CN109444651B - Monitoring method and system for secondary circuit - Google Patents
Monitoring method and system for secondary circuit Download PDFInfo
- Publication number
- CN109444651B CN109444651B CN201811631860.XA CN201811631860A CN109444651B CN 109444651 B CN109444651 B CN 109444651B CN 201811631860 A CN201811631860 A CN 201811631860A CN 109444651 B CN109444651 B CN 109444651B
- Authority
- CN
- China
- Prior art keywords
- voltage
- loop
- test
- current
- secondary circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/50—Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/08—Locating faults in cables, transmission lines, or networks
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Monitoring And Testing Of Transmission In General (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
Abstract
The application provides a monitoring method and a system for a secondary circuit, wherein the monitoring method comprises the steps of loading a dwg format electric power wiring diagram file into an information computing and processing system; generating a loop monitoring picture according to the dwg format electric power wiring diagram file; when the system is set to be in a monitoring mode, generating a monitoring picture according to the acquired voltage and current signals; the monitoring picture is convenient for workers to monitor the operation condition of the secondary loop at any time; when the system is set to a test mode, real-time graphic scanning and resistance testing are carried out on the test loop according to the voltage and current signals, wherein the real-time graphic scanning can detect whether the actual connecting line of the secondary loop is consistent with the graphic information, and the resistance testing can check whether each secondary loop has a fault according to the size of the resistance.
Description
Technical Field
The present application relates to the field of power systems, and in particular, to a monitoring method and system for a secondary circuit.
Background
The secondary equipment is suitable for low-voltage electrical equipment for detecting, controlling, measuring, adjusting and protecting the working conditions of an electric power system and primary equipment, and comprises a measuring instrument, a control and running condition monitoring signal and automatic monitoring system of the primary equipment, a relay protection and safety automatic device, communication equipment and the like, wherein electrical loops formed by connecting the secondary equipment together according to certain functional requirements are collectively called as secondary loops, and the secondary loops are indispensable important components for ensuring safe production, economic running and reliable power supply of the electric power system.
Secondary wiring is complicated due to various types of secondary equipment, the wiring of a terminal block in a protection control panel cabinet is hundreds of thousands, secondary circuits are prone to failure, basic failure types of the secondary circuits are not consistent as shown in the drawings, namely actual wiring is not consistent with the drawing numbers or positions due to the fact that specific installation conditions or equipment signals are not considered in the design; breaking the secondary circuit; the secondary circuit is grounded and short-circuited, and the secondary circuit is in mixed connection.
Once some secondary circuits have faults, it is very difficult for workers to find the faults in a short time, secondary wiring forms vary widely, wiring is dense, and it is time-consuming and laborious to find the faults one by one, so a quick and accurate monitoring method and system for the secondary circuits are urgently needed.
Disclosure of Invention
The application provides a monitoring method and a monitoring system for a secondary circuit, which can record the working condition of the secondary circuit during normal work and can be used for detection when the secondary circuit breaks down.
In order to solve the technical problem, the embodiment of the application discloses the following technical scheme:
the application provides a monitoring method for a secondary circuit, the method comprising:
connecting a voltage and current signal acquisition line with a secondary circuit to be monitored;
defining the secondary circuit to be monitored, and loading a dwg format electric power wiring diagram file into an information computing processing system;
generating a loop monitoring picture according to the dwg format electric power wiring diagram file;
when the system is set to be in a monitoring mode, the voltage channel and the current channel are respectively switched to the multiple voltage and current acquisition modules to acquire current and voltage signals;
transmitting the acquired voltage and current signals to an information computing and processing system after analog-to-digital conversion to generate a monitoring picture;
when the system is set to a test mode, the voltage channel and the current channel are respectively switched to the multiple voltage and current acquisition modules to acquire voltage and current signals;
and selecting a test loop from the loop monitoring picture, and carrying out real-time graphic scanning and resistance test on the test loop according to the voltage and current signals.
Preferably, the defining the secondary circuit to be monitored includes:
and defining the secondary circuit to be monitored according to the terminal strip information and the circuit number of the secondary circuit to be monitored.
Preferably, the performing a real scan on the test loop includes:
selecting a test loop from a loop monitoring picture;
respectively switching the voltage channel and the current channel to a multi-path voltage and current acquisition module to acquire voltage and current signals;
judging whether the test loop meets the test condition or not according to the voltage and current signals;
when the test loop meets the test condition, selecting one node as a signal source point, and setting the rest nodes as test points;
short-circuiting the test points and the signal source point through a protection resistor to form a loop, and recording voltage and current signals of the test points;
acquiring an actual topological structure of the test loop according to the voltage and current signals;
and comparing the actual topological structure with the dwg format power wiring diagram file, if the actual topological structure and the dwg format power wiring diagram file have access, the test circuit diagram is actually inconsistent, and if the actual topological structure and the dwg format power wiring diagram file are consistent, the test circuit diagram is actually consistent.
Preferably, the determining whether the test loop satisfies the test condition according to the voltage and current signals includes:
when U is turnedi0 and IiWhen 0, the test loop satisfies a test condition, where UiAnd IiRespectively, the voltage and current at each node of the terminal block of the test loop.
Preferably, the resistance testing the test loop includes:
selecting a test loop from a loop monitoring picture;
respectively switching the voltage channel and the current channel to a multi-path voltage and current acquisition module to acquire voltage and current signals;
judging whether the test loop meets the test condition or not according to the voltage and current signals;
when the test loop meets the test condition, selecting one node as a signal source point, and setting the rest nodes as test points;
short-circuiting the test points and the signal source point through a protection resistor to form a loop, and recording voltage and current signals of the test points;
acquiring each secondary loop resistor Rmn and the secondary loop ground resistor R according to the voltage and current signalsGmn；
According to the secondary loop resistance Rmn and the secondary loop ground resistance RGmn judging whether the test loop has a fault.
Preferably, the obtaining of each secondary loop resistance Rmn and the secondary loop ground resistance R according to the voltage and current signalsGmn comprises:
according to
Obtaining each secondary loop resistance Rmn, wherein UFIs the voltage of the power supply point, ImnIs the current between the signal source and the test node, ReTo protect the resistance;
according to
Obtaining the resistance R of each secondary loop to groundGmn, wherein, ImnFor the current between the signal source and the test node, EFTo ground potential.
Preferably, the secondary loop resistance Rmn and the secondary loop ground resistance R are determined according to the currentGmn judging whether the test loop has a fault comprises:
when the second isThe resistance of the secondary loop Rmn is more than RsetmnAnd R isGmn＜RsetGmnIf not, the test loop is in normal operation, wherein RsetmnTake 0.5 omega, RsetGmnTake 10M Ω.
The present application further provides a monitoring system for a secondary circuit, and a monitoring method for the secondary circuit, including:
the voltage and current signal acquisition line is used for connecting the monitoring system for the secondary circuit into the secondary circuit to be monitored;
the channel conversion module is used for switching a voltage channel or a current channel;
the multi-path voltage and current acquisition module is used for acquiring multi-path voltage and current signals;
the signal output module is used for transmitting voltage and current signals to the secondary circuit to be monitored;
the measurement and control subsystem is used for monitoring voltage and current signals of each secondary loop;
the information calculation processing system is used for processing the acquired voltage and current signals to generate a monitoring picture;
the power supply module is used for providing power supply for the monitoring system for the secondary loop;
the data analysis and storage subsystem is used for carrying out real-time graphic scanning and resistance test analysis according to the voltage and current signals;
the external computer is used for reading data and setting the working mode of the monitoring system for the secondary loop;
and the interconnection communication subsystem is used for interconnecting and communicating the voltage and current signal acquisition line, the channel conversion module, the multi-path voltage and current acquisition module, the signal output module, the measurement and control subsystem, the information calculation processing system, the power supply module, the data analysis and storage subsystem and the external computer.
Compared with the prior art, the beneficial effect of this application is:
the application provides a monitoring method and a system for a secondary circuit, wherein the method comprises the following steps: connecting a voltage and current signal acquisition line with a secondary circuit to be monitored; defining the secondary circuit to be monitored, and loading a dwg format electric power wiring diagram file into an information computing processing system; generating a loop monitoring picture according to the dwg format electric power wiring diagram file; when the system is set to be in a monitoring mode, the voltage channel and the current channel are respectively switched to the multiple voltage and current acquisition modules to acquire current and voltage signals; transmitting the acquired voltage and current signals to an information computing and processing system after analog-to-digital conversion to generate a monitoring picture; when the system is set to a test mode, the voltage channel and the current channel are respectively switched to the multiple voltage and current acquisition modules to acquire voltage and current signals; and selecting a test loop from the loop monitoring picture, and carrying out real-time graphic scanning and resistance test on the test loop according to the voltage and current signals. The method mainly comprises the steps of monitoring the working condition of the secondary circuit during normal operation and testing and troubleshooting faults of the secondary circuit during faults, wherein when the working mode of a test system is set to be the monitoring mode, a monitoring picture is generated through collected voltage and current signals, and the monitoring picture mainly comprises a connection topological graph of the secondary circuit and information of each terminal node, so that a worker can conveniently monitor the operation working condition of the secondary circuit at any time; when the working mode of the test system is set to be the test mode, real-time graph scanning and resistance testing are carried out on the test loop according to the voltage and current signals, wherein the real-time graph scanning can detect whether the actual connecting line of the secondary loop is consistent with the graph information, and the resistance testing can check whether each secondary loop fails according to the size of the resistance.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.
Drawings
In order to more clearly explain the technical solution of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious to those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic flow chart of a monitoring method for a secondary circuit according to an embodiment of the present invention;
fig. 2 is a schematic topology diagram of a monitoring system for a secondary circuit according to an embodiment of the present invention;
fig. 3 is an application diagram of a monitoring method for a secondary circuit according to an embodiment of the present invention;
fig. 4 is an application diagram of a monitoring method for a secondary circuit according to an embodiment of the present invention.
Description of reference numerals: the system comprises a 1-voltage and current signal acquisition line, a 2-channel conversion module, a 3-multi-channel voltage and current acquisition module, a 4-signal output module, a 5-measurement and control subsystem, a 6-information calculation and processing system, a 7-power module, an 8-data analysis and storage subsystem, a 9-external computer and a 10-interconnection communication subsystem.
Detailed Description
In order to make those skilled in the art better understand the technical solutions in the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The present application provides a monitoring method for a secondary circuit, and specifically, referring to fig. 1, fig. 1 is a schematic flow chart of the monitoring method for the secondary circuit according to an embodiment of the present invention; the method comprises the following steps:
s01: and connecting the voltage and current signal acquisition line with a secondary circuit to be monitored.
The voltage and current signal acquisition line is connected with the secondary circuit to be monitored, so that the voltage and current signal acquisition line is connected into the secondary circuit, the acquisition of subsequent voltage and current signals is facilitated, and the working condition of the secondary circuit can be analyzed according to the voltage and current signals.
S02: and defining the secondary circuit to be monitored, and loading a dwg format electric power wiring diagram file into an information computing processing system.
Specifically, the secondary circuit to be monitored is defined according to the terminal strip information and the circuit number of the secondary circuit to be monitored.
S03: and generating a loop monitoring picture according to the dwg format power wiring diagram file.
The specific method for generating the monitoring picture comprises the following steps: performing feature modeling according to the dwg format electric power wiring diagram file to form a feature database; converting the dwg format electric power wiring diagram file into a picture file of an electric power wiring diagram; carrying out feature identification on a picture file of the electric power wiring diagram; describing a terminal wiring information model of the power wiring diagram according to the result of the feature identification and the feature database; identifying a terminal line information model of the power wiring diagram; and generating a loop monitoring picture according to the recognition result of the terminal wiring information model of the multi-electric-power wiring diagram.
S04: when the system is set to be in a monitoring mode, the voltage channel and the current channel are respectively switched to the multiple voltage and current acquisition modules to acquire current and voltage signals.
And manually issuing control appointments to the external computer to set the system into a monitoring mode.
The collected voltage and current signals are mapped to the loop pictures in the monitoring mode, so that the real-time dynamic observation of workers is facilitated, and the change conditions of each secondary loop in the monitoring mode can be recorded according to the time sequence to generate corresponding events.
The voltage channel is connected with the corresponding voltage acquisition module to acquire voltage signals, and the current channel is connected with the corresponding current acquisition module to acquire current signals.
S05: and transmitting the acquired voltage and current signals to an information computing and processing system after analog-to-digital conversion to generate a monitoring picture.
The voltage and current analog quantity is converted into digital quantity through analog-to-digital conversion of the multi-path voltage and current acquisition module, and the voltage and current signals of the digital quantity are received by the calculation processing system, recorded in real time and displayed in the loop monitoring picture obtained in S03 to generate a monitoring picture. The monitoring picture mainly comprises a connection topological graph of the secondary circuit and information of each terminal node, and working personnel can conveniently monitor the operation condition of the secondary circuit at any time. Usually, the terminal strip is used as a demarcation point, the voltages and currents of different secondary circuits in normal operation are different, some secondary circuits have no charged points, some secondary circuits have direct currents, and the voltages and the currents are different, so that the data can be changed correspondingly according to the working conditions of the different secondary circuits.
S06: when the system is set to a test mode, the voltage channel and the current channel are respectively switched to the multiple voltage and current acquisition modules to acquire voltage and current signals.
Similarly, the voltage channel is connected with the corresponding voltage acquisition module to acquire voltage signals, and the current channel is connected with the corresponding current acquisition module to acquire current signals.
When the test mode is selected, the test loop should be isolated from other devices and secondary devices, and the system checks the secondary loop according to the test items after safety measures are taken.
S07: and selecting a test loop from the loop monitoring picture, and carrying out real-time graphic scanning and resistance test on the test loop according to the voltage and current signals.
Specifically, the performing a real-image scan on the test loop includes:
selecting a test loop from a loop monitoring picture;
respectively switching the voltage channel and the current channel to a multi-path voltage and current acquisition module to acquire voltage and current signals;
judging whether the test loop meets the test condition or not according to the voltage and current signals; when U is turnedi0 and IiWhen 0, the test loop satisfies a test condition, where UiAnd IiThe voltage and the current of each node of the terminal row of the test loop are respectively; satisfaction of this condition indicates that a secondary circuit outage can be performedAnd (6) line selection testing.
When the test loop meets the test condition, determining the wiring and node information associated with the node by injecting a characteristic voltage signal into the secondary loop, selecting one node as a signal source point, and setting the rest nodes as test points;
short-circuiting the test points and the signal source point through a protection resistor to form a loop, and recording voltage and current signals of the test points; the current information includes the magnitude and direction of the current.
Acquiring an actual topological structure of the test loop according to the voltage and current signals;
and comparing the actual topological structure with the dwg format power wiring diagram file, if the actual topological structure and the dwg format power wiring diagram file have access, the test circuit diagram is actually inconsistent, and if the actual topological structure and the dwg format power wiring diagram file are consistent, the test circuit diagram is actually consistent.
Specifically, the resistance testing the test loop includes:
selecting a test loop from a loop monitoring picture;
respectively switching the voltage channel and the current channel to a multi-path voltage and current acquisition module to acquire voltage and current signals;
judging whether the test loop meets the test condition or not according to the voltage and current signals;
when the test loop meets the test condition, selecting one node as a signal source point, and setting the rest nodes as test points;
short-circuiting the test points and the signal source point through a protection resistor to form a loop, and recording voltage and current signals of the test points;
acquiring each secondary loop resistor Rmn and the secondary loop ground resistor R according to the voltage and current signalsGmn; according to
Obtaining each secondary loop resistance Rmn, wherein UFIs the voltage of the power supply point, ImnAs signal sources and testsCurrent between nodes, ReTo protect the resistance;
according to
Obtaining the resistance R of each secondary loop to groundGmn, wherein, ImnFor the current between the signal source and the test node, EFTo ground potential.
According to the secondary loop resistance Rmn and the secondary loop ground resistance RGmn judging whether the test loop has a fault;
when the secondary loop resistance Rmn is more than RsetmnAnd R isGmn＜RsetGmnAnd if not, the test loop is in normal operation. Wherein R issetmnTypically 0.5 Ω, RsetGmnTake 10M Ω.
Reference is made to the GB50150-2016 standards: all terminals of current, voltage, DC control and signal loops are connected together, 1000V megger is used to measure the insulation resistance between loops and to ground, and its resistance value is greater than 10M omega, so R isGmnNormally greater than 10M omega. The sum of the contact resistance, the line resistance and the relay resistance is not more than 0.5 omega in general, namely RmnLess than 0.5 omega.
Example one
In an embodiment of the present invention, referring to fig. 3 and fig. 4 in particular, fig. 3 is one of application schematic diagrams of a monitoring method for a secondary circuit according to an embodiment of the present invention; fig. 4 is an application diagram of a monitoring method for a secondary circuit according to an embodiment of the present invention. As shown in fig. 3, a node 2 is used as a signal source point, nodes 1, 3, 4, 5, 6, and 7 are used as test points, a positive potential is connected to the node 2, and loops are respectively formed with the test points through protection resistors in the following manners: 21. 23, 24, 25, 26, 27, the direction of the current signal should be 2 → 1, 2 → 3 → 4 → 5, 2 → 3 → 6, 2 → 3 → 4 → 7. If the current direction does not accord with the node signal, the graph is judged to be not real. Each loop resistance is
Resistance to ground
(mn is 21, 23, 24, 25, 26, 27).
The method mainly comprises the steps of monitoring the working condition of the secondary circuit during normal operation and testing and troubleshooting faults of the secondary circuit during faults, wherein when the working mode of a test system is set to be the monitoring mode, a monitoring picture is generated through collected voltage and current signals, and the monitoring picture mainly comprises a connection topological graph of the secondary circuit and information of each terminal node, so that a worker can conveniently monitor the operation working condition of the secondary circuit at any time; when the working mode of the test system is set to be the test mode, real-time graph scanning and resistance testing are carried out on the test loop according to the voltage and current signals, wherein the real-time graph scanning can detect whether the actual connecting line of the secondary loop is consistent with the graph information, and the resistance testing can check whether each secondary loop fails according to the size of the resistance.
The present application further provides a monitoring system for a secondary circuit, which is a monitoring method for a secondary circuit, and specifically, refer to fig. 2, which is a schematic view of a topology structure of a monitoring system for a secondary circuit according to an embodiment of the present invention; the system as shown in the figure comprises:
the voltage and current signal acquisition line 1 is used for connecting the monitoring system for the secondary circuit into the secondary circuit to be monitored;
the channel conversion module 2 is used for switching a voltage channel or a current channel; and connecting the monitoring system to the voltage channel to acquire voltage signals, and connecting the monitoring system to the current channel to acquire current signals.
The multi-path voltage and current acquisition module 3 is used for acquiring multi-path voltage and current signals;
the signal output module 4 is used for transmitting voltage and current signals to the secondary circuit to be monitored;
the measurement and control subsystem 5 is used for monitoring voltage and current signals of each secondary loop;
the information calculation processing system 6 is used for processing the acquired voltage and current signals to generate a monitoring picture;
the power module 7 is used for providing power for the monitoring system for the secondary loop;
the data analysis and storage subsystem 8 is used for carrying out real-time graphic scanning and resistance test analysis according to the voltage and current signals;
the external computer 9 is used for reading data and setting the working mode of the monitoring system for the secondary circuit; the manual work can send the instruction of setting for the mode to external computer.
The interconnection communication subsystem 10 is used for interconnecting and communicating the voltage and current signal acquisition line, the channel conversion module, the multi-path voltage and current acquisition module, the signal output module, the measurement and control subsystem, the information calculation processing system, the power supply module, the data analysis and storage subsystem and the external computer; the interconnection between the secondary circuit detection devices is facilitated through a WiFi or 5G technology, and the long-distance complete secondary circuit monitoring is realized.
In addition, for the case that the distance is far away and the tested secondary circuit is long, a multi-device and multi-system interconnection cooperation testing technology can be selected.
Since the above embodiments are all described by referring to and combining with other embodiments, the same portions are provided between different embodiments, and the same and similar portions between the various embodiments in this specification may be referred to each other. And will not be described in detail herein.
Other embodiments of the present application will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure herein. This application is intended to cover any variations, uses, or adaptations of the invention following, in general, the principles of the application and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the application being indicated by the following claims.
The above-described embodiments of the present application do not limit the scope of the present application.
Claims (8)
1. A method of monitoring a secondary circuit, the method comprising:
connecting a voltage and current signal acquisition line with a secondary circuit to be monitored;
defining the secondary circuit to be monitored, and loading a dwg format electric power wiring diagram file into an information computing processing system;
generating a loop monitoring picture according to the dwg format electric power wiring diagram file;
when the system is set to be in a monitoring mode, the voltage channel and the current channel are respectively switched to the multiple voltage and current acquisition modules to acquire current and voltage signals;
transmitting the acquired voltage and current signals to an information computing and processing system after analog-to-digital conversion to generate a monitoring picture;
when the system is set to a test mode, the voltage channel and the current channel are respectively switched to the multiple voltage and current acquisition modules to acquire voltage and current signals;
selecting a test loop from the loop monitoring picture, and carrying out real-graph scanning and resistance testing on the test loop according to voltage and current signals, wherein the real-graph scanning comprises detecting whether an actual topological structure is consistent with a dwg format electric power wiring graph file, and the resistance testing comprises judging whether the test loop has a fault according to a secondary loop resistance and a secondary loop ground resistance.
2. The monitoring method for a secondary circuit as claimed in claim 1, wherein said defining the secondary circuit to be monitored comprises:
and defining the secondary circuit to be monitored according to the terminal strip information and the circuit number of the secondary circuit to be monitored.
3. The method of claim 1, wherein the step of performing a real scan of the test loop comprises:
selecting a test loop from a loop monitoring picture;
respectively switching the voltage channel and the current channel to a multi-path voltage and current acquisition module to acquire voltage and current signals;
judging whether the test loop meets the test condition or not according to the voltage and current signals;
when the test loop meets the test condition, selecting one node as a signal source point, and setting the rest nodes as test points;
short-circuiting the test points and the signal source point through a protection resistor to form a loop, and recording voltage and current signals of the test points;
acquiring an actual topological structure of the test loop according to the voltage and current signals;
and comparing the actual topological structure with the dwg format power wiring diagram file, if the actual topological structure and the dwg format power wiring diagram file have access, the test circuit diagram is actually inconsistent, and if the actual topological structure and the dwg format power wiring diagram file are consistent, the test circuit diagram is actually consistent.
4. The method as claimed in claim 3, wherein said determining whether the test loop satisfies the test condition according to the voltage and current signals comprises:
when U is turnedi0 and IiWhen 0, the test loop satisfies a test condition, where UiAnd IiRespectively, the voltage and current at each node of the terminal block of the test loop.
5. The monitoring method for the secondary loop as set forth in claim 1, wherein the resistance test of the test loop comprises:
selecting a test loop from a loop monitoring picture;
respectively switching the voltage channel and the current channel to a multi-path voltage and current acquisition module to acquire voltage and current signals;
judging whether the test loop meets the test condition or not according to the voltage and current signals;
when the test loop meets the test condition, selecting one node as a signal source point, and setting the rest nodes as test points;
short-circuiting the test points and the signal source point through a protection resistor to form a loop, and recording voltage and current signals of the test points;
acquiring each secondary loop resistor Rmn and the secondary loop ground resistor R according to the voltage and current signalsGmn；
According to the secondary loop resistance Rmn and the secondary loop ground resistance RGmn judging whether the test loop has a fault.
6. The monitoring method for secondary circuit as claimed in claim 5, wherein the obtaining of each secondary circuit resistance Rmn and the secondary circuit resistance to ground R according to the voltage and current signalsGmn comprises:
according to
Obtaining each secondary loop resistance Rmn, wherein UFIs the voltage of the power supply point, ImnIs the current between the signal source and the test node, ReTo protect the resistance;
according to
Obtaining the resistance R of each secondary loop to groundGmn, wherein, ImnFor the current between the signal source and the test node, EFTo ground potential.
7. Method for monitoring a secondary circuit according to claim 5, characterized in that said function is based on said secondary circuit resistance Rmn and a secondary circuit resistance to ground RGmn judging whether the test loop has faultThe barrier comprises:
when the secondary loop resistance Rmn is more than RsetmnAnd R isGmn＜RsetGmnIf not, the test loop is in normal operation, wherein RsetmnTake 0.5 omega, RsetGmnTake 10M Ω.
8. A monitoring system for a secondary circuit, for use in a monitoring method for a secondary circuit according to any one of claims 1 to 7, comprising:
the voltage and current signal acquisition line (1) is used for connecting the monitoring system for the secondary circuit into the secondary circuit to be monitored;
the channel conversion module (2) is used for switching a voltage channel or a current channel;
the multi-path voltage and current acquisition module (3) is used for acquiring multi-path voltage and current signals;
the signal output module (4) is used for transmitting voltage and current signals to the secondary circuit to be monitored;
the measurement and control subsystem (5) is used for monitoring voltage and current signals of each secondary loop;
the information calculation processing system (6) is used for processing the acquired voltage and current signals to generate a monitoring picture;
a power supply module (7) for providing power supply for the monitoring system for the secondary loop;
the data analysis and storage subsystem (8) is used for carrying out real-time graphic scanning and resistance test analysis according to the voltage and current signals;
the external computer (9) is used for reading data and setting the working mode of the monitoring system for the secondary circuit;
and the interconnection communication subsystem (10) is used for interconnecting and communicating the voltage and current signal acquisition lines, the channel conversion module, the multi-path voltage and current acquisition modules, the signal output module, the measurement and control subsystem, the information computing and processing system, the power supply module, the data analysis and storage subsystem and the external computer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811631860.XA CN109444651B (en) | 2018-12-29 | 2018-12-29 | Monitoring method and system for secondary circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811631860.XA CN109444651B (en) | 2018-12-29 | 2018-12-29 | Monitoring method and system for secondary circuit |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109444651A CN109444651A (en) | 2019-03-08 |
| CN109444651B true CN109444651B (en) | 2021-02-02 |
Family
ID=65539373
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811631860.XA Active CN109444651B (en) | 2018-12-29 | 2018-12-29 | Monitoring method and system for secondary circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109444651B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110888082B (en) * | 2019-11-27 | 2022-07-01 | 深圳供电局有限公司 | Relay protection secondary circuit node voltage fault positioning method and device |
| CN111157841B (en) * | 2019-12-25 | 2022-10-18 | 国网浙江省电力有限公司台州供电公司 | Fault quick positioning device for secondary circuit of electric operation type isolating switch |
| CN113608041B (en) * | 2021-06-25 | 2023-12-29 | 深圳供电局有限公司 | On-load test method, device, equipment and storage medium |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1298047C (en) * | 2003-02-21 | 2007-01-31 | 上海芯华微电子有限公司 | Validity verification of bipolar integrated circuit design and electric network consistency comparison method |
| CN102879662B (en) * | 2011-09-15 | 2014-11-19 | 国家电网公司 | Device and method for detecting secondary virtual loop of intelligent transformer substation |
| CN203705937U (en) * | 2014-02-27 | 2014-07-09 | 国家电网公司 | Detection system for substation secondary equipment |
| CN104360183A (en) * | 2014-06-26 | 2015-02-18 | 许继电气股份有限公司 | Method for abnormality detection of simulated secondary loop of intelligent transformer substation |
| CN106199313B (en) * | 2016-08-15 | 2019-03-08 | 国家电网公司 | The amount of the outputing circuit method of calibration and equipment of transforming plant protecting device secondary circuit |
| CN106409091A (en) * | 2016-12-05 | 2017-02-15 | 浙江舟山海洋输电研究院有限公司 | Method and system for realizing troubleshooting simulation of secondary circuit simulated fault in electric power system |
| CN206270398U (en) * | 2016-12-20 | 2017-06-20 | 国家电网公司 | A kind of voltage x current loop comprehensive tester |
| CN106992604A (en) * | 2017-05-31 | 2017-07-28 | 泉州创先力智能科技有限公司 | A kind of fault location and visual presentation device based on automation equipment virtual connections |
| CN107703391A (en) * | 2017-10-17 | 2018-02-16 | 云南电网有限责任公司电力科学研究院 | A kind of secondary circuit detecting system of transformer station |
| CN107798090A (en) * | 2017-10-23 | 2018-03-13 | 云南电网有限责任公司电力科学研究院 | A kind of site safety operation management and control document structure tree method and device |
| CN108616405A (en) * | 2018-05-11 | 2018-10-02 | 许继集团有限公司 | The Fault Locating Method and device in a kind of intelligent substation void circuit |
-
2018
- 2018-12-29 CN CN201811631860.XA patent/CN109444651B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN109444651A (en) | 2019-03-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109444651B (en) | Monitoring method and system for secondary circuit | |
| US6954076B2 (en) | Aircraft multi-function wire and insulation tester | |
| US6803770B2 (en) | Wireless multiconductor cable test system and method | |
| CN107078690A (en) | The method and system of failure is detected and positioned in DC systems | |
| CN111044843B (en) | Power transmission line fault positioning method based on multi-source data | |
| US4130794A (en) | Methods and means for identifying and testing circuit connections | |
| CN113281618A (en) | Low-voltage distribution line fault positioning method and device | |
| KR100538563B1 (en) | Simulator for power system and method therefor | |
| EP3334034B1 (en) | Inspection support apparatus and control method thereof, inspection system, and control program | |
| CN111537793B (en) | Power consumption testing method and system of mobile terminal | |
| CN107271854B (en) | Dual-redundancy equipotential cable network mixed wire testing device and testing method | |
| CN115727760A (en) | Spatial position identification method, system, equipment and storage medium | |
| CN115980438A (en) | Method and system for acquiring double-bus electric energy metering voltage of transformer substation | |
| KR102378902B1 (en) | Partial Discharge Pattern Analysis Method and Device for HVDC cables | |
| KR101971031B1 (en) | Apparatus and method for dynamic performance test of digital protection relay | |
| CN113075511A (en) | Line insulation monitoring method, system and device based on distributed fault recording | |
| CN106154122A (en) | A kind of retrospective power cable detecting and controlling system | |
| CN117741293B (en) | Aviation solid-state block terminal on-line measuring device | |
| CN217689372U (en) | Relay protection intelligent wireless vector test system | |
| US6026146A (en) | Automated voice terminal protocol identification system | |
| CN212781158U (en) | Low-current single-phase earth fault on-line monitoring device | |
| CN113093085B (en) | Secondary circuit fault detection method and device for station domain current transformer | |
| Barua et al. | Internet of Things (IoT) Based Underground Cable Fault Detection by Using Raspberry PI and Arduino Interfaced with Blynk Server | |
| Xu et al. | On-line and on-site PD monitoring and diagnosis of power transformer | |
| CN114740253A (en) | Movable voltage wave recording device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |