CN109524342B - Leveling device for two-dimensional material treatment - Google Patents
Leveling device for two-dimensional material treatment Download PDFInfo
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- CN109524342B CN109524342B CN201811229679.6A CN201811229679A CN109524342B CN 109524342 B CN109524342 B CN 109524342B CN 201811229679 A CN201811229679 A CN 201811229679A CN 109524342 B CN109524342 B CN 109524342B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
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- H—ELECTRICITY
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68363—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used in a transfer process involving transfer directly from an origin substrate to a target substrate without use of an intermediate handle substrate
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Abstract
The invention discloses a leveling device for two-dimensional material treatment, which comprises a base, a first rotating platform and a second rotating platform, wherein the second rotating platform is used for fixing a target substrate; the first rotating platform is rotatably arranged on the base, the second rotating platform is rotatably arranged on the first rotating platform, the rotating axis of the first rotating platform is perpendicular to the rotating axis of the second rotating platform, and the rotating axis of the first rotating platform and the rotating axis of the second rotating platform are respectively parallel to the plane where the bottom plate is located. The leveling device for processing the two-dimensional material can realize self-leveling and complete flat pasting through the autonomous rotation of the first rotary platform and the second rotary platform under the condition of uneven stress in the actual use process, the self-leveling mode is reliable and efficient, the two-dimensional material alignment and transfer efficiency can be greatly improved, and in the fixed-point transfer and subsequent photoetching process of the two-dimensional material, the flatness of the plane laminating of a sample and a substrate is effectively guaranteed.
Description
Technical Field
The invention relates to the technical field of material processing and manufacturing, in particular to a leveling device for two-dimensional material treatment.
Background
With the discovery of graphene and its special physical and chemical properties, such as extremely high electron mobility, thermal conductivity, mechanical strength, etc., graphene and other graphene-like two-dimensional materials (such as transition metal chalcogenide, black phosphorus, hexagonal boron nitride, etc.) are attracting wide attention of technologists and industries. The organic silicon-based organic.
Generally, two-dimensional materials have the following four methods: firstly, a mechanical stripping method, namely sticking sheet two-dimensional materials with different sizes and different layer numbers from a block material by using an adhesive tape or an electrostatic film, wherein the general defects are fewer; second, Chemical Vapor Deposition (CVD) methods, e.g. growing graphene, Si/SiO using Cu as a substrate2Substrate growth of MoS2(ii) a Triple, Molecular Beam Epitaxy (MBE), e.g. growing topological insulators Bi2Se3Etc.; fourthly, chemical solution methods such as hydrothermal method or solvent thermal method. In the processes of physical property test and device manufacturing of the grown two-dimensional material, fixed-point transfer of the two-dimensional material is required. At present, the main methods include chemical corrosion after spin coating of polymethyl methacrylate (PMMA), electrostatic film assistance, thermal release film assistance and the like to complete the transfer of two-dimensional materials.
During transfer and subsequent photolithography fabrication, a problem of alignment and pasting of the sample to the substrate (substrate) must be experienced. There are two approaches to solve this problem: firstly, by means of optical microscope and visual observation, the front-back and left-right pitching of a sample or a substrate are adjusted by a mechanical knob, so that a rigid sample (a two-dimensional material and a support thereof) is attached to the plane of the substrate in parallel; and secondly, the elastic support is utilized to ensure that the substrate has certain tolerance to the flatness and levelness of the substrate. The first method is original, low in efficiency, seriously dependent on the experience level of an operator and poor in repeatability; the second method has a certain applicability, but is not applicable to the case where the sample surface and the substrate surface have a large included angle, and is also not applicable to the case where large-area and hard contact requirements such as photolithography alignment are met. The patent (CN105800548A) discloses a device for fixed-point transfer of a single-layer two-dimensional material, which is characterized in that a cambered glass with a middle rectangular through hole is used to replace the traditional plane glass, so that a polymer layer film can be flatly and effectively contacted with the single-layer two-dimensional material without using a buffer. This method is effective for extremely fine grains of two-dimensional material, but is ineffective for transfer processes over a large area or a large number of grains of two-dimensional material over a large area. In addition, the method reported in this patent is not suitable for the alignment lithography process of two-dimensional materials. Therefore, in the fixed-point transfer of the two-dimensional material and the subsequent photoetching process, the problem that the flatness of the plane joint of the sample and the substrate is not easy to ensure generally exists.
In summary, how to solve the problem that the flatness of the planar fit between the sample and the substrate is not easily guaranteed in the fixed-point transfer of the two-dimensional material and the subsequent photolithography process has become a technical problem that needs to be solved by those skilled in the art.
Disclosure of Invention
The invention aims to provide a leveling device for processing a two-dimensional material, which aims to solve the problem that the flatness of plane fit between a sample and a substrate is not easy to guarantee in the fixed-point transfer and subsequent photoetching processes of the two-dimensional material.
In order to achieve the above object, the present invention provides a leveling device for two-dimensional material processing, comprising a base, a first rotary platform and a second rotary platform for fixing a target substrate;
first rotary platform rotationally sets up on the base, second rotary platform rotationally sets up on the first rotary platform, first rotary platform's rotation axle center with second rotary platform's rotation axle center is perpendicular, just first rotary platform's rotation axle center with second rotary platform's rotation axle center respectively with base place plane is parallel.
Preferably, two vertical plates which are arranged in parallel are arranged on the base, and the first rotating platform is rotatably arranged between the two vertical plates.
Preferably, a groove is formed in the base, and the first rotating platform is rotatably arranged in the groove.
Preferably, the groove is a rectangular parallelepiped groove.
Preferably, the first rotating platform is a rotating frame beam, and the second rotating platform is rotatably disposed in the rotating frame beam.
Preferably, the rotating frame beam is a rectangular frame beam.
Preferably, the rectangular frame beam comprises a first pair of parallel frames and a second pair of parallel frames perpendicular to the first pair of parallel frames, the first pair of parallel frames is used for connecting with the base, and the second pair of parallel frames is used for connecting with the second rotating platform.
Preferably, a first connecting groove is formed in the first pair of frames, a first connecting hole corresponding to the first connecting groove is formed in the base, and the first connecting hole is connected with the first connecting groove through a first connecting pin penetrating through the first connecting hole.
Preferably, a second connecting groove is formed in the second pair of frames, a second connecting hole corresponding to the second connecting groove is formed in the second rotating platform, and the second connecting hole is connected with the second connecting groove through a second connecting pin.
Preferably, the first coupling groove and the second coupling groove are both hemispherical grooves.
Compared with the introduction content of the background technology, the leveling device for two-dimensional material processing comprises a base, a first rotating platform and a second rotating platform for fixing a target substrate; the first rotating platform is rotatably arranged on the base, the second rotating platform is rotatably arranged on the first rotating platform, the rotating axis of the first rotating platform is perpendicular to the rotating axis of the second rotating platform, and the rotating axis of the first rotating platform and the rotating axis of the second rotating platform are respectively parallel to the plane of the base. The two-dimensional material processing leveling device fixes the target substrate on the second rotary platform in the actual use process, when the glass slide is attached to the target substrate, because the first rotary platform is rotatably arranged on the base, and the second rotary platform is rotatably arranged on the first rotary platform, according to the mechanics principle, when the sample and the substrate to be attached are not completely attached, the self-leveling and the complete flat attachment can be realized through the self-rotation of the first rotary platform and the second rotary platform under the condition of uneven stress, the self-leveling mode is reliable and efficient, the defects of low efficiency and low accuracy caused by manually adjusting the front and back and left and right pitching angles in the traditional method can be effectively improved, the influence of an initial included angle between the sample and the substrate is avoided, the operation is simple, the two-dimensional material aligning and transferring efficiency can be greatly improved, and in the fixed-point transferring and subsequent photoetching process of the two-dimensional material, the flatness of the planar fit of the sample and the substrate is effectively guaranteed.
Drawings
Fig. 1 is a schematic top view of a leveling device for two-dimensional material processing according to an embodiment of the present invention;
FIG. 2 is a schematic sectional view A-A of FIG. 1;
FIG. 3 is a schematic sectional view of the structure of FIG. 1B-B;
FIG. 4 is a schematic structural diagram of a base according to an embodiment of the present invention;
FIG. 5 is a schematic structural diagram of a first rotary platform according to an embodiment of the present invention;
FIG. 6 is a schematic structural diagram of a second rotary platform according to an embodiment of the present invention;
fig. 7 is a schematic structural view of the leveling device for two-dimensional material processing according to the embodiment of the present invention in use.
In the above figures 1-7 of the drawings,
the device comprises a base 1, a first rotating platform 2, a target substrate 3, a second rotating platform 4, a first connecting pin 5, a second connecting pin 6, a fixing hole 7, graphene 8, a flexible support 9 and a glass slide 10.
Detailed Description
The core of the invention is to provide a leveling device for processing a two-dimensional material, which is used for solving the problem that the flatness of the plane fit between a sample and a substrate is not easy to guarantee in the fixed-point transfer and subsequent photoetching processes of the two-dimensional material.
In order to make those skilled in the art better understand the technical solutions provided by the present invention, the present invention will be further described in detail with reference to the accompanying drawings and specific embodiments.
As shown in fig. 1 to 7, the leveling device for two-dimensional material processing according to the embodiment of the present invention includes a base 1, a first rotary platform 2, and a second rotary platform 4 for fixing a target substrate 3; the first rotating platform 2 is rotatably arranged on the base 1, the second rotating platform 4 is rotatably arranged on the first rotating platform 2, the rotating axis of the first rotating platform 2 is perpendicular to the rotating axis of the second rotating platform 4, and the rotating axis of the first rotating platform 2 and the rotating axis of the second rotating platform 4 are respectively parallel to the plane of the base 1.
The two-dimensional material processing leveling device fixes the target substrate on the second rotary platform in the actual use process, when the glass slide is attached to the target substrate, because the first rotary platform is rotatably arranged on the base, and the second rotary platform is rotatably arranged on the first rotary platform, according to the mechanics principle, when the sample and the substrate to be attached are not completely attached, the self-leveling and the complete flat attachment can be realized through the self-rotation of the first rotary platform and the second rotary platform under the condition of uneven stress, the self-leveling mode is reliable and efficient, the defects of low efficiency and low accuracy caused by manually adjusting the front and back and left and right pitching angles in the traditional method can be effectively improved, the influence of an initial included angle between the sample and the substrate is avoided, the operation is simple, the two-dimensional material aligning and transferring efficiency can be greatly improved, and in the fixed-point transferring and subsequent photoetching process of the two-dimensional material, the flatness of the planar fit of the sample and the substrate is effectively guaranteed.
It should be noted here that, a specific form in which the first rotating platform is rotatably disposed on the base may be that two vertical plates arranged in parallel are disposed on the base 1, and the first rotating platform 2 is rotatably disposed between the two vertical plates. This kind of arrangement processing simple manufacture, but can make leveling device's overall height become high. In another form, a groove 11 is formed on the base 1, and the first rotating platform 2 is rotatably disposed in the groove 11. Arrange like this and to practice thrift the thickness space of space make full use of base effectively and realize holding of first rotary platform, the effectual holistic volume that reduces leveling device. It will of course be appreciated by those skilled in the art that the depth and width dimensions of the recess should be such as to leave clearance for the rotational action of the first rotary platform.
In some specific embodiments, the overall shape structure of the base 1 may be a rectangular parallelepiped structure, or may be a structural form configured into other shapes as required, such as a cylinder, a truncated cone, etc., as long as the base has parallel upper and lower surfaces. In addition, the groove 11 on the base 1 can also be in a cuboid structure or a cylindrical structure, etc., so as to facilitate the principle of machining.
In a further embodiment, the first rotating platform 2 is preferably a rotating frame beam, and the second rotating platform 4 is rotatably disposed in the rotating frame beam. It is understood that the above-mentioned structure of the rotating frame beam is also to reduce the space occupied by the leveling device in height to the utmost extent, so that the second rotating platform can be directly installed in the rotating frame beam, and of course, within the allowable range of height, the structure of arranging the stand on the first rotating platform to install the second rotating platform can also be adopted, but the whole height of the leveling device is increased.
In addition, the specific structural form of the rotating frame beam may be a rectangular frame beam structure or a circular frame structure, and in the actual application process, the rotating frame beam may be selectively arranged according to actual requirements as long as the rotating frame beam is a through frame. It should be noted that the structure of the second rotating platform corresponds to that of the second rotating platform, for example, the second rotating platform is a circular cake shape, and the corresponding rotating frame is a circular frame.
In some more specific embodiments, the rectangular frame beam generally comprises two first pairs of rims 21 arranged in parallel and two second pairs of rims 22 perpendicular to the first pairs of rims 21, the two first pairs of rims 21 being adapted to be connected to the base 1 and the two second pairs of rims 22 being adapted to be connected to the second rotary platform 4. The structure of the rectangular frame beam enables the vertical relation between the rotating axis of the first rotating platform and the rotating axis of the second rotating platform to be guaranteed more easily, and the processing is more convenient.
It should be noted that, realize rotatable concrete structural style between rectangular frame roof beam and the base, can be for being provided with first connection recess 211 on the first pair of frame 21, be provided with on the base 1 with the corresponding first connecting hole 12 of first connection recess 211, first connecting hole 12 is connected through penetrating first connecting pin 5 with first connection recess 211. Rotatable connection is realized between rectangle frame roof beam and the base through above-mentioned first connecting pin, has avoided adopting whole pivot. Because the form of adopting whole root pivot, for realizing that second rotary platform can be at the sufficient space of dodging of pivot between rectangle frame roof beam and the base is surpassed to second rotary platform, obviously can make leveling device's whole height increase to some extent like this. Of course, the form of the whole rotating shaft can be adopted, but the invention preferably adopts the rotating connection mode of the first connecting pin.
Similarly, a second connecting groove 221 is formed in the second pair of frames 22, a second connecting hole 41 corresponding to the second connecting groove 221 is formed in the second rotating platform 4, and the second connecting hole 41 and the second connecting groove 221 are connected by penetrating through the second connecting pin 6. Therefore, the second rotating platform can rotate in the rectangular frame beam through the second connecting pin, and the rotating axis of the first rotating platform and the rotating axis of the second rotating platform can be in the same plane by adopting the form of the first connecting pin and the second connecting pin, so that the avoiding space is reduced to the maximum extent, and the longitudinal height of the leveling device is reduced. The concrete structure of the connecting pin can be a conical pin structure, or other structural forms capable of realizing connecting rotation.
It should be noted that, in general, the first connection recess 211 and the second connection recess 221 are both hemispherical recesses. It is understood that the above-mentioned structure of the hemispherical recess is merely a preferable example of the first connecting recess and the second connecting recess in the embodiment of the present invention, and may be other types of the recess structure of the body of revolution commonly used by those skilled in the art, such as a structure of a spherical crown recess, a tapered recess, etc.
In addition, it should be noted that the base, the first rotating platform, the second rotating platform, and other components may be made of different metals, such as aluminum and its alloy, stainless steel, etc., to meet the requirements of different weights, different thermal conductivities, different corrosion resistances, and different costs. In addition, in order to facilitate the installation and use of the leveling device, a fixing hole 7 for connecting with other structures, namely fixing, is further formed in the base 1.
In order to better understand the structure of the two-dimensional material processing leveling device provided by the present invention, the following description is given in connection with specific use cases:
for example, the leveling device of the invention is adopted to transfer the mechanical stripping graphene sample to Si/SiO2Self-leveling process of the substrate.
As shown in FIG. 7, the target substrate (Si/SiO)2The substrate) 3 is weakly fixed on a second rotary platform 4 of the leveling device through a double-sided adhesive tape, and the graphene 8 is weakly fixed on a glass slide 10 through a Polydimethylsiloxane (PDMS) flexible support body 9 for fixed-point transfer.
With the aid of an optical microscope (not shown in FIG. 7), the leveling device is moved horizontally and vertically (vertical movement direction is indicated by the downward arrow in FIG. 7) or moved horizontally or vertically (vertical movement direction is indicated by the upward arrow in FIG. 7) while the target substrate (Si/SiO)2Substrate) 3 and a Polydimethylsiloxane (PDMS) flexible support 9 bearing graphene 8, if the flexible support is not completely flat, the leveling device automatically rotates towards the contacted direction under the rotating action of the first rotating platform and the second rotating platform to promote a target substrate (Si/SiO)2Substrate) 3 and the position of the Polydimethylsiloxane (PDMS) flexible support 9 bearing the graphene 8, which is not completely contacted, are further attached until the positions of the target substrate 3 are evenly stressed when the substrate is completely attached, and then the self-leveling system stops the self-leveling process.
The two-dimensional material alignment, transfer and lithography self-leveling system of the present invention can be adapted for small substrate substrates, such as 5mm x 5mm, as well as larger wafers, such as 2 inch silicon wafers; can meet the transfer requirements of different two-dimensional materials, such as graphene, transition metal chalcogenide, black phosphorus, boron nitride and the like; the method can be suitable for different transfer processes, including a transfer-etching method, an electrostatic film method and a heat release film method; the leveling device can be uniformly heated by a method of installing the heater under the base, and the heating temperature can reach 140 ℃.
The leveling device for two-dimensional material processing provided by the present invention is described in detail above. It should be noted that, in the present specification, the embodiments are all described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments may be referred to each other.
It is also noted that, in this document, terms such as "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that an article or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such article or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in an article or device that comprises the element.
The principles and embodiments of the present invention are explained herein using specific examples, which are presented only to assist in understanding the core concepts of the present invention. It should be noted that, for those skilled in the art, it is possible to make various improvements and modifications to the present invention without departing from the principle of the present invention, and those improvements and modifications also fall within the scope of the claims of the present invention.
Claims (10)
1. A leveling device for two-dimensional material handling, characterized by comprising a base (1), a first rotary platform (2) and a second rotary platform (4) for fixing a target substrate (3);
the first rotating platform (2) is rotatably arranged on the base (1), the second rotating platform (4) is rotatably arranged on the first rotating platform (2), the rotating axis of the first rotating platform (2) is perpendicular to the rotating axis of the second rotating platform (4), and the rotating axis of the first rotating platform (2) and the rotating axis of the second rotating platform (4) are respectively parallel to the plane of the base (1);
when the glass slide is attached to the target substrate, according to the principle of mechanics, when a sample and a substrate which need to be attached are not completely attached, the first rotating platform and the second rotating platform can rotate independently under the condition of uneven stress to realize self-leveling and complete flat attachment.
2. The leveling device for two-dimensional material processing according to claim 1, characterized in that two parallel-arranged vertical plates are arranged on the base (1), and the first rotary platform (2) is rotatably arranged between the two vertical plates.
3. The two-dimensional material handling leveling device according to claim 1, characterized in that a recess (11) is provided on the base (1), the first rotary platform (2) being rotatably arranged in the recess (11).
4. The two-dimensional material processing leveling device according to claim 3, characterized in that the recess (11) is a cuboid recess.
5. The leveling device for two-dimensional material handling according to one of the claims 1 to 4, characterized in that the first rotary platform (2) is a rotary frame beam, in which the second rotary platform (4) is rotatably arranged.
6. The two-dimensional material handling leveling device of claim 5, wherein the rotating frame beam is a rectangular frame beam.
7. The two-dimensional material handling leveling device according to claim 6, characterized in that the rectangular frame beam comprises two first pairs of rims (21) arranged in parallel, two first pairs of rims (21) being adapted to be connected to the base (1), and two second pairs of rims (22) being perpendicular to the first pairs of rims (21), two second pairs of rims (22) being adapted to be connected to the second rotating platform (4).
8. The two-dimensional material processing leveling device according to claim 7, wherein a first connection groove (211) is provided on the first pair of rims (21), a first connection hole (12) corresponding to the first connection groove (211) is provided on the base (1), and the first connection hole (12) is connected with the first connection groove (211) by penetrating a first connection pin (5).
9. The two-dimensional material handling leveling device according to claim 8, wherein a second connecting groove (221) is provided on the second pair of rims (22), a second connecting hole (41) corresponding to the second connecting groove (221) is provided on the second rotary platform (4), and the second connecting hole (41) is connected with the second connecting groove (221) by penetrating a second connecting pin (6).
10. The two-dimensional material processing leveling device according to claim 9, wherein the first connection recess (211) and the second connection recess (221) are both hemispherical recesses.
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| CN201811229679.6A CN109524342B (en) | 2018-10-22 | 2018-10-22 | Leveling device for two-dimensional material treatment |
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| CN201811229679.6A CN109524342B (en) | 2018-10-22 | 2018-10-22 | Leveling device for two-dimensional material treatment |
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| US9373534B2 (en) * | 2012-09-05 | 2016-06-21 | Industrial Technology Research Institute | Rotary positioning apparatus with dome carrier, automatic pick-and-place system, and operating method thereof |
| CN204289407U (en) * | 2014-12-25 | 2015-04-22 | 常州二维碳素科技有限公司 | A kind of applying system |
| CN207938577U (en) * | 2018-01-22 | 2018-10-02 | 复旦大学 | A kind of transfer platform shifting large-area two-dimensional material under vacuum conditions |
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