CN109504085B - High-thermal-conductivity resin-based composite material and preparation method thereof - Google Patents

High-thermal-conductivity resin-based composite material and preparation method thereof Download PDF

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CN109504085B
CN109504085B CN201710826664.7A CN201710826664A CN109504085B CN 109504085 B CN109504085 B CN 109504085B CN 201710826664 A CN201710826664 A CN 201710826664A CN 109504085 B CN109504085 B CN 109504085B
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thermoplastic resin
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汪东
田正刚
龚文化
卢山
韩蕾
许孔力
嵇培军
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Aerospace Research Institute of Materials and Processing Technology
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    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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Abstract

The invention provides a high-thermal-conductivity resin-based composite material and a preparation method thereof, wherein the high-thermal-conductivity resin-based composite material comprises the following components in percentage by weight: 65-90 wt% of modified thermoplastic resin, 5-20 wt% of graphene and 5-15 wt% of heat-conducting chopped carbon fibers; wherein the modified thermoplastic resin is tannin-Fe3+Complex coated thermoplastic resin, specifically made of Tannic Acid (TA) and FeCl3·6H2O-modified thermoplastic resin. The invention solves the problems of uneven dispersion of the nano carbon filler in the resin matrix of the composite material, discontinuous heat conduction path and the like, and the prepared composite material has excellent heat conduction performance. The resin particle interface modification method has certain universality, is suitable for different types of resin matrix materials, has mild reaction conditions, high efficiency and low price of raw materials, and is easy for large-scale production and preparation.

Description

High-thermal-conductivity resin-based composite material and preparation method thereof
Technical Field
The invention particularly relates to a high-thermal-conductivity resin-based composite material and a preparation method thereof, belonging to the field of composite materials.
Background
High-performance thermoplastic resins, such as thermoplastic Polyimide (PI), polyphenylene sulfide (PPS), polyether ketone (PEK), and the like, have wide application prospects in high and new technical fields of aviation, aerospace, electronics and electricity and the like due to the advantages of excellent mechanical strength, heat resistance (the long-term use temperature can be more than 200 ℃), flame retardancy and the like. With the high performance of the equipment and the miniaturization of the electronic devices, the demand for heat dissipation protection of the structure is more and more urgent. Compared with metal and ceramic materials, the heat conductivity coefficient of the high polymer is generally lower (0.2-0.5W/mK), which greatly limits the application of the high polymer in the field of heat conduction. Therefore, it is necessary to develop a high-performance thermoplastic resin-based composite material having high thermal conductivity.
At present, the blending modification of high molecular polymers by using high thermal conductivity fillers is an effective way for improving thermal conductivity. Due to the extremely large specific surface area and the unique pi-electron delocalized system, graphene has ultrahigh thermal conductivity, the maximum in-plane thermal conductivity can reach 5300W/(mK), and the graphene is a material with the highest known thermal conductivity at present and is one of the most common high-thermal-conductivity fillers. In the prior art, the polymer and the graphene are compounded by methods such as a solution blending method, a melt blending method and in-situ polymerization. However, although the above method can improve the thermal conductivity of the polymer material to some extent, there are also the following problems: on one hand, the interface thermal impedance is large and the heat-conducting property of the composite material is difficult to effectively and greatly improve due to the difficult dispersibility of the graphene sheet layer and the weak binding force between the graphene and the polymer, and on the other hand, although the dispersibility of the graphene in the resin can be improved by a graphene surface modification method, the heat-conducting property of the graphene is reduced to different degrees, and finally the heat-conducting property of the composite material is not greatly improved.
Disclosure of Invention
In view of the defects in the prior art, the invention provides the high-thermal-conductivity resin-based composite material and the preparation method thereof.
The technical solution of the invention is as follows:
in one aspect, the present invention provides a resin-based composite material, which comprises the following components by weight: 65-90 wt% of modified thermoplastic resin and 5-20 wt% of graphene5-15 wt% of heat-conducting short carbon fibers; wherein the modified thermoplastic resin is tannin-Fe3+Complex coated thermoplastic resin, specifically made of Tannic Acid (TA) and FeCl3·6H2O-modified thermoplastic resin.
Further, the thermoplastic resin is preferably at least one of thermoplastic polyimide, polyphenylene sulfide (PPS), polyether sulfone (PES), polyether ether ketone (PEEK), and polyether ketone (PEKK).
Further, the diameter of the thermoplastic resin powder particle is preferably between 30um and 300 um.
Further, the heat-conducting chopped carbon fibers are preferably one or more of mesophase pitch-based carbon fibers.
Further, the length of the thermally conductive chopped carbon fibers is preferably in the range of 0.2-2 mm.
On the other hand, the invention also provides a preparation method of the resin-based composite material, which is realized by the following steps:
step 1, preparation of modified thermoplastic resin A,
uniformly dispersing thermoplastic resin powder in water, and adding a certain amount of Tannic Acid (TA) and FeCl3·6H2O, reacting for a certain time under rapid stirring to obtain a mixture containing modified resin powder, adjusting the mixture to be alkaline, then washing the modified resin powder with water, and further filtering and drying to obtain a modified thermoplastic resin A, wherein the modified thermoplastic resin A is tannic acid-Fe3+The complex coats the modified thermoplastic resin;
wherein, the mixture obtained after the reaction is adjusted to be alkaline, and can be adjusted by adding alkaline substances, such as sodium hydroxide, potassium hydroxide and the like, and the pH value is preferably adjusted to be within the range of 7.5-9, aiming at: improve the complexation strength of the tannic acid and the metal ions and stabilize the coating layer.
Further, the purpose of cleaning the modified resin powder is to: removing excessive tannic acid and FeCl3·6H2O；
Further, the rapid stirring reaction is preferably carried out at room temperature, and the reaction is preferably carried out for 10 to 30 seconds;
step 2, preparation of the modified thermoplastic resin B,
respectively carrying out ultrasonic dispersion on the obtained modified thermoplastic resin A and graphene in an organic solvent to obtain a modified thermoplastic resin A dispersion solution and a graphene dispersion solution, then adding the graphene dispersion solution into the modified thermoplastic resin A dispersion solution and stirring to obtain a modified thermoplastic resin B, wherein the modified thermoplastic resin B is a graphene-coated modified thermoplastic resin;
adding the graphene dispersion liquid into the modified thermoplastic resin A while stirring;
step 3, preparing the heat-conducting modified material,
ultrasonically dispersing a certain amount of heat-conducting chopped carbon fibers in an organic solvent, adding the mixture into the modified thermoplastic resin B, and ultrasonically or stirring, filtering and drying the mixture to obtain a heat-conducting modified material;
and 4, filling the heat conduction modified material into a mold, and carrying out compression molding under certain temperature and pressure conditions to obtain the resin matrix composite material.
Further, in the above method, step 1, the concentration of the tannic acid in the aqueous solution is 0.1 to 0.2g/L, preferably 0.15 g/L; the FeCl3·6H2The concentration of O in the aqueous solution is 0.4 to 0.8g/L, preferably 0.6 g/L.
Further, in the above method steps 2 and 3, the organic solvent is preferably one of ethanol, methanol and acetone;
further, in step 4), the following compression molding conditions may be adopted: the mould pressing temperature is 250 ℃ and 400 ℃, the pressure is 15-20MPa, the heat preservation and pressure maintaining are carried out for 0.5-1h, and the mould is demoulded when the temperature is reduced to 40-100 ℃.
The design principle of the invention is as follows:
the key points of the invention are as follows: the invention adopts tannic acid-metal complex to carry out interface modification on thermoplastic resin particles, and micromolecular tannic acid is connected together through metal complexing reaction, so that a polymer is formed to be coated on the surface of the resin particles, the formed tannic acid-metal complex has strong adhesiveness, and graphene sheets can be adhered to the surface of the resin particles to form a uniform coating layer. The adhesion mechanism of the resin is that a large number of polyphenol groups contained in the tannic acid, namely the tannic acid endows a resin interface with strong adhesion due to the existence of the polyphenol groups, so that the uniform coating of the resin particles by the graphene sheets is realized by utilizing the interface adhesion effect, a uniform and continuous heat conducting network is easy to form, and the self heat conducting performance of the graphene is also maintained; meanwhile, high-thermal-conductivity chopped carbon fibers with different lengths are compounded to serve as thermal-conductivity carbon fillers, the contact chance between the high-thermal-conductivity chopped carbon fibers and the thermal-conductivity carbon fillers is increased by utilizing the synergistic enhancement effect of the fillers in different forms, a continuous multi-dimensional thermal-conductivity passage is formed, and the prepared composite material has excellent thermal conductivity.
Compared with the prior art, the invention has the beneficial effects that:
1) compared with the traditional blending method, the invention realizes the uniform coating of graphene and the synergistic enhancement of fillers with different forms through the interface modification of resin particles, constructs a uniform and continuous three-dimensional heat-conducting network in the composite material, solves the problems of non-uniform dispersion of the nano carbon filler in the resin matrix of the composite material, discontinuous heat-conducting path and the like, and the prepared composite material shows excellent heat-conducting performance. The resin particle interface modification method has certain universality, is suitable for different types of resin matrix materials, has mild reaction conditions, high efficiency and low price of raw materials, and is easy for large-scale production and preparation.
2) The high-performance thermoplastic resin system endows the composite material with the advantages of excellent mechanical strength, heat resistance, flame retardance and the like, and has wide application prospect in various fields with higher requirements on the comprehensive performance of the material, such as high and new technical fields of aviation, aerospace, electronics and electricity and the like.
Drawings
FIG. 1 is a schematic diagram of the preparation process and the heat conduction enhancing mechanism of the resin-based composite material provided by the invention.
Detailed Description
The essential features and the significant advantages of the invention will be further clarified in the following description with reference to the attached drawings and embodiments, but the content of the invention is not limited to the following examples only.
Example 1
Referring to fig. 1, fig. 1 shows a preparation process and a heat conduction enhancing mechanism of a resin-based composite material, wherein the preparation process specifically comprises the following steps:
1) 100g of thermoplastic polyimide resin powder was uniformly dispersed in 1L of water, and 0.6g of Tannic Acid (TA) and 0.15g of FeCl were added3·6H2O, reacting at room temperature for 30s under rapid stirring, adding 1M NaOH to adjust pH to about 8.0, washing resin powder with water for three times to remove excessive tannin and FeCl3·6H2O, filtering and drying to obtain the tannin-Fe3+The complex coats the modified thermoplastic resin powder;
2) weighing 90g of modified polyimide powder, ultrasonically dispersing in 300ml of ethanol for 10min, weighing 5g of graphene, and ultrasonically dispersing in 100ml of ethanol for 10 min; under the mechanical stirring, adding the graphene dispersion liquid into the resin powder dispersion liquid, and continuously stirring for 1 h;
3) weighing 5g of heat-conducting chopped carbon fibers, ultrasonically dispersing in 100ml of ethanol for 10min, adding into the modified resin powder dispersion liquid, continuously ultrasonically dispersing for 30min, filtering and drying;
4) and (3) filling the obtained thermoplastic polyimide heat-conducting modified material into a mold, molding by adopting a hot molding mode, keeping the temperature and pressure for 1h at 350 ℃ and 15MPa, and demolding.
The thermal conductivity coefficient of the prepared thermoplastic polyimide thermal conductive composite material is 2.0W/mK through testing, and the table 1 shows.
Example 2
1) 100g of thermoplastic polyimide resin powder was uniformly dispersed in 1L of water, and 0.6g of Tannic Acid (TA) and 0.15g of FeCl were added3·6H2O, reacting at room temperature for 30s under rapid stirring, adding 1M NaOH to adjust pH to about 8.0, washing resin powder with water for three times to remove excessive tannin and FeCl3·6H2O, filtering and drying to obtain the tannin-Fe3+The complex coats the modified thermoplastic resin powder;
2) weighing 85g of modified polyimide powder, and ultrasonically dispersing in 300ml of ethanol for 10min, and weighing 10g of graphene, and ultrasonically dispersing in 100ml of ethanol for 10 min; under the mechanical stirring, adding the graphene dispersion liquid into the resin powder dispersion liquid, and continuously stirring for 1 h;
3) weighing 5g of heat-conducting chopped carbon fibers, ultrasonically dispersing in 100ml of ethanol for 10min, adding into the modified resin powder dispersion liquid, continuously ultrasonically dispersing for 30min, filtering and drying;
4) and (3) filling the obtained thermoplastic polyimide heat-conducting modified material into a mold, molding by adopting a hot molding mode, keeping the temperature and pressure for 1h at 350 ℃ and 15MPa, and demolding.
The thermal conductivity coefficient of the prepared thermoplastic polyimide thermal conductive composite material is 2.6W/mK through testing, and the table 1 shows.
Example 3
1) 100g of thermoplastic polyimide resin powder was uniformly dispersed in 1L of water, and 0.6g of Tannic Acid (TA) and 0.15g of FeCl were added3·6H2O, reacting at room temperature for 30s under rapid stirring, adding 1M NaOH to adjust pH to about 8.0, washing resin powder with water for three times to remove excessive tannin and FeCl3·6H2O, filtering and drying to obtain the tannin-Fe3+The complex coats the modified thermoplastic resin powder;
2) weighing 75g of modified polyimide powder, ultrasonically dispersing in 300ml of ethanol for 10min, weighing 20g of graphene, and ultrasonically dispersing in 200ml of ethanol for 10 min; under the mechanical stirring, adding the graphene dispersion liquid into the resin powder dispersion liquid, and continuously stirring for 1 h;
3) weighing 5g of heat-conducting chopped carbon fibers, ultrasonically dispersing in 100ml of ethanol for 10min, adding into the modified resin powder dispersion liquid, continuously ultrasonically dispersing for 30min, filtering and drying;
4) and (3) filling the obtained thermoplastic polyimide heat-conducting modified material into a mold, molding by adopting a hot molding mode, keeping the temperature and pressure for 1h at 350 ℃ and 15MPa, and demolding.
The thermal conductivity coefficient of the prepared thermoplastic polyimide thermal conductive composite material is 3.6W/mK through testing, and the thermal conductivity coefficient is shown in table 1.
Example 4
1) 100g of thermoplastic polyimide resin powder was uniformly dispersed in 1L of water, and 0.6g of Tannic Acid (TA) and 0.15g of FeCl were added3·6H2O, reacting at room temperature for 30s under rapid stirring, adding 1M NaOH to adjust pH to about 8.0, washing resin powder with water for three times to remove excessive tannin and FeCl3·6H2O, filtering and drying to obtain the tannin-Fe3+The complex coats the modified thermoplastic resin powder;
2) weighing 80g of modified polyimide powder, ultrasonically dispersing in 300ml of ethanol for 10min, weighing 10g of graphene, and ultrasonically dispersing in 200ml of ethanol for 10 min; under the mechanical stirring, adding the graphene dispersion liquid into the resin powder dispersion liquid, and continuously stirring for 1 h;
3) weighing 10g of heat-conducting chopped carbon fibers, ultrasonically dispersing in 100ml of ethanol for 10min, adding into the modified resin powder dispersion liquid, continuously ultrasonically dispersing for 30min, filtering and drying;
4) and (3) filling the obtained thermoplastic polyimide heat-conducting modified material into a mold, molding by adopting a hot molding mode, keeping the temperature and pressure for 1h at 350 ℃ and 15MPa, and demolding.
The thermal conductivity coefficient of the prepared thermoplastic polyimide thermal conductive composite material is 3.8W/mK through testing, and the thermal conductivity coefficient is shown in table 1.
Example 5
1) 100g of thermoplastic polyimide resin powder was uniformly dispersed in 1L of water, and 0.6g of Tannic Acid (TA) and 0.15g of FeCl were added3·6H2O, reacting at room temperature for 30s under rapid stirring, adding 1M NaOH to adjust pH to about 8.0, washing resin powder with water for three times to remove excessive tannin and FeCl3·6H2O, filtering and drying to obtain the tannin-Fe3+The complex coats the modified thermoplastic resin powder;
2) weighing 75g of modified polyimide powder, ultrasonically dispersing in 300ml of ethanol for 10min, weighing 10g of graphene, and ultrasonically dispersing in 200ml of ethanol for 10 min; under the mechanical stirring, adding the graphene dispersion liquid into the resin powder dispersion liquid, and continuously stirring for 1 h;
3) weighing 15g of heat-conducting chopped carbon fibers, ultrasonically dispersing in 100ml of ethanol for 10min, adding into the modified resin powder dispersion liquid, continuously ultrasonically dispersing for 30min, filtering and drying;
4) and (3) filling the obtained thermoplastic polyimide heat-conducting modified material into a mold, molding by adopting a hot molding mode, keeping the temperature and pressure for 1h at 350 ℃ and 15MPa, and demolding.
The thermal conductivity coefficient of the prepared thermoplastic polyimide thermal conductive composite material is 4.1W/mK through testing, and the thermal conductivity coefficient is shown in table 1.
Example 6
1) 100g of polyphenylene sulfide (PPS) resin powder was uniformly dispersed in 1L of water, and 0.6g of Tannic Acid (TA) and 0.15g of FeCl were added3·6H2O, reacting at room temperature for 30s under rapid stirring, adding 1M NaOH to adjust pH to about 8.0, washing resin powder with water for three times to remove excessive tannin and FeCl3·6H2O, filtering and drying to obtain the tannin-Fe3+The complex coats the modified thermoplastic resin powder;
2) weighing 80g of modified polyphenylene sulfide powder, ultrasonically dispersing in 300ml of ethanol for 10min, weighing 10g of graphene, and ultrasonically dispersing in 200ml of ethanol for 10 min; under the mechanical stirring, adding the graphene dispersion liquid into the resin powder dispersion liquid, and continuously stirring for 1 h;
3) weighing 10g of heat-conducting chopped carbon fibers, ultrasonically dispersing in 100ml of ethanol for 10min, adding into the modified resin powder dispersion liquid, continuously ultrasonically dispersing for 30min, filtering and drying;
4) and (3) loading the obtained polyphenylene sulfide heat conduction modified material into a mould, forming by adopting a hot mould pressing mode, keeping the mould pressing temperature at 300 ℃ and the pressure at 15MPa for 1h, and demoulding.
The heat conductivity coefficient of the polyphenylene sulfide heat-conducting composite material is 4.0W/mK through tests, and the table 1 shows.
Example 7
1) 100g of Polyetheretherketone (PEEK) resin powder was uniformly dispersed in 1L of water, and 0.6g of Tannic Acid (TA) and 0.15g of FeCl were added3·6H2O, reacting at room temperature for 30s under rapid stirring, adding 1M NaOH to adjust the pH to about 8.0Washing the resin powder with water for three times to remove excessive tannin and FeCl3·6H2O, filtering and drying to obtain the tannin-Fe3+The complex coats the modified thermoplastic resin powder;
2) weighing 80g of modified polyether-ether-ketone powder, ultrasonically dispersing in 300ml of ethanol for 10min, weighing 10g of graphene, and ultrasonically dispersing in 200ml of ethanol for 10 min; under the mechanical stirring, adding the graphene dispersion liquid into the resin powder dispersion liquid, and continuously stirring for 1 h;
3) weighing 10g of heat-conducting chopped carbon fibers, ultrasonically dispersing in 100ml of ethanol for 10min, adding into the modified resin powder dispersion liquid, continuously ultrasonically dispersing for 30min, filtering and drying;
4) and (3) filling the obtained polyether-ether-ketone heat-conducting modified material into a mold, molding by adopting a hot molding mode, keeping the temperature and pressure of the mold at 380 ℃ and 15MPa for 1 hour, and demolding.
The heat conductivity coefficient of the prepared polyetheretherketone heat-conducting composite material is 3.8W/mK through tests, which is shown in Table 1.
Comparative example 1
1) 100g of thermoplastic polyimide resin powder was uniformly dispersed in 1L of water, and 0.6g of Tannic Acid (TA) and 0.15g of FeCl were added3·6H2O, reacting at room temperature for 30s under rapid stirring, adding 1M NaOH to adjust pH to about 8.0, washing resin powder with water for three times to remove excessive tannin and FeCl3·6H2O, filtering and drying to obtain the tannin-Fe3+The complex coats the modified thermoplastic resin powder;
2) weighing 80g of modified polyimide powder, ultrasonically dispersing in 300ml of ethanol for 10min, weighing 20g of graphene, and ultrasonically dispersing in 200ml of ethanol for 10 min; under the mechanical stirring, adding the graphene dispersion liquid into the resin powder dispersion liquid, continuously stirring for 1h, filtering and drying;
3) and (3) filling the obtained thermoplastic polyimide heat-conducting modified material into a mold, molding by adopting a hot molding mode, keeping the temperature and pressure for 1h at 350 ℃ and 15MPa, and demolding.
The thermal conductivity coefficient of the prepared thermoplastic polyimide thermal conductive composite material is 2.8W/mK through testing, and the thermal conductivity coefficient is shown in table 1.
Comparative example 2
1) Weighing 80g of polyimide powder, ultrasonically dispersing in 300ml of ethanol for 10min, weighing 10g of graphene, and ultrasonically dispersing in 200ml of ethanol for 10 min; under the mechanical stirring, adding the graphene dispersion liquid into the resin powder dispersion liquid, and continuously stirring for 1 h;
2) weighing 10g of heat-conducting chopped carbon fibers, ultrasonically dispersing in 100ml of ethanol for 10min, adding into the modified resin powder dispersion liquid, continuously ultrasonically dispersing for 30min, filtering and drying;
3) and (3) filling the obtained thermoplastic polyimide heat-conducting modified material into a mold, molding by adopting a hot molding mode, keeping the temperature and pressure for 1h at 350 ℃ and 15MPa, and demolding.
The thermal conductivity coefficient of the prepared thermoplastic polyimide thermal conductive composite material is 1.7W/mK through testing, and the thermal conductivity coefficient is shown in Table 1.
Table 1 composite thermal conductivity test results
Figure GDA0002660981400000101
Figure GDA0002660981400000111
The results of the tests of the examples and comparative examples in table 1 show that:
from example 4 and comparative example 1, it can be seen that in comparative example 1, the polyimide was modified in the same way, except that there was no carbon fiber in the filler, and it can be seen that at the same filler percentage (20%), the thermal conductivity was much lower than that of example 4, indicating that the synergistic effect of different forms of filler contributes better to the thermal conductivity than the single filler at the same content;
as can be seen from examples 1, 2 and comparative example 1, the influence of the content of the thermally conductive filler on the thermal conductivity is also a major factor under the same modification conditions;
as can be seen from examples 1 to 5: in examples 1, 2 and 3, the content of carbon fiber is unchanged, the content of graphene is sequentially increased, and the corresponding increase of thermal conductivity can be seen; examples 2, 4, 5, in which the graphene content was unchanged and the carbon fiber content was sequentially increased, the thermal conductivity was seen to increase correspondingly, but the increase was decreased, indicating that it is the best solution from the cost and performance perspective when both graphene and carbon fiber were 10% wt.
From examples 1-7 and comparison 2, it can be seen that the thermal conductivity of the composite material obtained by the modified thermoplastic resin is better than that of the composite material prepared by the unmodified thermoplastic resin under the condition that the content of the heat-conducting filler is the same or even lower, which indicates that the unexpected technical effect is achieved by the composite material prepared by the modified thermoplastic resin.
The present invention is described in detail with reference to the embodiments, but the embodiments of the present invention are not limited by the embodiments, and any other changes, substitutions, combinations and simplifications made under the teaching of the patent core of the present invention are included in the protection scope of the present invention.
The present invention is not described in detail and is well known to those skilled in the art.

Claims (9)

1. A resin-based composite material is characterized by comprising the following components in percentage by weight: 65-90 wt% of modified thermoplastic resin, 5-20 wt% of graphene and 5-15 wt% of heat-conducting chopped carbon fibers; wherein the modified thermoplastic resin is prepared from tannic acid TA and FeCl3·6H2Tannic acid-Fe obtained by O-modifying thermoplastic resin3+A complex-coated thermoplastic resin.
2. The resin-based composite material according to claim 1, wherein: the thermoplastic resin is at least one selected from thermoplastic polyimide, polyphenylene sulfide (PPS), polyether sulfone (PES), polyether ether ketone and polyether ketone.
3. A resin-based composite material according to claim 1 or 2, wherein: the diameter of the thermoplastic resin powder particles is between 30um and 300 um.
4. A resin-based composite material according to claim 1 or 2, wherein: the heat-conducting short-cut carbon fibers are mesophase pitch-based carbon fibers.
5. The resin-based composite material according to claim 1, wherein: the length range of the heat-conducting chopped carbon fibers is between 0.2 and 2 mm.
6. A process for the preparation of a resin-based composite material according to any one of claims 1 to 5, which is carried out by:
step 1, preparation of modified thermoplastic resin A,
uniformly dispersing thermoplastic resin powder in water, and adding a certain amount of tannic acid TA and FeCl3·6H2O, reacting for a certain time under rapid stirring to obtain a mixture containing modified resin powder, adjusting the mixture to be alkaline, then washing the modified resin powder with water, and further filtering and drying to obtain a modified thermoplastic resin A, wherein the modified thermoplastic resin A is tannic acid-Fe3+The complex coats the modified thermoplastic resin;
step 2, preparation of the modified thermoplastic resin B,
respectively carrying out ultrasonic dispersion on the obtained modified thermoplastic resin A and graphene in an organic solvent to obtain a modified thermoplastic resin A dispersion solution and a graphene dispersion solution, then adding the graphene dispersion solution into the modified thermoplastic resin A dispersion solution and stirring to obtain a modified thermoplastic resin B, wherein the modified thermoplastic resin B is a graphene-coated modified thermoplastic resin;
step 3, preparing the heat-conducting modified material,
ultrasonically dispersing a certain amount of heat-conducting chopped carbon fibers in an organic solvent, adding the mixture into the modified thermoplastic resin B, and ultrasonically or stirring, filtering and drying the mixture to obtain a heat-conducting modified material;
and 4, filling the heat conduction modified material into a mold, and carrying out compression molding under certain temperature and pressure conditions to obtain the resin matrix composite material.
7. The method for producing a resin-based composite material according to claim 6, wherein: the pH value of the mixture obtained after the reaction is 7.5-9.
8. The method for producing a resin-based composite material according to claim 6, wherein: in the steps 2 and 3, the organic solvent is any one of ethanol, methanol or acetone.
9. The method for producing a resin-based composite material according to any one of claims 6 to 8, wherein: in the step 1, the concentration of the tannic acid in the aqueous solution is 0.1-0.2 g/L; FeCl3·6H2The concentration of O in the aqueous solution is 0.4-0.8 g/L.
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