CN109487208B - Back plate coating method - Google Patents

Back plate coating method Download PDF

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Publication number
CN109487208B
CN109487208B CN201910074523.3A CN201910074523A CN109487208B CN 109487208 B CN109487208 B CN 109487208B CN 201910074523 A CN201910074523 A CN 201910074523A CN 109487208 B CN109487208 B CN 109487208B
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optical film
back plate
coating
metal layer
plating
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CN201910074523.3A
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Chinese (zh)
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CN109487208A (en
Inventor
周伟杰
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Truly Opto Electronics Ltd
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Truly Opto Electronics Ltd
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/0641—Nitrides
    • C23C14/0652—Silicon nitride
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08—Oxides
    • C23C14/081—Oxides of aluminium, magnesium or beryllium
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08—Oxides
    • C23C14/083—Oxides of refractory metals or yttrium
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/10—Glass or silica
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Surface Treatment Of Optical Elements (AREA)
  • Electroplating Methods And Accessories (AREA)

Abstract

The invention discloses a method for coating a back plate, which comprises the following steps: plating a metal layer with the adhesive force lower than a threshold value with the back plate in a non-film plating area of the back plate; plating an optical film layer on the front surface of the back plate; and removing the metal layer and the optical film layer above the non-film-coating area. The metal layer with poor adhesion with the backplate is established through plating earlier in the non-coating area of backplate, the optical film layer of establishing needs is plated on whole face, because the adhesion in the coating area of optical film layer and backplate is far away super metal layer and non-coating area, consequently the metal layer breaks away from with non-coating area very easily, thereby drive the optical film part of non-coating area top and take place to separate with the optical film part in other regions, thereby finally realize only carrying out the coating of optical film in the coating area and establish, the method is simple, need not to adopt chemical agent to stamp out with strength, also can not produce the corruption to the back, can not reduce the quality of optical film.

Description

Back plate coating method
Technical Field
The invention relates to the technical field of optical coating, in particular to a method for coating a back plate.
Background
Due to the continuous development of various technologies, the gap between basic technologies of various mobile phone manufacturers is smaller and smaller, and unless revolutionary technologies are developed, the products of various manufacturers cannot be greatly different, so that the competitiveness far beyond the same line is not generated, and the manufacturers are difficult to win in competition.
Because of the great investment and the long period like some basic technologies, such as 4G technology and 5G technology, the effect is difficult to see from the beginning to the end. And some small creatives have the advantages of less investment and quick response, and can easily obtain the recognition of consumers. In the mobile phone industry, besides core technologies such as a display screen and a processor of a mobile phone, the appearance of the mobile phone also seriously affects the competitiveness of the product. Generally, an optical coating is often required to be performed on a back cover of a mobile phone so as to achieve a better appearance effect. However, there are places where no coating is needed in the whole back plate area, such as the position of the camera hole. In order to make the area not coated with film, the existing practice is often:
firstly, silk-screen printing a layer of peelable glue, then coating a film, and then removing the peelable glue by an external force mode. Such as: the force is poked away with a chemical agent. The disadvantage of this solution is that the "outgassing" of the peelable glue during the re-coating process can affect the quality of the nearby film, such as uneven color; in addition, the film layer in the vicinity is easily damaged by a chemical agent which is strongly removed after the film formation.
And secondly, after the film coating is finished, corroding the area by using corrosive liquid medicine. The disadvantage of this solution is that it is necessary to find a material that is resistant to corrosion and that must protect the entire backplate, making it difficult to handle. In addition, for the glass back plate, the components of the coating film are similar to those of the glass, and the glass is easily corroded after the film layer is corroded by the etching liquid medicine. This process is difficult to control.
Therefore, there is a need for a new technique that can perform optical coating on the backplane area with low cost, high efficiency, and high quality.
Disclosure of Invention
The invention aims to provide a method for coating a back plate, which can improve the yield of coating and reduce the coating cost.
In order to solve the above technical problems, an embodiment of the present invention provides a method for coating a backplane, including:
plating a metal layer with the adhesive force lower than a threshold value with the back plate in a non-film plating area of the back plate;
plating an optical film layer on the front surface of the back plate;
and removing the metal layer and the optical film layer above the non-film-coating area.
Wherein the metal layer is an aluminum layer or an indium layer.
Wherein the thickness of the metal layer is 5 nm-30 nm.
Wherein, the removing the metal layer and the optical film layer above the non-coating area comprises: and adhering and pulling the optical film layer in the non-film-coated area by using an adhesive tape, and removing the metal layer and the optical film layer above the non-film-coated area, or removing the metal layer and the optical film layer above the non-film-coated area by using ultrasonic cleaning.
Wherein the optical film layer is silicon oxide, silicon nitride, aluminum oxide, niobium oxide, titanium oxide or zirconium oxide.
Wherein the thickness of the optical film layer is 100 nm-500 nm.
Wherein, the backboard is a glass backboard or a plastic backboard.
Compared with the prior art, the back plate coating method provided by the embodiment of the invention has the following advantages:
according to the method for coating the backboard, the metal layer with poor adhesion with the backboard is firstly coated on the non-coating area of the backboard, and the required optical film layer is coated on the whole surface of the backboard.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic flow chart illustrating steps of a specific embodiment of a method for coating a back plate according to an embodiment of the present invention;
fig. 2 is a schematic view of a film-coating structure implemented by using the method for coating a back plate according to the embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1 to 2, fig. 1 is a schematic flow chart illustrating a process of a specific embodiment of a method for coating a backplane according to an embodiment of the present invention; fig. 2 is a schematic view of a film-coating structure implemented by using the method for coating a back plate according to the embodiment of the present invention.
In one embodiment, the method for coating a back plate comprises the following steps:
step 1, plating a metal layer 20 with the adhesive force with the backboard 10 lower than a threshold value on a non-plating area of the backboard 10;
step 2, plating an optical film layer 30 on the front surface of the back plate 10;
and 3, removing the metal layer 20 and the optical film layer 30 above the non-coating area.
The metal layer 20 with poor adhesion with the backboard 10 is plated in the non-film plating area of the backboard 10, the required optical film layer 30 is plated on the whole surface, and the adhesion between the optical film layer 30 and the film plating area of the backboard 10 is far higher than that between the metal layer 20 and the non-film plating area, so that the metal layer 20 is easy to separate from the non-film plating area, the optical film part above the non-film plating area is driven to be separated from the optical film part of other areas, the optical film is plated only in the film plating area finally, the method is simple, chemical agents are not needed to be used for poking, the back surface is not corroded, and the quality of the optical film is not reduced.
The non-coating area is not limited in the invention, and can be the position of a camera hole and the like.
The type, thickness and plating method of the metal layer 20 are not specifically limited in the present invention, and a magnetron sputtering plating method may be adopted, or other plating methods may be adopted.
Preferably, the thickness of the metal layer 20 is 5nm to 30 nm.
The invention is not particularly limited to how to remove the metal layer 20 and the optical film on the non-coating region, and the metal layer 20 and the optical film 30 on the non-coating region are removed, the optical film 30 on the non-coating region is adhered and pulled by using an adhesive tape to remove the metal layer 20 and the optical film 30 on the non-coating region, or the metal layer 20 and the optical film 30 on the non-coating region are removed by using ultrasonic cleaning.
It should be noted that the present invention is not limited to the above-mentioned manner, such as using a solution that is harmless to the back plate 10 and using an acid solution at the time of ultrasonic wave.
The type and thickness of the optical film 30 are not limited in the present invention, the optical film 30 may be silicon oxide, silicon nitride, aluminum oxide, niobium oxide, titanium oxide or zirconium oxide, or other optical films, and silicon oxide or silicon nitride film is generally used to increase the gloss of the surface of the back plate and improve the appearance thereof.
The thickness of the optical film layer 30 is generally 100nm to 500 nm.
The type of the back sheet 10 is not limited in the present invention, and the back sheet 10 is a glass back sheet 10 or a plastic back sheet 10.
In one embodiment of the invention, an Al metal layer with the thickness of 10nm and the adhesion force with the glass backboard lower than a threshold value is plated on an area without film plating, namely a non-film plating area, such as the position of a camera hole, and the like, then silicon oxide with the thickness of 200nm is plated on the whole surface, after film forming, the non-film plating area is adhered by using an adhesive tape, the adhesion force of an optical film of the non-film plating area and the Al metal layer is strong, the adhesion force of the Al metal layer and the backboard is poor, and the adhesion force of an optical film of other areas and the backboard is strong, so that the optical film of the non-film plating area and the optical film of the film plating area are torn and separated from the backboard together, and the purpose of optical film plating in the film plating area is achieved.
In summary, in the method for plating a film on a backplane provided by the embodiments of the present invention, a metal layer with poor adhesion to the backplane is plated on a non-plating area of the backplane first, and a required optical film layer is plated on the entire surface of the backplane, because the adhesion between the optical film layer and the plating area of the backplane is far higher than that between the metal layer and the non-plating area, the metal layer is easily separated from the non-plating area, so as to drive the optical film portion above the non-plating area to be separated from the optical film portion in other areas, thereby finally realizing the plating of the optical film only in the plating area.
The method for coating the back plate provided by the invention is described in detail above. The principles and embodiments of the present invention are explained herein using specific examples, which are presented only to assist in understanding the method and its core concepts. It should be noted that, for those skilled in the art, it is possible to make various improvements and modifications to the present invention without departing from the principle of the present invention, and those improvements and modifications also fall within the scope of the claims of the present invention.

Claims (7)

1. A method for coating a back plate is characterized by comprising the following steps:
plating a metal layer with the adhesive force lower than a threshold value with the back plate in a non-film plating area of the back plate;
plating an optical film layer on the front surface of the back plate;
and removing the metal layer and the optical film layer above the non-film-coating area.
2. The method for plating a film on a backplane according to claim 1, wherein the metal layer is an aluminum layer or an indium layer.
3. The method for coating a rear plate of claim 2, wherein the thickness of the metal layer is 5nm to 30 nm.
4. The method for plating a backplane according to claim 1, wherein the removing the metal layer and the optical film layer over the non-plated area comprises: and adhering and pulling the optical film layer in the non-film-coated area by using an adhesive tape, and removing the metal layer and the optical film layer above the non-film-coated area, or removing the metal layer and the optical film layer above the non-film-coated area by using ultrasonic cleaning.
5. The method of plating a backplane according to claim 1, wherein the optical film layer is silicon oxide, silicon nitride, aluminum oxide, niobium oxide, titanium oxide, or zirconium oxide.
6. The method for coating a rear plate of claim 5, wherein the optical film layer has a thickness of 100nm to 500 nm.
7. The method for coating a film on a back plate according to claim 1, wherein the back plate is a glass back plate or a plastic back plate.
CN201910074523.3A 2019-01-25 2019-01-25 Back plate coating method Active CN109487208B (en)

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Application Number Priority Date Filing Date Title
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CN109487208B true CN109487208B (en) 2020-11-27

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101445903B (en) * 2008-12-15 2011-10-05 宸阳光电科技（厦门）有限公司 Pattern molding method in vacuuming metalling
TWI555862B (en) * 2011-09-16 2016-11-01 V科技股份有限公司 Evaporation mask, method for manufacturing the same and thinfilm pattern forming method
CN107431728B (en) * 2015-04-08 2019-09-13 华为技术有限公司 A kind of waterproof film plating process, equipment and terminal
CN107868932A (en) * 2016-09-27 2018-04-03 上海和辉光电有限公司 A kind of metal mask version and preparation method thereof
CN207793401U (en) * 2017-12-27 2018-08-31 信利光电股份有限公司 A kind of curved surface cover board
CN109136837A (en) * 2018-10-18 2019-01-04 信利光电股份有限公司 A kind of film plating process, deckboard and terminal

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