous, conducive to the release of stress；Therefore, the embodiment of the present invention provides one kind
The method for laser machining chip, as shown in Figure 8, which comprises
S51, the workbench for building angle adjustable, and refrigeration mode infrared detecting chip to be processed is placed on workbench
On；
S52, the adjusting that workbench is arranged and compensation and are added technological parameter by laser, the built laser of optical element
The laser parameter of work system；
S53, lathe of work level angle is changed according to the laser parameter, adjusting and compensation technological parameter at least once, so as to swash
Light system of processing carries out inclination processing to the pixel layer on refrigeration mode infrared detecting chip and between edge and forms the small folder in edge
Angle shallow trench.
Laser processing beam is mainly exposed to processing cavity by the method for laser processing chip provided in an embodiment of the present invention
Photosensitive layer, epoxy are run through being formed close to refrigeration mode infrared detecting chip edge in indoor refrigeration mode infrared detecting chip surface
Resin layer, encapsulate glue layer closed annular groove, while using angle adjustable workbench carry out different angle transformation with
And technological parameter is compensated accordingly, final real formed now close to refrigeration mode infrared detecting chip edge runs through photosensitive layer, ring
Oxygen resin layer, the small angle shallow trench of closed annular for encapsulating glue layer increase photosensitive layer, epoxy resin layer, encapsulation glue layer core
Physical isolation effect between heart district domain (pixel layer) and edge thickness glue wall fundamentally improves the reliability of chip.This implementation
Example the method is by improving the groove bathtub construction of preparation, to the region of thermal effect of groove when effectively controlling laser processing procedure
Domain, the further yields for optimizing refrigeration mode optimization infrared detecting chip performance, improving preparation.
Optionally, as shown in Figs. 8 to 11, the lathe of work level angle that changes at least once is to allow workbench with ditch groove center
It on the basis of line, is tilted to both sides, to control groove angle.
Optionally, the laser-processing system is inclined to the pixel layer on refrigeration mode infrared detecting chip and between edge
It tiltedly processes and forms the small angle shallow trench in edge and include:
According to the laser parameter, adjusting and technological parameter is compensated by workbench on the basis of ditch groove center line, to one side
Tilt to first angle；
It adjusts workbench Z-direction position and carries out focal length compensation, so that laser-processing system is to refrigeration mode infrared acquisition core
The Working position of piece is in focal position；
According to the laser parameter, adjusting and compensation technological parameter by workbench on the basis of ditch groove center line, to another
While tilting to second angle；
It adjusts workbench Z-direction position and carries out focal length compensation, so that laser-processing system is to refrigeration mode infrared acquisition core
The Working position of piece is in focal position.
Optionally, the progress focal length compensation of workbench Z-direction position is being adjusted, so that laser-processing system is red to refrigeration mode
The Working position of outer detection chip is in after focal position, the method also includes:
Laser beam is adjusted to low-power mode and is processed.
Optionally, the workbench adjusting and compensation technological parameter include: groove groove parameters, angular adjustment parameter,
Focal length compensating parameter, laser facula, one or any combination in light spot energy；
The angular adjustment parameter is corresponding with groove information.
Optionally, it is described according to the laser parameter, adjusting and compensation technological parameter by workbench with ditch groove center line
On the basis of, banking to before first angle, the method also includes:
Refrigeration mode infrared detecting chip position and angle are adjusted, so that groove is being located at the galvanometer of the laser-processing system just
Lower section, and the hot spot plane of incidence of entire groove and laser beam is in a horizontal position.
Optionally, it is processed in the table inclination to second angle and adjust laser beam to low-power mode
Later, the method also includes:
Platform resume work to initial position, keeps refrigeration mode infrared detecting chip horizontal；
Laser beam is adjusted to low-power mode and reduces cutting times, it is made to carry out smooth processing to trench bottom surfaces.
Optionally, the small angle shallow trench in the edge is square trench.
Optionally, as shown in figure 11, the method also includes:
Refrigeration mode infrared detecting chip is adsorbed by the spray orifice being set under workbench.
Optionally, the work table flatness is better than 1um/20mm.
Example IV
Since the height of refrigeration type infrared detector wafer is greater than 500 microns, it is therefore desirable to repeatedly be cut using high frequency lasers
It cuts, in up to thousand times repetition cuttings, has and be greatly likely to occur heat history situation, to change cold working effect, shadow
Ring chip effective coverage；Therefore, the embodiment of the present invention provides a kind of method for laser machining chip, as shown in figure 12, the side
Method includes:
S61, mobile refrigeration mode infrared detecting chip to be processed center to laser-processing system galvanometer immediately below, adjustment to
Refrigeration mode infrared detecting chip position and angle are processed so that Cutting Road groove is in a horizontal position with the laser facula plane of incidence；
S62, it successively processes on one group of opposite two edges through laser, galvanometer, the field flattening lens in laser-processing system
Groove；
S63, the worktable rotary for placing refrigeration mode infrared detecting chip is run 90 degree；
S64, another group opposite two successively then is processed through laser, galvanometer, the field flattening lens in laser-processing system again
Groove on edge；Wherein, the groove on two groups of opposite two edges is set to the pixel layer and phase of refrigeration mode infrared detecting chip
To between two edges and formed a closed annular groove.
Successively through the laser in laser-processing system, vibration in the method for laser processing chip provided in an embodiment of the present invention
Mirror, field flattening lens process the groove on one group of opposite two edges, or again successively through the laser in laser-processing system, vibration
The groove that mirror, field flattening lens are processed on another group of opposite two edges is mainly principle by controlling time-sharing multiplex to galvanometer, one
Secondary property processes two opposite grooves.Based on discontinuously being processed for every groove, in the case where guaranteeing processing efficiency, effectively
Reduction heat history.
Optionally, as shown in Figure 12 and Figure 13, described successively saturating through laser, galvanometer, the flat field in laser-processing system
Mirror processes one group
Starting galvanometer simultaneously opens laser, then again processes the laser beam of laser transmitting through galvanometer, field flattening lens
Groove on one group of opposite two edges is as first step；
Start galvanometer and the preset time that is delayed and open laser, then again by the laser beam of laser transmitting through galvanometer,
Field flattening lens processes the groove on one group of opposite two edges as the second step.
Optionally, the laser beam by laser transmitting is processed on one group of opposite two edges through galvanometer, field flattening lens
Groove include:
The laser beam that laser is emitted is through galvanometer, field flattening lens in the first position of groove to the groove of first edge
N times are processed, then to the groove processing n times of second edge；
The laser beam that laser is emitted is through galvanometer, field flattening lens in the second position of groove to the groove of first edge
N times are processed, then to the groove processing n times of second edge；
And it completes to carry out other positions preset on groove according to first position, second position processing method reciprocating
Processing is used as one group；
Then processing N group is repeated to groove；Wherein, n >=1, N >=2.
Optionally, movement refrigeration mode infrared detecting chip to be processed center to laser-processing system galvanometer just under
Side, adjusts refrigeration mode infrared detecting chip to be processed position and angle so that groove is in a horizontal position with the laser facula plane of incidence
Before or after, the method also includes:
The flute profile information of closed annular groove to be processed is obtained, and laser facula, energy are determined according to the flute profile information
It is distributed, galvanometer process velocity, one or any combination in the repetition rate of laser；
The preset time of delay needed for opening laser is determined according to laser facula.
Optionally, the laser facula magnitude range is 8 microns to 12 microns.
Optionally, the galvanometer process velocity is greater than 3000mm/s.
Optionally, the repetition rate of the laser is less than 200k.
The embodiment of the present invention also provides a kind of device for laser machining chip, as shown in fig. 4 and 13, described device packet
It includes:
Laser-processing system is built by laser, galvanometer, field flattening lens；
Workbench, for placing refrigeration mode infrared detecting chip to be processed, and by 90 degree of its rotating operation；
Mobile system, for move refrigeration mode infrared detecting chip to be processed center to laser-processing system galvanometer just under
Side adjusts refrigeration mode infrared detecting chip to be processed position and angle so that groove and the laser facula plane of incidence are in horizontal position
It sets；
Control system successively processes one group of phase through laser, galvanometer, the field flattening lens in laser-processing system for controlling
To the groove on two edges；Then again successively through laser, galvanometer, the flat field in laser-processing system after 90 degree of rotating operation
Lens process the groove on another group of opposite two edges；Wherein, it is infrared to be set to refrigeration mode for the groove on two groups of opposite two edges
Between the pixel layer of detection chip and opposite two edges and form a closed annular groove.
It is controlled by controller successively through laser-processing system in the device of laser processing chip provided in an embodiment of the present invention
In laser, galvanometer, field flattening lens process the groove on one group of opposite two edges, or again successively through in laser-processing system
Laser, the groove processed on another group of opposite two edges of galvanometer, field flattening lens it is mainly multiple by controlling timesharing to galvanometer
With for principle, two opposite grooves are disposably processed.Based on discontinuously processing for every groove, guaranteeing processing efficiency
In the case of, effectively reduce heat history.
Optionally, the control system includes:
First step control unit, for starting galvanometer and opening laser, then again by the laser light of laser transmitting
Beam processes the groove on one group of opposite two edges as first step through galvanometer, field flattening lens；
The second step control unit, for starting galvanometer and the preset time opening laser that is delayed, then again by laser
The laser beam of transmitting processes the groove on one group of opposite two edges as the second step through galvanometer, field flattening lens.
Optionally, the control system further include:
Parameter determination unit, for obtaining the flute profile information of closed annular groove to be processed, and according to the flute profile information
Determine laser facula, Energy distribution, galvanometer process velocity, one or any combination in the repetition rate of laser；Then basis
Laser facula determines the preset time being delayed needed for opening laser；
Preferably, the laser facula magnitude range is 8 microns to 12 microns；
Preferably, the galvanometer process velocity is greater than 3000mm/s；
Preferably, the repetition rate of the laser is less than 200k.,
The device of the present embodiment can be used for executing the technical solution of above method embodiment, realization principle and technology
Effect is similar, and details are not described herein again.
Embodiment five
Since, the prior art is by way of laser slotting, galvanometer control laser facula and detector chip are being utilized
When relative motion, due to the limitation of galvanometer control mode, when progress hollow slots to form closed annular groove, corner can go out
Existing arc, the depth and width so as to cause corner's groove are uneven, and affect the area of effective pixel area.Therefore, this hair
Bright embodiment provides a kind of method for laser machining chip, as shown in figure 14, which comprises
S71, laser-processing system is built by laser, optical element；
S72, the machining deviation amount for detecting built laser-processing system；
S73, the rendering parameter that groove to be processed is calculated according to the machining deviation amount；
S74, refrigeration mode infrared detecting chip is added according to the rendering parameter of groove to be processed by laser-processing system
Work, so as to form in the pixel layer on refrigeration mode infrared detecting chip and between edge a closed annular groove.
It is provided in an embodiment of the present invention laser processing chip method mainly setting laser machine closed annular groove when,
The machining deviation amount of built laser-processing system is detected first；Then it is calculated according to machining deviation amount detected
The rendering parameter of groove to be processed and fixed laser open the light and close light delay time etc. out, effectively improve focus planar detector
Reliability when undergoing temperature cycles process, when realizing that laser slots to refrigeration mode infrared detecting chip, corner is right angle,
And width and uniform depth.Therefore, compared with directly carrying out closed annular groove and drawing processing, the present embodiment the method is effective
The pixel utilization rate of closed annular groove corner is improved, reduces influence of the corner to groove width and depth uniformity, finally
Improve the effect and chip reliability of laser slotting.
Meanwhile after refrigeration mode infrared detecting chip surrounding forms a closed annular groove, actually to by filling glue
Spilling glue side and effective pixel area after technique realize physical isolation, thus in temperature cycles, it is a large amount of to overflow glue side
Power is pullled due to caused by thermal stress to be applied on pixel area, and refrigeration mode infrared detecting chip is effectively raised
Reliability.
Optionally, as shown in Figure 14 and Figure 15, the machining deviation amount packet for detecting built laser-processing system
It includes:
A pre-rendered length is the straight line of X, and is processed by laser-processing system；
After processing is completed, the departure of processing result and straight line is measured.
Optionally, described to measure processing result and the departure of straight line includes:
Measure the position of actual start point and the alternate position spike N of drawn straight line starting point；
Measure the alternate position spike M of the position of physical end point and the end point of drawn straight line；
Using end to end closed annular groove as the four independent linear channels disconnected, and every independent linear channel
Length is calculated according to following formula:
(N-D/2)+X+(M-D/2)；Wherein,
D is the spot diameter of laser processing beam in laser-processing system.
Optionally, before the alternate position spike of the position for setting physical end point and the end point of drawn straight line is M, institute
State method further include:
Detection physical end point whether be more than drawn straight line end point；
When physical end point is less than the end point of drawn straight line, then position and the institute of physical end point are directly measured
Draw the alternate position spike M of the end point of straight line；
When physical end point be more than drawn straight line end point when, then according to the position of physical end point with draw directly
The delaying policy of the position adjustment laser folding of the end point of line, then fixes the delaying policy of laser folding adjusted
And processed according to it, finally measure the alternate position spike M of the position of its practical end point and the end point of drawn straight line；
Wherein, the delaying policy of the adjustment laser folding is to reduce laser to close laser beam delay time, is made
Physical end point is less than the end point of drawn straight line.
Optionally, the rendering parameter of the groove to be processed includes trench length, groove flute profile, groove width, ditch groove depth
One or any combination in degree.
Optionally, the refrigeration mode infrared detecting chip is followed successively by photosensitive layer, epoxy resin layer, chip circuit under upper
Layer；Wherein,
The trench depth D range is refrigeration mode infrared detecting chip surface photosensitive layer thickness D1 < D < infrared spy of refrigeration mode
Survey chip photosensitive layer thickness D1+ epoxy resin layer thickness D2.
The embodiment of the present invention also provides a kind of device for laser machining chip, as shown in Fig. 4 and Figure 15, described device packet
It includes:
Detection unit, for detecting the machining deviation amount of built laser-processing system；
Computing unit, for the rendering parameter of groove to be processed to be calculated according to the machining deviation amount；
Laser-processing system is built by laser, optical element, and for the rendering parameter according to groove to be processed
Refrigeration mode infrared detecting chip is processed, so as to be formed in the pixel layer on refrigeration mode infrared detecting chip and between edge
One closed annular groove.
It is provided in an embodiment of the present invention laser processing chip device mainly setting laser machine closed annular groove when,
The machining deviation amount of built laser-processing system is detected first；Then it is calculated according to machining deviation amount detected
The rendering parameter of groove to be processed and fixed laser open the light and close light delay time etc. out, effectively improve focus planar detector
Reliability when undergoing temperature cycles process, when realizing that laser slots to refrigeration mode infrared detecting chip, corner is right angle,
And width and uniform depth.Therefore, compared with directly carrying out closed annular groove and drawing processing, the present embodiment described device is effective
The pixel utilization rate of closed annular groove corner is improved, reduces influence of the corner to groove width and depth uniformity, finally
Improve the effect and chip reliability of laser slotting.
Meanwhile after refrigeration mode infrared detecting chip surrounding forms a closed annular groove, actually to by filling glue
Spilling glue side and effective pixel area after technique realize physical isolation, thus in temperature cycles, it is a large amount of to overflow glue side
Power is pullled due to caused by thermal stress to be applied on pixel area, and refrigeration mode infrared detecting chip is effectively raised
Reliability.
Optionally, the detection unit includes:
Preprocessing module, the straight line for being X for a pre-rendered length, and processed by laser-processing system；
Measurement module, for after processing is completed, measuring the departure of processing result and straight line.
Optionally, the measurement module includes:
First measurement submodule, for measuring the position of actual start point and the alternate position spike N of drawn straight line starting point；
Detection sub-module, for detect physical end point whether be more than drawn straight line end point；When physical end point
When being less than the end point of drawn straight line, then the position of the position of physical end point and the end point of drawn straight line is directly measured
Set poor M；When physical end point is more than the end point of drawn straight line, then according to the position of physical end point and drawn straight line
End point position adjustment laser folding delaying policy, then fix the delaying policy of laser adjusted folding simultaneously
It is processed according to it, finally measures the alternate position spike M of the position of its practical end point and the end point of drawn straight line；Wherein,
The delaying policy of the adjustment laser folding is to reduce laser to close laser beam delay time, is less than physical end point
The end point of drawn straight line；
Second measurement submodule, for measuring the alternate position spike M of the position of physical end point and the end point of drawn straight line；
Computational submodule, for using end to end closed annular groove as disconnect four independent linear channels, and
Every independent linear trench length is calculated according to following formula:
(N-D/2)+X+(M-D/2)；Wherein,
D is the spot diameter of laser processing beam in laser-processing system.
Optionally, the rendering parameter of the groove to be processed includes trench length, groove flute profile, groove width, ditch groove depth
One or any combination in degree；
Preferably, the refrigeration mode infrared detecting chip is followed successively by photosensitive layer, epoxy resin layer, chip circuit under upper
Layer；Wherein, the trench depth D range is refrigeration mode infrared detecting chip surface photosensitive layer thickness D1 < D < infrared spy of refrigeration mode
Survey chip photosensitive layer thickness D1+ epoxy resin layer thickness D2.
The device of the present embodiment can be used for executing the technical solution of above method embodiment, realization principle and technology
Effect is similar, and details are not described herein again.
The above description is merely a specific embodiment, but scope of protection of the present invention is not limited thereto, any
In the technical scope disclosed by the present invention, any changes or substitutions that can be easily thought of by those familiar with the art, all answers
It is included within the scope of the present invention.Therefore, protection scope of the present invention should be subject to the protection scope in claims.
Claims (10)
1. a kind of method for laser machining chip characterized by comprising
Immediately below mobile refrigeration mode infrared detecting chip to be processed center to the galvanometer of laser-processing system, refrigeration to be processed is adjusted
Type infrared detecting chip position and angle are so that groove is in a horizontal position with the laser facula plane of incidence；
The groove on one group of opposite two edges is successively processed through laser, galvanometer, the field flattening lens in laser-processing system；
The worktable rotary for placing refrigeration mode infrared detecting chip is run 90 degree；
Then it is successively processed on another group of opposite two edges through laser, galvanometer, the field flattening lens in laser-processing system again
Groove；Wherein, the pixel layer and two edges relatively that the groove on two groups of opposite two edges is set to refrigeration mode infrared detecting chip
Between and formed a closed annular groove.
2. the method according to claim 1, wherein described successively through the laser in laser-processing system, vibration
Mirror, field flattening lens process one group
Starting galvanometer simultaneously opens laser, and the laser beam of laser transmitting is then processed one group through galvanometer, field flattening lens again
Groove on opposite two edges is as first step；
Start galvanometer and the preset time that is delayed opens laser, then again by the laser beam of laser transmitting through galvanometer, flat field
Lens process the groove on one group of opposite two edges as the second step.
3. according to the method described in claim 2, it is characterized in that, the laser beam by laser transmitting is through galvanometer, flat
Field lens processes one group
The laser beam that laser is emitted is through galvanometer, field flattening lens in the first position of groove to the groove processing of first edge
N times, then to the groove processing n times of second edge；
The laser beam that laser is emitted is through galvanometer, field flattening lens in the second position of groove to the groove processing of first edge
N times, then to the groove processing n times of second edge；
And other positions preset on groove are processed according to first position, the completion of second position processing method reciprocating
As one group；
Then processing N group is repeated to groove；Wherein, n >=1, N >=2.
4. method according to claim 1 to 3, which is characterized in that in movement refrigeration mode infrared acquisition to be processed
Chip center to laser-processing system galvanometer immediately below, adjust refrigeration mode infrared detecting chip to be processed position and angle so that
Before or after groove and the laser facula plane of incidence are in a horizontal position, the method also includes:
It obtains the flute profile information of closed annular groove to be processed, and laser facula is determined according to the flute profile information, Energy distribution,
Galvanometer process velocity, one or any combination in the repetition rate of laser；
The preset time of delay needed for opening laser is determined according to laser facula.
5. according to the method described in claim 4, it is characterized in that, the laser facula magnitude range is 8 microns to 12 microns.
6. -5 any method according to claim 1, which is characterized in that the galvanometer process velocity is greater than 3000mm/s.
7. according to the method described in claim 6, it is characterized in that, the repetition rate of the laser is less than 200k.
8. a kind of device for laser machining chip characterized by comprising
Laser-processing system is built by laser, galvanometer, field flattening lens；
Workbench, for placing refrigeration mode infrared detecting chip to be processed, and by 90 degree of its rotating operation；
Mobile system, for moving immediately below refrigeration mode infrared detecting chip to be processed center to the galvanometer of laser-processing system,
Refrigeration mode infrared detecting chip to be processed position and angle are adjusted so that groove is in a horizontal position with the laser facula plane of incidence；
Control system successively processes one group opposite two through laser, galvanometer, the field flattening lens in laser-processing system for controlling
Groove on edge；Then again successively through laser, galvanometer, the field flattening lens in laser-processing system after 90 degree of rotating operation
Process the groove on another group of opposite two edges；Wherein, the groove on two groups of opposite two edges is set to refrigeration mode infrared acquisition
Between the pixel layer of chip and opposite two edges and form a closed annular groove.
9. device according to claim 8, which is characterized in that the control system includes:
First step control unit, for starting galvanometer and opening laser, then the laser beam again by laser transmitting is passed through
Galvanometer, field flattening lens process the groove on one group of opposite two edges as first step；
Then the second step control unit again emits laser for starting galvanometer and the preset time opening laser that is delayed
Laser beam process the groove on one group of opposite two edges as the second step through galvanometer, field flattening lens.
10. device according to claim 8 or claim 9, which is characterized in that the control system further include:
Parameter determination unit is determined for obtaining the flute profile information of closed annular groove to be processed, and according to the flute profile information
Laser facula, Energy distribution, galvanometer process velocity, one or any combination in the repetition rate of laser；Then according to laser
Hot spot determines the preset time being delayed needed for opening laser；
Preferably, the laser facula magnitude range is 8 microns to 12 microns；
Preferably, the galvanometer process velocity is greater than 3000mm/s；
Preferably, the repetition rate of the laser is less than 200k.
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