CN109433514A - Encapsulating device - Google Patents
Encapsulating device Download PDFInfo
- Publication number
- CN109433514A CN109433514A CN201811386445.2A CN201811386445A CN109433514A CN 109433514 A CN109433514 A CN 109433514A CN 201811386445 A CN201811386445 A CN 201811386445A CN 109433514 A CN109433514 A CN 109433514A
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- Prior art keywords
- encapsulating
- connecting structure
- transition connecting
- main body
- electronics element
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- 230000007704 transition Effects 0.000 claims abstract description 106
- 230000005611 electricity Effects 0.000 claims description 2
- 238000009434 installation Methods 0.000 claims description 2
- 230000006978 adaptation Effects 0.000 claims 1
- 239000003292 glue Substances 0.000 description 22
- 238000005266 casting Methods 0.000 description 15
- 238000000034 method Methods 0.000 description 13
- 230000008569 process Effects 0.000 description 10
- 238000004382 potting Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 239000000463 material Substances 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 230000002146 bilateral effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000009432 framing Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000002910 structure generation Methods 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
- B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
The present invention provides a kind of encapsulating devices.Encapsulating device includes: encapsulating main body, including mounting frame, interconnecting piece, fixing piece, and fixing piece is connected by interconnecting piece and the inner wall of mounting frame, and the upper surface of fixing piece protrudes from the upper surface setting of interconnecting piece；Transition connecting structure, transition connecting structure with it is detachably connected by pot electronics element and be located at by the lower section of pot electronics element, connect by transition connecting structure with fixing piece by pot electronics element；Wherein, when encapsulating main body is with by the assembly of pot electronics element in place, transition connecting structure is located in bracket by the orthographic projection on the bracket of pot electronics element, has pre-determined distance h between the lower end surface of transition connecting structure and the upper surface of interconnecting piece.Present invention efficiently solves the problem of both bonding and influence disassembly is easily occurred between pot electronics element and encapsulating main body in the prior art.
Description
Technical field
The present invention relates to LED encapsulation technology fields, in particular to a kind of encapsulating device.
Background technique
Currently, LED (light emitting diode) is used as a kind of light source, have many advantages, such as that brightness is high, small in size, the service life is long, extensively
Applied in display equipment.LED display is a kind of common display equipment.However, LED display on the market is all more crisp
Situations such as weak, anti-fight can be poor, will appear damage when by biggish external impacts, and waterproof and dustproof effect is poor.In order to
The anti-strike ability for improving LED display, usually in the surface sealing resin material of LED display.
However, often occurring being bonded in one by resin glue between pot electronics element and encapsulating main body in potting process
It rises, the phenomenon for causing the two not easy to disassemble affects encapsulating quality and processing efficiency.
Summary of the invention
The main purpose of the present invention is to provide a kind of encapsulating device, with solve in the prior art by pot electronics element with
The problem of bonding easily occurs between encapsulating main body and influences the two disassembly.
To achieve the goals above, the present invention provides a kind of encapsulating devices, comprising: encapsulating main body, including mounting frame,
Interconnecting piece, fixing piece, fixing piece are connected by interconnecting piece and the inner wall of mounting frame, and the upper surface of fixing piece protrudes from interconnecting piece
Upper surface setting；Transition connecting structure, transition connecting structure with by pot electronics element it is detachably connected and be located at filled
The lower section for sealing electronic component is connect by transition connecting structure with fixing piece by pot electronics element；Wherein, when encapsulating main body with
When by the assembly of pot electronics element in place, transition connecting structure is being located at bracket by the orthographic projection on the bracket of pot electronics element
It is interior, there is pre-determined distance h between the lower end surface of transition connecting structure and the upper surface of interconnecting piece.
Further, pre-determined distance h is more than or equal to 2mm.
Further, the side wall of transition connecting structure and had between the side wall of the bracket of pot electronics element it is default away from
It is more than or equal to 2mm from D, pre-determined distance D.
Further, there is prepsetting gap d between pot electronics element and the inner wall of mounting frame, prepsetting gap d is small
In equal to 0.05mm.
Further, the upper surface of mounting frame is higher than the outer surface by pot electronics element far from encapsulating main body.
Further, fixing piece includes sequentially connected column section and cone cell section, and cone cell section passes through column section and encapsulating master
Body connection, transition connecting structure have tapered recess compatible with cone cell section shape, cone cell section towards the surface of encapsulating main body
Protrude into tapered recess so that transition connecting structure towards encapsulating main body surface and column section towards transition connecting structure table
Face abuts, and fastener is tightened on transition connecting structure after sequentially passing through encapsulating main body, column section and cone cell section.
Further, encapsulating main body includes multiple fixing pieces, and multiple fixing pieces are between the inner surface circumferential direction of mounting frame
Every setting, transition connecting structure has multiple tapered recess, and multiple tapered recess are arranged correspondingly with multiple fixing pieces.
Further, encapsulating main body far from by pot electronics element surface have multiple counter sinks, multiple counter sinks with
Multiple fixing pieces are arranged in a one-to-one correspondence, and the first end of fastener is fastened on transition connecting structure after passing through fixing piece, fastener
Second end be located in counter sink.
Further, interconnecting piece is plate structure, and the lower end surface of interconnecting piece and the lower end surface of mounting frame are concordant.
Further, transition connecting structure is plate structure, is LED module by pot electronics element.
Apply the technical scheme of the present invention, fixing piece is connected by the inner wall of interconnecting piece and mounting frame, fixing piece it is upper
End face protrudes from the upper surface setting of interconnecting piece.It, will when needing using encapsulating device to being potted by pot electronics element
It is mounted in encapsulating main body by pot electronics element and transition connecting structure, casting glue is poured after being installed in place and is filled in by encapsulating electricity
To be potted to by pot electronics element in subcomponent.In potting process, transition connecting structure is located at bracket and encapsulating master
Between body, and orthographic projection of the transition connecting structure on bracket is located in bracket, the lower end surface of transition connecting structure and interconnecting piece
Upper surface between have pre-determined distance h.In this way, above-mentioned setting can be avoided the contact surface of bracket and transition connecting structure, with
And the contact surface of fixing piece and transition connecting structure is stained with resin glue, and then it is viscous to prevent transition connecting structure and encapsulating main body from occurring
The disassembly for tying and influencing the two, is also prevented from bracket and transition connecting structure generation is bonded and influenced by pot electronics element and transition
The disassembly of connection structure solves and is easily occurred to bond between pot electronics element and encapsulating main body in the prior art and influence two
The problem of person dismantles.
Detailed description of the invention
The accompanying drawings constituting a part of this application is used to provide further understanding of the present invention, and of the invention shows
Examples and descriptions thereof are used to explain the present invention for meaning property, does not constitute improper limitations of the present invention.In the accompanying drawings:
Fig. 1 shows the decomposition texture schematic diagram of the embodiment of encapsulating device according to the present invention；
Fig. 2 shows the top views of the encapsulating main body in Fig. 1；
Fig. 3 shows the cross-sectional view of the encapsulating main body in Fig. 1；
Fig. 4 show encapsulating device in Fig. 1 with by the cross-sectional view after pot electronics element and transition connecting structure assembly；
And
Fig. 5 shows the encapsulating device in Fig. 4 and is amplified at the A after pot electronics element and transition connecting structure assembly
Schematic diagram.
Wherein, the above drawings include the following reference numerals:
10, encapsulating main body；11, mounting frame；12, fixing piece；121, column section；122, cone cell section；13, counter sink；14,
Interconnecting piece；20, by pot electronics element；21, pcb board；30, transition connecting structure；31, tapered recess；40, bracket.
Specific embodiment
It should be noted that in the absence of conflict, the features in the embodiments and the embodiments of the present application can phase
Mutually combination.The present invention will be described in detail below with reference to the accompanying drawings and embodiments.
It should be pointed out that unless otherwise specified, all technical and scientific terms used in this application have and the application
The normally understood identical meanings of person of an ordinary skill in the technical field.
In the present invention, in the absence of explanation to the contrary, the noun of locality used is usually directed to attached drawing as " upper and lower "
Shown in for direction, or on vertical, vertical or gravity direction；Similarly, it for ease of understanding and retouches
It states, " left and right " is usually for shown in the drawings left and right；" inside and outside " refers to the inside and outside of the profile relative to each component itself,
But the above-mentioned noun of locality is not intended to restrict the invention.
In order to solve easily to be occurred both to bond and influence between pot electronics element and encapsulating main body to tear open in the prior art
The problem of unloading, this application provides a kind of encapsulating devices.
As shown in Figures 1 to 5, encapsulating device includes encapsulating main body 10 and transition connecting structure 30.Wherein, encapsulating main body 10
Including mounting frame 11, interconnecting piece 14, fixing piece 12, fixing piece 12 is connect by interconnecting piece 14 with the inner wall of mounting frame 11,
The upper surface of fixing piece 12 protrudes from the upper surface setting of interconnecting piece 14.Transition connecting structure 30 with can by pot electronics element 20
It releasably connects and is located at by the lower section of pot electronics element 20, by pot electronics element 20 by transition connecting structure 30 and admittedly
Determine the connection of part 12.Wherein, when encapsulating main body 10 is with by the assembly of pot electronics element 20 in place, transition connecting structure 30 is being filled
The orthographic projection sealed on the bracket 40 of electronic component 20 is located in bracket 40, lower end surface and the interconnecting piece 14 of transition connecting structure 30
There is pre-determined distance h between upper surface.
Using the technical solution of the present embodiment, fixing piece 12 is connect by interconnecting piece 14 with the inner wall of mounting frame 11, Gu
The upper surface for determining part 12 protrudes from the upper surface setting of interconnecting piece 14.When needing using encapsulating device to by pot electronics element 20
When being potted, it will be mounted in encapsulating main body 10 by pot electronics element 20 and transition connecting structure 30, it will after being installed in place
Casting glue pour be filled in by pot electronics element 20 to be potted to by pot electronics element 20.In potting process, transition
Connection structure 30 is between bracket 40 and encapsulating main body 10, and orthographic projection of the transition connecting structure 30 on bracket 40 is located at branch
In frame 40, there is pre-determined distance h between the lower end surface of transition connecting structure 30 and the upper surface of interconnecting piece 14.In this way, above-mentioned set
Set the contact surface of the contact surface that can be avoided bracket 40 and transition connecting structure 30 and fixing piece 12 and transition connecting structure 30
It is stained with resin glue, and then prevents transition connecting structure 30 and encapsulating main body 10 from bonding occurs and influences the disassembly of the two, is also prevented from
Bracket 40 and transition connecting structure 30 occur bonding and influence by the disassembly of pot electronics element 20 and transition connecting structure 30, solution
It has determined and the problem of both bonding and influence disassembly is easily occurred between pot electronics element and encapsulating main body in the prior art.
In the present embodiment, will be connected by pot electronics element 20 and encapsulating main body 10 by transition connecting structure 30
It connects, to be then more easier by the dismounting between pot electronics element 20 and encapsulating main body 10, is easy.Specifically, when needs pair
When being potted by pot electronics element 20, it will first be linked together by pot electronics element 20 and transition connecting structure 30, it
The overall structure that the two is formed is placed in the mounting frame 11 of encapsulating main body 10 again afterwards, by transition connecting structure 30 and encapsulating
The connection of main body 10 can be realized by the connection of pot electronics element 20 and encapsulating main body 10.And then to by pot electronics element
20 are potted.
It in the present embodiment, is LED module by pot electronics element 20.Wherein, LED module includes pcb board 21 and setting
Bracket 40 below pcb board 21.Include pcb board 21 and bracket 40 by pot electronics element 20, is provided on pcb board 21 more
A LED lamp bead.
In the present embodiment, transition connecting structure 30 is rectangular slab, and bracket 40 is cube structure, transition connecting structure 30
In the orthographic projection on bracket 40 in bracket 40.
In the present embodiment, bracket 40 is bonded in pcb board 21 towards the surface of transition connecting structure 30.It needs to illustrate
It is that bracket 40 and the connection type of pcb board 21 are without being limited thereto.Optionally, bracket 40 is bolted or blocks with pcb board 21
It connects.
In the present embodiment, casting glue is resin material.In this way, by the surface sealing resin material of pot electronics element 20
Material is extended with being promoted by the structural strength on 20 surface of pot electronics element by the service life of pot electronics element 20.
In the present embodiment, in casting glue technical process, the above structure of encapsulating device is arranged so that by pot electronics
Element 20 is more easier, conveniently from the taking-up in encapsulating device, will not in the contact surface of bracket 40 and transition connecting structure 30, with
And residue glue is generated on the contact surface of fixing piece 12 and transition connecting structure 30, and reduce activity duration and production process, it can be with
Guarantee the consistency of casting glue thickness.
In the present embodiment, pre-determined distance h is more than or equal to 2mm.
In the present embodiment, there is pre-determined distance D between the side wall of transition connecting structure 30 and the side wall of bracket 40, preset
Distance D is more than or equal to 2mm.
In the present embodiment, had between the pcb board 21 of pot electronics element 20 and the inner wall of mounting frame 11 default
Gap d, prepsetting gap d are less than or equal to 0.05mm.
In the present embodiment, the upper surface of mounting frame 11 is higher than by pot electronics element 20 far from the outer of encapsulating main body 10
Surface.
As shown in Figure 3 and Figure 5, fixing piece 12 includes sequentially connected column section 121 and cone cell section 122, and cone cell section 122 is logical
It crosses column section 121 to connect with encapsulating main body 10, transition connecting structure 30 has and cone cell section 122 towards the surface of encapsulating main body 10
The compatible tapered recess 31 of shape, cone cell section 122 protrude into tapered recess 31, so that transition connecting structure 30 is towards encapsulating master
The surface of body 10 is abutted with the surface of column section 121 towards transition connecting structure 30, and fastener sequentially passes through encapsulating main body 10, column
It is tightened on transition connecting structure 30 after shape section 121 and cone cell section 122.In this way, on the one hand above-mentioned connection type can prevent
It crosses connection structure 30 to shake in mounting frame 11, on the other hand makes the company of encapsulating main body 10 Yu transition connecting structure 30
It connects and more fastens, prevent transition connecting structure 30 in potting process from shaking and influencing encapsulating effect.Above structure is more simple
It is single, it is easily worked, realizes.
Specifically, the overall structure formed after being connect by pot electronics element 20 with transition connecting structure 30 is placed on peace
It framing up in body 11, then cone cell section 122 is protruded into the tapered recess 31 of transition connecting structure 30 and is limited with tapered recess 31 and cooperates,
Prevent transition connecting structure 30 from shaking relative to mounting frame 11.Later, fastener sequentially passes through encapsulating main body 10, column
It is tightened on transition connecting structure 30 after section 121 and cone cell section 122, to realize the peace of transition connecting structure 30 Yu encapsulating main body 10
Dress.
Optionally, encapsulating main body 10 includes multiple fixing pieces 12, and multiple fixing pieces 12 surround the inner surface of mounting frame 11
It is provided at circumferentially spaced, transition connecting structure 30 has multiple tapered recess 31, multiple tapered recess 31 and multiple fixing pieces 12 1
One is arranged in correspondence with.As shown in Fig. 2, encapsulating main body 10 includes four fixing pieces 12, and four fixing pieces 12 surround mounting frame
11 inner surface interval setting, there are four tapered recess 31, four tapered recess 31 and four fixations for the tool of transition connecting structure 30
Part 12 is arranged in a one-to-one correspondence.In this way, above-mentioned setting so that encapsulating main body 10 with by pot electronics element 20 and transition connecting structure
30 installation is more firm, prevents from encapsulating main body 10 occurring in potting process and by pot electronics element 20 and transition connecting structure
30 influence encapsulating effect there is a phenomenon where relative movement, promote encapsulating quality and encapsulating effect.
Optionally, the separate surface by pot electronics element 20 of encapsulating main body 10 has multiple counter sinks 13, multiple countersunk heads
Hole 13 is arranged in a one-to-one correspondence with multiple fixing pieces 12, and the first end of fastener passes through fixing piece 12 and is fastened on transition connecting structure 30
On, the second end of fastener is located in counter sink 13.As shown in figure 3, encapsulating main body 10 is far from by the table of pot electronics element 20
There are four counter sink 13, four counter sinks 13 to be arranged in a one-to-one correspondence with four fixing pieces 12 for mask.In this way, when fastener is successively worn
It crosses after encapsulating main body 10, column section 121 and cone cell section 122 after being tightened on transition connecting structure 30, is threaded through encapsulating main body 10
On fastener will not protrude from the lower surface of encapsulating main body 10, and then avoid fastener and place encapsulating main body 10 operation it is flat
Platform or ground interfere, so that the structure of encapsulating main body 10 is more stable, to promote encapsulating effect.
As shown in Figure 1, interconnecting piece 14 is plate structure, the lower end surface of interconnecting piece 14 and the lower end surface of mounting frame 11 are flat
Together.
In the present embodiment, transition connecting structure 30 is plate structure, is LED module by pot electronics element 20.In this way,
Above-mentioned setting is easily worked, realized so that the structure of transition connecting structure 30 is simpler, thereby reduce encapsulating device plus
Work cost.
In the present embodiment, mounting frame 11 is rectangle frame.The length of rectangle frame is by the length of pot electronics element 20
The sum of tolerance limit is cut with bilateral technique side length and pcb board length, the width of rectangle frame is by the width of pot electronics element 20
Degree cuts the sum of tolerance limit with bilateral technique hem width and pcb board width, and the depth of rectangle frame is by pot electronics element 20
The sum of the thickness of pcb board 21, the thickness of bracket 40, the thickness of casting glue and thickness of transition connecting structure 30.
In the present embodiment, potting process is as follows:
(1) it will be fixed by screws in together by pot electronics element 20 and transition connecting structure 30 first；
(2) encapsulating master is fixed by screws in by pot electronics element 20 and transition connecting structure 30 by what is be fixed together
On body 10；
(3) to be placed in operation by assembled encapsulating main body 10 and by pot electronics element 20 and transition connecting structure 30 flat
Casting glue operation is carried out on platform；
(4) after encapsulating adhesive curing, the screw dismantled between transition connecting structure 30 and encapsulating main body 10 can be light by external force
Changing places will be split out from encapsulating main body 10 by pot electronics element 20 and transition connecting structure 30；
(5) it dismantles by the screw between pot electronics element 20 and transition connecting structure 30, by pot electronics element 20
It is separated with transition connecting structure 30.
In above-mentioned potting process, due to had between pot electronics element 20 and the inner wall of mounting frame 11 it is default between
Gap d has casting glue in encapsulating and casting glue solidification process and flows into mounting frame 11 from prepsetting gap d.Due to casting glue
Itself has viscosity, and prepsetting gap d is smaller to have siphonage, so the encapsulating glue amount flowed down from prepsetting gap d is smaller.Its
In, the casting glue flowed down from prepsetting gap d flows on interconnecting piece 14, lower end surface and interconnecting piece due to transition connecting structure 30
There is pre-determined distance h, then casting glue will not be bonded in the lower end surface of transition connecting structure, will not more bond between 14 upper surface
In the lower end surface of bracket 40 so that between transition connecting structure 30 and encapsulating main body 10, by pot electronics element 20 and mistake
The disassembly crossed between connection structure 30 is more easier.
Specifically, in entire production process, casting glue will not be with the lower surface of transition connecting structure 30 and bracket 40
Lower surface is in contact, then will not generate residue glue on thickness (height) direction, improve production efficiency, and being capable of effective guarantee
The consistency of casting glue thickness.
It can be seen from the above description that the above embodiment of the present invention realizes following technical effect:
Fixing piece is connected by interconnecting piece and the inner wall of mounting frame, and the upper surface of fixing piece protrudes from the upper end of interconnecting piece
Face setting.When needing using encapsulating device to being potted by pot electronics element, will be connected by pot electronics element and transition
Binding structure is mounted in encapsulating main body, casting glue poured after being installed in place be filled in by pot electronics element to by pot electronics
Element is potted.In potting process, transition connecting structure is between bracket and encapsulating main body, and transition connecting structure exists
Orthographic projection on bracket is located in bracket, has pre-determined distance between the lower end surface of transition connecting structure and the upper surface of interconnecting piece
h.In this way, above-mentioned setting can be avoided the contact surface and fixing piece and transition connecting structure of bracket and transition connecting structure
Contact surface is stained with resin glue, and then prevents transition connecting structure and encapsulating main body from bonding occurs and influence the disassembly of the two, also prevents
Only bracket and transition connecting structure occur bonding and influence to be solved existing by the disassembly of pot electronics element and transition connecting structure
Have in technology and the problem of both bonding and influence disassembly is easily occurred between pot electronics element and encapsulating main body.
Obviously, above-mentioned the described embodiment is only a part of the embodiment of the present invention, instead of all the embodiments.
Based on the embodiments of the present invention, obtained by those of ordinary skill in the art without making creative efforts all
Other embodiments should fall within the scope of the present invention.
It should be noted that term used herein above is merely to describe specific embodiment, and be not intended to restricted root
According to the illustrative embodiments of the application.As used herein, unless the context clearly indicates otherwise, otherwise singular
Also it is intended to include plural form, additionally, it should be understood that, when in the present specification using term "comprising" and/or " packet
Include " when, indicate existing characteristics, step, work, device, component and/or their combination.
It should be noted that the description and claims of this application and term " first " in above-mentioned attached drawing, "
Two " etc. be to be used to distinguish similar objects, without being used to describe a particular order or precedence order.It should be understood that using in this way
Data be interchangeable under appropriate circumstances, so that presently filed embodiment described herein can be in addition to illustrating herein
Or the sequence other than those of description is implemented.
The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention, for the skill of this field
For art personnel, the invention may be variously modified and varied.All within the spirits and principles of the present invention, made any to repair
Change, equivalent replacement, improvement etc., should all be included in the protection scope of the present invention.
Claims (10)
1. a kind of encapsulating device characterized by comprising
Encapsulating main body (10), including mounting frame (11), interconnecting piece (14), fixing piece (12), the fixing piece (12) pass through institute
It states interconnecting piece (14) to connect with the inner wall of the mounting frame (11), the upper surface of the fixing piece (12) protrudes from the connection
The upper surface in portion (14) is arranged；
Transition connecting structure (30), the transition connecting structure (30) with by pot electronics element (20) is detachably connected and position
It is described to pass through the transition connecting structure (30) by pot electronics element (20) in the lower section by pot electronics element (20)
It is connect with the fixing piece (12)；
Wherein, when the encapsulating main body (10) and it is described by pot electronics element (20) assembly in place when, transition connection knot
Orthographic projection of the structure (30) on the bracket (40) by pot electronics element (20) is located in the bracket (40), the transition
There is pre-determined distance h between the lower end surface of connection structure (30) and the upper surface of the interconnecting piece (14).
2. encapsulating device according to claim 1, which is characterized in that the pre-determined distance h is more than or equal to 2mm.
3. encapsulating device according to claim 1, which is characterized in that the side wall of the transition connecting structure (30) with it is described
There is pre-determined distance D, the pre-determined distance D to be more than or equal to 2mm between the side wall of the bracket (40) of pot electronics element (20).
4. encapsulating device according to claim 1, which is characterized in that described by pot electronics element (20) and the installation
There is prepsetting gap d, the prepsetting gap d to be less than or equal to 0.05mm between the inner wall of framework (11).
5. encapsulating device according to claim 1, which is characterized in that the upper surface of the mounting frame (11) is higher than described
Outer surface by pot electronics element (20) far from the encapsulating main body (10).
6. encapsulating device according to claim 1, which is characterized in that the fixing piece (12) includes sequentially connected column
Section (121) and cone cell section (122), the cone cell section (122) are connected by the column section (121) and the encapsulating main body (10)
It connects, the transition connecting structure (30) has and cone cell section (122) the shape phase towards the surface of the encapsulating main body (10)
The tapered recess (31) of adaptation, the cone cell section (122) is protruded into the tapered recess (31), so that the transition connecting structure
(30) towards the surface of the encapsulating main body (10) and the column section (121) towards the surface of the transition connecting structure (30)
It abuts, fastener is tightened in after sequentially passing through the encapsulating main body (10), the column section (121) and the cone cell section (122)
On the transition connecting structure (30).
7. encapsulating device according to claim 6, which is characterized in that the encapsulating main body (10) includes multiple fixations
Part (12), inner surface of multiple fixing pieces (12) around the mounting frame (11) are provided at circumferentially spaced, and the transition connects
Binding structure (30) has multiple tapered recess (31), multiple tapered recess (31) and multiple fixing pieces (12) one
One is arranged in correspondence with.
8. encapsulating device according to claim 6, which is characterized in that the encapsulating main body (10) is far from described by encapsulating electricity
The surface of subcomponent (20) has multiple counter sinks (13), and multiple counter sinks (13) and multiple fixing pieces (12) are one by one
It being correspondingly arranged, the first end of the fastener is fastened on the transition connecting structure (30) after passing through the fixing piece (12),
The second end of the fastener is located in the counter sink (13).
9. encapsulating device according to claim 1, which is characterized in that the interconnecting piece (14) is plate structure, the company
The lower end surface of socket part (14) is concordant with the lower end surface of the mounting frame (11).
10. encapsulating device according to claim 1, which is characterized in that the transition connecting structure (30) is plate structure,
It is described by pot electronics element (20) be LED module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811386445.2A CN109433514A (en) | 2018-11-20 | 2018-11-20 | Encapsulating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811386445.2A CN109433514A (en) | 2018-11-20 | 2018-11-20 | Encapsulating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109433514A true CN109433514A (en) | 2019-03-08 |
Family
ID=65553287
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811386445.2A Pending CN109433514A (en) | 2018-11-20 | 2018-11-20 | Encapsulating device |
Country Status (1)
| Country | Link |
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| CN (1) | CN109433514A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110675768A (en) * | 2019-11-12 | 2020-01-10 | 深圳创维－Rgb电子有限公司 | LED (light-emitting diode) assembling module |
Citations (7)
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