CN109425799B - Electronic component pre-burning test device and pre-burning furnace applied by same - Google Patents
Electronic component pre-burning test device and pre-burning furnace applied by same Download PDFInfo
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- CN109425799B CN109425799B CN201810424203.1A CN201810424203A CN109425799B CN 109425799 B CN109425799 B CN 109425799B CN 201810424203 A CN201810424203 A CN 201810424203A CN 109425799 B CN109425799 B CN 109425799B
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- 238000012360 testing method Methods 0.000 title claims abstract description 178
- 238000005452 bending Methods 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 238000010304 firing Methods 0.000 claims 2
- 230000000712 assembly Effects 0.000 claims 1
- 238000000429 assembly Methods 0.000 claims 1
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- 238000010586 diagram Methods 0.000 description 5
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/003—Environmental or reliability tests
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/01—Subjecting similar articles in turn to test, e.g. "go/no-go" tests in mass production; Testing objects at points as they pass through a testing station
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- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The invention provides an electronic component presintering test device and a presintering furnace applied by the same, which comprise a test fixture and an air guide cover; the testing tool is provided with a testing board, and a plurality of testing socket are arranged on the testing board for respectively placing the electronic components to be tested, and an air guiding cover is arranged at the bottom of the testing tool, a bottom plate is arranged in the wind scooper, a channel is arranged between the bottom plate and the test fixture, an air inlet is arranged at one side of the channel, the base plate is provided with a plurality of air outlets, when the burn-in test operation of the electronic components is executed in the burn-in furnace, namely, the hot air is intensively guided into the channel by the air inlet of the air guide cover and then is discharged from the air outlet on the bottom plate, so as to blow hot air to each electronic component to be tested on the lower layer test fixture in a centralized manner, so that each electronic component is rapidly heated to a preset test temperature, so that each electronic component to be tested can uniformly exchange heat with the output hot air, and the test operation can be executed at the preset test temperature, thereby achieving the benefit of improving the test quality.
Description
Technical Field
The invention relates to a burn-in test device of an electronic component, which can quickly heat the electronic component, ensure that the electronic component to be tested executes test operation within a preset test temperature and improve the test quality.
Background
At present, after the electronic components are manufactured, Burn-in test operation is often performed in a high temperature environment to eliminate defective products and ensure product quality; referring to fig. 1 and 2, a Burn-in test operation of a conventional electronic component is provided with a plurality of Burn-in test jigs 10 and a Burn-in oven (Burn-in oven), wherein the Burn-in test jig 10 is provided with a test board 11, and the test board 11 is provided with a plurality of test sockets 12 for respectively receiving an electronic component a to be tested; the pre-burning furnace is provided with an operation space 21 in a furnace body 20, one side of the operation space 21 is provided with an air supply passage 22 communicated with a hot air output device (not shown in the figure), a plurality of air supply ports 23 are arranged between the operation space 21 and the air supply passage 22, the other side of the operation space 21 is provided with an air exhaust passage 24, and a plurality of air exhaust ports 25 are arranged between the air exhaust passage 24 and the operation space 31; when executing Burn-in test operation, a plurality of Burn-in test fixtures 10 with electronic components A are erected in an operation space 21 of a furnace body 20 at proper intervals, hot air is output by a hot air output device in an air supply channel 22 and is input into the operation space 21 through the air supply ports 22, the hot air flows through the interval space between the Burn-in test fixtures 10 and is exhausted by the air exhaust ports 25 and the air exhaust channel 24, the electronic components A on the Burn-in test fixtures 10 are heated to a preset test temperature under the influence of the hot air flowing in the interval space, and then the electronic components A execute the Burn-in test operation of the electronic components A in a high temperature state; however, the hot air circulation method of the pre-burning furnace (Burn-in oven) has the following disadvantages in use:
each electronic component a on each pre-burning test fixture 10 is affected by the hot air circulating through each interval space to be heated, so that each electronic component a executes the pre-burning (Burn-in) test operation of each electronic component a in a high-temperature state; however, when the hot air output device outputs hot air in the air supply channel 22, because the hot air is input into each interval space from each air supply outlet 23 located at one side, each electronic component a adjacent to the air supply outlet 23 can obtain a better temperature rise effect, and each electronic component a adjacent to the air exhaust outlet 25 side reduces the temperature rise effect due to the thermal attenuation of the hot air, so that the temperature of each electronic component a is different, and the test operation of each electronic component a cannot be executed in a uniform temperature state, thereby affecting the test quality.
When Burn-in test operation is performed, the hot air output device is used for heating, so that the output hot air is heated to a preset test temperature, however, the temperature rise effect of each electronic component a adjacent to the air outlet 25 side is reduced due to the thermal attenuation of the hot air, so that each electronic component a adjacent to the air outlet 25 side cannot be ensured to be heated to the preset test temperature, and the test quality is further influenced.
Disclosure of Invention
In view of the above, the present inventors have conducted research and manufacturing experience in related industries for many years, and have made extensive research on the problems faced by the present inventors, and have made long-term research and trial work to develop an electronic component pre-burning test apparatus and a pre-burning furnace applied thereto, so as to effectively improve the drawbacks of the background art, which is the design objective of the present invention.
In order to achieve the purpose, the invention adopts the technical scheme that:
an electronic component burn-in test apparatus, comprising:
testing the fixture: the test board is provided with at least one test sleeve seat for placing the electronic component to be tested;
wind scooper: the air guiding cover is arranged below the test fixture, a bottom plate is arranged on the air guiding cover, at least one channel is arranged between the bottom plate and the test fixture, at least one air inlet is arranged on the first side of the channel, and at least one air outlet is arranged on the bottom plate.
In the electronic component burn-in test device, at least one frame part is arranged between at least one side edge of the test board of the test fixture and the air guide cover.
The electronic component presintering test device is characterized in that the air outlet of the bottom plate of the air guide cover corresponds to the test sleeve seat of the test fixture.
The electronic component pre-burning test device is characterized in that a first end edge of a bottom plate of the air guide cover is upwards bent and provided with a first baffle connected to the bottom of the test fixture, and a second end edge of the bottom plate is upwards bent and provided with a second baffle connected to the bottom of the test fixture, so that the channel is formed between the bottom plate and the bottom of the test fixture.
The electronic component presintering test device is characterized in that a first baffle of the air guide cover is provided with a first connecting part in a bending and extending mode, a second baffle is provided with a second connecting part in a bending and extending mode, and the first connecting part and the second connecting part are connected to the bottom of the test fixture.
The electronic component presintering test device is characterized in that a third baffle is arranged on the second side of the channel of the air guide cover.
The electronic component burn-in testing device is characterized in that at least one downward inclined air deflector is arranged on the first side edge of the bottom plate of the air guide cover in an extending mode.
The invention also provides a pre-burning furnace using the electronic component pre-burning test device, which is characterized by comprising:
a furnace body: an operation space is arranged, an air supply channel is arranged on one side of the operation space, at least one air supply outlet is arranged between the operation space and the air supply channel, an air exhaust channel is arranged on the other side of the operation space, and at least one air exhaust outlet is arranged between the air exhaust channel and the operation space;
at least one electronic component burn-in test device: the electronic component on the burn-in test device executes burn-in test operation in the furnace body.
The pre-burning furnace is used for the pre-burning test device of the electronic component, wherein the furnace body is provided with a bearing frame for supporting the test fixture.
The pre-burning furnace is characterized in that the air supply channel of the furnace body is provided with a plurality of air supply ports, the air exhaust channel of the furnace body is provided with a plurality of air exhaust ports, and a plurality of bearing frames are arranged between the plurality of air supply ports and the air exhaust ports so as to be used for erecting a plurality of pre-burning testing devices, and each pre-burning testing device is erected in the operation space of the furnace body at a proper interval distance and in an upper-lower layered mode.
One of the advantages of the present invention is to provide a pre-burning testing device for electronic components and a pre-burning furnace applied thereto, wherein the pre-burning testing device comprises a testing fixture and an air guiding cover; the testing tool is provided with a testing board, a plurality of testing sleeve seats are arranged on the testing board for respectively placing electronic components to be tested, an air guide cover is arranged at the bottom of the testing tool, a bottom plate is arranged in the air guide cover, a channel is arranged between the bottom plate and the testing tool, an air inlet is arranged at one side of the channel, a plurality of air outlets are arranged on the bottom plate, when the pre-burning test operation of the electronic components is executed in the pre-burning furnace, the hot air is intensively guided into the channel by the air inlet of the air guide cover and then is exhausted from the air outlet on the bottom plate, so that the hot air is intensively blown to the electronic components to be tested on the testing tool at the lower layer, the electronic components to be tested can uniformly exchange heat with the output hot air, and the benefit of improving the testing quality is achieved.
The second advantage of the present invention is to provide an electronic component pre-burning test device and a pre-burning furnace applied thereto, wherein the hot air is guided into the channel by the air inlet of the air guiding cover and then exhausted from the air outlet, so as to blow hot air to each electronic component to be tested on the lower layer test fixture, so that each electronic component to be tested is rapidly heated to a preset test temperature, thereby ensuring that the test operation is performed at the preset test temperature, and achieving the benefit of improving the test quality.
Drawings
Fig. 1 is an external view of a conventional electronic component burn-in test fixture.
Fig. 2 is a schematic diagram of a conventional electronic component burn-in test apparatus for performing a test operation.
Fig. 3 is an exploded view of the burn-in test apparatus of the present invention.
Fig. 4 is a combination schematic diagram of the burn-in testing apparatus of the present invention.
Figure 5 is an assembled cross-sectional view of the burn-in testing apparatus of the present invention.
Figure 6 is a schematic diagram (one) of the burn-in testing apparatus of the present invention for performing testing operations.
Fig. 7 is a schematic cross-sectional view of fig. 6.
Figure 8 is a schematic diagram (two) of the burn-in testing apparatus of the present invention for performing testing operations.
Figure 9 is a schematic diagram (three) of the burn-in testing apparatus of the present invention for performing testing operations.
Fig. 10 is an enlarged schematic view of a portion a of fig. 9.
Description of reference numerals: (existing section) 10-burn-in test fixture; 11-test board; 12-a test nest; 20-furnace body; 21-a working space; 22-an air supply channel; 23-an air supply outlet; 24-an exhaust channel; 25-an air outlet; a-an electronic component; (part of the invention) 30-burn-in test apparatus; 31-a test fixture; 311-test board; 312-test nest; 313-a socket; 314-a handle; 315-a setting part; 32-a wind scooper; 321-a bottom plate; 322-a first baffle; 3221-a first connection portion; 323-a second baffle; 3231-a second connecting portion; 324-a channel; 325-air inlet; 326-third baffle; 327-air outlet; 328-air deflector; 40-an electronic component; 50-furnace body; 51-a working space; 52-air supply channel; 53-air supply outlet; 54-an exhaust channel; 55-air outlet; and 56-bearing frame.
Detailed Description
To further understand the present invention, a preferred embodiment is shown in the drawings, and the following detailed description is given:
referring to fig. 3, fig. 4 and fig. 5, the electronic component burn-in testing apparatus 30 of the present invention includes a testing fixture 31 and an air guiding cover 32; the testing jig 31 is provided with a testing board 311, and a plurality of testing sockets 312 are provided on the testing board 311 for respectively placing the electronic components to be tested; a socket 313 electrically connected to each test socket 312 is disposed at a first end of the test board 311 for being plugged into a plug of an electrical system of the pre-burning furnace, so that each test socket 312 is electrically connected to a signal transmission system of the pre-burning furnace, and the electrical connection manner between the test board 311 of the test fixture 31 and the pre-burning furnace is not important in this application and is therefore not described in detail; a handle 314 is disposed at the second end of the test board 311 for the operation of the operator, and the first and second lateral edges of the test board 311 are respectively disposed with a rack 315 for being placed in the burn-in oven; the air guiding cover 32 is installed at the bottom of the testing fixture 31, the air guiding cover 32 is provided with a bottom plate 321, a first baffle 322 connected to the bottom of the testing fixture 31 is bent upwards at a first end edge of the bottom plate 321, a second baffle 323 connected to the bottom of the testing fixture 31 is bent upwards at a second end edge, and a channel 324 is formed between the bottom plate 321 and the bottom of the testing fixture 31; in this embodiment, the first baffle 322 is bent outward to form a first connection portion 3221, the second baffle 323 is bent outward to form a second connection portion 3231, the first connection portion 3221 and the second connection portion 3231 are respectively fastened to the bottom of the testing fixture 31 by bolts, an air inlet 325 is disposed on the first side of the channel 324, a third baffle 326 is disposed on the second side, and a plurality of air outlets 327 corresponding to the testing sockets 312 of the testing fixture 31 are disposed on the bottom plate 321, such that hot air can flow from the air inlet 325 into the channel 324 and then be discharged downward from the air outlets 327 on the bottom plate 321; in the present embodiment, the bottom plate 321 is provided with a downward-inclined air guiding plate 328 extending from a first side edge thereof to guide the hot air in a concentrated manner, so that the hot air is easy to flow into the channel 324 through the air inlet 325.
Referring to fig. 6 and 7, when the Burn-in test apparatus 30 of the present invention executes a Burn-in test operation for the electronic components 40, the electronic components 40 to be tested are respectively inserted into the test sockets 312 of the test board 311 of the test fixture 31; referring to fig. 8, a plurality of pre-burning test devices 30 with electronic components 40 to be tested are mounted in a pre-burning furnace (Burn-in oven), the pre-burning furnace is provided with a furnace body 50, the furnace body 50 is provided with an operating space 51, one side of the operating space 51 is provided with an air supply channel 52 communicated with a hot air output device (not shown in the figure), a plurality of air supply outlets 53 are arranged between the operating space 51 and the air supply channel 52, the other side of the operating space 51 is provided with an air exhaust channel 54, a plurality of air exhaust outlets 55 are arranged between the air exhaust channel 54 and the operating space 51, a support frame 56 is respectively arranged between each air supply outlet 53 and each air exhaust outlet 55 for mounting a mounting portion 315 of a test fixture 31, so that each pre-burning test device 30 is mounted in the operating space 51 in an upper and lower layered manner at a proper distance, and a socket 313 of the test fixture 31 is plugged into a plug (not shown in the figure) of an electric system of the pre-burning furnace, so that each test socket 312 is electrically connected to the power system of the pre-burning furnace.
Referring to fig. 9 and 10, the pre-burning furnace outputs hot air heated to a predetermined testing temperature through an air supply channel 52 by a hot air output device (not shown in the drawings), and inputs the hot air heated to the predetermined testing temperature into the working space 51 through air supply ports 53, when the hot air circulates into the working space 51 through the air supply ports 53, the hot air is intensively guided by the air deflector 328 of each air guiding cover 32, and circulates from the air inlet 325 into the channel 324 formed between the testing jig 31 and the air guiding cover 32, and then is output downwards from the air outlets 327 on the bottom plate 321, and the hot air is intensively blown to each electronic component 40 to be tested on the other testing jig 31 below by each air outlet 327, and the hot air is exhausted through the air outlet 55 and the air exhaust channel 54 of the furnace body 50, and each electronic component 40 to be tested respectively exchanges heat with the hot air output by each air outlet 327, heating to a preset test temperature, and then executing Burn-in test operation of each electronic component 40 in a high temperature state; thus, when the burn-in test device 30 of the present invention executes the burn-in test operation, the air inlet 325 of the air guiding cover 32 is utilized to intensively guide the hot air into the channel 324, and then the hot air is discharged from the air outlets 327 of the bottom plate 321 to intensively blow the hot air to the electronic components to be tested on the lower layer test fixture, so that the electronic components are rapidly heated to the preset test temperature, thereby not only enabling the electronic components to be tested to uniformly exchange heat with the output hot air, but also ensuring the electronic components to be tested to execute the test operation at the preset test temperature, and further achieving the practical benefit of improving the test quality.
The foregoing description is intended to be illustrative rather than limiting, and it will be appreciated by those skilled in the art that many modifications, variations or equivalents may be made without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (8)
1. An electronic component burn-in test apparatus, comprising:
testing the fixture: the test board is provided with at least one test sleeve seat for placing the electronic component to be tested;
wind scooper: the air guiding cover is fixed at the bottom of the testing jig and is positioned below the testing jig, the air guiding cover is provided with a bottom plate, a first end and a second end of the bottom plate are respectively provided with a first baffle and a second baffle which are connected with the bottom of the testing jig in an upward bending mode, at least one channel is arranged between the bottom plate and the testing jig, the first side of the channel is provided with at least one air inlet, the bottom plate is provided with at least one air outlet, the first side edge of the bottom plate of the air guiding cover extends to be provided with at least one air guiding plate which inclines downwards so as to intensively guide hot air to flow into the channel, the hot air in the channel flows through the bottom of the heating testing jig, and the hot air is blown to an electronic element to be tested of another testing jig at the lower layer through the air outlet.
2. The burn-in testing apparatus for electronic components of claim 1, wherein at least one mounting portion is disposed between at least one side edge of the testing board of the testing fixture and the air guiding cover.
3. The burn-in testing apparatus for electronic components of claim 1, wherein the air outlet of the bottom plate of the air guiding cover corresponds to the testing socket of the testing fixture.
4. The pre-burning test device of claim 1, wherein the first baffle of the air guiding cover is bent and extended to form a first connection portion, the second baffle is bent and extended to form a second connection portion, and the first connection portion and the second connection portion are connected to the bottom of the test fixture.
5. The burn-in testing apparatus for electronic assemblies according to claim 1, wherein the second side of the duct of the air deflection housing is provided with a third baffle.
6. A pre-burning furnace using an electronic component pre-burning test device is characterized by comprising:
a furnace body: an operation space is arranged, an air supply channel is arranged on one side of the operation space, at least one air supply outlet is arranged between the operation space and the air supply channel, an air exhaust channel is arranged on the other side of the operation space, and at least one air exhaust outlet is arranged between the air exhaust channel and the operation space;
at least one electronic assembly burn-in testing apparatus according to claim 1: the electronic component on the burn-in test device executes burn-in test operation in the furnace body.
7. The pre-firing furnace for the electronic component pre-firing test apparatus according to claim 6, wherein the furnace body is provided with a support for mounting the test fixture.
8. The pre-burning oven using the pre-burning test device of electronic components as claimed in claim 7, wherein the air supply passage of the oven body is provided with a plurality of the air supply ports, the air exhaust passage of the oven body is provided with a plurality of the air exhaust ports, and a plurality of the holders are provided between the plurality of the air supply ports and the air exhaust ports for mounting a plurality of the pre-burning test devices, and each of the pre-burning test devices is mounted in the operation space of the oven body at a proper interval and in an upper and lower layered manner.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW106129025 | 2017-08-25 | ||
| TW106129025A TWI639844B (en) | 2017-08-25 | 2017-08-25 | Burn-in test device for electronic component |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109425799A CN109425799A (en) | 2019-03-05 |
| CN109425799B true CN109425799B (en) | 2022-04-01 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201810424203.1A Active CN109425799B (en) | 2017-08-25 | 2018-05-04 | Electronic component pre-burning test device and pre-burning furnace applied by same |
Country Status (2)
| Country | Link |
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| CN (1) | CN109425799B (en) |
| TW (1) | TWI639844B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM594691U (en) | 2020-02-06 | 2020-05-01 | 鴻邦自動化有限公司 | Feedback pre-burning device of burn-in furnace |
| CN111289880A (en) * | 2020-03-25 | 2020-06-16 | 武汉精鸿电子技术有限公司 | High-low temperature incubator for batch test of semiconductor chips |
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| JPH05343490A (en) * | 1992-06-09 | 1993-12-24 | Hitachi Ltd | Method and apparatus for aging |
| TW200521443A (en) * | 2003-11-14 | 2005-07-01 | Micro Control Company | Cooling air flow control for burn-in system |
| JP2006090805A (en) * | 2004-09-22 | 2006-04-06 | Espec Corp | Burn-in apparatus |
| CN201859154U (en) * | 2010-10-16 | 2011-06-08 | 中芯国际集成电路制造(上海)有限公司 | Air baffle |
| TW201611143A (en) * | 2014-09-03 | 2016-03-16 | Hsinho Advanced Technology Inc | Cooling air control gate mechanism of burn-in system |
| JP2016180730A (en) * | 2015-03-25 | 2016-10-13 | 合同会社Ｐｌｅｓｏｎ | Temperature controller for burn-in test device |
| TW201704758A (en) * | 2015-07-23 | 2017-02-01 | Hsinho Advanced Tech Inc | Flow-guiding vapor chamber mechanism on burn-in board of burn-in system including a burn-in oven, a plurality of burn-in boards and a plurality of flow-guiding vapor chambers |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI282839B (en) * | 2005-06-16 | 2007-06-21 | Hsin Long Electric Machine Ind | Air controlling structure of heating furnace |
| TWM404979U (en) * | 2010-11-02 | 2011-06-01 | King Yuan Electronics Co Ltd | Pre-heating oven with frequencymodulation fan and heating adjustment device |
-
2017
- 2017-08-25 TW TW106129025A patent/TWI639844B/en active
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2018
- 2018-05-04 CN CN201810424203.1A patent/CN109425799B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05343490A (en) * | 1992-06-09 | 1993-12-24 | Hitachi Ltd | Method and apparatus for aging |
| TW200521443A (en) * | 2003-11-14 | 2005-07-01 | Micro Control Company | Cooling air flow control for burn-in system |
| JP2006090805A (en) * | 2004-09-22 | 2006-04-06 | Espec Corp | Burn-in apparatus |
| CN201859154U (en) * | 2010-10-16 | 2011-06-08 | 中芯国际集成电路制造(上海)有限公司 | Air baffle |
| TW201611143A (en) * | 2014-09-03 | 2016-03-16 | Hsinho Advanced Technology Inc | Cooling air control gate mechanism of burn-in system |
| JP2016180730A (en) * | 2015-03-25 | 2016-10-13 | 合同会社Ｐｌｅｓｏｎ | Temperature controller for burn-in test device |
| TW201704758A (en) * | 2015-07-23 | 2017-02-01 | Hsinho Advanced Tech Inc | Flow-guiding vapor chamber mechanism on burn-in board of burn-in system including a burn-in oven, a plurality of burn-in boards and a plurality of flow-guiding vapor chambers |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI639844B (en) | 2018-11-01 |
| TW201913123A (en) | 2019-04-01 |
| CN109425799A (en) | 2019-03-05 |
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