CN109438914A - 一种发泡聚醚醚酮材料 - Google Patents

一种发泡聚醚醚酮材料 Download PDF

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CN109438914A
CN109438914A CN201811001049.3A CN201811001049A CN109438914A CN 109438914 A CN109438914 A CN 109438914A CN 201811001049 A CN201811001049 A CN 201811001049A CN 109438914 A CN109438914 A CN 109438914A
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陈福珍
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JIAXING BOFA NEW PLASTIC Co Ltd
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Abstract

本发明是一种发泡聚醚醚酮材料,所述的发泡聚醚醚酮材料包括以下质量份数的原料:聚醚醚酮颗粒70~85份,发泡剂2~5份,成核剂2~5份;所述发泡剂为超临界态二氧化碳和苯基四唑;所述成核剂为聚酰亚胺、三氧化二铝和二氧化硅;本发明制备方法简单、生产周期短、生产效率高,可用于大规模商业化生产;制得的聚醚醚酮发泡材料玻璃化温度及熔融温度都与未发泡的聚醚醚酮树脂相差不大,但微孔结构的引入,降低了材料本身15‑35%的重量,可以减少原料消耗、减轻制品重量和节约成本;由于具有耐高温、耐腐蚀,具有高机械强度等性能,可应用于国防、军工、航空航天等使用环境苛刻的领域。

Description

一种发泡聚醚醚酮材料
技术领域
本发明属于高分子材料技术领域,尤其是一种发泡聚醚醚酮。
背景技术
聚醚醚酮是一种具有半结晶结构的特种工程塑料,由于其具有较高的耐热等级、较好的耐化学腐蚀性、耐老化性、耐冲击性、及较好的阻燃性等优点,被广泛的应用于石油化工、电子电器、航空航天以及交通运输等各个领域。聚醚醚酮材料由于主链中包含很多苯环,导致其具有较强的刚性,使得聚合物的玻璃化温度和热分解温度均较高;另一方面,主链中由于存在共轭双键,分子链排列规整,使其具有优异的力学性能。
聚合物微孔发泡材料是特指孔径小于100μm,孔密度大于1.0×106个/cm3的多孔聚合物发泡材料。由于材料内部大量微米级泡孔的存在,微孔发泡材料具有优异的减震、隔热和吸声性能,可广泛用于包装、隔热保温、减震缓冲和消音吸声等领域。聚合物发泡材料因其具有质轻、保温、隔音、绝缘、比强度高、成本低等优点,在食品包装、轻质材料、运动器材、汽车部件、航空航天、电子封装、以及生物医学材料等领域得到广泛应用,已经成为人们日常生活中不可或缺的一部分。通过微孔结构的引入,可以降低样品本身15-35%的重量,显著降低聚合物制品重量,同时却不会影响聚合物制品应有的力学及热性能,因此可以使用微孔聚合物制品代替未发泡的实体聚合物制品,从而实现减少原料消耗、减轻制品重量和节约成本的目的。聚醚醚酮作为性能优异的特种工程塑料,但是极高的加工温度以及价格相对昂贵等问题都限制着其在发泡材料加工方面研究的开展,在国防、军工、航空航天等使用环境苛刻的领域,需要发泡材料具备耐高温、耐腐蚀、高机械强度等性质。而耐高温的发泡材料是指,在连续使用温度250℃左右、短期使用温度310℃的环境下可以使用,常见的PVC、ABS、PP等绝大多数使用温度在100℃以下,PC、PMMA、PPS、PES等均在200℃以下。因此,亟需开发一种耐高温、耐腐蚀、高机械强度的高性能发泡聚醚醚酮材料。
发明内容
本发明的目的是为了解决现有技术中发泡材料使用温度低,在高酸碱、高腐蚀度的条件下无法长期稳定的使用的技术问题,提供一种耐高温、耐腐蚀、高机械强度的高性能发泡聚醚醚酮材料。
本发明解决其技术问题所采用的技术方案是:一种发泡聚醚醚酮材料,包括以下质量份数的原料:聚醚醚酮颗粒70~85份,发泡剂2~5份,成核剂2~5份;所述发泡剂为超临界态二氧化碳和苯基四唑,其中超临界态二氧化碳为1~3份、苯基四唑为2~3份;所述成核剂为聚酰亚胺、三氧化二铝和二氧化硅,其中聚酰亚胺为1~2份、三氧化二铝为1~3份、二氧化硅1~3份。
优选的,所述聚醚醚酮颗粒熔融指数为20~25g/10min。
优选的,所述二氧化硅粒径为20~30nm。
优选的,所述超临界态二氧化碳纯度≥99%。
本发明的有益效果是:本发明制备发泡聚醚醚酮材料的方法简单、生产周期短、生产效率高,可用于大规模商业化生产;对原料提前进行干燥避免了水在100℃左右下提前汽化,在材料内部结构产生不规则发泡,最终影响发泡率及力学性能;制得的醚醚酮发泡材料玻璃化温度及熔融温度都与未发泡的聚醚醚酮树脂相差不大,但微孔结构的引入,降低了材料本身15-35%的重量,同时却没有影响聚合物制品应有的力学及热性能,使用聚醚醚酮发泡材料代替未发泡的实体聚醚醚酮制品,可以减少原料消耗、减轻制品重量和节约成本;同时通过本发明的方法制备的发泡聚醚醚酮材料具有耐高温、耐腐蚀,具有高机械强度等性能,可应用于国防、军工、航空航天等使用环境苛刻的领域。
具体实施方式
下面结合实施例对本发明进一步说明。
本发明的一种发泡聚醚醚酮材料,包括以下质量份数的原料:聚醚醚酮颗粒70~85份,发泡剂2~5份,成核剂2~5份;所述聚醚醚酮颗粒粒径为5-10目。实验发现,成核剂量过大会影响发泡尺寸,导致发泡不均匀,只有在此比例范围既能提高结晶速率,又不影响发泡尺寸。
所述发泡剂为超临界态二氧化碳和苯基四唑,其中超临界态二氧化碳为1~3份、苯基四唑为2~3份;所述成核剂为聚酰亚胺、三氧化二铝和二氧化硅,其中聚酰亚胺为1~2份、三氧化二铝为1~3份、二氧化硅1~3份。所采用的苯基四唑即5-苯基-1H-四氮唑,化学式为C7H6N4。
超临界二氧化碳在临界状态下在聚醚醚酮中的溶解度极限不会高于3份,所以在进行添加的过程中,严格控制发泡剂的加入量;针对于苯基四唑的加入量应控制在2~3份之间,总体控制发泡数量;本方法采用物理、化学相结合发泡的方法进行。通过采用聚酰亚胺、纳米二氧化硅、纳米氧化铝作为成核剂,可以有效提高成核效率,同时提高体系材料的结晶速率。
所述聚醚醚酮颗粒熔融指数为20~25g/10min。所述二氧化硅粒径为20~30nm。所述超临界态二氧化碳纯度≥99%。
实施例1:
一种发泡聚醚醚酮材料,包括以下质量份数的原料:聚醚醚酮颗粒7kg,超临界态二氧化碳为0.1kg份、苯基四唑为0.2kg;聚酰亚胺为0.1kg、三氧化二铝为0.1kg、粒径为20nm的二氧化硅0.1kg;聚醚醚酮颗粒熔融指数为20~25g/10min。超临界态二氧化碳纯度≥99%。
实施例2:
一种发泡聚醚醚酮材料,包括以下质量份数的原料:聚醚醚酮颗粒8.5kg,超临界态二氧化碳为0.3kg份、苯基四唑为0.3kg;聚酰亚胺为0.2kg、三氧化二铝为0.3kg、粒径为30nm的二氧化硅0.3kg;聚醚醚酮颗粒熔融指数为20~25g/10min。超临界态二氧化碳纯度≥99%。
实施例3:
本一种发泡聚醚醚酮材料,包括以下质量份数的原料:聚醚醚酮颗粒8kg,超临界态二氧化碳为0.2kg份、苯基四唑为0.22kg;聚酰亚胺为0.15kg、三氧化二铝为0.2kg、粒径为25nm的二氧化硅0.2kg;聚醚醚酮颗粒熔融指数为20~25g/10min。超临界态二氧化碳纯度≥99%。
表1实施例1-3所得的发泡聚醚醚酮材料的性能测试
其中对照组为未发泡的聚醚醚酮树脂,由表1可以看出,实施例1-3所得的聚醚醚酮发泡材料相对于聚醚醚酮树脂,其固有性能变化不大,泡孔密度得到了大幅度的提高,同时膨胀率达到10%以上,并且相对可控,对后期对发泡材料的后加工起到了非常有利的作用。尤其是固有性能Tm、Tg与聚醚醚酮树脂基本相同,玻璃化温度高于128℃,因此可应用与高温、高强度等环境苛刻的领域。

Claims (4)

1.一种发泡聚醚醚酮材料,其特征在于,包括以下质量份数的原料:
聚醚醚酮颗粒70~85份,
发泡剂2~5份,
成核剂2~5份;
所述发泡剂为超临界态二氧化碳和苯基四唑,其中超临界态二氧化碳为1~3份、苯基四唑为2~3份;
所述成核剂为聚酰亚胺、三氧化二铝和二氧化硅,其中聚酰亚胺为1~2份、三氧化二铝为1~3份、二氧化硅1~3份。
2.根据权利要求1所述的一种发泡聚醚醚酮材料,其特征在于,所述聚醚醚酮颗粒熔融指数为20~25g/10min。
3.根据权利要求1所述的一种发泡聚醚醚酮材料,其特征在于,所述二氧化硅粒径为20~30nm。
4.根据权利要求1所述的一种发泡聚醚醚酮材料,其特征在于,所述超临界态二氧化碳纯度≥99%。
CN201811001049.3A 2018-08-30 2018-08-30 一种发泡聚醚醚酮材料 Pending CN109438914A (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112537933A (zh) * 2020-12-23 2021-03-23 深圳市亿东阳建材有限公司 一种隔声砂浆及隔声楼板结构系统

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112537933A (zh) * 2020-12-23 2021-03-23 深圳市亿东阳建材有限公司 一种隔声砂浆及隔声楼板结构系统
CN112537933B (zh) * 2020-12-23 2022-07-05 深圳市亿东阳建材有限公司 一种隔声砂浆及隔声楼板结构系统

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Application publication date: 20190308