CN108761796A - A kind of virtual reality device - Google Patents

Abstract

The invention discloses a virtual reality device, which comprises a front shell and a main board arranged inside the front shell. The front shell is made of heat-conducting material, and a processing chip and a power management circuit are arranged on the front side of the main board. A thermal diffusion film is provided, and the thermal diffusion film is respectively in contact with the front shell, the processing chip and the power management circuit. This application adopts a passive heat dissipation method to integrate the front shell and heat sink of the virtual reality device. The front shell is made of heat-conducting material, and a thermal diffusion film is arranged between the inner wall of the front shell and the main board. The thermal diffusion film contacts the processing chip of the main board. And the power management circuit, the heat generated by its work is quickly transferred to the front shell, and finally dissipated to the external environment through the front shell, which realizes the heat dissipation and cooling of the virtual reality device. Moreover, using the front shell as the heat sink of the virtual reality device also avoids The weight problem caused by the additional heat sink is beneficial to the lightweight design and improves the wearing experience.

Description

a virtual reality device

technical field

The invention relates to the technical field of virtual reality, in particular to a virtual reality device.

Background technique

In virtual reality technology, in order to provide users with an immersive virtual reality experience, it is usually necessary to use a virtual reality device close to the body, such as a virtual reality all-in-one machine shaped like a virtual reality helmet, glasses, etc., and a processor chip is installed in its housing , as a game host, it can run applications and use the embedded screen-lens system to provide users with a realistic virtual reality experience. From the perspective of safety and comfort experience, virtual reality devices need to have good heat dissipation . However, the existing active cooling method, which uses fans to dissipate heat, is noisy and has a short lifespan, and is not suitable for virtual reality devices.

Contents of the invention

In view of the problem that a virtual reality device in the prior art needs to maintain good heat dissipation, a virtual reality device of the present invention is proposed to overcome the above problem or at least partially solve the above problem.

In order to achieve the above object, the present invention adopts the following technical solutions:

A virtual reality device, comprising a front shell and a main board arranged inside the front shell, the front shell is made of heat-conducting material, a processing chip and a power management circuit are arranged on the front side of the main board, and a thermal diffusion is arranged between the inner wall of the front shell and the main board The film and the thermal diffusion film are respectively in contact with the front shell, the processing chip and the power management circuit.

Optionally, there is no opening on the surface of the front shell.

Optionally, lightening holes are provided on the surface of the front shell.

Optionally, the inner wall of the front shell is provided with reinforcing ribs along the transverse direction and the longitudinal direction.

Optionally, the outer side of the front shell is covered with a flexible material.

Optionally, the virtual reality device further includes a middle case, and a first gap is provided between the middle case and the front case to form a first air flow channel.

Optionally, the virtual reality device further includes a rear shell and a lens barrel bracket, and a second gap is provided between the rear shell and the lens barrel bracket to form a second air flow channel.

Optionally, the width of the first gap and the second gap is 0.5-1.5mm.

Optionally, the front shell is made of magnesium-aluminum alloy.

Optionally, the virtual reality device is a virtual reality helmet or virtual reality glasses.

In summary, the beneficial effects of the present invention are:

Passive heat dissipation is adopted to integrate the front shell and heat sink of the virtual reality device. The front shell is made of heat-conducting materials, and a thermal diffusion film is set between the inner wall of the front shell and the main board. The thermal diffusion film contacts the processing chip and power supply of the main board. The management circuit quickly conducts the heat generated by its work to the front case, and finally dissipates heat to the external environment through the front case, so as to solve the problem that the processing chip and power management circuit area are easy to heat up and cause damage due to excessive temperature, and realize the virtual reality equipment. Heat dissipation and cooling, and the use of the front shell as the heat sink of the virtual reality device also avoids the weight problem caused by the additional heat sink, which is conducive to lightweight design and improves the wearing experience.

Description of drawings

Fig. 1 is a partial exploded view of an embodiment of the virtual reality device of the present invention;

Fig. 2 is a partial exploded view of another embodiment of the virtual reality device of the present invention;

Fig. 3 is a sectional view of an embodiment of the virtual reality device of the present invention;

Figure 4 is an enlarged view of the local details shown in the circled area in Figure 3;

In the picture:

1. Flexible material; 2. Front shell; 3. Thermal diffusion film; 4. Main board; 5. Screen bracket; 6. Screen; 7. Lens barrel bracket; 8. Middle shell; 9. Back shell; 28. First gap ; 79, the second gap.

Detailed ways

In order to make the object, technical solution and advantages of the present invention clearer, the implementation manner of the present invention will be further described in detail below in conjunction with the accompanying drawings.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" etc. The indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, or in a specific orientation. construction and operation, therefore, should not be construed as limiting the invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and should not be construed as indicating or implying relative importance.

In the description of the present invention, it should be noted that unless otherwise specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection. Connected, or integrally connected; it can be mechanically connected or electrically connected; it can be directly connected or indirectly connected through an intermediary, and it can be the internal communication of two components. Those of ordinary skill in the art can understand the specific meanings of the above terms in the present invention in specific situations.

The technical concept of the present invention is: in the virtual reality device, adopt passive heat dissipation method, integrate the front shell and heat sink of the virtual reality device, make the front shell with heat-conducting material, and set the front shell between the inner wall of the front shell and the main board Thermal diffusion film, the thermal diffusion film contacts the processing chip and power management circuit of the main board, quickly conducts the heat generated by its work to the front case, and finally dissipates it to the external environment through the front case, so as to solve the problem of easy heating of the processing chip and power management circuit area. The problem of damage due to excessive temperature has realized the heat dissipation and cooling of virtual reality equipment. Moreover, using the front shell as the heat sink of the virtual reality device also avoids the weight problem caused by the additional heat sink, which is conducive to lightweight design and improves the wearing experience.

Fig. 1 is a partially exploded view of an embodiment of the virtual reality device of the present invention. As shown in Figure 1, a virtual reality device includes a front shell 2, and a main board 4 arranged on the inside of the front shell 2, the front shell 2 is made of a heat-conducting material, and the front side of the main board 4 is provided with a processing chip and a power management circuit ( (not shown), a thermal diffusion film 3 is arranged between the inner wall of the front case 2 and the main board 4, and the thermal diffusion film 3 is in contact with the front case 2, the processing chip and the power management circuit respectively.

In addition, the embodiment shown in FIG. 1 also includes a screen 6, a screen bracket 5, a lens barrel bracket 7, and the like.

Wherein, the processing chip on the main board 4 is a SOC chip (System on Chip, Chinese name: System-on-Chip), which is a kind of integrated circuit with special purpose, which includes a complete system and all the contents of embedded software. The power management circuit on the mainboard 4 is a PMIC circuit (Power Management IC, Chinese name: power management integrated circuit), which is used to manage power devices in the host system, and is often used in mobile phones and various mobile terminal devices. The purpose of heat dissipation of the virtual reality device in this embodiment is to control the SOC chip and PMIC circuit so that their respective internal temperature and shell temperature can meet their respective temperature specifications, so as to avoid overheating affecting normal operation or even causing burnout.

The thermal diffusion film 3 is a material with an ultra-high thermal conductivity. In this embodiment, the thermal diffusion film 3 is in contact with the processing chip and the power management circuit of the front case 2 and the motherboard 4 respectively, so that the processing chip and the power management circuit can be quickly connected to each other. The heat generated by the power management circuit is conducted and diffused to the front shell 2 used as a heat sink, so as to achieve the effect of heat uniformity and heat dissipation, so that the temperature of the processing chip and the power management circuit on the main board 4 can be effectively controlled, and local overheating of the main board 4 can be avoided. At the same time avoid scalding the user.

In the embodiment shown in FIG. 1 , the surface of the front case 2 remains intact without openings. Different from the existing virtual reality devices that leave cooling holes on the shell, the applicant found that in the process of heat dissipation with the help of the front shell 2 and the thermal diffusion film 3, the heat dissipation effect of the front shell 2 with the surface intact is better, so , from the perspective of heat dissipation, the front case 2 of this embodiment is not provided with openings.

In the embodiment shown in FIG. 1 , the front shell 2 is made of magnesium-aluminum alloy material with good thermal conductivity, and the density of magnesium-aluminum alloy is low, which can also improve the wearing experience of the virtual reality device.

In the embodiment shown in FIG. 1 , on the inner wall of the front shell 2 , reinforcing ribs are provided both in the transverse direction and in the longitudinal direction. The criss-crossing reinforcing ribs can reinforce the lack of structural strength caused by the front case 2 being radiated with fins, so as to ensure that the virtual reality device does not lose its operating function under the premise of reducing its weight.

In the embodiment shown in FIG. 1 , the outer side of the front shell 2 is covered with a flexible material 1 to form a beautiful and comfortable appearance. Specifically, the front shell 2 can be realized by wrapping with a flexible material such as non-woven fabric.

FIG. 2 is a partial exploded view of another embodiment of the virtual reality device of the present invention. The difference from the embodiment shown in FIG. 1 is that in the embodiment shown in FIG. Therefore, the weight of the front case 2 can be reduced, so that in a virtual reality device that does not require high heat dissipation power, it can be designed as lightweight as possible to improve the wearing comfort of the user.

On the basis of the above-mentioned embodiments shown in Figures 1 and 2, in order to further improve the heat dissipation capability, the present application also shows a virtual reality device with an airflow channel to increase the air in the cavity of the virtual reality device and the outside world. Convective heat exchange.

Fig. 3 is a cross-sectional view of an embodiment of the virtual reality device of the present invention; Fig. 4 is an enlarged view of partial details shown in the circled area in Fig. 3 .

As shown in Figures 3-4, the virtual reality device also includes a middle shell 8, a first gap 28 (see the enlarged view in Figure 4) is provided between the middle shell 8 and the front shell 2 to form a first airflow channel, and the first airflow channel is connected to the front shell 2. External communication realizes gas flow and heat exchange, further improving the heat dissipation capacity of the virtual reality device. Wherein, the middle shell 8 is connected with the front shell 2 through a hook structure.

Continuing to refer to FIGS. 3-4 , the virtual reality device further includes a rear shell 9 and a lens barrel bracket 7 . The lens barrel bracket 7 is used to install the lenses or lens groups required by the user to watch the screen. A second gap 79 (see the enlarged view of FIG. 4 ) is provided between the rear shell 9 and the lens barrel bracket 7 to form a second airflow channel. The second airflow channel communicates with the outside world to realize gas flow and heat exchange, which further improves the heat dissipation capacity of the virtual reality device. At the same time, the air exchange and heat exchange effect through the second airflow channel can also prevent the lens from fogging and improve the user's viewing of the virtual reality scene. look and feel. In this embodiment, the rear shell 9 is locked on the middle shell 8 by screws, so that the middle shell 8 plays the role of fixedly connecting the front shell 2 and the rear shell 9, and the front shell 2, the middle shell 8 and the rear shell 9 together form a virtual The shell of the realistic device.

The size of the first gap 28 and the second gap 79 can be specifically designed according to the structural size of the virtual reality device. Preferably, the width of the first gap 28 and the second gap 79 is set at 0.5-1.5mm, as shown in the embodiment of Figure 3 , the width of the first gap 28 and the second gap 79 is set to 1mm.

In addition, a dust-proof structure such as a dust cover can also be provided at the position where the first gap 28 and the second gap 79 communicate with the outside world, so as to prevent dust from entering the virtual reality device and being polluted.

In the above embodiments of the present application, the cooling power of the virtual reality device is below 7W. This application is based on the principle of passive heat dissipation, and realizes heat uniformity and heat dissipation through the thermal diffusion film 3 and the front shell 2, and is especially suitable for low-power heat dissipation devices that do not require high heat dissipation power.

In some embodiments of the present application, the virtual reality device is a virtual reality helmet or virtual reality glasses.

Through experimental testing, the virtual reality device of this application has a good heat dissipation effect, and the temperature control performance is better. The test results are shown in the following table:

Table 1 Temperature comparison of various parts of the front shell 2 with different opening ratios

It can be seen from Table 1 that the temperature of each main heat-generating component is about 5° C. lower in the scheme in which the front shell 2 has no openings than in the scheme in which the opening ratio of the front shell 2 is 30%.

Table 2 Comparison of the temperature of each component with and without thermal diffusion film 3 on the inner wall of the front shell 2

It can be seen from Table 2 that the solution of the thermal diffusion film 3 attached to the inner wall of the front shell 2 is lower than that of the solution without the thermal diffusion film 3. The temperature of the magnesium-aluminum alloy front shell 2 drops by about 7°C, and most of the other components also have obvious temperature fluctuations. reduce.

To sum up, in the virtual reality device applied for, a passive heat dissipation method is adopted to integrate the front case and heat sink of the virtual reality device, and the front case is made of heat-conducting materials, and a heat sink is installed between the inner wall of the front case and the main board. Thermal diffusion film, the thermal diffusion film contacts the processing chip and power management circuit of the main board, quickly conducts the heat generated by its work to the front case, and finally dissipates it to the external environment through the front case, so as to solve the problem of easy heating of the processing chip and power management circuit area. The problem of damage due to excessive temperature has realized the heat dissipation and cooling of virtual reality equipment. Moreover, using the front shell as the heat sink of the virtual reality device also avoids the weight problem caused by the additional heat sink, which is conducive to lightweight design and improves the wearing experience. In a preferred embodiment, the virtual reality device is also provided with an airflow channel for further cooling down, so that the temperature of the virtual reality device can be controlled more effectively.

The above descriptions are only specific implementations of the present invention. Under the above teaching of the present invention, those skilled in the art can make other improvements or modifications on the basis of the above embodiments. Those skilled in the art should understand that the above specific description is only to better explain the object of the present invention, and the protection scope of the present invention should be determined by the protection scope of the claims.

Claims (10)

1. a kind of virtual reality device, including front housing, and the mainboard on the inside of the front housing is set, which is characterized in that it is described Front housing is made of heat-conducting, and processing chip and electric power management circuit, the inner wall of the front housing are provided on front side of the mainboard Be provided with thermal diffusion film between the mainboard, the thermal diffusion film respectively with the front housing, the processing chip and the electricity Power management circuits contact.

2. virtual reality device according to claim 1, which is characterized in that the surface of the front housing does not set trepanning.

3. virtual reality device according to claim 1, which is characterized in that the surface of the front housing offers lightening hole.

4. virtual reality device according to claim 1, which is characterized in that the inner wall of the front housing is transversely equal with longitudinal direction It is provided with reinforcing rib.

5. virtual reality device according to claim 1, which is characterized in that the outside of the front housing coats flexible material Material.

6. virtual reality device according to claim 1, which is characterized in that the virtual reality device further includes middle shell, It is equipped with the first gap between the middle shell and the front housing and forms the first gas channel.

7. virtual reality device according to claim 6, which is characterized in that the virtual reality device further include rear shell and Lens cone frame is equipped with the second gap and forms the second gas channel between the rear shell and the lens cone frame.

8. virtual reality device according to claim 7, which is characterized in that first gap and second gap Width is 0.5-1.5mm.

9. virtual reality device according to claim 1, which is characterized in that the front housing is magnesium alloy material.

10. virtual reality device according to claim 1, which is characterized in that the virtual reality device is virtual reality The helmet or virtual reality glasses.