CN109473759A - SSPP local electromagnetic field enhancer based on folded substrate integrated waveguide - Google Patents
SSPP local electromagnetic field enhancer based on folded substrate integrated waveguide Download PDFInfo
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- CN109473759A CN109473759A CN201811056504.XA CN201811056504A CN109473759A CN 109473759 A CN109473759 A CN 109473759A CN 201811056504 A CN201811056504 A CN 201811056504A CN 109473759 A CN109473759 A CN 109473759A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P3/00—Waveguides; Transmission lines of the waveguide type
- H01P3/18—Waveguides; Transmission lines of the waveguide type built-up from several layers to increase operating surface, i.e. alternately conductive and dielectric layers
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Abstract
The invention provides an SSPP local electromagnetic field enhancer based on a folded substrate integrated waveguide, which comprises two layers of medium substrates and an upper layer, a middle layer and a lower layer of metal structures arranged on the medium substrates. A rectangular metal sheet is arranged between the two symmetrical microstrip lines, a plurality of metal through holes which are uniformly spaced in a transverse row are arranged on the upper edge of the rectangular metal sheet, and a plurality of grooves which are uniformly spaced and have the same groove width are formed outside the lower edge of the rectangular metal sheet. The SSPP local electromagnetic field enhancer based on the folded substrate integrated waveguide enhances the intensity of a local electromagnetic field, improves the transmission performance of artificial surface plasmons at low frequency, and solves the problems that the substrate integrated waveguide has overlarge volume relative to a plane transmission line and has low compactness when a microwave circuit is integrated.
Description
Technical field
The invention belongs to the frequency microwave device arts of wireless communication system electronic device, and in particular to a kind of utilization
The low-loss artificial surface phasmon local Electromagnetic enhancement device of folded substrate substrate integration wave-guide.
Background technique
The optical wavelength slow-wave structure that it is special that surface phasmon (SPP) is one kind has its advantage is that field containment ability is strong
Local Electromagnetic enhancement effect, light can be limited within the scope of sub-wavelength.Since perfect conductor is presented in microwave frequency band metal
Effect, SPP can not propagate.But it can be simulated in microwave frequency band by using one-dimensional or two-dimensional periodical sub-wavelength structure
The characteristic of SPP realizes artificial surface phasmon (SSPP) mode.Currently based on artificial surface phasmon structure two dimension or
Three-dimensional microwave device is widely proposed, and has the characteristics that flexible transmission, high frequency performance are good.But since radiation is damaged
Consumption and when low frequency weaker bound, SSPP performance in low frequency is poor.Substrate integration wave-guide (SIW) is a kind of novel guided wave
Structure constitutes the equivalent electric wall of waveguide by excavating two rows of metal throuth holes on printed circuit board (PCB) substrate.With plane
The characteristics of transmission line and metal rectangular waveguide, low insertion loss, the performance of low interference and Low emissivity, it is easy to and other planes electricity
Road is integrated.But SIW works in fast wave mode, and operation wavelength is long, volume is big, and virtually make microwave circuit is integrated to be restricted,
In order to reduce volume, the concept of folded substrate substrate integration wave-guide (FSIW) is suggested, and is remaining original SIW field distribution premise
Under, reduce SIW lateral dimension.
Increasingly the electromagnetic technique developed proposes increasingly higher demands to the miniaturization of microwave device.With working frequency
Further increase, how to improve electromagnetic field intensity in smaller size smaller, to preferably carry out electromagnetic wave regulation, become crucial
A Xiang Wenti.It is mixed based on folded substrate substrate integration wave-guide and artificial surface phasmon that there are no a kind of in the prior art
Structure is closed, local Electromagnetic enhancement effect may be implemented in this mixed structure, reduces radiation loss, and compactedness is high.
Summary of the invention
Goal of the invention of the invention is to provide a kind of SSPP local electromagnetic field increasing based on folded substrate substrate integration wave-guide
Strong device, electromagnetic field can be limited in the range of the very little of metal surface and enhance, while improving artificial surface etc.
Transmission performance when from excimer low frequency, solution substrate integration wave-guide is excessive with respect to the defeated line volume of plane, and microwave circuit is tight when integrated
The not high problem of degree of gathering, while on lesser device, realization further regulates and controls electromagnetic wave.
The specific technical solution of the present invention is a kind of SSPP local electromagnetic field increasing based on folded substrate substrate integration wave-guide
Strong device, including upper, middle and lower-ranking metal structure and be clipped in respectively, between middle layer metal structure and in, lower metal structure
Between two layers of medium substrate, which is characterized in that
The middle layer metal structure is itself symmetrical structure, is respectively the feedback of input and output micro-strip at the both ends of symmetrical structure
Line is two symmetrical rectangular microstrip lines in the inside of input and output microstrip feed line, divides on the outside of the upper and lower edge of rectangular microstrip line
Not Ju You the connection upper and lower layer metal structure parallel with rectangular microstrip line length direction of a row two metal throuth hole, at two
It is rectangular metal sheet between symmetrical rectangular microstrip line, it is horizontally-arranged evenly spaced multiple with one on the top edge of rectangular metal sheet
Metal throuth hole connects upper and lower layer metal structure, also has a horizontally-arranged evenly spaced multiple gold outside the lower edge of rectangular metal sheet
Belong to through-hole and connects upper and lower layer metal structure, the lateral position of the metal throuth hole outside the lower edge of rectangular metal sheet and rectangular metal
The lateral position of metal throuth hole on the top edge of piece is corresponding, is provided on the lower edge of rectangular metal sheet and is spaced uniform, groove width phase
Deng multiple grooves, multiple grooves are divided into left side concentration gradient gradual change groove, right side concentration gradient gradual change groove and position
Groove in intermediate even depth groove three parts, left side concentration gradient gradual change groove part, from the left end of rectangular metal sheet
Start, the depth of groove gradually increases, and until the depth of groove is identical as the depth of groove in even depth groove part, right side is deep
Spend the structure of gradient groove part and the symmetrical configuration of left side concentration gradient gradual change groove part.
Further, the groove is rectangle.
Further, the metal throuth hole is circle.
Further, the recess width is 0.6mm, and groove spacing is 0.6mm, the groove of even depth groove part
Depth is 3.0mm.
The beneficial effects of the invention are as follows it is 1) of the invention be a kind of artificial surface based on folded substrate substrate integration wave-guide
Phasmon local Electromagnetic enhancement device, artificial surface phasmon have the bound of stronger electromagnetic field, enhance office
Domain electromagnetic field intensity further utilizes the full-closed structure of folded substrate substrate integration wave-guide, it is suppressed that artificial surface etc. is from sharp
Radiation loss in first transmission process improves artificial surface phasmon local electromagnetic field intensity again；2) using folding lining
The mixed transport structure of bottom substrate integrated waveguide and artificial surface phasmon can be realized using periodical sub-wavelength structure
There is the transmission of the artificial surface phasmon of slow wave characteristic；3) the slow wave characteristic of artificial surface phasmon and folding lining are utilized
Bottom substrate integrated waveguide, while reducing horizontal and vertical size.Although folded substrate substrate integration wave-guide is reducing lateral ruler
Thickness is increased while very little, but due to significantly reducing longitudinal size in conjunction with artificial surface phasmon, to have
Lesser volume；4) using strip line as the intermediary of microstrip line and folded form substrate integration wave-guide, the two of strip line
Add metal throuth hole in side, it is suppressed that the radiation of higher mode obtains smaller leakage losses；5) using the recessed of concentration gradient gradual change
Slot realizes impedance matching between folded substrate substrate integration wave-guide and surface phasmon positioned at the front side of fold belt line.This hair
The bright artificial surface phasmon local Electromagnetic enhancement device as a kind of based on folded substrate substrate integration wave-guide has and increases
Strong local electromagnetic field and it is small in size, compactedness is high, design is simple, easy processing, the advantages that small is lost.It can be enterprising in this device
Row improves, and realizes further electromagnetic wave regulation.Integrated circuit and communication system, radar in future microwave and terahertz wave band
There is important prospect in system.
Detailed description of the invention
Fig. 1 is the detonation configuration of the SSPP local Electromagnetic enhancement device of the invention based on folded substrate substrate integration wave-guide
Schematic diagram,
Wherein, the upper layer 1- metal structure, 2- middle layer metal structure, 3- lower metal structure, 4- top dielectric substrate, under 5-
Layer medium substrate；
The structural schematic diagram of the middle layer metal structure of local Electromagnetic enhancement device Fig. 2 of the invention；
Fig. 3 is existing artificial surface phasmon, traditional folded substrate substrate integration wave-guide and local electricity of the invention
The contrastive colours non-dramatic song line chart of magnetic field-enhanced device；
Fig. 4 is the SSPP local Electromagnetic enhancement device of the invention based on folded substrate substrate integration wave-guide and existing people
The longitudinal section magnetic distribution figure of work surface phasmon transmission structure；
Wherein, (a) is the longitudinal section magnetic distribution figure of existing artificial surface phasmon transmission structure, is (b) this
The longitudinal section magnetic distribution figure of the local Electromagnetic enhancement device of invention；
Fig. 5 is the SSPP local Electromagnetic enhancement device and existing folding of the invention based on folded substrate substrate integration wave-guide
The comparison distribution map of the electric field of folded substrate base integrated waveguide；
Wherein, (a) is existing folded substrate substrate integrated wave guide structure distribution map of the electric field, (b) is local of the invention
The distribution map of the electric field of Electromagnetic enhancement device；
S parameter figure when Fig. 6 is the SSPP mixed structure transmission of the invention based on folded substrate substrate integration wave-guide.
Specific embodiment
Technical solution of the present invention is described further with reference to the accompanying drawings of the specification.
The present invention is a kind of SSPP local Electromagnetic enhancement device based on folded substrate substrate integration wave-guide, is presented using micro-strip
Electricity is realized using the unilateral fold belt line based on surface phasmon.It is described based on the artificial of folded substrate substrate integration wave-guide
The fold strip line structure of micro-strip strip lines configuration and groove depth gradual change has been respectively adopted in the transition structure of surface phasmon transmission line,
Wave number matching and the impedance matching between waveguide are realized, and then realizes power transmission maximized.
By loading unilateral fold belt line, realizes slow-wave transmission characteristic, strengthen to the bound of electromagnetic field.Pass through folding
Full-closed structure is realized in the introducing of substrate base integrated waveguide.The labor statement based on folded substrate substrate integration wave-guide
There is upper cut off frequency by the introducing of artificial surface phasmon in the dispersion curve of face phasmon transmission line, and then confirms
The slow-wave transmission characteristic of transmission line.By adjusting the size of fold belt line groove, adjustable upper cut off frequency.Under transmission line
Cutoff frequency can be controlled by the width of FSIW.
As shown in Fig. 1, a kind of artificial surface phasmon office based on folded substrate substrate integration wave-guide of the invention
Domain Electromagnetic enhancement device, it is special including two layers of medium substrate and the upper, middle and lower three-layer metal structure being arranged in medium substrate
Sign is that the middle layer metal structure is itself symmetrical structure, is respectively the feedback of input and output micro-strip at the both ends of symmetrical structure
Line is two symmetrical rectangular microstrip lines in the inside of input and output microstrip feed line, divides on the outside of the upper and lower edge of rectangular microstrip line
Not Ju You the connection upper and lower layer metal structure parallel with rectangular microstrip line length direction of a row two metal throuth hole, at two
It is rectangular metal sheet between symmetrical rectangular microstrip line, it is horizontally-arranged evenly spaced multiple with one on the top edge of rectangular metal sheet
Metal throuth hole connects upper and lower layer metal structure, also has a horizontally-arranged evenly spaced multiple gold outside the lower edge of rectangular metal sheet
Belong to through-hole and connects upper and lower layer metal structure, the lateral position of the metal throuth hole outside the lower edge of rectangular metal sheet and rectangular metal
The lateral position of metal throuth hole on the top edge of piece is corresponding, is provided on the lower edge of rectangular metal sheet and is spaced uniform, groove width phase
Deng multiple grooves, multiple grooves are divided into left side concentration gradient gradual change groove, right side concentration gradient gradual change groove and position
Groove in intermediate even depth groove three parts, left side concentration gradient gradual change groove part, from the left end of rectangular metal sheet
Start, the depth of groove gradually increases, and until the depth of groove is identical as the depth of groove in even depth groove part, right side is deep
Spend the structure of gradient groove part and the symmetrical configuration of left side concentration gradient gradual change groove part.Metal structure can be divided into list
Side fold belt line, metal throuth hole, transition structure several parts describe.
Unilateral fold belt line is exactly the groove that rectangular metal sheet one side uniform intervals offer setting width and depth, another
Side is the metal throuth hole in period；Transition structure includes two parts, and one is micro-strip strip lines configuration, is located at FSIW transmission line two
End, realization are matched with port Impedance.Another is the groove of concentration gradient gradual change, positioned at the front side of fold belt line, realizes FSIW
The impedance matching between SSPP.
In the specific embodiment of the invention, the shape of unilateral fold belt line upper groove is rectangle, but the present invention does not terminate in
This, the shape of groove can be other suitable geometries such as trapezoidal, square.And in the specific embodiment of the invention, groove
Width 0.6mm, depth 3.0mm, groove spacing be 0.6mm, electromagnetic field local booster overall length L=52mm, upper and lower two row
The long L of spacing W=6.6mm between metal throuth hole, FSIW structure1=40mm, unilateral fold belt is away from lower-lying metal through-hole wf=0.1mm, mistake
Cross structure lm=1.3mm, ln=1.5mm, wm=2mm, wn=4mm.Equally, the width of groove in the present invention, depth and
Away from, the distance between spacing, unilateral fold belt and lower-lying metal through-hole between total device length, metal throuth hole, transition structure ruler
It is very little to set as needed.
As shown in Fig. 2, metal structure of the invention includes:
(a) metal throuth hole of periodic arrangement.
Equivalent electric wall is constituted by metal throuth hole made of periodic arrangement, waveguide can be made by designing its radius and spacing
Effectively transmission, the lower limiting frequency of transmission line can be determined by the position of metal throuth hole.
(b) surface phasmon sub-wavelength period structure.
The fold belt line of groove depth gradual change is extended by surface phasmon sub-wavelength period structure, both sides uniform intervals
The groove of setting width is offered, groove is gradually deepened with development length；The waveguide of artificial surface phasmon is by fold belt line
It constitutes, fold belt line is fluted, and FSIW does not have groove, will have wave number mismatch between the two, therefore use gradual change
Groove depth realizes the smooth transition of two kinds of wave numbers.
As shown in Fig. 3, it is observed that folded substrate substrate integration wave-guide and surface etc. from sharp by dispersion curve figure
The dispersion curve of first mixed structure is between folded substrate substrate integration wave-guide and surface phasmon dispersion curve, the present invention
New construction upper lower limiting frequency i.e. respectively by the parameter setting of surface phasmon and folded substrate substrate integration wave-guide institute
Control, the depth, height, width for adjusting groove can be adjusted the upper side band cutoff frequency of the structure, adjust metal throuth hole
The lower sideband cutoff frequency of the structure can be adjusted in position.
As shown in Fig. 4, wherein (a) is the longitudinal section electromagnetic field point of existing artificial surface phasmon transmission structure
Butut is (b) the longitudinal section magnetic distribution figure of technical solution of the present invention structure.The figure is confirmed in artificial surface phasmon
Under the action of electromagnetic field is bound and folded substrate substrate integration wave-guide full-closed structure, local Electromagnetic enhancement performance significantly mentions
It is high.
As shown in Fig. 5, wherein (a) is folded substrate substrate integrated wave guide structure, does not introduce slow wave characteristic, (b) is
The innovation structure of folded substrate substrate integration wave-guide and surface phasmon.The figure further demonstrate introduce artificial surface etc. from
When excimer structure, electromagnetic wavelength shortens, and propagating has slow wave characteristic.The performance enhancement of local electromagnetic field is shown simultaneously.
As shown in Fig. 6, it is analyzed according to the transmission line model of Microwave Net, the scattering of four port networks in available figure
Parameter: the S within the scope of 8 to 13.5GHz21In 1.5dB or so, S11Respectively less than -10dB, it is meant that impedance matching and momentum matching
It is very perfect.
In conclusion the artificial surface phasmon local electromagnetic field of the invention based on folded substrate substrate integration wave-guide
Enhance device, local electromagnetic field intensity can be improved, reduce loss, realization transverse and longitudinal size while the diminution when transmitting and promoted
Circuit compactness.And have many advantages, such as that small in size, design is simple, easy to process, laser propagation effect is good, in future microwave and Terahertz
There is important prospect in the phasmon integrated circuit and communication system of wave band.
The above is only a preferred embodiment of the present invention.It should be pointed out that for the ordinary skill people of the art
For member, various improvements and modifications may be made without departing from the principle of the present invention, these improvements and modifications are also answered
It is considered as protection scope of the present invention.
Claims (4)
1. a kind of SSPP local Electromagnetic enhancement device based on folded substrate substrate integration wave-guide, including upper, middle and lower-ranking metal
Structure and be clipped in respectively, between middle layer metal structure and in, two layers of medium substrate between lower metal structure, feature
It is,
The middle layer metal structure is itself symmetrical structure, is respectively input and output microstrip feed line at the both ends of symmetrical structure,
It is two symmetrical rectangular microstrip lines, difference on the outside of the upper and lower edge of rectangular microstrip line in the inside of input and output microstrip feed line
Metal throuth hole with a row two connection upper and lower layer metal structures parallel with rectangular microstrip line length direction, it is right at two
Rectangular microstrip line between be referred to as rectangular metal sheet, there are a horizontally-arranged evenly spaced multiple gold on the top edge of rectangular metal sheet
Belong to through-hole and connect upper and lower layer metal structure, also there are a horizontally-arranged evenly spaced multiple metals outside the lower edge of rectangular metal sheet
Through-hole connects upper and lower layer metal structure, the lateral position of the metal throuth hole outside the lower edge of rectangular metal sheet and rectangular metal sheet
Top edge on metal throuth hole lateral position it is corresponding, be provided on the lower edge of rectangular metal sheet interval uniformly, groove width it is equal
Multiple grooves, multiple grooves are divided into left side concentration gradient gradual change groove, right side concentration gradient gradual change groove and are located at
Intermediate even depth groove three parts, the groove in the concentration gradient gradual change groove part of left side, are opened from the left end of rectangular metal sheet
Beginning, the depth of groove gradually increases, until the depth of groove is identical as the depth of groove in even depth groove part, right side depth
The structure of gradient groove part and the symmetrical configuration of left side concentration gradient gradual change groove part.
2. a kind of SSPP local Electromagnetic enhancement device based on folded substrate substrate integration wave-guide according to claim 1,
It is characterized in that, the groove is rectangle.
3. a kind of SSPP local Electromagnetic enhancement device based on folded substrate substrate integration wave-guide according to claim 1,
It is characterized in that, the metal throuth hole is circle.
4. a kind of SSPP local Electromagnetic enhancement device based on folded substrate substrate integration wave-guide according to claim 1,
It is characterized in that, the recess width is 0.6mm, groove spacing is 0.6mm, and the depth of groove of even depth groove part is
3.0mm。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811056504.XA CN109473759A (en) | 2018-09-11 | 2018-09-11 | SSPP local electromagnetic field enhancer based on folded substrate integrated waveguide |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201811056504.XA CN109473759A (en) | 2018-09-11 | 2018-09-11 | SSPP local electromagnetic field enhancer based on folded substrate integrated waveguide |
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| CN109473759A true CN109473759A (en) | 2019-03-15 |
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| CN201811056504.XA Pending CN109473759A (en) | 2018-09-11 | 2018-09-11 | SSPP local electromagnetic field enhancer based on folded substrate integrated waveguide |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111326840A (en) * | 2020-02-07 | 2020-06-23 | 北京邮电大学 | Self-packaging substrate integrated bow-tie cell artificial surface plasmon transmission line |
| CN112290180A (en) * | 2020-11-06 | 2021-01-29 | 上海交通大学 | Ridge half-mode substrate integrated waveguide transmission line |
| CN116937091A (en) * | 2023-09-19 | 2023-10-24 | 中国计量大学 | Reconfigurable band-pass filter of SSPP and SIW hybrid circuit |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201156573Y (en) * | 2008-01-25 | 2008-11-26 | 南京理工大学 | Integrated wave-guide band filter based on foldable substrate |
| CN105789804A (en) * | 2016-03-11 | 2016-07-20 | 南京邮电大学 | Broadband transition structure from micro-strip line to folded substrate-integrated waveguide |
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2018
- 2018-09-11 CN CN201811056504.XA patent/CN109473759A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201156573Y (en) * | 2008-01-25 | 2008-11-26 | 南京理工大学 | Integrated wave-guide band filter based on foldable substrate |
| CN105789804A (en) * | 2016-03-11 | 2016-07-20 | 南京邮电大学 | Broadband transition structure from micro-strip line to folded substrate-integrated waveguide |
Non-Patent Citations (1)
| Title |
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| DONG-FANG GUAN 等: ""Slow-wave Half-Mode Substrate Integrated Waveguide Using Spoof Surface Plasmon Polariton Structure"", 《IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES》 * |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111326840A (en) * | 2020-02-07 | 2020-06-23 | 北京邮电大学 | Self-packaging substrate integrated bow-tie cell artificial surface plasmon transmission line |
| CN111326840B (en) * | 2020-02-07 | 2021-04-27 | 北京邮电大学 | Self-packaging substrate integrated bow-tie cell artificial surface plasmon transmission line |
| CN112290180A (en) * | 2020-11-06 | 2021-01-29 | 上海交通大学 | Ridge half-mode substrate integrated waveguide transmission line |
| CN116937091A (en) * | 2023-09-19 | 2023-10-24 | 中国计量大学 | Reconfigurable band-pass filter of SSPP and SIW hybrid circuit |
| CN116937091B (en) * | 2023-09-19 | 2023-12-08 | 中国计量大学 | Reconfigurable band-pass filter of SSPP and SIW hybrid circuit |
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