CN109439862B - Buffer backing plate for pipe annealing - Google Patents
Buffer backing plate for pipe annealing Download PDFInfo
- Publication number
- CN109439862B CN109439862B CN201811603994.0A CN201811603994A CN109439862B CN 109439862 B CN109439862 B CN 109439862B CN 201811603994 A CN201811603994 A CN 201811603994A CN 109439862 B CN109439862 B CN 109439862B
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- bottom plate
- steel wire
- layer
- wire mesh
- buffer
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- 238000000137 annealing Methods 0.000 title claims abstract description 36
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 55
- 239000010959 steel Substances 0.000 claims abstract description 55
- 229910001220 stainless steel Inorganic materials 0.000 claims abstract description 6
- 239000010935 stainless steel Substances 0.000 claims abstract description 6
- 238000003466 welding Methods 0.000 claims description 8
- 239000011148 porous material Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 11
- 239000002131 composite material Substances 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 33
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 28
- 229910052802 copper Inorganic materials 0.000 description 28
- 239000010949 copper Substances 0.000 description 28
- 239000000463 material Substances 0.000 description 16
- 238000000034 method Methods 0.000 description 8
- 239000002344 surface layer Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 5
- 238000005520 cutting process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 238000004378 air conditioning Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D1/00—General methods or devices for heat treatment, e.g. annealing, hardening, quenching or tempering
- C21D1/26—Methods of annealing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
- B32B15/011—Layered products comprising a layer of metal all layers being exclusively metallic all layers being formed of iron alloys or steels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/02—Layer formed of wires, e.g. mesh
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/18—Layered products comprising a layer of metal comprising iron or steel
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
- B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by features of form at particular places, e.g. in edge regions
- B32B3/04—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by features of form at particular places, e.g. in edge regions characterised by at least one layer folded at the edge, e.g. over another layer ; characterised by at least one layer enveloping or enclosing a material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B3/00—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form
- B32B3/02—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by features of form at particular places, e.g. in edge regions
- B32B3/06—Layered products comprising a layer with external or internal discontinuities or unevennesses, or a layer of non-planar form; Layered products having particular features of form characterised by features of form at particular places, e.g. in edge regions for securing layers together; for attaching the product to another member, e.g. to a support, or to another product, e.g. groove/tongue, interlocking
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/08—Interconnection of layers by mechanical means
-
- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D9/00—Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor
- C21D9/0006—Details, accessories not peculiar to any of the following furnaces
- C21D9/0025—Supports; Baskets; Containers; Covers
-
- C—CHEMISTRY; METALLURGY
- C21—METALLURGY OF IRON
- C21D—MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS; GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUS METALS OR ALLOYS; MAKING METAL MALLEABLE, e.g. BY DECARBURISATION OR TEMPERING
- C21D9/00—Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor
- C21D9/08—Heat treatment, e.g. annealing, hardening, quenching or tempering, adapted for particular articles; Furnaces therefor for tubular bodies or pipes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/558—Impact strength, toughness
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/744—Non-slip, anti-slip
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
Abstract
The invention discloses a buffer backing plate for pipe annealing, which comprises a bottom plate, wherein the bottom plate is a stainless steel plate with the thickness of 3-5mm, inclined planes are respectively arranged on two sides of the bottom plate, the inclined planes on two sides of the bottom plate are symmetrically arranged relative to the central line of the bottom plate, and the inclined angles of the inclined planes along the horizontal direction are 65-80 degrees; the bottom plate is sleeved with a steel wire mesh, the steel wire mesh is covered on the bottom plate, and two sides of the steel wire mesh are fixed on the bottom surface of the bottom plate after respectively bypassing the inclined plane on the bottom plate from top to bottom; a steel wire buffer layer is arranged between the upper end face of the bottom plate and the steel wire mesh, the thickness of the steel wire buffer layer is larger than that of the steel wire mesh, two clamping grooves are further formed in the bottom face of the bottom plate, the clamping grooves are of a door-shaped structure with downward openings, and the tops of the clamping grooves are welded and fixed on the bottom plate. The buffer backing plate adopts a multi-layer composite structure, ensures rigid support, has better toughness and buffer space, is high-temperature resistant, does not deform, and has lower manufacturing cost.
Description
Technical Field
The invention relates to an auxiliary tool in the annealing process of a copper pipe, in particular to a buffer backing plate for pipe annealing, and belongs to the technical field of copper pipe processing.
Background
The high-precision copper pipe has wider application in manufacturing industry, such as the fields of air-conditioning condensers, radio frequency cables and the like, and with the wider application of the copper pipe, the market has more demands on some sectional materials, such as straight pipes, short pipes, square pipes and the like. Annealing is still one of the essential procedures in the production of copper tubes of these profiles. At present, when annealing is carried out on a copper pipe, a copper pipe intermediate material after drawing forming is placed on an annealing material frame, the copper pipe is conveyed into an annealing furnace by the annealing material frame, and then high-temperature annealing treatment is carried out. Because of the high requirements on the surface finish of the copper pipe product, when the copper pipe is placed on an annealing material frame, the copper pipe at the bottom needs to be protected so as to prevent the surface of the copper pipe from being scratched due to contact with the material frame.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to solve the problem that the copper pipe is easy to scratch after being contacted and extruded with a material frame when the copper pipe is placed on an annealing material frame at present, and introduces a buffer backing plate capable of avoiding the copper pipe from being scratched by the material frame.
The technical scheme of the invention is as follows: the buffer backing plate for pipe annealing is characterized by comprising a bottom plate, wherein the bottom plate is a stainless steel plate with the thickness of 3-5mm, inclined planes are respectively arranged on two sides of the bottom plate, the inclined planes on two sides of the bottom plate are symmetrically arranged relative to the central line of the bottom plate, and the inclined angles of the inclined planes along the horizontal direction are 65-80 degrees; the bottom plate is sleeved with a steel wire mesh, the steel wire mesh is covered on the bottom plate, and two sides of the steel wire mesh are fixed on the bottom surface of the bottom plate after respectively bypassing the inclined plane on the bottom plate from top to bottom; the steel wire buffer layer is arranged between the upper end face of the bottom plate and the steel wire mesh, the thickness of the steel wire buffer layer is larger than that of the steel wire mesh, two clamping grooves are further formed in the bottom face of the bottom plate, the clamping grooves are of a door-shaped structure with downward openings, and the tops of the clamping grooves are welded and fixed on the bottom plate.
The buffer backing plate is an auxiliary device special for an annealing process in copper pipe production, combines the high temperature resistance requirement of a copper pipe in the high temperature annealing process, the anti-friction requirement of the surface of the copper pipe, the precision size matching requirement of an annealing furnace burden frame and the cost requirement of enterprises, and the structural scheme is obtained after comprehensive analysis and design, so that the buffer backing plate not only needs structural optimization design, but also needs size precision matching, and also needs the reliability requirement of materials, and can meet the requirement of actual production, and the buffer backing plate is also a reason that the buffer backing plate cannot be replaced by a common backing plate in the process production, and can be suitable for the high temperature annealing process requirement of the copper pipe under the condition that all aspects are required to meet the requirement.
Optimally, three-level ladder-shaped structures are respectively formed on two sides of the steel wire mesh, wherein the three-level ladder-shaped structures are respectively a first horizontal layer, a second inclined surface layer and a third inclined surface layer, the first horizontal layer is paved on the top of the steel wire buffer layer and is arranged along the horizontal direction, the second inclined surface layer is arranged between the first horizontal layer and the third inclined surface layer, the inclination angle between the second inclined surface layer and the horizontal direction is 15-60 degrees, the third inclined surface layer extends downwards to the bottom surface position of the bottom plate and is clung to the inclined surface, and the inclination angle of the third inclined surface layer along the horizontal direction is 65-80 degrees. The three-stage ladder-shaped structure has a specific effect, can tightly wrap the inner steel wire buffer layer, and cannot be loosened even in a high-temperature state, so that compared with a common arc-shaped edge-wrapping structure, the three-stage ladder-shaped structure has higher process manufacturing difficulty, and meanwhile, the three-stage ladder-shaped structure has a better structural stability effect, and is a technical means which is not adopted in the field.
Optimally, the thickness of the steel wire buffer layer is 6-8mm. The thickness of the designed steel wire buffer layer is designed according to the weight of the copper coil pipe required to bear the weight, the deformation degree of the steel wire buffer layer in a pressed state is calculated and analyzed by considering the weight of the copper coil pipe, the thickness requirement is comprehensively obtained, the abrasion caused by touching the bottom plate when the copper coil pipe is pressed down can be avoided, the steel wire buffer layer can rebound and return after being released, and the deformation is reduced, so that the thickness design in the invention has very important effect on the whole technological requirement.
Optimally, the granularity of the steel wire mesh is 100 meshes, and the aperture of the steel wire mesh is 0.1-0.15mm. In the invention, the steel wire mesh is directly contacted with the copper pipe, so that the high precision requirement is met for the aperture of the steel wire mesh, if the granularity is too small, the surface roughness of the steel wire mesh is increased, the copper pipe is possibly scratched, and if the granularity is too large, the surface of the steel wire mesh is possibly too smooth, the copper coil pipe slowly shifts and slips after being subjected to tiny vibration, and the copper coil pipe is greatly negatively influenced by purging, so that the design requirement on granularity and aperture in the invention reaches a balance degree, and the balance degree is the technical problem that technicians are required to work in the first line for a long time, understand various problems of production links and can be solved by combining with innovative structural design.
Optimally, the steel wire mesh forms a left folding section and a right folding section on two sides of the bottom surface of the bottom plate respectively, the lengths of the left folding section and the right folding section are equal, and the length of the left folding section is smaller than 1/5 of the width of the bottom plate. The steel wire mesh is tensioned through the folded section of the edge, and is matched with the three-stage ladder-shaped structure, so that the purpose of avoiding high-temperature deformation is achieved, the convenience in manufacturing is considered for the length design of the folded section, and meanwhile, the cutting is convenient, and particularly, the convenience in electric welding operation is also achieved.
Optimally, the left folding section and the right folding section are fixed with the bottom plate by spot welding, and the density of the spot welding is 20 multiplied by 20mm. The specific weld density is used here to ensure that sufficient tensile force is obtained to avoid the occurrence of spring back and deformation of the wire mesh, and such weld density design is matched to the foregoing particle size and pore size design of the wire mesh, and if the particle size and pore size of the wire mesh are changed, the same tensile force effect cannot be obtained under such weld density conditions, and it is apparent that these are comprehensively considered in the present invention.
Optimally, the width of the open end of the clamping groove is 70-120mm. Here, the design of the slot opening needs to be combined with a matched annealing material rack, and the design of the slot opening needs to achieve the effect of stable and non-shaking after installation because the specificity of the annealing material rack is strong, so that the slot opening also needs to be matched with high precision.
Compared with the prior art, the invention has the following beneficial effects:
1. the buffer backing plate adopts a multi-layer composite structure, ensures rigid support, and has better toughness and buffer space, so that friction between the copper pipe and an annealing material frame can be well prevented when the copper pipe is placed, and scratch is avoided.
2. High temperature resistance, no deformation, difficult damage and good reliability.
3. The manufacturing cost is lower, certain universality is achieved, and the annealing use requirements of different sectional materials can be met.
Drawings
Fig. 1 is a perspective view of a buffer pad for annealing a pipe according to the present invention.
Fig. 2 is a structural cross-sectional view of a buffer pad for tube annealing according to the present invention.
Fig. 3 is an enlarged view of the section I in fig. 2.
Fig. 4 is a perspective view of the cushion pan of the present invention mounted on an annealing stack.
In the figure, 1-bottom plate, 2-inclined plane, 3-wire gauze, 31-first horizontal layer, 32-second inclined plane layer, 33-third inclined plane layer, 34-left folding section, 35-right folding section, 4-wire buffer layer, 5-clamping groove and 6-annealing material rack.
Detailed Description
The invention is further described below with reference to the drawings and the detailed description.
As shown in fig. 1 to 4, the buffer backing plate for annealing a pipe comprises a bottom plate 1, wherein the bottom plate 1 is a stainless steel plate with the thickness of 3mm, 3.5mm, 4mm, 4.5mm or 5mm, inclined planes 2 are respectively arranged on two sides of the bottom plate 1, the inclined planes 2 on two sides of the bottom plate 1 are symmetrically arranged relative to the central line of the bottom plate 1, and the inclined angles of the inclined planes 2 along the horizontal direction can be 65 °, 70 °, 75 °, 78 ° or 80 °. The bottom plate 1 is sleeved with a steel wire mesh 3, the steel wire mesh 3 covers the bottom plate 1, and two sides of the steel wire mesh 3 are fixed on the bottom surface of the bottom plate 1 after respectively bypassing the inclined surface on the bottom plate 1 from top to bottom; be provided with steel wire buffer layer 4 between the up end of bottom plate 1 and the wire net 3, the thickness of steel wire buffer layer 4 is greater than the thickness of wire net 3 still be equipped with two draw-in grooves 5 on the bottom surface of bottom plate 1, draw-in groove 5 be the decurrent door-shaped structure of opening, the top welding of draw-in groove 5 is fixed on bottom plate 1.
Referring to fig. 1-4, in the present invention, three-stage ladder structures are formed on two sides of the steel wire mesh 3, respectively, a first horizontal layer 31, a second inclined layer 32 and a third inclined layer 33, where the first horizontal layer 31 is laid on top of the steel wire buffer layer 4 and is set along the horizontal direction, the second inclined layer 32 is set between the first horizontal layer 31 and the third inclined layer 33, the inclination angle between the second inclined layer 32 and the horizontal direction may be 15 °, 20 °, 30 °, 45 °, 50 ° or 60 °, the third inclined layer 33 extends downward to the bottom surface position of the bottom plate 1 and is tightly attached to the inclined plane 2, the inclination angle between the third inclined layer 33 along the horizontal direction may be 65 °, 70 °, 75 °, 78 ° or 80 °, the thickness of the steel wire buffer layer 4 can be 6mm, 6.5mm, 7mm, 7.6mm or 8mm, the granularity of the steel wire mesh 3 is 100 meshes, the aperture of the steel wire mesh 3 can be 0.1mm, 0.12mm, 0.13mm, 0.14mm or 0.15mm, the steel wire mesh 3 forms a left folding section 34 and a right folding section 35 respectively on two sides of the bottom surface of the bottom plate 1, the lengths of the left folding section 34 and the right folding section 35 are equal, the length of the left folding section 34 is less than 1/5 of the width of the bottom plate 1, the left folding section 34 and the right folding section 35 are welded and fixed with the bottom plate 1 by spot welding, the density of spot welding is 20×20mm, and the width of the opening end of the clamping groove 5 can be 70mm, 75mm, 80mm, 90mm, 105mm, 112mm, 115mm or 120mm.
The buffer backing plate of the invention is manufactured by the following method:
1) Cutting a stainless steel plate with the thickness of 3-5mm to obtain a base plate blank with the length of 0.8-1.8 m;
2) Respectively carrying out inclined plane processing on two sides of the base plate blank, so that an included angle between the inclined plane and the horizontal direction is 65-80 degrees, and obtaining a base plate 1 with the width of 15-25 mm;
3) Uniformly paving a steel wire buffer layer 4 with the thickness of 6-8mm on a bottom plate 1, wherein the steel wire buffer layer 4 is prepared from a fine steel wire mesh with smaller density, and then wrapping a steel wire mesh 3 with the granularity of 100 meshes outside the steel wire buffer layer 4;
4) The two sides of the steel wire mesh 3 are clung to the bottom surface of the bottom plate 1 after bypassing the inclined surface on the bottom plate 1, and are fixed by spot welding, and three-level ladder-shaped structures are respectively formed on the two sides of the steel wire mesh after being fixed;
5) Stainless steel is selected to manufacture clamping grooves, and the clamping grooves are welded and fixed at two ends of the central line of the bottom surface of the bottom plate 1;
6) And 5) annealing the cushion plate obtained in the step 5) to obtain the required buffer cushion plate.
The cushion pad structure disclosed by the invention has the advantages of good stability, good matching degree with an annealing material rack, no deformation at a high temperature, and outstanding wear resistance and anti-skid capability.
It should be noted that the above embodiments are only for illustrating the technical solution of the present invention and not for limiting the technical solution, and although the applicant has described the present invention in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications and equivalents of the technical solution of the present invention can be made without departing from the spirit and scope of the technical solution, and all such modifications and equivalents are intended to be encompassed in the scope of the claims of the present invention.
Claims (7)
1. The buffer backing plate for pipe annealing is characterized by comprising a bottom plate (1), wherein the bottom plate (1) is a stainless steel plate with the thickness of 3-5mm, inclined planes (2) are respectively arranged on two sides of the bottom plate (1), the inclined planes (2) on two sides of the bottom plate (1) are symmetrically arranged relative to the central line of the bottom plate (1), and the inclined angles of the inclined planes (2) along the horizontal direction are 65-80 degrees; the bottom plate (1) is sleeved with a steel wire mesh (3), the steel wire mesh (3) covers the bottom plate (1), and two sides of the steel wire mesh (3) are fixed on the bottom surface of the bottom plate (1) after respectively bypassing the inclined surface on the bottom plate (1) from top to bottom; be provided with steel wire buffer layer (4) between up end and the wire net (3) of bottom plate (1), the thickness of steel wire buffer layer (4) is greater than the thickness of wire net (3) still be equipped with two draw-in grooves (5) on the bottom surface of bottom plate (1), draw-in groove (5) be the decurrent door-type structure of opening, the top welding of draw-in groove (5) is fixed on bottom plate (1).
2. Buffer pad for annealing of pipes according to claim 1, characterized in that three-stage ladder-like structures are formed on both sides of the steel wire mesh (3), respectively, a first horizontal layer (31), a second inclined layer (32) and a third inclined layer (33), the first horizontal layer (31) is laid on top of the steel wire buffer layer (4) and is arranged along the horizontal direction, the second inclined layer (32) is arranged between the first horizontal layer (31) and the third inclined layer (33), the inclination angle of the second inclined layer (32) and the horizontal direction is 15 ° -60 °, the third inclined layer (33) extends downwards to the bottom surface position of the bottom plate (1) and is clung on the inclined plane (2), and the inclination angle of the third inclined layer (33) along the horizontal direction is 65 ° -80 °.
3. A buffer pad for annealing of pipes according to claim 2, characterized in that the thickness of the wire buffer layer (4) is 6-8mm.
4. A buffer pad for annealing of pipes according to claim 3, characterized in that the wire mesh (3) has a pore size of 0.1-0.15mm.
5. A buffer pad for annealing of pipes according to claim 4, characterized in that the steel wire mesh (3) forms a left folded section (34) and a right folded section (35) on both sides of the bottom surface of the bottom plate (1), respectively, the lengths of the left folded section (34) and the right folded section (35) are equal, and the length of the left folded section (34) is less than 1/5 of the width of the bottom plate (1).
6. A buffer pad for annealing of pipes according to claim 5, characterized in that the left folded section (34) and the right folded section (35) are both spot welded to the bottom plate (1), the density of the spot welds being 20 x 20mm.
7. A buffer backing plate for annealing of pipes according to claim 6, characterized in that the width of the open end of the clamping groove (5) is 70-120mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811603994.0A CN109439862B (en) | 2018-12-26 | 2018-12-26 | Buffer backing plate for pipe annealing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811603994.0A CN109439862B (en) | 2018-12-26 | 2018-12-26 | Buffer backing plate for pipe annealing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109439862A CN109439862A (en) | 2019-03-08 |
| CN109439862B true CN109439862B (en) | 2024-01-26 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811603994.0A Active CN109439862B (en) | 2018-12-26 | 2018-12-26 | Buffer backing plate for pipe annealing |
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| CN (1) | CN109439862B (en) |
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| CN209276568U (en) * | 2018-12-26 | 2019-08-20 | 重庆龙煜精密铜管有限公司 | A kind of buffer plate for tubing annealing |
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