CN109524333A - A kind of high-voltage IGBT module encapsulation release liquid injection tooling - Google Patents
A kind of high-voltage IGBT module encapsulation release liquid injection tooling Download PDFInfo
- Publication number
- CN109524333A CN109524333A CN201811619745.0A CN201811619745A CN109524333A CN 109524333 A CN109524333 A CN 109524333A CN 201811619745 A CN201811619745 A CN 201811619745A CN 109524333 A CN109524333 A CN 109524333A
- Authority
- CN
- China
- Prior art keywords
- release liquid
- support rod
- igbt module
- bottom plate
- support bar
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000007788 liquid Substances 0.000 title claims abstract description 43
- 238000002347 injection Methods 0.000 title claims abstract description 24
- 239000007924 injection Substances 0.000 title claims abstract description 24
- 238000005538 encapsulation Methods 0.000 title abstract description 11
- 239000003292 glue Substances 0.000 claims abstract description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
- 238000010079 rubber tapping Methods 0.000 abstract description 9
- 238000000034 method Methods 0.000 abstract description 8
- 230000003247 decreasing effect Effects 0.000 abstract description 4
- 239000000243 solution Substances 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000007943 implant Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Coating Apparatus (AREA)
Abstract
The release liquid that the present invention provides a kind of for encapsulating 4500V or more high-voltage IGBT module injects tooling, including bottom plate, deck, buckle and support rod, the support rod includes vertical support rod and horizontal support bar, it is connected by a snap between the vertical support rod and horizontal support bar, it is connected between the vertical support rod and bottom plate by deck, the glue injecting head and sucking rubber heads of release liquid injection device is installed on the horizontal support bar.The injection tooling is suitable for encapsulating the high-voltage IGBT module of 4500V or more, the difficulty that release liquid is injected in conventional high-tension IGBT module encapsulation process can be greatly reduced, the requirement to operator's technical level and experience is greatly decreased, the operator that experience can also simultaneously lacked goes up hand as early as possible, the quality of annotation tapping is significantly improved, the time of annotation tapping is reduced.
Description
Technical field
The invention belongs to IGBT encapsulation technology fields, and in particular to a kind of high-voltage IGBT module encapsulation release liquid injection work
Dress.
Background technique
It is the new of representative with IGBT (Insulated Gate Bipolar Transistor, insulated gate bipolar transistor)
Type power semiconductor device module is to develop most rapid, the widest power semiconductor device module of purposes in the world at present, is made
For the core devices of power electronics power-saving technology, IGBT device is in frequency converter, electric welding machine, Switching Power Supply, air conditioner and railcar
Electric drive system is widely used.
It is especially applied to high pressure (4500V or more) IGBT module of Rail Transit System, quality and reliability is straight
Connect the stability for affecting rail vehicle electric drive system；And having a procedure in the encapsulation link of high pressure IGBT is exactly to annotate
Tapping, to alleviate different encapsulating materials as the influence caused by module of thermal expansion coefficient difference.Therefore, how efficiently, fast,
Reliable completion release liquid injection needs to pay special attention to.
However so far, not yet there is the release liquid note in relation to the high-voltage IGBT module for being suitable for encapsulating 4500V or more
Enter the relevant technologies and is seen in report.
Summary of the invention
Technical problem to be solved by the present invention lies in view of the above shortcomings of the prior art, provide a kind of high pressure IGBT mould
The release liquid of block injects tooling, which is suitable for encapsulating the high-voltage IGBT module of 4500V or more, can greatly reduce
The difficulty that release liquid is injected in conventional high-tension IGBT module encapsulation process is greatly decreased to operator's technical level and experience
It is required that while operator's upper hand as early as possible that experience can also be made to lack, significantly improve the quality of annotation tapping, reduce annotation and put
The time of liquid.
In order to solve the above technical problems, the technical solution adopted by the present invention is that: one kind is for encapsulating 4500V or more high pressure
The release liquid of IGBT module injects tooling, it is characterised in that: including bottom plate, deck, buckle and support rod, the support rod includes
Vertical support rod and horizontal support bar, are connected by a snap, the vertical branch between the vertical support rod and horizontal support bar
It is connected between strut and bottom plate by deck, the glue injecting head of release liquid injection device is installed on the horizontal support bar and inhales glue
Head.
A kind of above-mentioned release liquid for encapsulating 4500V or more high-voltage IGBT module injects tooling, it is characterised in that: institute
Stating bottom plate and being one piece can make release liquid injection tooling be stably placed at hardboard on station, offer and be used on the deck
The through-hole of vertical support rod is plugged, the bottom plate and deck are bolted.
A kind of above-mentioned release liquid for encapsulating 4500V or more high-voltage IGBT module injects tooling, it is characterised in that: sets
The quantity for setting the deck on bottom plate, buckle, vertical support rod and horizontal support bar is two, wherein a horizontal support bar
On the glue injecting head of release liquid injection device is installed, the suction glue of release liquid injection device is installed on another horizontal support bar
Head.
A kind of above-mentioned release liquid for encapsulating 4500V or more high-voltage IGBT module injects tooling, it is characterised in that: institute
Stating buckle is that cross buckles.
Compared with the prior art, the present invention has the following advantages:
1, the present invention technological deficiency high for release liquid injection difficulty in conventional high-tension IGBT module encapsulation process, provides
A kind of release liquid injects tooling, which is suitable for encapsulating the high-voltage IGBT module of 4500V or more, can greatly drop
The difficulty that release liquid is injected in low conventional high-tension IGBT module encapsulation process, is greatly decreased to operator's technical level and experience
Requirement, while the operator that experience can also be made to lack upper hand as early as possible significantly improves the quality of annotation tapping, reduces annotation
The time of tapping.
2, injection tooling proposed by the present invention has efficient, convenient and fast distinguishing feature, can effectively improve release liquid injection
Operability, Improving The Quality of Products, reduce annotation tapping needed for the time, improve production efficiency.
Invention is further described in detail with reference to the accompanying drawings and examples.
Detailed description of the invention
Fig. 1 is the structural schematic diagram that high-voltage IGBT module encapsulation release liquid of the present invention injects tooling.
Fig. 2 is the top view of Fig. 1.
Fig. 3 is the left view of Fig. 1.
Specific embodiment
The invention discloses it is a kind of for encapsulate 4500V or more high-voltage IGBT module release liquid inject tooling, as Fig. 1,
Shown in Fig. 2 and Fig. 3, which includes bottom plate 1, deck 2, buckle 3 and four part of support rod, wherein the support rod packet
Vertical support rod 41 and horizontal support bar 42 are included, is connected between the vertical support rod 41 and horizontal support bar 42 by buckle 3,
It is connected between the vertical support rod 41 and bottom plate 1 by deck 2, release liquid injection is installed on the horizontal support bar 42 and is set
Standby glue injecting head and sucking rubber heads.It should be noted that release liquid injection device belongs to existing, conventional, the commercially available equipment that is easy to get.
The bottom plate 1 is one piece of hardboard as a preferred technical solution, and the present invention has no the material of bottom plate 1 and strictly wants
It asks, plate hardness can make release liquid injection tooling of the present invention rest easily within the steel plate on station, ceramic wafer, hard modeling
Flitch, composite panel etc..
The through-hole for plugging vertical support rod 41 is offered on the deck 2 as a preferred technical solution, it is described
Bolt hole is offered on bottom plate 1 and deck 2, the two can be achieved a fixed connection by bolt.
Every bottom plate 1 is corresponded to as a preferred technical solution, the deck 2 that is arranged on, buckle 3,41 and of vertical support rod
The quantity of horizontal support bar 42 is two, wherein being equipped with the injecting glue of release liquid injection device on a horizontal support bar 42
Head is equipped with the sucking rubber heads of release liquid injection device on another horizontal support bar 42.
The buckle 3 buckles as a preferred technical solution, for cross.
In conjunction with Fig. 1, Fig. 2 and Fig. 3, the present invention is used to encapsulate the release liquid injection tooling of 4500V or more high-voltage IGBT module
It is specific installation and application method are as follows: firstly, bottom plate 1 and deck 2 are connected, then vertical support rod 41 is connect with deck 2,
Buckle 3 is mounted on vertical support rod 41 later, horizontal support bar 42 is connect with buckle 3 then, finally infuses release liquid
The glue injecting head and sucking rubber heads for entering equipment are mounted on horizontal support bar 42.It, can be by operating release liquid after the completion of above step
Equipment quickly and easily completes release liquid implant operation.The injection tooling can be used in encapsulating the high pressure IGBT of 4500V or more
Module can greatly reduce the difficulty that release liquid is injected in conventional high-tension IGBT module encapsulation process, be greatly decreased to operation
The requirement of Personnel Skill Levels and experience, while the operator that experience can also be made to lack goes up hand as early as possible, significantly improves annotation
The quality of tapping reduces the time of annotation tapping.
The above is only presently preferred embodiments of the present invention, is not intended to limit the invention in any way.It is all according to invention skill
Art any simple modification, change and equivalence change substantially to the above embodiments, still fall within technical solution of the present invention
Protection scope in.
Claims (4)
1. a kind of release liquid for encapsulating 4500V or more high-voltage IGBT module injects tooling, it is characterised in that: including bottom plate
(1), deck (2), buckle (3) and support rod, the support rod include vertical support rod (41) and horizontal support bar (42), described
It is connect between vertical support rod (41) and horizontal support bar (42) by buckling (3), the vertical support rod (41) and bottom plate (1)
Between connected by deck (2), the glue injecting head and sucking rubber heads of release liquid injection device are installed on the horizontal support bar (42).
2. a kind of release liquid for encapsulating 4500V or more high-voltage IGBT module according to claim 1 injects tooling,
Be characterized in that: the bottom plate (1), which is one piece, can make release liquid injection tooling be stably placed at the hardboard on station, the card
The through-hole for plugging vertical support rod (41) is offered on seat (2), the bottom plate (1) and deck (2) are bolted.
3. a kind of release liquid for encapsulating 4500V or more high-voltage IGBT module according to claim 1 or 2 injects work
Dress, it is characterised in that: deck (2), buckle (3), vertical support rod (41) and the horizontal support bar (42) being arranged on bottom plate (1)
Quantity be two, wherein being equipped with the glue injecting head of release liquid injection device, another water on a horizontal support bar (42)
The sucking rubber heads of release liquid injection device are installed on flat support rod (42).
4. a kind of release liquid for encapsulating 4500V or more high-voltage IGBT module according to claim 1 or 2 injects work
Dress, it is characterised in that: the buckle (3) is cross buckle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811619745.0A CN109524333B (en) | 2018-12-27 | 2018-12-27 | Release liquid injection tool for packaging high-voltage IGBT module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811619745.0A CN109524333B (en) | 2018-12-27 | 2018-12-27 | Release liquid injection tool for packaging high-voltage IGBT module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109524333A true CN109524333A (en) | 2019-03-26 |
| CN109524333B CN109524333B (en) | 2024-03-26 |
Family
ID=65797719
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811619745.0A Active CN109524333B (en) | 2018-12-27 | 2018-12-27 | Release liquid injection tool for packaging high-voltage IGBT module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109524333B (en) |
Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09129822A (en) * | 1995-10-26 | 1997-05-16 | Mitsubishi Electric Corp | Semiconductor device |
| EP0921565A2 (en) * | 1997-12-08 | 1999-06-09 | Kabushiki Kaisha Toshiba | Package for semiconductor power device and method for assembling the same |
| US20030183907A1 (en) * | 2002-03-28 | 2003-10-02 | Mitsubishi Denki Kabushiki Kaisha | Resin-molded device and manufacturing apparatus thereof |
| JP2005116556A (en) * | 2003-10-02 | 2005-04-28 | Fuji Electric Fa Components & Systems Co Ltd | Method of manufacturing resin-sealed semiconductor device and arrangement method thereof |
| WO2013091143A1 (en) * | 2011-12-21 | 2013-06-27 | 武汉飞恩微电子有限公司 | Microchannel direct bonded copper substrate and packaging structure and process of power device thereof |
| CN104347432A (en) * | 2013-07-23 | 2015-02-11 | 西安永电电气有限责任公司 | Tool structure for injecting and sucking out semiconductor module packaging liquid |
| US20150155228A1 (en) * | 2013-12-02 | 2015-06-04 | Mitsubishi Electric Corporation | Power module and method for manufacturing the same |
| JP2016025154A (en) * | 2014-07-17 | 2016-02-08 | 三菱電機株式会社 | High breakdown voltage resin molded type semiconductor device and metal mold |
| CN206229597U (en) * | 2016-12-01 | 2017-06-09 | 南京哈维斯特精密机械有限公司 | A kind of full-automatic horizontal glue-injection machine with preheating function |
| CN207150940U (en) * | 2017-07-10 | 2018-03-27 | 特变电工西安电气科技有限公司 | A kind of PCBA board of encapsulating processing |
| WO2018137280A1 (en) * | 2017-01-25 | 2018-08-02 | 新加坡有限公司 | Chip packaging device and method |
| CN207782345U (en) * | 2017-12-20 | 2018-08-28 | 西安中车永电电气有限公司 | A kind of insulation support device suitable for L-type composite bus bar |
| CN210073773U (en) * | 2018-12-27 | 2020-02-14 | 西安中车永电电气有限公司 | High pressure IGBT module encapsulation is with release liquid injection frock |
-
2018
- 2018-12-27 CN CN201811619745.0A patent/CN109524333B/en active Active
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09129822A (en) * | 1995-10-26 | 1997-05-16 | Mitsubishi Electric Corp | Semiconductor device |
| EP0921565A2 (en) * | 1997-12-08 | 1999-06-09 | Kabushiki Kaisha Toshiba | Package for semiconductor power device and method for assembling the same |
| US20030183907A1 (en) * | 2002-03-28 | 2003-10-02 | Mitsubishi Denki Kabushiki Kaisha | Resin-molded device and manufacturing apparatus thereof |
| JP2005116556A (en) * | 2003-10-02 | 2005-04-28 | Fuji Electric Fa Components & Systems Co Ltd | Method of manufacturing resin-sealed semiconductor device and arrangement method thereof |
| WO2013091143A1 (en) * | 2011-12-21 | 2013-06-27 | 武汉飞恩微电子有限公司 | Microchannel direct bonded copper substrate and packaging structure and process of power device thereof |
| CN104347432A (en) * | 2013-07-23 | 2015-02-11 | 西安永电电气有限责任公司 | Tool structure for injecting and sucking out semiconductor module packaging liquid |
| US20150155228A1 (en) * | 2013-12-02 | 2015-06-04 | Mitsubishi Electric Corporation | Power module and method for manufacturing the same |
| JP2016025154A (en) * | 2014-07-17 | 2016-02-08 | 三菱電機株式会社 | High breakdown voltage resin molded type semiconductor device and metal mold |
| CN206229597U (en) * | 2016-12-01 | 2017-06-09 | 南京哈维斯特精密机械有限公司 | A kind of full-automatic horizontal glue-injection machine with preheating function |
| WO2018137280A1 (en) * | 2017-01-25 | 2018-08-02 | 新加坡有限公司 | Chip packaging device and method |
| CN207150940U (en) * | 2017-07-10 | 2018-03-27 | 特变电工西安电气科技有限公司 | A kind of PCBA board of encapsulating processing |
| CN207782345U (en) * | 2017-12-20 | 2018-08-28 | 西安中车永电电气有限公司 | A kind of insulation support device suitable for L-type composite bus bar |
| CN210073773U (en) * | 2018-12-27 | 2020-02-14 | 西安中车永电电气有限公司 | High pressure IGBT module encapsulation is with release liquid injection frock |
Non-Patent Citations (1)
| Title |
|---|
| 龙乐;: "功率模块封装结构及其技术", 电子与封装, no. 11 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109524333B (en) | 2024-03-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN210073773U (en) | High pressure IGBT module encapsulation is with release liquid injection frock | |
| CN109524333A (en) | A kind of high-voltage IGBT module encapsulation release liquid injection tooling | |
| CN209738233U (en) | Quick cooling device is used in production of moulding plastics of computer keyboard frame | |
| CN205968124U (en) | Electric horn of automobile casing assembly device for tighten | |
| CN206928150U (en) | A kind of insulation gauge tie adjusting apparatus | |
| CN206416999U (en) | A kind of pressing strip device for railcar console | |
| CN208334910U (en) | A kind of foundation base for extreme ultraviolet litho machine | |
| CN208336869U (en) | A kind of easy-maintaining power distribution cabinet | |
| CN206204555U (en) | Carpet knitting device and the knitting workshop of carpet | |
| CN109080058A (en) | A kind of automotive upholstery compression molding groove binder frame | |
| CN206912024U (en) | A kind of base punching composite die | |
| CN202623155U (en) | Wind power machine cabin cover sucker type combined mold | |
| CN207077574U (en) | A kind of pasting board timber destressing device | |
| CN204209278U (en) | Can the process equipment of quick locking mould | |
| CN206149182U (en) | Solar cell panel installs guide rail | |
| CN205970806U (en) | Pull formula mounting structure of new energy automobile electrical part | |
| CN105141078B (en) | Magnetic machines rotor magnetic field injection molding apparatus | |
| CN108592840A (en) | A kind of cubing suitable for refractory brick sky kiln car | |
| CN206030218U (en) | Frame is pressed to concrete switch tie sleeve pipe location | |
| CN218283683U (en) | Die casting die is used in processing of mining equipment base | |
| CN108247957A (en) | A kind of automobile lower protective plate stent injection forming mold | |
| CN201889870U (en) | Glue injection block used in vacuum assisted resin infusion process | |
| CN207086678U (en) | A kind of mounting structure of mould | |
| CN210530868U (en) | Roller type concrete transportation self-pumping system for contact channel of shield interval | |
| CN206956467U (en) | A kind of track vibration-reducing fastener |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |