CN109487208A - A kind of backboard film plating process - Google Patents
A kind of backboard film plating process Download PDFInfo
- Publication number
- CN109487208A CN109487208A CN201910074523.3A CN201910074523A CN109487208A CN 109487208 A CN109487208 A CN 109487208A CN 201910074523 A CN201910074523 A CN 201910074523A CN 109487208 A CN109487208 A CN 109487208A
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- CN
- China
- Prior art keywords
- backboard
- layer
- plated
- optical film
- film
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/0641—Nitrides
- C23C14/0652—Silicon nitride
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
- C23C14/081—Oxides of aluminium, magnesium or beryllium
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
- C23C14/083—Oxides of refractory metals or yttrium
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/10—Glass or silica
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
Abstract
The invention discloses a kind of backboard film plating process, comprising: in the non-plated film area of backboard, plating sets the metal layer for being lower than threshold value with the adhesion strength of the backboard；Optical film layer is plated in the backboard front；Remove the metal layer and optical film layer above the non-plated film area.It is first plated by the non-plated film area in backboard and sets the metal layer poor with the adhesion strength of backboard, the optical film layer of needs is set in whole face plating, due to optical film layer super metal floor remote with the adhesion strength in plated film area of backboard and non-plated film area, therefore metal layer is easy to be detached from non-plated film area, to drive the optics membrane part above non-plated film area to separate with the optics membrane part in other regions, it is only set in the plating that plated film area carries out optical film to finally realize, method is simple, it firmly stabs and removes without chemical agent, corrosion will not be generated to the back side, the quality of optical film will not be reduced.
Description
Technical field
The present invention relates to technical field of optical coating, more particularly to a kind of backboard film plating process.
Background technique
Due to the continuous development of present various technologies, the gap of the basic technology in present each cell phone manufacturer is increasingly
Small, unless developing revolutionary technology, otherwise the difference of the product of various manufacturers is not too large, does not generate remote super colleague's
Competitiveness is difficult to win in competition.
Huge, the period is long due to putting into as some basic technologies, such as 4G, 5G technology, hold and interior has been hardly visible effect.
And some small intention, have the advantages that less investment, quick, it is easy to obtain the approval of consumer.And in Mobile Industry,
Other than the core technologies such as the display screen of mobile phone, processor, the quality of appearance of mobile phone etc. also seriously affects the competition of product
Power.General cell phone back cover generally requires to do optical coating, to realize better appearance.But in entire backplane region, often
Some places do not need plated film, such as camera shooting hole site.In order to allow the region not plated film, existing way is often:
One layer of method one, first silk-screen peelable glue, then plated film, is then again removed peelable glue with external force mode.Such as: it uses
Chemical agent will be removed firmly stamp.The shortcomings that this scheme be peelable glue again " deflation " in coating process, can be to the matter nearby to form a film
Amount impacts, such as uneven color；It removes, can be also easy to neighbouring film in addition, firmly being stabbed after film forming with chemical agent
Layer generates destruction.
Method two, plated film finish, and corrode the region using corrosivity liquid medicine.The shortcomings that this scheme is to need to find one kind
Erosion-resisting material, and the material must protect entire backboard, operate highly difficult.In addition, for glass back plate,
The ingredient and glass of plated film are much like, and the corrosion medical fluid is after corroding film layer, it is easy to just corrode to glass.This work
It is relatively high that skill controls difficulty.
Therefore, it is necessary to a kind of new technology, can low cost, efficiently, high quality in backplane region carry out optical coating.
Summary of the invention
The object of the present invention is to provide a kind of backboard film plating process, improve the yields of plated film and reduce plated film at
This.
In order to solve the above technical problems, the embodiment of the invention provides a kind of backboard film plating process, comprising:
In the non-plated film area of backboard, plating sets the metal layer for being lower than threshold value with the adhesion strength of the backboard；
Optical film layer is plated in the backboard front；
Remove the metal layer and optical film layer above the non-plated film area.
Wherein, the metal layer is aluminium layer or indium layer.
Wherein, the metal layer with a thickness of 5nm~30nm.
Wherein, the metal layer and optical film layer above the removal non-plated film area, comprising:
It carries out adherency using the optical film layer of the adhesive tape to the non-plated film area to pull, above the non-plated film area
Metal layer and optical film layer, or metal layer and optical film layer above the non-plated film area are removed using ultrasonic cleaning.
Wherein, the optical film layer is silica, silicon nitride, aluminium oxide, niobium oxide, titanium oxide or zirconium oxide.
Wherein, the optical film layer with a thickness of 100nm~500nm.
Wherein, the backboard is glass back plate or plastic back plate.
Backboard film plating process provided by the embodiment of the present invention has the advantage that compared with prior art
The backboard film plating process is first plated by the non-plated film area in backboard and sets the metal poor with the adhesion strength of backboard
Layer sets the optical film layers of needs in whole face plating, due to optical film layer super metal floor remote with the adhesion strength in plated film area of backboard with it is non-
Plated film area, therefore metal layer is easy to be detached from non-plated film area, to drive optics membrane part above non-plated film area and its
The optics membrane part in its region separates, and only sets in the plating that plated film area carries out optical film to finally realize, method is simple, nothing
It need to firmly be stabbed and be removed using chemical agent, corrosion will not generated to the back side, the quality of optical film will not be reduced.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is the present invention
Some embodiments for those of ordinary skill in the art without creative efforts, can also basis
These attached drawings obtain other attached drawings.
Fig. 1 is a kind of step process signal of specific embodiment of backboard film plating process provided in an embodiment of the present invention
Figure；
Fig. 2 is a kind of coating structure schematic diagram realized using backboard film plating process provided in an embodiment of the present invention.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
FIG. 1 to FIG. 2 is please referred to, Fig. 1 is a kind of specific embodiment of backboard film plating process provided in an embodiment of the present invention
Step flow diagram；Fig. 2 is that a kind of coating structure realized using backboard film plating process provided in an embodiment of the present invention is shown
It is intended to.
In a specific embodiment, the backboard film plating process, comprising:
Step 1, in the non-plated film area of backboard 10, plating sets the metal layer 20 for being lower than threshold value with the adhesion strength of the backboard 10；
Step 2, in the 10 front plating optical film layer 30 of backboard；
Step 3, the metal layer 20 and optical film layer 30 above the non-plated film area are removed.
It is first plated by the non-plated film area in backboard 10 and sets the metal layer 20 poor with the adhesion strength of backboard 10, set in whole face plating
The optical film layer 30 needed, due to the super metal floor 20 remote with the adhesion strength in plated film area of backboard 10 of optical film layer 30 and non-plated film area
, therefore metal layer 20 is easy to be detached from non-plated film area, to drive the optics membrane part above non-plated film area and other areas
The optics membrane part in domain separates, and only sets in the plating that plated film area carries out optical film to finally realize, method is simple, without adopting
It is firmly stabbed and is removed with chemical agent, corrosion will not generated to the back side, the quality of optical film will not be reduced.
The present invention can be camera shooting hole site etc. without limitation for non-plated film area.
The present invention is not specifically limited the type of the metal layer 20, thickness and plating equipment, method, can use magnetic
The method for controlling sputter coating can also be not specifically limited its technique using other film plating process, the present invention, general described
Metal layer 20 is aluminium layer or indium layer.
Preferably, the metal layer 20 with a thickness of 5nm~30nm.
The present invention for how removing the metal layer 20 and optical film in non-plated film area, do not do it is western it is specific limit, it is described to go
Except the metal layer 20 and optical film layer 30 above the non-plated film area, adhesive tape is adopted as to the optics in the non-plated film area
Film layer 30 carries out adherency and pulls, can also be using ultrasound except the metal layer 20 and optical film layer 30 above the non-plated film area
Wave cleaning removes metal layer 20 and optical film layer 30 above the non-plated film area.
It should be pointed out that above-mentioned mode is not limited in the present invention, and it is as harmless to backboard 10 in used, in ultrasonic wave
Using acid solution.
The present invention for optical film layer 30 type and thickness without limitation, the optical film layer 30 can for oxidation
Silicon, silicon nitride, aluminium oxide, niobium oxide, titanium oxide or zirconium oxide, or be other optical film layers, and generally using silica or
Silicon nitride film increases the gloss of back plate surface, improves its appearance.
The general optical film layer 30 with a thickness of 100nm~500nm.
The present invention for backboard 10 type without limitation, the backboard 10 be glass back plate 10 or plastic back plate 10.
In one embodiment of the invention, in the region Ji Fei plated film area for not needing plated film, such as camera shooting hole site, plating
One layer of Al metal layer with glass back plate adhesion strength lower than the 10nm thickness of threshold value, then the silica of whole face plating 200nm, forms a film
Later, non-plated film area is adhered to adhesive tape, the binding force of the optical film and Al metal layer in non-plated film area is stronger, Al metal layer
It is poor with the binding force of backboard, and the optical film in other regions and the binding force of backboard are stronger, so that non-plated film area and plated film area
Optical film be torn separation, rather than the optical film in plated film area is separated together with Al metal layer from backboard, to realize
Plated film area carries out the purpose of plating optical film.
In conclusion backboard film plating process provided in an embodiment of the present invention, first plated by the non-plated film area in backboard set with
The poor metal layer of the adhesion strength of backboard sets the optical film layer of needs in whole face plating, due to the plated film area of optical film layer and backboard
Adhesion strength remote super metal floor and non-plated film area, therefore metal layer is easy to be detached from non-plated film area, to drive non-plated film
Optics membrane part above area is separated with the optics membrane part in other regions, only carries out light in plated film area to finally realize
The plating for learning film is set, and method is simple, is firmly stabbed and is removed without chemical agent, will not be generated corrosion to the back side, will not be reduced light
Learn the quality of film.
Backboard film plating process provided by the present invention is described in detail above.Specific case pair used herein
The principle of the present invention and embodiment are expounded, method of the invention that the above embodiments are only used to help understand
And its core concept.It should be pointed out that for those skilled in the art, before not departing from the principle of the invention
It puts, can be with several improvements and modifications are made to the present invention, these improvement and modification also fall into the guarantor of the claims in the present invention
It protects in range.
Claims (7)
1. a kind of backboard film plating process characterized by comprising
In the non-plated film area of backboard, plating sets the metal layer for being lower than threshold value with the adhesion strength of the backboard；
Optical film layer is plated in the backboard front；
Remove the metal layer and optical film layer above the non-plated film area.
2. backboard film plating process as described in claim 1, which is characterized in that the metal layer is aluminium layer or indium layer.
3. backboard film plating process as claimed in claim 2, which is characterized in that the metal layer with a thickness of 5nm~30nm.
4. backboard film plating process as described in claim 1, which is characterized in that the metal layer above the removal non-plated film area
And optical film layer, comprising:
It carries out adherency using the optical film layer of the adhesive tape to the non-plated film area to pull, except the metal above the non-plated film area
Layer and optical film layer, or metal layer and optical film layer above the non-plated film area are removed using ultrasonic cleaning.
5. backboard film plating process as described in claim 1, which is characterized in that the optical film layer is silica, silicon nitride, oxidation
Aluminium, niobium oxide, titanium oxide or zirconium oxide.
6. backboard film plating process as claimed in claim 5, which is characterized in that the optical film layer with a thickness of 100nm~
500nm。
7. backboard film plating process as described in claim 1, which is characterized in that the backboard is glass back plate or plastic back plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910074523.3A CN109487208B (en) | 2019-01-25 | 2019-01-25 | Back plate coating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910074523.3A CN109487208B (en) | 2019-01-25 | 2019-01-25 | Back plate coating method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109487208A true CN109487208A (en) | 2019-03-19 |
| CN109487208B CN109487208B (en) | 2020-11-27 |
Family
ID=65714897
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910074523.3A Active CN109487208B (en) | 2019-01-25 | 2019-01-25 | Back plate coating method |
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| Country | Link |
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| CN (1) | CN109487208B (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101445903A (en) * | 2008-12-15 | 2009-06-03 | 宸阳光电科技（厦门）有限公司 | Pattern molding method in vacuuming metalling |
| US20140199808A1 (en) * | 2011-09-16 | 2014-07-17 | V Technology Co., Ltd. | Deposition mask, producing method therefor and forming method for thin film pattern |
| WO2016161567A1 (en) * | 2015-04-08 | 2016-10-13 | 华为技术有限公司 | Water-proof film coating method, device and terminal |
| CN107868932A (en) * | 2016-09-27 | 2018-04-03 | 上海和辉光电有限公司 | A kind of metal mask version and preparation method thereof |
| CN207793401U (en) * | 2017-12-27 | 2018-08-31 | 信利光电股份有限公司 | A kind of curved surface cover board |
| CN109136837A (en) * | 2018-10-18 | 2019-01-04 | 信利光电股份有限公司 | A kind of film plating process, deckboard and terminal |
-
2019
- 2019-01-25 CN CN201910074523.3A patent/CN109487208B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101445903A (en) * | 2008-12-15 | 2009-06-03 | 宸阳光电科技（厦门）有限公司 | Pattern molding method in vacuuming metalling |
| US20140199808A1 (en) * | 2011-09-16 | 2014-07-17 | V Technology Co., Ltd. | Deposition mask, producing method therefor and forming method for thin film pattern |
| WO2016161567A1 (en) * | 2015-04-08 | 2016-10-13 | 华为技术有限公司 | Water-proof film coating method, device and terminal |
| CN107868932A (en) * | 2016-09-27 | 2018-04-03 | 上海和辉光电有限公司 | A kind of metal mask version and preparation method thereof |
| CN207793401U (en) * | 2017-12-27 | 2018-08-31 | 信利光电股份有限公司 | A kind of curved surface cover board |
| CN109136837A (en) * | 2018-10-18 | 2019-01-04 | 信利光电股份有限公司 | A kind of film plating process, deckboard and terminal |
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| Publication number | Publication date |
|---|---|
| CN109487208B (en) | 2020-11-27 |
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