CN109449117A - Fixture is used in a kind of encapsulation of thick film hybrid integrated circuit - Google Patents
Fixture is used in a kind of encapsulation of thick film hybrid integrated circuit Download PDFInfo
- Publication number
- CN109449117A CN109449117A CN201811348453.8A CN201811348453A CN109449117A CN 109449117 A CN109449117 A CN 109449117A CN 201811348453 A CN201811348453 A CN 201811348453A CN 109449117 A CN109449117 A CN 109449117A
- Authority
- CN
- China
- Prior art keywords
- fixture
- sliding slot
- thick film
- slide bar
- hybrid integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Coating Apparatus (AREA)
Abstract
A kind of thick film hybrid integrated circuit encapsulation fixture, it is by bracket (1), slide bar (2), one group of fixture (3) and two limited block (4) compositions, 1 both ends of bracket have sliding slot (1-1) and sliding slot (1-2), the both ends of slide bar (2) pass through bolt respectively and are movably arranged in the sliding slot of bracket 1, one group of fixture (3) is movably arranged on slide bar (2), two limited blocks (4) are movably arranged on respectively in the sliding slot (1-1) and sliding slot (1-2) of bracket 1, there are also hand draw ring (5) for it, hand draw ring (5) is installed on slide bar (2).The invention has the advantages that the fixture using thick film hybrid integrated circuit can disposably pick up multiple thick film hybrid integrated circuits, the time is saved, is improved work efficiency.
Description
Technical field
The present invention relates to thick film hybrid integrated circuit processing equipments.
Background technique
Currently, needing manually to pass through fixture during the surface containment of thick film hybrid integrated circuit for thick film and mixing collection
Picked up at circuit, then will thick film hybrid integrated circuit immerse configuration encapsulating liquid in, then take out thick film hybrid integrated circuit into
Row dries, disadvantage is that needing manually to pick up thick film hybrid integrated circuit by fixture, effect is low, time-consuming to take
Power.
Summary of the invention
It needs manually to pick up thick film hybrid integrated circuit by fixture the purpose of the present invention is to current, effect
It is low, time-consuming laborious deficiency and a kind of thick film hybrid integrated circuit encapsulation fixture is provided.
The present invention is made of bracket, slide bar, one group of fixture and two limited blocks, and bracket both ends have sliding slot and cunning
Slot, the both ends of slide bar pass through bolt respectively and are movably arranged in the sliding slot of bracket, and one group of fixture is movably arranged on slide bar, and two
Limited block is movably arranged on respectively in the sliding slot and sliding slot of bracket, and there are also hand draw ring, hand draw rings to install on slide bar for it.
The invention has the advantages that the fixture using thick film hybrid integrated circuit can disposably pick up multiple thick-film hybrid integrations
Circuit saves the time, improves work efficiency.
Detailed description of the invention
Attached drawing 1 is schematic structural view of the invention.
Specific embodiment
As shown in Figure 1, the present invention is by 2, one groups of bracket 1, slide bar
Fixture 3 and two limited blocks 4 form, and 1 both ends of bracket have sliding slot 1-1 and sliding slot 1-2, the both ends difference of slide bar 2
It is movably arranged on by bolt in the sliding slot of bracket 1, one group of fixture 3 is movably arranged on slide bar 2, and two limited blocks 4 are lived respectively
Dynamic to be mounted in the sliding slot 1-1 and sliding slot 1-2 of bracket 1, there are also hand draw ring 5, hand draw rings 5 to install on slide bar 2 for it.
Usage mode: in use, needing manually to be clipped in the foot of thick film hybrid integrated circuit on fixture respectively, then slide bar is loosened
Slide bar 2 is moved downward to limited block by pulling hand draw ring, at this time thick film hybrid integrated circuit by the bolt at 2 both ends along the chute
Except in the encapsulating liquid for being immersed in configuration, the foot of thick film hybrid integrated circuit is located at outside encapsulating liquid.It then will be by bracelet by slide bar 2
It moves up, so that thick film hybrid integrated circuit is detached from encapsulating liquid level, then the bolt by tightening 2 both ends of slide bar, it is another to remove fixture
It sets and dries, new fixture is changed on slide bar.
Claims (2)
1. a kind of thick film hybrid integrated circuit encapsulation fixture, it is characterised in that it is by bracket (1), slide bar (2), one group of fixture
(3) and two limited block (4) compositions, 1 both ends of bracket have sliding slot (1-1) and sliding slot (1-2), the both ends point of slide bar (2)
It is not movably arranged on by bolt in the sliding slot of bracket 1, one group of fixture (3) is movably arranged on slide bar (2), two limited blocks
(4) it is movably arranged on respectively in the sliding slot (1-1) and sliding slot (1-2) of bracket 1.
2. a kind of thick film hybrid integrated circuit encapsulation fixture according to claim 1, it is characterised in that it is also pulled
Ring (5), hand draw ring (5) are installed on slide bar (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811348453.8A CN109449117A (en) | 2018-11-13 | 2018-11-13 | Fixture is used in a kind of encapsulation of thick film hybrid integrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811348453.8A CN109449117A (en) | 2018-11-13 | 2018-11-13 | Fixture is used in a kind of encapsulation of thick film hybrid integrated circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109449117A true CN109449117A (en) | 2019-03-08 |
Family
ID=65552198
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811348453.8A Withdrawn CN109449117A (en) | 2018-11-13 | 2018-11-13 | Fixture is used in a kind of encapsulation of thick film hybrid integrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109449117A (en) |
-
2018
- 2018-11-13 CN CN201811348453.8A patent/CN109449117A/en not_active Withdrawn
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20190308 |
|
| WW01 | Invention patent application withdrawn after publication |