CN109524334B - Semiconductor crystal grain sheet transferring device - Google Patents
Semiconductor crystal grain sheet transferring device Download PDFInfo
- Publication number
- CN109524334B CN109524334B CN201811635333.6A CN201811635333A CN109524334B CN 109524334 B CN109524334 B CN 109524334B CN 201811635333 A CN201811635333 A CN 201811635333A CN 109524334 B CN109524334 B CN 109524334B
- Authority
- CN
- China
- Prior art keywords
- frame
- table top
- film
- feeding table
- scraping plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 34
- 239000013078 crystal Substances 0.000 title description 3
- 238000007790 scraping Methods 0.000 claims abstract description 41
- 238000004804 winding Methods 0.000 claims abstract description 5
- 230000000149 penetrating effect Effects 0.000 claims abstract description 4
- 239000002184 metal Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000002313 adhesive film Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
Abstract
The invention relates to a semiconductor grain sheet transferring device, which is provided with a frame; a feeding table top is fixedly arranged on the frame; the rack is provided with a scraping plate which can be spliced or separated from the right side of the feeding table through a first sliding control assembly in a sliding manner; an electric roller is arranged on the frame and positioned below the feeding table top in a sliding manner; the electric roller can be pressed or separated from the lower surface of the feeding table top through the second sliding control assembly; the frame is also provided with a film winding drum; the film on the film winding drum passes through the lower part of the scraping plate and passes out from between the scraping plate and the feeding table top; a sliding beam which is driven to slide by a driving device is arranged on the rack in a sliding manner; the sliding beam spans over the scraping plate; and the sliding beam is provided with a pressing component for pressing the film penetrating out from between the scraping plate and the feeding table top. The invention can completely transfer the cut semiconductor wafer to the film without the viscosity, thereby facilitating the subsequent sorting work.
Description
Technical Field
The present invention relates to semiconductor die manufacturing equipment, and more particularly, to a semiconductor die sheet transfer apparatus.
Background
Semiconductor devices or integrated circuits are fabricated by dicing a semiconductor wafer into individual device chips or dies. In order to ensure the accuracy in dicing, it is necessary to apply a film to the semiconductor wafer, and after dicing, the semiconductor wafer is also ensured to be intact under the adhesive property of the film. After dicing the semiconductor wafer, the semiconductor wafer needs to be divided into dies and then sorted. In the prior art, since the adhesive film has tackiness, in order to secure sorting efficiency, it is necessary to transfer the cut semiconductor wafer onto a film having no tackiness and then disperse the semiconductor wafer into grains. The existing transfer equipment is complex in operation and low in automation degree.
Disclosure of Invention
The invention aims to provide a semiconductor crystal grain sheet transferring device with high automation degree and high transferring efficiency.
The technical scheme for realizing the aim of the invention is as follows: the invention has a frame; a feeding table top is fixedly arranged on the frame; the rack is provided with a scraping plate which can be spliced or separated from the right side of the feeding table through a first sliding control assembly in a sliding manner; an electric roller is arranged on the frame and positioned below the feeding table top in a sliding manner; the electric roller can be pressed or separated from the lower surface of the feeding table top through the second sliding control assembly; the frame is also provided with a film winding drum; the film on the film winding drum passes through the lower part of the scraping plate and passes out from between the scraping plate and the feeding table top; a sliding beam which is driven to slide by a driving device is arranged on the rack in a sliding manner; the sliding beam spans over the scraping plate; and the sliding beam is provided with a pressing component for pressing the film penetrating out from between the scraping plate and the feeding table top.
The feeding table top is an inclined plane; the scraping plate is horizontally arranged.
A supporting table top is fixedly arranged on the frame; the scraping plate slides between the supporting table top and the feeding table top.
And a holding plate arranged between the film and the scraping plate.
The first sliding control assembly comprises a first main rod, a first control deflector rod and a first rocker; the two ends of the scraping plate are arranged on the frame in a sliding way, the two ends of the scraping plate are rotationally connected with one end of one first rocker, and the other ends of the two first rockers are rotationally connected with the first main rod; the first main rod is rotatably connected to the frame, and one end of the first main rod extends out of the frame and is connected with a first control deflector rod capable of controlling the rotation of the first main rod.
The second sliding control assembly comprises a second main rod, a second control deflector rod and a second rocker; two ends of the electric roller are rotationally connected with one end of a second rocker, and the other ends of the two second rockers are fixedly connected with the second main rod; the second main rod is rotatably connected to the frame, and one end of the second main rod extends out of the frame and is connected with a second control deflector rod capable of controlling the rotation of the second main rod.
The pressing component comprises a bracket, a pressing block and a pull rod; the bracket is fixedly connected to the sliding beam and is positioned above the scraping plate; the two ends of the pressing block are rotationally connected to the bracket, and a pull rod for controlling the pressing block to rotate is fixedly arranged on the pressing block; one side of the pressing block is provided with a pressing head which is matched and pressed with the bracket.
The Cheng Jieban is a metal plate; and the accommodating plate is also provided with a magnet which can compress the film on the accommodating plate.
One side of the scraping plate, which is close to the feeding table top, is provided with a limiting stop bar for positioning the holding plate.
The invention has the positive effects that: (1) The invention can transfer the cut semiconductor wafer from the film with viscosity to the film without viscosity, so as to facilitate the sorting work in the later period;
(2) The invention has high degree of automation, can realize pulling the film with viscosity through the electric roller, and relatively and completely transfers the cut semiconductor wafer to the film without viscosity by utilizing the scraping plate;
(3) The feeding table top is an inclined plane, and the scraping plate is horizontally arranged, so that the semiconductor wafer can be better transferred to the film 7;
(4) According to the invention, the electric roller and the scraping plate can be better controlled in a sliding way through the first sliding control assembly and the second sliding control assembly, so that the efficiency and the accuracy are greatly improved;
(5) According to the invention, the film can be ensured to move along with the sliding beam when the sliding beam slides through the compression assembly, so that smooth transfer of the cut semiconductor wafer is ensured;
(6) The invention can further improve the transfer effect through the holding plate, and is convenient for picking and placing the transferred semiconductor wafer;
(7) According to the invention, through the matching of the magnet and the accommodating plate, the film can be fixed, so that the integrity of the cut semiconductor wafer on the film is effectively ensured;
(8) The invention can facilitate the placement and positioning of the holding plates and improve the transfer efficiency through the limiting stop bars.
Drawings
In order that the invention may be more readily understood, a more particular description of the invention will be rendered by reference to specific embodiments thereof which are illustrated in the appended drawings, in which
FIG. 1 is a schematic diagram of the structure of the present invention;
FIG. 2 is a schematic view of the structure of the present invention before the film is fixed;
FIG. 3 is a cross-sectional view of the present invention;
FIG. 4 is a schematic diagram of a first sliding control assembly according to the present invention;
FIG. 5 is a schematic diagram of a second slide control assembly according to the present invention;
fig. 6 is a schematic structural view of the compression assembly of the present invention.
Detailed Description
Referring to fig. 1 to 6, the present invention has a frame 1; a feeding table top 11 is fixedly arranged on the frame 1; the frame 1 is provided with a scraping plate 3 which can be spliced or separated from the right side of the feeding table top 11 through a first sliding control assembly 2 in a sliding manner; the electric roller 4 is arranged on the frame 1 and positioned below the feeding table top 11 in a sliding manner; the motorized pulley 4 can be pressed or separated from the lower surface of the feeding table top 11 through the second sliding control assembly 5; the frame 1 is also provided with a film reel 6; the film 7 on the film reel 6 passes through the lower part of the scraper 3 and passes out from between the scraper 3 and the feeding table top 11; a sliding beam 8 which is driven to slide by a driving device is arranged on the frame 1 in a sliding manner; the sliding beam 8 is spanned above the scraping plate 3; the sliding beam 8 is provided with a pressing component 9 for pressing the film 7 penetrating out from between the scraping plate 3 and the feeding table top 11.
The feeding table top 11 is an inclined plane; the scraping plate 3 is horizontally arranged.
A supporting table top 12 is fixedly arranged on the frame 1; the scraper 3 slides between the supporting table 12 and the feeding table 11.
A receiving plate 10 is also provided for placement between the membrane 7 and the scraper 3. Better support for the receiving plate 10 is provided by the support table 12.
The first sliding control assembly 2 comprises a first main rod 21, a first control deflector rod 22 and a first rocker 23; the two ends of the scraping plate 3 are arranged on the frame 1 in a sliding way, the two ends of the scraping plate 3 are both rotationally connected with one end of one first rocker 23, and the other ends of the two first rockers 23 are both rotationally connected with the first main rod 21; the first main lever 21 is rotatably connected to the frame 1, and one end of the first main lever 21 extends out of the frame 1 and is connected to a first control lever 22 capable of controlling the rotation of the first main lever 21.
The second sliding control assembly 5 comprises a second main rod 51, a second control deflector rod 52 and a second rocker 53; both ends of the electric roller 4 are rotationally connected with one end of a second rocking rod 53, and the other ends of the two second rocking rods 53 are fixedly connected with the second main rod 51; the second main lever 51 is rotatably connected to the frame 1, and one end of the second main lever 51 extends out of the frame 1 and is connected to a second control lever 52 capable of controlling the rotation of the second main lever 51.
The compressing assembly 9 comprises a bracket 91, a pressing block 92 and a pull rod 93; the bracket 91 is fixedly connected to the sliding beam 8 and is positioned above the scraping plate 3; both ends of the pressing block 92 are rotatably connected to the bracket 91, and a pull rod 93 for controlling the pressing block 92 to rotate is fixedly arranged on the pressing block 92; one side of the pressing block 92 is a pressing head which is matched and pressed with the bracket 91.
The Cheng Jieban is a metal plate; the accommodating plate 10 is also provided with a magnet which can press the film 7 on the accommodating plate 10.
One side of the scraping plate 3 close to the feeding table top 11 is provided with a limiting stop bar for positioning the holding plate 10.
The working principle of the invention is as follows:
firstly, the film 7 is pulled out from the scraper 3 and then fixed on the pressing component 9, then the semiconductor wafer with the film is prevented from being arranged on the feeding table top 11, and the edge of the film is pressed below the feeding table top 11; then the second control deflector rod 52 is pulled to press the edge of the film by the electric roller 4, and then the scraping plate 3 is spliced with the feeding table top 11 by the first control deflector rod 22; then, the holding plate 10 is placed between the film 7 and the scraping plate 3, then the film is pulled by the electric roller 4, the sliding beam 8 is also moved to the right side under the drive of the driving device, and at this time, the scraping plate 3 peels the semiconductor wafer on the film from the film and continuously transfers the semiconductor wafer to the film 7. After the transfer is completed, the motorized pulley 4 stops working, then the film 7 is cut off with a blade, and then the film 7 is fixed with a magnet. The holding plate 10 is taken down, the scraping plate 3 is separated from the feeding table top 11 through the first control deflector 22, and then the electric roller 4 is separated from the feeding table top 11 through the second control deflector 52.
While the foregoing is directed to embodiments of the present invention, other and further details of the invention may be had by the present invention, it should be understood that the foregoing description is merely illustrative of the present invention and that no limitations are intended to the scope of the invention, except insofar as modifications, equivalents, improvements or modifications are within the spirit and principles of the invention.
Claims (9)
1. A semiconductor die-transfer apparatus has a frame (1); the method is characterized in that: a feeding table top (11) is fixedly arranged on the frame (1); the frame (1) is provided with a scraping plate (3) which can be spliced or separated from the right side of the feeding table top (11) through a first sliding control assembly (2) in a sliding manner and is used for stripping the semiconductor wafer on the film; an electric roller (4) for pulling the film is arranged on the frame (1) and is positioned below the feeding table top (11) in a sliding manner; the electric roller (4) can be pressed or separated from the lower surface of the feeding table top (11) through the second sliding control assembly (5); the frame (1) is also provided with a film winding drum (6); the film (7) on the film reel (6) passes through the lower part of the scraper (3) and passes out from between the scraper (3) and the feeding table top (11); a sliding beam (8) which is driven to slide by a driving device is arranged on the frame (1) in a sliding manner; the sliding beam (8) is spanned above the scraping plate (3); the sliding beam (8) is provided with a pressing component (9) for pressing the film (7) penetrating out from between the scraping plate (3) and the feeding table top (11).
2. A semiconductor die transfer apparatus as defined in claim 1, wherein: the feeding table top (11) is an inclined plane; the scraping plate (3) is horizontally arranged.
3. A semiconductor die transfer apparatus as defined in claim 1, wherein: a supporting table top (12) is fixedly arranged on the frame (1); the scraping plate (3) slides between the supporting table top (12) and the feeding table top (11).
4. A semiconductor die transfer apparatus according to claim 1, 2 or 3, wherein: a holding plate (10) is also provided for placement between the film (7) and the scraper (3).
5. A semiconductor die transfer apparatus as defined in claim 1, wherein: the first sliding control assembly (2) comprises a first main rod (21), a first control deflector rod (22) and a first rocker (23); the two ends of the scraping plate (3) are arranged on the frame (1) in a sliding way, the two ends of the scraping plate (3) are rotationally connected with one end of a first rocker (23), and the other ends of the two first rockers (23) are rotationally connected with the first main rod (21); the first main rod (21) is rotatably connected to the frame (1), and one end of the first main rod (21) extends out of the frame (1) and is connected with a first control deflector rod (22) capable of controlling the first main rod (21) to rotate.
6. A semiconductor die transfer apparatus as defined in claim 1, wherein: the second sliding control assembly (5) comprises a second main rod (51), a second control deflector rod (52) and a second rocker (53); both ends of the electric roller (4) are rotationally connected with one end of a second rocker (53), and the other ends of the two second rockers (53) are fixedly connected with a second main rod (51); the second main rod (51) is rotatably connected to the frame (1), and one end of the second main rod (51) extends out of the frame (1) and is connected with a second control deflector rod (52) capable of controlling the second main rod (51) to rotate.
7. A semiconductor die transfer apparatus as defined in claim 1, wherein: the compressing assembly (9) comprises a bracket (91), a pressing block (92) and a pull rod (93); the bracket (91) is fixedly connected to the sliding beam (8) and is positioned above the scraping plate (3); both ends of the pressing block (92) are rotationally connected to the bracket (91), and a pull rod (93) for controlling the pressing block (92) to rotate is fixedly arranged on the pressing block; one side of the pressing block (92) is provided with a pressing head which is matched and pressed with the bracket (91).
8. The semiconductor die transfer apparatus of claim 4, wherein: the Cheng Jieban (10) is a metal plate; and a magnet capable of pressing the film (7) on the Cheng Jieban (10) is also arranged on the Cheng Jieban (10).
9. The semiconductor die transfer apparatus of claim 4, wherein: one side of the scraping plate (3) close to the feeding table top (11) is provided with a limiting stop bar for positioning the holding plate (10).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811635333.6A CN109524334B (en) | 2018-12-29 | 2018-12-29 | Semiconductor crystal grain sheet transferring device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811635333.6A CN109524334B (en) | 2018-12-29 | 2018-12-29 | Semiconductor crystal grain sheet transferring device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109524334A CN109524334A (en) | 2019-03-26 |
| CN109524334B true CN109524334B (en) | 2024-02-06 |
Family
ID=65798182
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811635333.6A Active CN109524334B (en) | 2018-12-29 | 2018-12-29 | Semiconductor crystal grain sheet transferring device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109524334B (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0345674A (en) * | 1989-07-14 | 1991-02-27 | Santetsuku:Kk | Method and apparatus for adhesion of double-adhesive tape |
| TW405238B (en) * | 1998-08-26 | 2000-09-11 | Samsung Electronics Co Ltd | Semiconductor device having die adhesively bonded by electrically insulating tape, method and apparatus for die bonding |
| JP2009016470A (en) * | 2007-07-03 | 2009-01-22 | Panasonic Corp | Sheet stretcher and sheet expanding method |
| CN101383274A (en) * | 2007-09-06 | 2009-03-11 | 株式会社新川 | Semiconductor chip pickup apparatus and pickup method |
| JP2011091121A (en) * | 2009-10-20 | 2011-05-06 | Csun Mfg Ltd | Wafer laminator dry film transmission mechanism |
| CN208084915U (en) * | 2018-02-08 | 2018-11-13 | 青岛软盛塑业有限公司 | A kind of special feeding equipment of film stretching machine |
| CN209298078U (en) * | 2018-12-29 | 2019-08-23 | 泰州芯格电子科技有限公司 | A kind of semiconductor grain piece transfer device |
-
2018
- 2018-12-29 CN CN201811635333.6A patent/CN109524334B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0345674A (en) * | 1989-07-14 | 1991-02-27 | Santetsuku:Kk | Method and apparatus for adhesion of double-adhesive tape |
| TW405238B (en) * | 1998-08-26 | 2000-09-11 | Samsung Electronics Co Ltd | Semiconductor device having die adhesively bonded by electrically insulating tape, method and apparatus for die bonding |
| JP2009016470A (en) * | 2007-07-03 | 2009-01-22 | Panasonic Corp | Sheet stretcher and sheet expanding method |
| CN101383274A (en) * | 2007-09-06 | 2009-03-11 | 株式会社新川 | Semiconductor chip pickup apparatus and pickup method |
| JP2011091121A (en) * | 2009-10-20 | 2011-05-06 | Csun Mfg Ltd | Wafer laminator dry film transmission mechanism |
| CN208084915U (en) * | 2018-02-08 | 2018-11-13 | 青岛软盛塑业有限公司 | A kind of special feeding equipment of film stretching machine |
| CN209298078U (en) * | 2018-12-29 | 2019-08-23 | 泰州芯格电子科技有限公司 | A kind of semiconductor grain piece transfer device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109524334A (en) | 2019-03-26 |
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