CN109449132A - A kind of computer chip safeguard structure with moisture-proof heat sinking function - Google Patents
A kind of computer chip safeguard structure with moisture-proof heat sinking function Download PDFInfo
- Publication number
- CN109449132A CN109449132A CN201811589384.XA CN201811589384A CN109449132A CN 109449132 A CN109449132 A CN 109449132A CN 201811589384 A CN201811589384 A CN 201811589384A CN 109449132 A CN109449132 A CN 109449132A
- Authority
- CN
- China
- Prior art keywords
- protective cover
- moisture
- air inlet
- pedestal
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/38—Cooling arrangements using the Peltier effect
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/18—Packaging or power distribution
- G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/562—Protection against mechanical damage
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/564—Details not otherwise provided for, e.g. protection against moisture
Abstract
The invention discloses a kind of computer chip safeguard structures with moisture-proof heat sinking function, including pedestal, protective cover and pin, the base bottom adhesion, which has, is provided with protection cotton on the inside of bradyseism pad and pedestal, the pedestal inner top is equipped with pin by mounting groove, the top is provided with protective cover, the protective cover two sides offer air inlet and air inlet side has been bolted filter screen, are equipped with stamp-mounting-paper diode by installation set at the top of the air inlet and stamp-mounting-paper diode one end is located inside air inlet.Cold air can be brought into protective cover simultaneously in heat dissipation by setting air inlet and stamp-mounting-paper diode, cool down, while being provided with bradyseism pad and protection cotton to CPU, can play the functions such as damping, dust-proof, moisture-proof, be suitble to be widely popularized and used by the present invention.
Description
Technical field
The present invention relates to chip protection technology field, in particular to a kind of computer chip with moisture-proof heat sinking function is anti-
Protection structure.
Background technique
Computer chip is one piece of ultra-large integrated circuit, and also known as CPU is the arithmetic core and control of a computer
Core processed, existing technology are in the CPU slot being mounted on CPU on mainboard, and stick silicon rubber, install radiator and heat dissipation
Fan radiates, and protective is poor, while heat dissipation effect is general, for this purpose, it is proposed that a kind of have moisture-proof heat sinking function
Computer chip safeguard structure.
Summary of the invention
The main purpose of the present invention is to provide a kind of computer chip safeguard structures with moisture-proof heat sinking function, pass through
Air inlet and stamp-mounting-paper diode are set, cold air can be brought into protective cover simultaneously in heat dissipation, be cooled down to CPU, simultaneously
It is provided with bradyseism pad and protection cotton, the functions such as damping, dust-proof, moisture-proof can be played, can effectively solve asking in background technique
Topic.
To achieve the above object, the technical scheme adopted by the invention is as follows:
A kind of computer chip safeguard structure with moisture-proof heat sinking function, including pedestal, protective cover and pin, the pedestal bottom
Portion's adhesion, which has, is provided with protection cotton on the inside of bradyseism pad and pedestal, and the pedestal inner top is equipped with pin by mounting groove, described
Top is provided with protective cover, and the protective cover two sides offer air inlet and air inlet side has been bolted filter screen,
Stamp-mounting-paper diode is equipped with by installation set at the top of the air inlet and stamp-mounting-paper diode one end is located inside air inlet, it is described anti-
It has been bolted at the top of protecting cover at the top of radiator and radiator and has been bolted radiator fan, the radiator bottom
Adhesion has silicone rubber pad and silicone rubber pad is located inside protective cover, is inlaid with and is destaticed by mounting groove on the outside of the protective cover
Ball.
Further, described pin one end is located in protection cotton and the pin other end is located at the rebasing portion of bradyseism.
Further, the protective cover two sides are connected with buckle by shaft, and the chassis outer side is provided with and buckle pair
The card slot answered.
Further, the stamp-mounting-paper diode is electrical connected with radiator fan.
Further, bradyseism pad two sides are provided with fixation hole.
Compared with prior art, the invention has the following beneficial effects:
1. in heat dissipation while cold wind can be made to enter in protective cover by setting air inlet and stamp-mounting-paper diode, reach heat dissipation, drop
The effect of temperature, when radiator fan takes the heat in protective cover away, outside air enters in protective cover from air inlet, in patch
Air is set to cool off the heat absorption in outside air according to peltier effect after diode energization.
2. protection cotton is made of polytetrafluoroethylene material by setting protection cotton, anti-corrosion, moisture-proof, dust-proof can be played
Purpose avoids chip from producing because of vibration by the way that bradyseism pad is arranged, can be effectively relieved because of external impact force or shakes to pedestal vibration
Life loosens or shifts.
3. protective cover can be securely fixed, it is avoided to fall off by setting buckle and card slot, it, can by the way that pin is arranged
Chip to be connect with computer motherboard, so that they can work normally.
Detailed description of the invention
Fig. 1 is a kind of overall structure diagram of the computer chip safeguard structure with moisture-proof heat sinking function of the present invention.
Fig. 2 is a kind of protective cover internal structure of the computer chip safeguard structure with moisture-proof heat sinking function of the present invention
Figure.
Fig. 3 is a kind of understructure figure of the computer chip safeguard structure with moisture-proof heat sinking function of the present invention.
Fig. 4 is a kind of pin configuration figure of the computer chip safeguard structure with moisture-proof heat sinking function of the present invention.
In figure: 1, pedestal；2, protective cover；3, pin；4, protection cotton；5, silicone rubber pad；6, radiator；7, radiator fan；
8, stamp-mounting-paper diode；9, air inlet；10, filter screen；11, it buckles；12, card slot；13, fixation hole；14, bradyseism pad；15, it destatics
Ball.
Specific embodiment
To be easy to understand the technical means, the creative features, the aims and the efficiencies achieved by the present invention, below with reference to
Specific embodiment, the present invention is further explained.
As shown in Figs 1-4, a kind of computer chip safeguard structure with moisture-proof heat sinking function, including pedestal 1, protective cover
2 and pin 3, the 1 bottom adhesion of pedestal, which has, is provided with protection cotton 4 on the inside of bradyseism pad 14 and pedestal 1,1 inner top of pedestal
Pin 3 is installed by mounting groove, 1 top is provided with protective cover 2,2 two sides of protective cover offer air inlet 9 and into
9 side of air port has been bolted filter screen 10, at the top of the air inlet 9 by installation set be equipped with stamp-mounting-paper diode 8 and
8 one end of stamp-mounting-paper diode is located inside air inlet 9, and radiator 6 and radiator 6 have been bolted at the top of the protective cover 2
Top has been bolted radiator fan 7, and the 6 bottom adhesion of radiator has silicone rubber pad 5 and silicone rubber pad 5 is located at protection
Inside lid 2, it is inlaid on the outside of the protective cover 2 by mounting groove and destatics ball 15.
Wherein, described 3 one end of pin is located in protection cotton 4 and 3 other end of pin is located at bradyseism and pads 14 bottoms.
As shown in figure 4, pin 3 is for chip to be connect with computer motherboard in the present embodiment.
Wherein, 2 two sides of protective cover are connected with buckle 11 by shaft, are provided on the outside of the pedestal 1 and buckle 11
Corresponding card slot 12.
In the present embodiment as shown in Figure 2,3, protective cover 2 can be fixed on pedestal 1 by buckle 11 and card slot 12.
Wherein, the stamp-mounting-paper diode 8 is electrical connected with radiator fan 7.
As shown in Fig. 2, radiator fan 7 gives the power supply of stamp-mounting-paper diode 8 after being powered in the present embodiment.
Wherein, the bradyseism pads 14 two sides and is provided with fixation hole 13.
As shown in Figure 1, pedestal 1 can be fixed on computer motherboard by fixation hole 13 in the present embodiment.
It should be noted that the present invention is a kind of computer chip safeguard structure with moisture-proof heat sinking function, when work,
Pedestal 1 is mounted in the CPU slot on computer motherboard using bolt by fixation hole 13 by personnel, and chip bottom is aligned
Pin 3 is placed in the protection cotton 4 of pedestal 1, and chip can be connect by pin 3 with computer motherboard, so that they can work normally,
Protection cotton 4 is made of polytetrafluoroethylene material, can play anti-corrosion, moisture-proof, dust-proof purpose, covers protective cover 2, and use card
Button 11 is fixed protective cover 2 by card slot 12, radiator fan 7 is connect with external power supply, silicone rubber pad 5 can dissipate chip
The heat of sending is transmitted to the Guangzhou radiator 6(electricity sounds electronic Science and Technology Ltd. product) on, chip can be improved in radiator 6
Heat dissipation area, radiator fan 7 take heat away, and when radiator fan 7 takes the heat in protective cover 2 away, outside air passes through logical
Air port 9 enter protective cover 2 in, get Bo Electronic Science and Technology Co., Ltd., the Shenzhen stamp-mounting-paper diode 8(product) be powered after can generate pa
That note effect releases heat positioned at external one end stamp-mounting-paper diode 8, and 8 one end of stamp-mounting-paper diode being located in ventilation opening 9 is inhaled
Receive heat, can by ventilation opening 9 outside air in heat absorption, thus when the lower air of temperature enter protective cover 2
It is interior to cool down for chip, heat dissipation effect is effectively improved, destaticing ball 15, (Dongguan City swallow rises the limited public affairs of anion science and technology by negative ion powder
Department's product) it is made, anion can be given out, the charge on 2 surface of protective cover is neutralized, achievees the purpose that eliminate electrostatic, bradyseism pad
14 can be effectively relieved because of external impact force or shake to the vibration of pedestal 1, and chip is avoided to loosen or shift because vibration generates.
The above shows and describes the basic principles and main features of the present invention and the advantages of the present invention.The technology of the industry
Personnel are it should be appreciated that the present invention is not limited to the above embodiments, and the above embodiments and description only describe this
The principle of invention, without departing from the spirit and scope of the present invention, various changes and improvements may be made to the invention, these changes
Change and improvement all fall within the protetion scope of the claimed invention.The claimed scope of the invention by appended claims and its
Equivalent thereof.
Claims (5)
1. a kind of computer chip safeguard structure with moisture-proof heat sinking function, including pedestal (1), protective cover (2) and pin
(3), it is characterised in that: pedestal (1) the bottom adhesion, which has, is provided with protection cotton (4), institute on the inside of bradyseism pad (14) and pedestal (1)
It states pedestal (1) inner top to be equipped with pin (3) by mounting groove, is provided with protective cover (2), the protective cover at the top of described (1)
(2) two sides offer air inlet (9) and air inlet (9) side has been bolted filter screen (10), air inlet (9) top
Portion is equipped with stamp-mounting-paper diode (8) by installation set and stamp-mounting-paper diode (8) one end is located at air inlet (9) inside, the protection
It has been bolted at the top of radiator (6) and radiator (6) and has been bolted radiator fan (7) at the top of lid (2), it is described
Radiator (6) bottom adhesion has silicone rubber pad (5) and silicone rubber pad (5) is located at protective cover (2) inside, and the protective cover (2) is outside
Side is inlaid with by mounting groove destatics ball (15).
2. a kind of computer chip safeguard structure with moisture-proof heat sinking function according to claim 1, it is characterised in that:
Described pin (3) one end is located in protection cotton (4) and pin (3) other end is located at bradyseism pad (14) bottom.
3. a kind of computer chip safeguard structure with moisture-proof heat sinking function according to claim 1, it is characterised in that:
Protective cover (2) two sides are connected with buckle (11) by shaft, are provided on the outside of the pedestal (1) corresponding with buckle (11)
Card slot (12).
4. a kind of computer chip safeguard structure with moisture-proof heat sinking function according to claim 1, it is characterised in that:
The stamp-mounting-paper diode (8) is electrical connected with radiator fan (7).
5. a kind of computer chip safeguard structure with moisture-proof heat sinking function according to claim 1, it is characterised in that:
Bradyseism pad (14) two sides are provided with fixation hole (13).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811589384.XA CN109449132A (en) | 2018-12-25 | 2018-12-25 | A kind of computer chip safeguard structure with moisture-proof heat sinking function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811589384.XA CN109449132A (en) | 2018-12-25 | 2018-12-25 | A kind of computer chip safeguard structure with moisture-proof heat sinking function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109449132A true CN109449132A (en) | 2019-03-08 |
Family
ID=65535587
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811589384.XA Pending CN109449132A (en) | 2018-12-25 | 2018-12-25 | A kind of computer chip safeguard structure with moisture-proof heat sinking function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109449132A (en) |
-
2018
- 2018-12-25 CN CN201811589384.XA patent/CN109449132A/en active Pending
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20190308 |
|
| WD01 | Invention patent application deemed withdrawn after publication |