CN109500199A - A kind of stamping device of wiring board - Google Patents

A kind of stamping device of wiring board Download PDF

Info

Publication number
CN109500199A
CN109500199A CN201811419084.7A CN201811419084A CN109500199A CN 109500199 A CN109500199 A CN 109500199A CN 201811419084 A CN201811419084 A CN 201811419084A CN 109500199 A CN109500199 A CN 109500199A
Authority
CN
China
Prior art keywords
die holder
lower die
wiring board
pedestal
fixed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201811419084.7A
Other languages
Chinese (zh)
Inventor
刘朝斌
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Heshan Runchang Electronic And Electrical Co Ltd
Original Assignee
Heshan Runchang Electronic And Electrical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heshan Runchang Electronic And Electrical Co Ltd filed Critical Heshan Runchang Electronic And Electrical Co Ltd
Priority to CN201811419084.7A priority Critical patent/CN109500199A/en
Publication of CN109500199A publication Critical patent/CN109500199A/en
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21DWORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D28/00Shaping by press-cutting; Perforating
    • B21D28/02Punching blanks or articles with or without obtaining scrap; Notching
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21DWORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D28/00Shaping by press-cutting; Perforating
    • B21D28/02Punching blanks or articles with or without obtaining scrap; Notching
    • B21D28/04Centering the work; Positioning the tools
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B21MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21DWORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21D28/00Shaping by press-cutting; Perforating
    • B21D28/02Punching blanks or articles with or without obtaining scrap; Notching
    • B21D28/14Dies

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

The invention discloses a kind of stamping devices of wiring board, including bracket, pedestal, stand, hydraulic station, upper die holder, lower die holder, lower die, the pedestal upper end firm banking, pedestal upside are equipped with hydraulic station close to the fixed stand in edge, stand top, the fixed upper die holder of the output end of hydraulic station, upper die holder can be gone up and down under the action of hydraulic station, and upper mold, the fixed lower die holder in the pedestal upper end opposite with upper die holder are equipped in the upper die holder, lower die holder is equipped with lower die, and lower die is oppositely arranged with upper mold.The design of its structure is simple, reasonable, and easy to use, substrate registration, punching press dimensional accuracy is high, and position is accurate, meets market use demand, is conducive to product promotion.

Description

A kind of stamping device of wiring board
Technical field
The invention belongs to electronic product machining technical fields, and in particular to a kind of stamping device of wiring board.
Background technique
Wiring board is divided into single sided board, the three big classification of dual platen and multilayer circuit board if dividing by the number of plies.
Wiring board needs to strike out substrate into required shape in processing.
Common wiring board stamping device, structure is complicated, inconvenient to use.
Summary of the invention
The purpose of the present invention is to propose to a kind of stamping devices of wiring board, overcome the above-mentioned deficiency of the prior art, knot Structure design is simple, reasonable, and easy to use, substrate registration, punching press dimensional accuracy is high, and position is accurate, meets market and uses need It asks, is conducive to product promotion.
In order to reach above-mentioned purpose of design, The technical solution adopted by the invention is as follows:
A kind of stamping device of wiring board, including bracket, pedestal, stand, hydraulic station, upper die holder, lower die holder, lower die, institute Pedestal upper end firm banking is stated, the close fixed stand in edge on the upside of pedestal, stand top is equipped with hydraulic station, the output of hydraulic station Fixed upper die holder is held, upper die holder can be gone up and down under the action of hydraulic station, and upper mold, institute opposite with upper die holder are equipped in the upper die holder The fixed lower die holder in pedestal upper end is stated, lower die holder is equipped with lower die, and lower die is oppositely arranged with upper mold.
The lower die edge is equipped with multiple positioning columns, and positioning column is used to position the substrate in lower die.
The positioning column upper end is equipped with inclined surface close to the side of lower die.
The upper die holder is respectively equipped with guide sleeve close to edge, is socketed guide rod in guide sleeve.
The guide rod upper end is fixed in stand, and the guide rod lower end is fixed on the base.
The lower die holder is respectively equipped with pilot hole close to edge, for cooperating with the guide post in upper die holder.
The beneficial effect of the stamping device of wiring board of the present invention is: the design of its structure is simple, reasonable, user Just, substrate registration, punching press dimensional accuracy is high, and position is accurate, meets market use demand, is conducive to product promotion.
Detailed description of the invention
Fig. 1 is the schematic diagram of the stamping device of wiring board of the present invention;
Fig. 2 is the schematic diagram of the lower die holder of the stamping device of wiring board of the present invention;
Fig. 3 is the schematic diagram of the positioning column of the stamping device of wiring board of the present invention.
Specific embodiment
As shown in Figure 1-3, in embodiment of the present invention, the stamping device of the wiring board, including it is bracket 1, pedestal 2, vertical Frame 3, hydraulic station 4, upper die holder 5, lower die holder 6, lower die 10, the 1 upper end firm banking 2 of bracket, 2 upside of pedestal is close to edge Fixed stand 3,3 top of stand are equipped with hydraulic station 4, and the fixed upper die holder 5 of the output end of hydraulic station 4, upper die holder 5 can be in hydraulic station 4 Under the action of go up and down, upper mold is equipped in the upper die holder 5, with the fixed lower die holder 6 in relatively described 2 upper end of pedestal of upper die holder 5, lower die Seat 6 is equipped with lower die 10, and lower die 10 is oppositely arranged with upper mold, and structure is simple, easy to use.
10 edge of lower die is equipped with multiple positioning columns 11, and positioning column 11 is used to position the substrate in lower die 10, so that punching Press precision high.
11 upper end of positioning column is equipped with inclined surface 12 close to the side of lower die 10, and substrate is facilitated to pick and place.
The upper die holder 5 is respectively equipped with guide sleeve 8 close to edge, guide rod 7 is socketed in guide sleeve 8, for being oriented to.
7 upper end of guide rod is fixed in stand 3, and 7 lower end of guide rod is fixed on pedestal 2.
The lower die holder 6 is respectively equipped with pilot hole 9 close to edge, for cooperating with the guide post in upper die holder 5, carries out Guiding.
The foregoing description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments are it will be apparent that as defined herein one for those skilled in the art As principle can realize in other embodiments without departing from the spirit or scope of the present invention.Therefore, the present invention will It will not be intended to be limited to the embodiments shown herein, and be to fit to consistent with the principles and novel features disclosed herein Widest scope.

Claims (6)

1. a kind of stamping device of wiring board, it is characterised in that: including bracket, pedestal, stand, hydraulic station, upper die holder, lower die Seat, lower die, the pedestal upper end firm banking, close to the fixed stand in edge, stand top is equipped with hydraulic station, liquid for pedestal upside The fixed upper die holder of output end at pressure station, upper die holder can be gone up and down under the action of hydraulic station, and upper mold is equipped in the upper die holder, and upper The fixed lower die holder in the relatively described pedestal upper end of die holder, lower die holder are equipped with lower die, and lower die is oppositely arranged with upper mold.
2. the stamping device of wiring board according to claim 1, it is characterised in that: the lower die edge is equipped with multiple positioning Column, positioning column are used to position the substrate in lower die.
3. the stamping device of wiring board according to claim 2, it is characterised in that: the positioning column upper end is close to lower die Side is equipped with inclined surface.
4. the stamping device of wiring board according to claim 1, it is characterised in that: the upper die holder is distinguished close to edge Equipped with guide sleeve, guide rod is socketed in guide sleeve.
5. the stamping device of wiring board according to claim 4, it is characterised in that: the guide rod upper end is fixed on stand On, the guide rod lower end is fixed on the base.
6. the stamping device of wiring board according to claim 1, it is characterised in that: the lower die holder is distinguished close to edge Equipped with pilot hole, for cooperating with the guide post in upper die holder.
CN201811419084.7A 2018-11-26 2018-11-26 A kind of stamping device of wiring board Pending CN109500199A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201811419084.7A CN109500199A (en) 2018-11-26 2018-11-26 A kind of stamping device of wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201811419084.7A CN109500199A (en) 2018-11-26 2018-11-26 A kind of stamping device of wiring board

Publications (1)

Publication Number Publication Date
CN109500199A true CN109500199A (en) 2019-03-22

Family

ID=65750657

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201811419084.7A Pending CN109500199A (en) 2018-11-26 2018-11-26 A kind of stamping device of wiring board

Country Status (1)

Country Link
CN (1) CN109500199A (en)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU1282942A1 (en) * 1985-06-04 1987-01-15 Омский политехнический институт Apparatus for ultrasound machining of hard materials
CN203599768U (en) * 2013-12-05 2014-05-21 苏州新成光电器件厂 Electric welding jig for aperture blades
CN205160943U (en) * 2015-10-26 2016-04-13 江苏弘信华印电路科技有限公司 Punching machine of joint plate processing usefulness has just been scratched
CN205629112U (en) * 2016-04-11 2016-10-12 南京德丰机械有限公司 Stamping die
KR20170045968A (en) * 2015-10-20 2017-04-28 주식회사 진아스틸 shearing machine one body type of a rods bar frame menufactoring device
CN206519492U (en) * 2016-12-23 2017-09-26 信宜华宇电子科技有限公司 A kind of thermal sensitive piece pressing equipment
CN207899958U (en) * 2017-11-16 2018-09-25 漯河建泰精密科技有限公司 A kind of outer frame of mobile phone fine cut mold

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU1282942A1 (en) * 1985-06-04 1987-01-15 Омский политехнический институт Apparatus for ultrasound machining of hard materials
CN203599768U (en) * 2013-12-05 2014-05-21 苏州新成光电器件厂 Electric welding jig for aperture blades
KR20170045968A (en) * 2015-10-20 2017-04-28 주식회사 진아스틸 shearing machine one body type of a rods bar frame menufactoring device
CN205160943U (en) * 2015-10-26 2016-04-13 江苏弘信华印电路科技有限公司 Punching machine of joint plate processing usefulness has just been scratched
CN205629112U (en) * 2016-04-11 2016-10-12 南京德丰机械有限公司 Stamping die
CN206519492U (en) * 2016-12-23 2017-09-26 信宜华宇电子科技有限公司 A kind of thermal sensitive piece pressing equipment
CN207899958U (en) * 2017-11-16 2018-09-25 漯河建泰精密科技有限公司 A kind of outer frame of mobile phone fine cut mold

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PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication

Application publication date: 20190322

RJ01 Rejection of invention patent application after publication