CN109448885A - A kind of YH21CT stainless steel thick film circuit resistance slurry and preparation method thereof - Google Patents
A kind of YH21CT stainless steel thick film circuit resistance slurry and preparation method thereof Download PDFInfo
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- CN109448885A CN109448885A CN201811344745.4A CN201811344745A CN109448885A CN 109448885 A CN109448885 A CN 109448885A CN 201811344745 A CN201811344745 A CN 201811344745A CN 109448885 A CN109448885 A CN 109448885A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/14—Conductive material dispersed in non-conductive inorganic material
- H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C10/00—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition
- C03C10/0009—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition containing silica as main constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/003—Thick film resistors
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Abstract
A kind of YH21CT stainless steel thick film circuit resistance slurry and preparation method thereof, it includes that weight percent is 86%~90% solid-phase component and 10%~14% organic binder；The solid-phase component includes that weight percent is 70%~90% tungsten palladium composite powder and 10%~30% SiO2‑BaO‑Al2O3‑CaO‑ZrO2‑H3BO3Microcrystalline glass in series powder, tungsten palladium composite powder include that weight percent is 8%~25% tungsten powder and 75%~92% palladium powder, and the partial size of tungsten powder and palladium powder is respectively less than 1.5 μm；The SiO2‑BaO‑Al2O3‑CaO‑ZrO2‑H3BO3Microcrystalline glass in series powder raw material includes the SiO that weight percent is 30%~80%2, 2%~20% BaO, 6%~40% Al2O3, 20%~60% CaO, 2%~20% H3BO3, 2%~15% ZrO2；The organic binder raw material includes that weight percent is 60%~82% tributyl citrate, 0.2%~10% rilanit special, 1%~15% NC Nitroncellulose, 3%~30% terpinol, 1%~18% Span -85,0.2%~10% 4. gamma-butyrolactons.Preparation step includes: to prepare microcrystalline glass powder, tungsten palladium composite powder, organic binder, resistance slurry.
Description
Technical field
The present invention relates to a kind of thick film circuit resistance slurry, in particular to a kind of YH21CT stainless steel thick film circuit electricity consumption
Resistance paste and preparation method thereof.
Technical background
In thick film circuit technique field, traditional substrate has polymer and ceramic substrate, matched series electronic
Slurry is commercialized already, but the two has its limitation.Polymeric substrates thermal conductivity is low, and the coefficient of expansion is high, and high temperature is greater than 100 DEG C
When stability it is poor.Ceramic substrate includes Al2O3And AIN etc., size is smaller, generally no greater than 100mm2×100mm2, and it is mechanical
Performance is poor, and complete machine assembling is difficult.
Summary of the invention
It is high and adjustable the purpose of the present invention is to provide a kind of sheet resistance, temperature-coefficient of electrical resistance is higher and adjustable, printing characteristic
And sintering characteristic is excellent and the resistance slurry and preparation method thereof that mutually matches with YH21CT stainless steel substrate.
One of in order to achieve the above objectives, the present invention uses following technical proposal: a kind of YH21CT stainless steel thick film circuit use
Resistance slurry, it includes that weight percent is 86%~90% solid-phase component and 10%~14% organic binder；It is described
Solid-phase component include weight percent be 70%~90% tungsten palladium composite powder and 10%~30% SiO2-BaO-Al2O3-
CaO-ZrO2-H3BO3Microcrystalline glass in series powder, tungsten palladium composite powder include weight percent be 8%~25% tungsten powder and 75%~
The partial size of 92% palladium powder, tungsten powder and palladium powder is respectively less than 1.5 μm；The SiO2-BaO-Al2O3-CaO-ZrO2-H3BO3It is micro-
Crystal glass powder raw material includes the SiO that weight percent is 30%~80%2, 2%~20% BaO, 6%~40% Al2O3、
20%~60% CaO, 2%~20% H3BO3, 2%~15% ZrO2；The organic binder raw material includes weight
Percentage be 60%~82% tributyl citrate, 0.2%~10% rilanit special, 1%~15% nitrocellulose
Element, 3%~30% terpinol, 1%~18% Span -85,0.2%~10% 4. gamma-butyrolactons.
In order to achieve the above objectives two, the present invention uses following technical proposal, a kind of YH21CT stainless steel thick film circuit use
Resistance slurry preparation method, includes the following steps:
A, SiO is prepared2-BaO-Al2O3-CaO-ZrO2-H3BO3Microcrystalline glass in series powder: being by weight percentage 30%~80%
SiO2, 2%~20% BaO, 6%~40% Al2O3, 20%~60% CaO, 2%~20% H3BO3, 2%~
15% ZrO2, it is put into melting in high-temperature electric resistance furnace after mixing in batch mixer, smelting temperature is 1400~1800 DEG C, heat preservation
Time is 1~3 hour, then carries out water quenching, obtains glass dregs, the micro- slag of glass is put into ball mill and is ground, grain is obtained
Diameter is not more than 3 microns of micro mist；
B, tungsten palladium composite powder is prepared: the tungsten powder and palladium powder for selecting granularity less than 2 μm, the tungsten for being 8%~25% by weight percent
Powder and 75%~92% palladium powder are poured into batch mixer and are uniformly mixed, and tungsten palladium composite powder required for being mixed to prepare is spare；
C, it prepares organic binder: being 60%~82% tributyl citrate, 0.2%~10% hydrogenation by weight percent
Castor oil, 1%~15% NC Nitroncellulose, 3%~30% terpinol, 1%~18% Span -85,0.2%~10%
4. γ-butyrolactone pour into power mixer, in 80 DEG C~100 DEG C dissolution a few hours, adjust NC Nitroncellulose, citric acid
Tributyl content makes the control of organic binder viscosity within the scope of 300Pas~400mPas.
D, it prepares resistance slurry: being 70%~90% tungsten palladium composite powder and 10%~30% SiO by weight percent2-
BaO-Al2O3-CaO-ZrO2-H3BO3Microcrystalline glass in series powder is poured into batch mixer and is uniformly mixed, and obtains solid-phase component；Again by weight
Percentage is that 86%~90% solid-phase component and 10%~14% organic binder are put into stirring dispersion machine and stir evenly
Afterwards, rolling to get resistance slurry is arrived for three rollers bundle machine is carried out again after mixing evenly；Test resistance slurry viscosity is tested in 65RPM
Under the conditions of, range of viscosities is 150Pas~200Pas, error ± 10Pas.
Compared with prior art, the present invention having following good effect:
1, YH21CT stainless steel not only has the advantages that general stainless steel, also has the characteristics that below better than general stainless steel: adding
It is hot uniformly, high effective heat-storage, physics is viscous, totally nontoxic, energy-saving and environmental protection, durable.Substrate made of YH21CT stainless steel,
It is more durable, environmentally friendly, it matches with the dielectric paste coefficient of expansion of the invention, more preferably, bonding is securely, safe for adhesive property
Reliably.YH21CT stainless steel thermal conductivity ratio SUS304 stainless steel is high by 30%, faster than SUS304 stainless steel heating speed, more supernumerary segment
Energy.
2, pass through the basic demands such as physical and chemical performance to YH21CT stainless steel thick film circuit resistance slurry and preparation method
Reasonable analysis, select high-precision devitrified glass as binder.By to SiO2-BaO-Al2O3-CaO-ZrO2-H3BO3It is micro-
The system researches such as the crystal glass coefficient of expansion, glass melting temperature, softening temperature, the big dynamics of crystallite forming core, determine devitrified glass
Formula and melting, ball milling production method and technique are allowed to swollen with the compound composition resistor track layer of the precious metal powder of proper proportion
Swollen coefficient matches with YH21CT stainless steel substrate and has good binding performance.
3, based on the reasonable understanding to organic principle mechanism of action each in slurry, multicomponent alcohol and esters main solvent is selected to replace passing
System one pack system alcohols main solvent, by the main solvent of different boiling and evaporation rate, reasonable disposition makes slurry in printing, baking in proportion
The defects of equilibrium is volatilized during dry, sintering etc., and solvent is avoided to concentrate cracked volatilization, cracking, pin hole.
5, it selects NC Nitroncellulose as thixotropic agent, forms good film bulk structure in organic binder system, have slurry
There is the excellent heavy effect of thixotropy and side.
6, resistance slurry printing characteristic of the invention and sintering characteristic are excellent, due to the resistance track of resistance slurry of the present invention preparation
Layer has sheet resistance high and adjustable, and temperature-coefficient of electrical resistance is high and adjustable, at low cost, and has and YH21CT stainless steel substrate thick film electricity
The advantages that road dielectric paste, electrocondution slurry are mutually compatible with.
Specific embodiment
Embodiment 1:
A kind of YH21CT stainless steel thick film circuit resistance slurry:
1, microcrystalline glass formula: SiO2(35%), BaO (8%), Al2O3(15%), CaO (26%), ZrO2(6%), H3BO3
(10%).
2,1550 DEG C, 2~3 hours devitrified glass smelting technology: are kept the temperature.
3, devitrified glass Powder Particle Size controls: being roughly ground with vibrator, is then finely ground to planetary ball mill or agitating ball mill
The largest particles is no more than 3 microns.
4, tungsten palladium composite powder formula and mixing: 8% tungsten powder and 92% palladium powder, powder the largest particles is less than 1.5 microns.It pours into
It is uniformly mixed in batch mixer, tungsten palladium composite powder required for being mixed to prepare is spare.
5, organic adhesive agent prescription and dissolution process: tributyl citrate (80%), rilanit special (1%), NC Nitroncellulose
(2.5%), terpinol (15%), Span -85 (1%), 4. gamma-butyrolactons (0.5%) pour into power mixer mix after
3~4 hours are kept the temperature in high temperature (85 DEG C~95 DEG C) water-bath.
6, it sizes mixing and expects technique: 70% tungsten palladium composite powder and 30% microcrystalline glass powder being poured into batch mixer and are uniformly mixed, is obtained
To solid-phase component；The organic binder of 90% solid-phase component and 10% is put into stirring dispersion machine after mixing evenly again, is stirred
Rolling to get resistance slurry is arrived for three rollers bundle machine is carried out after mixing uniformly again.
7, resistance slurry performance
Sheet resistance: 200 ± 10m Ω/
Temperature-coefficient of electrical resistance: 2100 ± 200 × 10-6/℃
Viscosity: under 30RPM test condition, 300Pas ± 10Pas
Embodiment 2:
A kind of YH21CT stainless steel thick film circuit resistance slurry:
1, microcrystalline glass formula: SiO2(33%), BaO (9%), Al2O3(16%), CaO (28%), ZrO2(5%), H3BO3
(9%).
2,1550 DEG C, 2~3 hours devitrified glass smelting technology: are kept the temperature.
3, devitrified glass Powder Particle Size controls: being roughly ground with vibrator, is then finely ground to planetary ball mill or agitating ball mill
The largest particles is no more than 3 microns.
4, tungsten palladium composite powder formula and mixing: 25% tungsten powder and 75% palladium powder, powder the largest particles is less than 1.5 microns.?
Enter in batch mixer and be uniformly mixed, tungsten palladium composite powder required for being mixed to prepare is spare.
5, organic adhesive agent prescription and dissolution process: tributyl citrate (76%), rilanit special (1.5%), nitrocellulose
Plain (3.5%), terpinol (17%), Span -85 (1.5%), 4. gamma-butyrolactons (0.5%) are poured into power mixer and are mixed
3~4 hours are kept the temperature in high temperature (85 DEG C~95 DEG C) water-bath afterwards.
6, it sizes mixing and expects technique: 90% tungsten palladium composite powder and 10% microcrystalline glass powder being poured into batch mixer and are uniformly mixed, is obtained
To solid-phase component；The organic binder of 86% solid-phase component and 14% is put into stirring dispersion machine after mixing evenly again, is stirred
Rolling to get resistance slurry is arrived for three rollers bundle machine is carried out after mixing uniformly again.
7, resistance slurry performance
Sheet resistance: 200 ± 10m Ω/
Temperature-coefficient of electrical resistance: 500 ± 50 × 10-6/℃
Viscosity: under 30RPM test condition, 300Pas ± 10Pas.
Claims (2)
1. a kind of YH21CT stainless steel thick film circuit resistance slurry, it is characterized in that: it include weight percent be 86%~
90% solid-phase component and 10%~14% organic binder；The solid-phase component include weight percent be 70%~
90% tungsten palladium composite powder and 10%~30% SiO2-BaO-Al2O3-CaO-ZrO2-H3BO3Microcrystalline glass in series powder, tungsten palladium are multiple
It is 8%~25% tungsten powder and 75%~92% palladium powder that close powder, which include weight percent, and the partial size of tungsten powder and palladium powder is respectively less than
1.5μm；The SiO2-BaO-Al2O3-CaO-ZrO2-H3BO3Microcrystalline glass in series powder raw material include weight percent be 30%~
80% SiO2, 2%~20% BaO, 6%~40% Al2O3, 20%~60% CaO, 2%~20% H3BO3, 2%
~15% ZrO2；The organic binder raw material include weight percent be 60%~82% tributyl citrate,
0.2%~10% rilanit special, 1%~15% NC Nitroncellulose, 3%~30% terpinol, 1%~18% department
4. gamma-butyrolactons of class -85,0.2%~10%.
2. a kind of YH21CT stainless steel thick film circuit resistance slurry preparation method, it is characterized in that: including the following steps:
A, SiO is prepared2-BaO-Al2O3-CaO-ZrO2-H3BO3Microcrystalline glass in series powder: being by weight percentage 30%~80%
SiO2, 2%~20% BaO, 6%~40% Al2O3, 20%~60% CaO, 2%~20% H3BO3, 2%~15%
ZrO2, it is put into melting in high-temperature electric resistance furnace after mixing in batch mixer, smelting temperature is 1400~1800 DEG C, soaking time
It is 1~3 hour, then carries out water quenching, obtain glass dregs, the micro- slag of glass is put into ball mill and is ground, obtains partial size not
Micro mist greater than 3 microns；
B, tungsten palladium composite powder is prepared: the tungsten powder and palladium powder for selecting granularity less than 2 μm, the tungsten for being 8%~25% by weight percent
Powder and 75%~92% palladium powder are poured into batch mixer and are uniformly mixed, and tungsten palladium composite powder required for being mixed to prepare is spare；
C, it prepares organic binder: being 60%~82% tributyl citrate, 0.2%~10% hydrogenation by weight percent
Castor oil, 1%~15% NC Nitroncellulose, 3%~30% terpinol, 1%~18% Span -85,0.2%~10%
4. gamma-butyrolactons pour into power mixer, in 80 DEG C~100 DEG C dissolution a few hours, adjust NC Nitroncellulose, citric acid three
Butyl ester content makes the control of organic binder viscosity within the scope of 300Pas~400mPas.
D, it prepares resistance slurry: being 70%~90% tungsten palladium composite powder and 10%~30% SiO by weight percent2-BaO-
Al2O3-CaO-ZrO2-H3BO3Microcrystalline glass in series powder is poured into batch mixer and is uniformly mixed, and obtains solid-phase component；Again by weight percent
Than for 86%~90% solid-phase component and 10%~14% organic binder be put into stirring dispersion machine after mixing evenly, stir
Rolling to get resistance slurry is arrived for three rollers bundle machine is carried out after mixing uniformly again；Test resistance slurry viscosity, in 65RPM test condition
Under, range of viscosities is 150Pas~200Pas, error ± 10Pas.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110880376A (en) * | 2019-12-18 | 2020-03-13 | 广东顺德弘暻电子有限公司 | Thick film dielectric paste with high thermal expansion coefficient for stainless steel base material and preparation method thereof |
| CN112447311A (en) * | 2019-09-03 | 2021-03-05 | 泰阳电子(东莞)有限公司 | Preparation method of microcrystalline glass resistance paste |
| EP4289297A4 (en) * | 2021-02-02 | 2024-04-03 | Shenzhen Smoore Technology Ltd | Heating component and electronic atomizing device |
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2018
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|---|---|---|---|---|
| JPS63217607A (en) * | 1987-03-06 | 1988-09-09 | Toshiba Corp | Superconducting magnet |
| JPH11251105A (en) * | 1998-03-04 | 1999-09-17 | Sumitomo Metal Electronics Devices Inc | Thick-film resistance paste and its manufacture |
| CN1424727A (en) * | 2002-12-30 | 2003-06-18 | 中国人民解放军国防科学技术大学 | Resistance sizing agent and its producing process for high-power thick-film circuit based on stainless steel substrate |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112447311A (en) * | 2019-09-03 | 2021-03-05 | 泰阳电子(东莞)有限公司 | Preparation method of microcrystalline glass resistance paste |
| CN110880376A (en) * | 2019-12-18 | 2020-03-13 | 广东顺德弘暻电子有限公司 | Thick film dielectric paste with high thermal expansion coefficient for stainless steel base material and preparation method thereof |
| EP4289297A4 (en) * | 2021-02-02 | 2024-04-03 | Shenzhen Smoore Technology Ltd | Heating component and electronic atomizing device |
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Application publication date: 20190308 |