CN109417269A - Interface chip on glass assembly - Google Patents
Interface chip on glass assembly Download PDFInfo
- Publication number
- CN109417269A CN109417269A CN201780040353.6A CN201780040353A CN109417269A CN 109417269 A CN109417269 A CN 109417269A CN 201780040353 A CN201780040353 A CN 201780040353A CN 109417269 A CN109417269 A CN 109417269A
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- Prior art keywords
- component
- transparent
- coupled
- photoelectric subassembly
- array
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4267—Reduction of thermal stress, e.g. by selecting thermal coefficient of materials
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4238—Soldering
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4239—Adhesive bonding; Encapsulation with polymer material
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4245—Mounting of the opto-electronic elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4246—Bidirectionally operating package structures
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
- G02B6/425—Optical features
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4251—Sealed packages
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
- G02B6/4269—Cooling with heat sinks or radiation fins
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/026—Monolithically integrated components, e.g. waveguides, monitoring photo-detectors, drivers
- H01S5/0261—Non-optical elements, e.g. laser driver components, heaters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
- H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/40—Transceivers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B10/00—Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
- H04B10/80—Optical aspects relating to the use of optical transmission for specific applications, not provided for in groups H04B10/03 - H04B10/70, e.g. optical power feeding or optical transmission through water
- H04B10/801—Optical aspects relating to the use of optical transmission for specific applications, not provided for in groups H04B10/03 - H04B10/70, e.g. optical power feeding or optical transmission through water using optical interconnects, e.g. light coupled isolators, circuit board interconnections
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Engineering & Computer Science (AREA)
- Computer Networks & Wireless Communication (AREA)
- Signal Processing (AREA)
- Semiconductor Lasers (AREA)
- Optical Couplings Of Light Guides (AREA)
- Light Receiving Elements (AREA)
Abstract
In an exemplary embodiment, a kind of photoelectric subassembly (200) includes: electric substrate (208), the transparent component (202) being coupled on the first side of electric substrate and the first component (210), which can be formed by the nickel-clad copper for being coupled to second side opposite with the first side of electric substrate or may include such nickel-clad copper.Electric substrate, transparent component and the first component can limit sealing shell (244).Laser array (232) or receiver array (236) can be mechanically coupled to the transparent component of interior of shell, and are oriented and send or receive optical signal by transparent component.Laser array or receiver array may be electrically coupled to electric substrate.Second component (214) can be located between the first component and transparent component in sealing shell, and wherein thermal interfacial material forms the first interface between second component and transparent component.
Description
Technical field
Present disclosure relates generally to the photoelectric subassembly transmitted for signal.
Background technique
Optical signal can be used in the various applications of such as fiber optic network or computer system etc rapidly and reliably passing
Defeated information.
Compared with other kinds of network (such as based on the network of copper wire), fiber optic network has the advantages that various.It is many existing
Some copper networks with for copper wire technology close to the message transmission rate of maximum possible and close to the distance of maximum possible
Operation.Fiber optic network can be used for farther reliably transmitting data on more possible than copper networks with higher rate.
Compared with other computer systems, improved performance can be provided using the computer system of high-speed optical interconnection.
The performance of certain computer systems may by computer processor access memory or with the other component in computer system
The limitation of the rate of communication.Limitation may be partly due to the physical limit of data interconnection (being such as electrically connected).For example, having
The electric pin of the specific dimensions and/or surface area that can be used for being electrically connected can may only transmit the data of specific quantity, and this is again
The maximum bandwidth of data-signal may be limited.In some cases, when the maximum bandwidth of connection becomes Limiting-Performance Factors, this
The connection of sample may result in bottleneck.
Optical signal (being referred to as " optical signalling (optical signal) ") can be used in such as fiber optic network or meter
Information is rapidly and reliably transmitted in the various applications of calculation machine system.It is allowed using the high-speed optical interconnection of optical signal to increase
Data rate transmit information, to reduce or eliminate bottleneck.Although optical signal can be used for fiber optic network, computer system or its
Data are transmitted with increased data rate in his application, but many electronic components use electric signal.Photoelectric subassembly can be used for will be electric
Signal is converted to optical signal, converts optical signals to electric signal, or converts electrical signals to optical signal and convert optical signal
For electric signal.Photoelectric subassembly can be used in fiber optic network, computer system or other environment.
The semiconductor mount technologies of referred to as " flip-chip " can be used in some photoelectric subassemblys.Term " flip-chip " can refer to
Form the ad hoc approach of semiconductor device and/or the specific structure of semiconductor device.Specifically, flip-chip device can be used
Controlled collapse chip connection is by semiconductor device interconnecting to other circuits.
In typical controlled collapsible chip connec-tion, integrated circuit can be created on chip.Pad can be on the surface of chip
Upper metallization.Solder joint can be deposited on each pad.Chip can be cut into chip.It can overturn and positioning chip, make
Obtain the connector on soldered ball facing external circuit.Melt solder balls can be made so that chip is electrically coupled to external circuit.Electricity can be used
Insulating binder carries out underfill to the chip of installation.
Although controlled collapsible chip connec-tion is relatively common for certain semiconductor devices, implement to fall in photoelectric subassembly
There is challenge in cored blade technolgy.For example, photoelectric subassembly may include and dimensions, manufacturing tolerance, heat dissipation, stress tolerance, thermocouple
Conjunction, Power Processing and/or other relevant various requirements.These aspect may to formed flip-chip photoelectric subassembly structure or
Method provides limitation.In other respects, relevant to flip-chip photoelectric subassembly and its manufacture this disclosure provides overcoming
The solution of challenge.
Theme claimed is not limited to solve than any defect under environment as described above or only herein
The embodiment operated under than environment as described above.And this can be practiced by being to provide the background technique and being merely to illustrate
One exemplary technology area of some embodiments described in text.
Summary of the invention
Exemplary light electrical component may include the transparent component extended between first surface and opposite second surface.Swash
Light device array can be coupled to the second surface of transparent component.Laser array, which can be oriented to, sends optical signal by transparent component.
Receiver array can be coupled to the second surface of transparent component.Receiver array, which can be oriented to, receives light letter by transparent component
Number.Electric substrate can be mechanically coupled to transparent component.The first component can be coupled to electronics oppositely with transparent component
Substrate.The first component can limit holder (receptacle).Second component can be located in the holder limited by the first component
Between the first component and transparent component.The first surface of second component can be coupled to laser array and be connect by thermal interfacial material
Receive device array.Thermal interfacial material is softer than the first component and second component.The second surface of second component can pass through solder coupling
Close the first component.Second surface can be opposite with first surface.
Another exemplary photoelectric subassembly may include electric substrate, the transparent component being coupled on the first side of electric substrate,
And it is coupled to the first component of second side opposite with the first side of electric substrate.Electric substrate, transparent component and first
Component can limit sealing shell.Laser array or receiver array can be mechanically coupled to transparent component inside the housing,
And it is oriented and optical signal is sent or received by transparent component.Laser array or receiver array may be electrically coupled to electronics
Substrate.Second component can be located between the first component and transparent component in sealing shell, and wherein thermal interfacial material is second
The first interface is formed between component and transparent component.
In another example, photoelectric subassembly may include radiator, and the radiator includes the holder for being located in second component
The internal first component.Photoelectric subassembly may include transparent component and photovoltaic array, and the photovoltaic array is coupled to transparent component simultaneously
And it is oriented and optical signal is sent or received by transparent component.Electronic component can be coupled to transparent component, and electric substrate can
It is located between transparent component and second component.Thermal interfacial material can be positioned on photovoltaic array, electronic component and the first component it
Between.The first component can be coupled to photovoltaic array and electronic component by thermal interfacial material.
The content of present invention describes some concepts in simplified form, these concepts will in the following detailed description
It further describes.The content of present invention is not intended to the key features or essential features for identifying theme claimed, is not intended to
It is used to help determine the range of theme claimed.
Detailed description of the invention
By using attached drawing, illustrative embodiments will be described and explained using additional feature and details, in which:
Fig. 1 is the schematic diagram of exemplary optical-electric module；
Fig. 2 is the schematic side elevation for the exemplary light electrical component that can be realized in the optical-electric module of Fig. 1；With
Fig. 3 A-3F is the schematic side elevation of a part of the photoelectric subassembly of Fig. 2.
Fig. 4 is the example for the transparent component that can be realized in the photoelectric subassembly of Fig. 2.
Fig. 5 is the example for the component that can be realized in the photoelectric subassembly of Fig. 2.
Specific embodiment
The various aspects of present disclosure are described with reference to the accompanying drawings and by language-specific is used.It uses in this way
Attached drawing and description are not necessarily to be construed as limiting its range.According to present disclosure (including claim), other aspects be can be
It will be apparent that can learn by putting into practice.
Present disclosure relates generally to the photoelectric subassembly transmitted for signal.As it is used herein, term " photoelectricity group
Part " includes the component with optical component and electric component.The example of photoelectric subassembly include transponder, transceiver, transmitter,
And/or receiver, any combination thereof or its any part.
Fig. 1 is the schematic diagram of exemplary optical-electric module 100.A part that optical-electric module 100 can be realized as fiber optic network.Light
Electric module 100 can be used for converting the electrical signal to optical signal, the optical cable that then lightray propagation passes through fiber optic network.Alternatively or
Additionally, optical-electric module 100 can convert optical signals to electric signal.Optical-electric module 100 can be configured to receive one or more
Electric signal and/or optical signal.Optical-electric module 100 is also configured to export one or more electric signals and/or optical signal.
It will only illustrate and describe optical-electric module 100, and this description does not limit the scope of the disclosure.As shown,
Optical-electric module 100 includes optical receiver 102, post amplifier 104, laser driver 108, optical transmitting set 110, control module
112 and long-time memory 114.
In operation, optical-electric module 100 receives optical signal at optical receiver 102.Optical receiver 102 converts optical signal
At electric signal.Obtained electric signal 130 is supplied to post amplifier 104 by optical receiver 102.Post amplifier 104 amplifies electricity
The signal of amplification 118 is simultaneously supplied to host 116 by signal 130.Host 116 may include times that can be communicated with optical-electric module 100
What computing system, such as MAC controller (" MAC ") card, Synchronous Optical Network (SONET) framer or fellow.Photoelectricity
Module 100 can also receive electric signal from host 116, using as optical signal transmission.Specifically, laser driver 108 can be from master
Machine 116 receives electric signal 120, and optical transmitting set 110 can be driven to emit optical signal.Optical transmitting set 110 includes suitable
Light source, such as semiconductor laser are driven by driving signal 126, and driving signal 126 indicates the telecommunications provided by host 116
Numbers 120, so that light source transmitting be made to represent the optical signal of the information carried in electric signal 120.
Optical receiver 102, post amplifier 104, laser driver 108 and optical transmitting set 110 behavior can be due to many
Factor and dynamically change.For example, temperature change, power swing and feedback condition may all influence the performance of these components.Cause
This, optical-electric module 100 may include control module 112, can be with evaluation condition, and can be adjusted in response to the condition assessed
The operation of optical-electric module 100.The condition assessed may include the environmental condition of such as temperature etc and/or the light function such as emitted
The operating condition of rate and/or wavelength etc.The environmental condition and/or operating condition assessed allow control module 112 to optimize light
The performance of the dynamic change of electric module 100.
Control module 112 can be operatively coupled to post amplifier 104, as indicated by arrows 122, and operationally
It is coupled to laser driver 108, as indicated by arrows 124.Control module 112 can be from post amplifier 104 and/or Laser Driven
The information of the reception of device 108 such as operating condition etc.Control module 112 can transmit control signals to post amplifier 104
And/or laser driver 108.Control module 112 can be by adjusting post amplifier 104 and/or laser drive with control signal
Being arranged to optimize the operation of optical-electric module 100 on dynamic device 108.
The accessible long-time memory 114 of control module 112, in some embodiments, long-time memory 114 includes electricity can
Erasable programmable read-only memory (EPROM) (" EEPROM ").Long-time memory 114 can be alternately or in addition that any other is non-easily
The property lost memory source.Any part group mentioned in optical-electric module 100 can be encapsulated in together without restriction it is same encapsulation or
In difference encapsulation.
Control module 112 may include host interface 128, for transmitting the clock from host 116 and/or data-signal
To control module 112 and/or for will the data transmission from control module 112 to host 116.Host interface 128 can be real
Any one of existing various communications protocols, including but not limited to internal integrated circuit (I2C), management data input/output
(MDIO), serial peripheral interface (SPI) etc. or any combination thereof.
In the photoelectric subassembly for including flip-chip arrangement, some engagements, combination or coupling part between each component may
It is relatively hard and/or frangible.In some photoelectric subassemblys, many components can position relatively close to each other, lead to photoelectricity group
The closed tolerance of the various aspects of part, the positioning including various parts.
Some aspects described in present disclosure can be realized in flip-chip photoelectric subassembly.These aspects can solve
The relevant challenge certainly to controlled collapsible chip connec-tion is realized in photoelectric subassembly.For example, these aspects can be related to flip-chip photoelectricity group
The manufacture of part, with meet to dimensions, manufacturing tolerance, heat dissipation, stress tolerance, be electrically coupled, Power Processing and/or other are related
Various requirement.
Some components of photoelectric subassembly may generate heat during operation, and some components may need relatively
High rate of heat dissipation.Specifically, such as the component of laser, receiver, driver and/or electric component etc may operate
Period generates heat, these heats may need to dissipate so that photoelectric subassembly works normally.It can be certain for the distribution of some components
The operation temperature of range, in order to make component work normally and/or prevent the non-sensitive part of damage photoelectric subassembly, no more than these
Operation temperature.Therefore, the heat management of photoelectric subassembly can be used for working normally photoelectric subassembly under various conditions.For example, heat pipe
Reason can be used for high density photoelectric subassembly comprising be relatively close to each other many components of positioning to generate in space relatively more
More heats.
The heat generated during operation may also lead to the stress in photoelectric subassembly.For example, when photoelectric subassembly is heated
And/or when cooling, the various pieces of photoelectric subassembly can based on different heat expansion characteristic expansion or shrinkage.It is swollen with different heat
Each section of the photoelectric subassembly of swollen coefficient is inflatable or shrinks different amounts and/or with different rate expansion or shrinkage.This can
It can lead to the variation of the stress or tolerance in the various pieces of photoelectric subassembly.
In some cases, the stress effect that heat generates may be shown in various engagements, combination and/or coupling part.
Especially if engagement, combination and/or coupling part are between two kinds of materials with different heat expansion coefficient.This stress effect
It should may weaken or destroy engagement, combination and/or coupling part, so that photoelectric subassembly can not operate.It can be used soft or flexible
Material mitigate this stress effect.However, soft or flexible material may be not suitable for certain parts of photoelectric subassembly.Example
Such as, some soft or flexible materials may have poor thermal conductivity, and may be not suitable in some of photoelectric subassembly
It radiates in part.In another example, soft or flexible material may have the heat different from the other parts of photoelectric subassembly
The coefficient of expansion, and this species diversity can actually can increase thermal stress effects.In addition, some parts of photoelectric subassembly it is sustainable or
Reinforce some parts of photoelectric subassembly.In such a case, it is possible to implement harder material.
Photoelectric subassembly may include the feature structure of such as radiator and/or thermoelectric (al) cooler etc, with management in the operation phase
Between the heat that generates.For radiator, it may be necessary to the material with relatively high thermal conductivity.However, having high thermal conductivity
Material it is usually harder and/or more crisp than relatively soft material, these relatively soft materials can be used for reducing stress effect
It answers.
In some cases, the packing material of higher density can be included in softer or flexible material and be led with increasing it
It is hot.But when introducing the filler of higher density to increase thermal conductivity, pliability, viscosity and/or the compliance of obtained material
It may reduce.
Aspect described in present disclosure can help to solve stress effect, while keep appropriate in photoelectric subassembly
Heat dissipation.The various aspects of described photoelectric subassembly may include various beneficial thermal propertys, to maintain the integrality of its component, increase
Operation lifetime, the range of extended operation condition, and/or new potential application is created for described photoelectric subassembly.In addition, beneficial
Thermal property be useful for providing perhaps multipart high density photoelectric subassembly application wherein very close to each otherly.Fig. 2 shows
Exemplary light electrical component 200 is gone out, can have been realized in the optical-electric module 100 of Fig. 1 and/or in other operating environments.Light
Electrical component 200 may include transparent component 202, and transparent component 202 is formed by least partly transparent or translucent material, such as glass
Glass, plastics, polymer or the like.Transparent component 202 can prolong between first surface 204 and opposite second surface 206
It stretches.One or more lens 218 can be positioned on first surface 204, and the various parts of photoelectric subassembly 200 can be positioned on
On two surfaces 206.As shown, the component being located on second surface 206 may include laser array 232, receiver array
234, driver 236, electric component 230 and/or passive component 238, or any combination thereof.Laser array 232 and receiver
Array 234 is referred to alternatively as photovoltaic array.
Laser array 232, which is oriented at, emits optical signal by transparent component 202 and one or more lens 218.
Receiver array 234, which is oriented at, receives optical signal by transparent component 202 and/or one or more lens 218.Lens
218 can be configured to transmission, guidance and/or focus from laser array 232 and/or to the optical signal of receiver array 234.
Lens 218 can be optical transmission surface, such as curved surface (such as concave surface or convex surface), plane or combinations thereof.
Laser array 232 may include array of source, light source such as semiconductor laser, light emitting diode, vertical cavity surface
Emitting laser (VCSEL), edge emitter laser, distributed Feedback (DFB) laser, distributed Bragg reflector
(DBR) laser or any other suitable light source.Driver 236 can be configured to receive electric signal from host, and drive
Laser array 232 is to emit optical signal.In some respects, driver 236 can correspond to the laser driver for Fig. 1 description
108.In some configurations, driver 236 can be SiGe driver ic.The light source of laser array 232 can origin
The driving signal of output from driver 236 drives, to make the optical signal of light source transmitting representative information.Receiver array 234 may include
Receiver array, receiver such as photodiode, photo-resistor, reverse bias light emitting diode (LED), photodetector
Or it is able to detect any other suitable component of light.In some configurations, receiver array 234 may include at least one monitoring
Device photodiode (MPD).
Electric component 230 can be integrated circuit (IC) or any electric component suitable for photoelectric subassembly 200.Some
In configuration, electric component 230 can correspond to the control module 112 described referring to Fig.1.Photoelectric subassembly 200 may include any quantity
Passive component, such as passive component 238.Passive component may include resistor, capacitor, thermistor or be suitable for photoelectricity group
Any other component of part 200.
Redistributing layer 212 can be located at least part of second surface 206.Redistributing layer 212 can be conductive layer,
It is configured as being electrically coupled some or all of components on second surface 206, such as laser array 232, receiver array
234, driver 236, electric component 230 and/or passive component 238, or any combination thereof.As shown, laser array
232, receiver array 234, driver 236, electric component 230 and/or passive component 238 can be respectively via being located at each it
Between electrical connection and be electrically coupled to redistributing layer 212.
Underfill 228 can be located at laser array 232, receiver array 234, driver 236, electric component
Between 230 and transparent component 202.Underfill 228 can be transparent or semitransparent material, allow optical signal to pass through saturating
Bright component 202 reaches receiver array 234 or advances from laser array 232.Laser battle array can be filled in underfill 228
Space between column 232, receiver array 234 and transparent component 202.In some configurations, the material of underfill 228
It can be chosen and substantially matched with the refractive index with transparent component 202.Underfill 228, which can be positioned so that, at least partly to be enclosed
Around laser array 232, receiver array 234, driver 236 and/or electric component 230.
Transparent component 202 can be coupled to electric substrate 208 by the first solder 222 and/or underfill 226.Electricity
Submount 208 can be printed circuit board (PCB), flexible circuit or any other suitable electric substrate.In some configurations,
First solder 222 and underfill 226 cooperate with each other so that transparent component 202 is coupled to electric substrate 208.First solder
Transparent component 202 can be electrically coupled to electric substrate 208 by 222.Specifically, the first solder 222 can dividing again by transparent component 202
What layer of cloth 212 was electrically coupled to electric substrate 208 is electrically coupled portion.In some configurations, the first solder 222 may be electrically coupled to electronics
Pad on substrate 208.Transparent component 202 can be sealed to electric substrate 208 by underfill 226.In some configurations
In, underfill 226 can form closing or semi-enclosed sealing between transparent component 202 and electric substrate 208.?
In some configurations, the electrical connection formed by the first solder 222 can be reinforced or be supported to underfill 226.
Electric substrate 208 can be coupled to the first component 210.The first component 210 can be radiator, reinforcer
(stiffener) or both.The first component 210 can be formed by the material with relatively high thermal conductivity.Additionally or substitute
Ground, the first component 210 can be formed by relatively hard material.For example, the first component 210 can be formed by nickel-clad copper or may include plating
Ambrose alloy.The first component 210 can support or some parts of ruggedized electronics substrate 208 and/or transparent component 202.In some configurations
In, the first component 210 can be used for reducing the bending or flexure of electric substrate 208 and/or transparent component 202.For example, in photoelectricity group
During the operation of part 200, the first component 210 can be conducted away heat from some parts of photoelectric subassembly 200.As shown,
First side of electric substrate 208 can be coupled to transparent component 202, and opposite second side of electric substrate 208 can couple
To the first component 210.In some configurations, electric substrate 208 can be coupled to the first component 210 by adhesive 242.In this way
Configuration in, adhesive 242 can interface between electric substrate 208 and the first component 210.
Transparent component 202 can be coupled to second component 214.Second component 214 can be positioned at least partially at by first
In the holder 244 that part 210 limits.In some configurations, transparent component 202 can be coupled to second component by adhesive 240
214.Adhesive 240, laser array 232, receiver array 234, driver 236, electric component 230 and/or passive component
238 can be positioned between second component 214 and transparent component 202.Adhesive 240 can fill second component 214 and hyalomere
A part of space between part 202.
As shown, the first surface of second component 214 can be coupled to laser array 232, receiver array 234, drive
Dynamic device 236 and/or electric component 230, and the opposite second surface of second component 214 can be coupled to the first component 210.
Specifically, the first surface of second component 214 can be coupled to laser array 232, receiver array by thermal interfacial material 216
234, driver 236 and/or electric component 230.The second surface of second component 214 can be coupled to by the second solder 224
One component 210.Thermal interfacial material 216 can form laser array 232, receiver array 234, driver 236 and/or electrical part
Interface between part 230 and second component 214.Second solder 224 can be formed between second component 214 and the first component 210
Interface.
Second component 214 can be formed by the material with relatively high thermal conductivity.Additionally or alternatively, second component
214 can be formed by relatively hard material.Additionally or alternatively, thermal interfacial material 216 can be by with relatively high thermally conductive
The material of rate is formed.Additionally or alternatively, thermal interfacial material 216 can be formed by flexible relative and/or flexible material.Example
Such as, thermal interfacial material 216 can be formed by silicone resin and packing material or may include silicone resin and packing material.In some configurations
In, thermal interfacial material 216 can be formed by the material softer than second component 214 and/or the first component 210.In some configurations, hot
Boundary material 216 can be relatively thin layer.For example, thermal interfacial material 216 may include such as thickness between 50 microns and 100
Micron between, between 50 microns and 75 microns, between 25 microns and 75 microns, less than 100 microns, it is micro- less than 200
Rice, less than 300 microns, greater than 25 microns, greater than 50 microns or its any suitable combined size.In another example, hot
The thickness range of boundary material 216 can between 50 microns and 100 microns, between 50 microns and 75 microns, between 25
Micron and 75 microns between, less than 100 microns, less than 200 microns, less than 300 microns, be greater than 25 microns, be greater than 50 microns or
Its any suitable combination.
Second component 214 and/or thermal interfacial material 216 it is sustainable or reinforce laser array 232, receiver array 234,
Driver 236 and/or electric component 230.In some configurations, when the other parts of photoelectric subassembly 200 are due to acting on photoelectricity
Power on component 200 and when expanding, shrink, be bent or bend and (such as thermally expanding or shrink), second component 214 and/or hot boundary
Plane materiel material 216 can support laser array 232, receiver array 234, driver 236 and/or electric component 230.Match some
In setting, second component 214 and/or thermal interfacial material 216 can help to some parts (such as laser for photoelectric subassembly 200
Array 232, receiver array 234, driver 236 and/or electric component 230) to provide static discharge (ESD) and/or electromagnetism dry
Disturb (EMI) protection.In such a configuration, it is suitable that the material of second component 214 and/or thermal interfacial material 216, which can choose,
It is protected in providing ESD and/or EMI.
Second component 214, thermal interfacial material 216, the second solder 224 and/or the first component 210 can be by heats from photoelectricity group
The some parts of part 200 conduct away.In some configurations, for example, during the operation of photoelectric subassembly 200, all second
Part 214, thermal interfacial material 216, the second solder 224 and the first component 210 may both contribute to allow heat from laser array
232, receiver array 234, driver 236 and/or electric component 230 dissipate.
As shown, the first component 210 and transparent component 202 can be by laser array 232, receiver array 234, drives
Dynamic device 236, electric component 230 and/or passive component 238 are sealed in closing or semi-enclosed shell.
Aspect described in present disclosure can help to solve stress effect, while keep appropriate in photoelectric subassembly
Heat dissipation.In some respects, the radiator of photoelectric subassembly 200 can be formed by two individual components.For example, photoelectric subassembly 200
Radiator can be formed by the first component 210 and second component 214, and the individual component can be by suitably coupling
Or joint portion (such as the second solder 224) is coupled to each other.In addition, second component 214 can by such as thermal interfacial material 216 it
The flexible relative of class and/or flexible material are coupled to laser array 232, receiver array 234, driver 236 and/or electricity
Gas component 230.
Such configuration may include for such as laser array 232, receiver array 234, driver 236 and/or electricity
The appropriate heat dissipation of the component of gas component 230 etc.Specifically, heat can be via thermal interfacial material 216, the first component 210, second
Solder 224 and/or second component 214 are from laser array 232, receiver array 234, driver 236 and/or electric component
230 dissipate.Additionally or alternatively, such configuration can contribute to reduce engagement, combination or the coupling part of photoelectric subassembly 200
The stress effect at place.For example, second component 214 and/or thermal interfacial material 216 can support laser array 232, receiver array
234, driver 236 and/or electric component 230, while reducing such as the first solder 222, adhesive 242, and/or transparent component
Coupling part between 202 and laser array 232, receiver array 234, driver 236 and/or electric component 230 etc
Stress effect in coupling.
In some respects, thermal interfacial material 216 can provide mechanical and/or ESD for some aspects of photoelectric subassembly 200 and protect
Shield.Specifically, thermal interfacial material 216 can help to as laser array 232, receiver array 234, driver 236 and/or electricity
Gas component 230 provides mechanical and/or ESD protection.
Fig. 3 A-3F shows some parts of the photoelectric subassembly 200 of Fig. 2.Referring to Fig. 3 A-3F, description is manufactured into photoelectricity group
The exemplary aspect of part (such as photoelectric subassembly 200).
As shown in Figure 3A, lens 218 may be formed on the first surface 204 of transparent component 202.Lens 218 can couple
To first surface 204 or it is formed on first surface 204.Therefore, lens 218 can be integral with transparent component 202, Huo Zhe
It forms transparent component 202 and is coupled to transparent element 202 later.Redistributing layer 212 may be formed at the second surface of transparent component 202
On 206.Redistributing layer 212 can be deposited on second surface 206.Depositing redistributing layer 212 may include by patterns of conductive materials
With metallization on second surface 206, and/or form on second surface 206 any suitable technique of conductive material.
Laser array 232, receiver array 234, driver 236, electric component 230 and/or passive component 238 can couplings
It closes the second surface 206 of transparent component 202 or is formed on the second surface 206 of transparent component 202.In some configurations,
These components can be for example, by landing pad, solder and/or other suitable structure Couplings to second surface 206.Landing pad
It can be by laser array 232, receiver array 234, driver 236, electric component 230 and/or passive component 238 mechanically coupling
Second surface 206 is closed, and these components can be electrically coupled to redistributing layer 212.In other configurations, laser array
232, any suitable technique can be used in receiver array 234, driver 236, electric component 230 and/or passive component 238
It is formed on second surface 206.
First solder 222 can be coupled to second surface 206.In some configurations, the first solder 222 can be electrically coupled to divides again
Layer of cloth 212.In laser array 232, receiver array 234,238 coupling of driver 236, electric component 230 and/or passive component
Before or after closing second surface 206 or being formed on second surface 206, underfill 228 can be coupled to the second table
Face 206 is formed on second surface 206, as shown in the figure.
As shown in Figure 3A, a part of photoelectric subassembly 200 can be positioned on supporting element 220.Go to Fig. 3 B, photoelectric subassembly
200 part can be positioned on supporting element 220.Supporting element 220 can be configured to reinforce during the various aspects of manufacture
The part of photoelectric subassembly 200.In some configurations, supporting element 220 can be formed by optical clear or trnaslucent materials.At this
In the configuration of sample, supporting element 220 can promote the part of photoelectric subassembly 200 optical alignment during manufacture or test.
As shown in Figure 3 C, second component 214 can be positioned on transparent component 202 and laser array 232, receiver array
234, on driver 236 and/or electric component 230.In some configurations, adhesive may be provided on second component 214.Turn
To Fig. 3 D, second component 214 can be coupled to transparent component 202 and laser array 232, receiver array 234, driver 236
And/or electric component 230.
Second component 214 and transparent component 202 can be coupled to each other by adhesive 240.It is arranged in adhesive 240 second
After on component 214, transparent component 202 can be positioned so as to be connect with 240 interface of adhesive, therefore transparent component 202 is by viscous
Mixture 240 is kept relative to second component 214.
Second component 214 can be mechanical couplings and to be thermally coupled to laser array 232, receiver array 234, driver
236 and/or electric component 230.For example, as shown in Figure 3 C, thermal interfacial material 216 could attach to second component 214, then second
Component 214 can be positioned so that and laser array 232,230 interface of receiver array 234, driver 236 and/or electric component
Connection.In some configurations, second component 214 is remained to laser array 232, receiver array by thermal interfacial material 216
234, driver 236 and/or electric component 230.In other configurations, thermal interfacial material 216 be can be positioned so that against laser
Array 232, receiver array 234, driver 236 and/or electric component 230, but corresponding component can not be protected each other
It holds together.Second component 214 can be thermally coupled to laser array 232, receiver array 234, driving by thermal interfacial material 216
Device 236 and/or electric component 230, allow heat from laser array 232, receiver array 234, driver 236 and/
Or electric component 230 is transferred to second component 214, vice versa.
As shown, some components of such as passive component 238 etc can be coupled to transparent component 202 but be not coupled to
Two components 214.These components can not generate heat during operation, or can not generate such as other component (such as laser
Device array 232, receiver array 234, driver 236 and/or electric component 230) so much heat.Therefore, these components
It may not be needed or be not benefit from the heat dissipation by second component 214.
It, can be to 214 applied force of second component to be arranged when component is coupled to each other as shown in the arrow in Fig. 3 D
To be resisted against on transparent component 202, laser array 232, receiver array 234, driver 236 and/or electric component 230.
This can help ensure that forms suitable interface between the component of coupling.
Fig. 3 E is gone to, the first component 210 for example can be coupled to electric substrate 208 using adhesive 242.Second solder 224
It can be positioned in the holder 244 of the first component 210.Photoelectric subassembly 200 shown in Fig. 3 D includes being coupled to transparent component 202
Second component 214 including part can be positioned on the holder 244 of the first component 210.
As illustrated in Figure 3 F, the second component 214 for being coupled to transparent component 202 can be positioned at least partially in holder 244,
So that second component 214 is for example connect at the second solder 224 with 210 interface of the first component, and make transparent component 202
Such as it is connect at the first solder 222 with 208 interface of electric substrate.Can heat the first solder 222 and/or the second solder 224 with
At least partly melt or soften the first solder 222 and/or the second solder 222.Heating the first solder 222 can be by transparent component
202 mechanically and/or are electrically coupled to electric substrate 208.Heating the second solder 224 can be by the first component 210 and second
214 machinery of component and thermal coupling.
In some configurations, the first solder 222 and the second solder 224 may include different fusing points, so that the first solder 222
It is melted at a temperature of lower than the second solder 224, or vice versa.In such a configuration, when photoelectric subassembly 200 at least
When a part is heated, one in the first solder 222 or the second solder 224 melts and/or is formed before another solder
Engaging portion.The some parts that such configuration can promote photoelectric subassembly 200 are positioned and/or are aligned during assembly.
For example, the second solder 224 may include the fusing point lower than the first solder 222.Photoelectric subassembly 200 can be heated to melt
Second component 214 and the first component 210 are located in holder 244 by the second solder 224 oppositely, suitable to be formed
Interface.Photoelectric subassembly 200 can further be heated to melt the first solder 222, in transparent component 202 and electric substrate 208
Between formed combine.
In some respects, boundary can be formed to help to prevent the first solder 222 and/or the second solder 224 to be applied
To or advance to the undesirable part of photoelectric subassembly 200.In such a configuration, boundary can be configured to the first solder 222
And/or second solder 224 be limited in the desired region of photoelectric subassembly 200.For example, in some configurations, boundary may include weldering
Mask (solder mask) or solder resist (solder resist) are connect, helps to prevent the first solder 222 and/or the second weldering
Material 224 is applied to the undesirable part of photoelectric subassembly 200.Solder mask may include be applied to close to the first solder 222 and/or
The polymeric layer in the region of the second solder 224, to prevent solder to be applied to undesirable region.In other configurations, Ke Yishi
Any suitable boundary is applied to prevent the first solder 222 and/or the second solder 224 to be applied to or advance to photoelectric subassembly 200
Undesirable part.
After the first solder 222 couples transparent component 202 and electric substrate 208, can by photoelectric subassembly 200 it is cooling with
Solidified welding engaging portion, and underfill 226 can be positioned at around the first solder 222.Additionally or alternatively, bottom
Portion's packing material 226, which can be positioned so that, is sealed to electric substrate 208 for transparent component 202.
Fig. 4 is the example with the transparent component 202 of camera lens protector 250.As shown, camera lens protector 250 can be determined
Position is on the first surface 204 on a part of transparent component 202.The size and shape of camera lens protector 250 can be set
To shield lens 218.This configuration can help to that lens 218 is prevented to be damaged in some cases.For example, working as transparent component
202 when being located on supporting element (such as supporting element 220 of Fig. 3 A-3D), and lens protector 250 is convenient for protection lens 218.At this
In the case of kind, supporting element 220 may not include and/or not need the structure for protecting lens 218.
Fig. 5 is another example of second component 214a.Second component 214a may include times described for second component 214
What suitable aspect.As shown, second component 214a may include groove 260.Groove 260 can be configured to receive and/or protect
Hold thermal interfacial material 216.In some respects, groove 260 can be convenient for the manufacture of photoelectric subassembly 200.For example, groove 260 can be in warm
Thermal interfacial material 216 is kept during the formation of boundary material 216.In other respects, groove 260 can be determined convenient for thermal interfacial material
Position.Groove 260 can substantially extend the length of second component 214a.In some configurations, groove 260 terminates at second component
Near the end of 214a.In some configurations, groove 260 may include the size that such as depth is 100 microns (μm).Match some
In setting, groove 260 may include between 0 μm and 200 μm, between 50 μm and 150 μm, between 80 μm and 120 μm,
Or the depth of any other suitable value or combinations thereof.
Term used in the specification and claims is not limited to dictionary meanings, be only used for making it possible to it is clear and
Consistently understand present disclosure.It should be understood that unless the context clearly determines otherwise, otherwise such as " one ", "one" and " institute
State " etc the singular of word include plural object.Thus, for example, mention " parts surface " include be related to one or
Multiple such surfaces.
Term " substantial " refers to that the feature, parameter or value do not need accurately to realize, but deviation or variation (such as
Including tolerance, measurement error, measurement accuracy limitation and other factors well known by persons skilled in the art) it can be not interfere feature
The amount for being intended to the effect provided occurs.
In the case where not departing from the spirit or essential attributes of present disclosure, the various aspects of present disclosure can be with it
He embodies form.Described aspect is all considered to be illustrative and be not restrictive in all respects.It is claimed
Theme is by appended claims rather than the description of front indicates.All changes in the meaning and equivalency range of claim
It is included within the scope of its.
Claims (20)
1. a kind of photoelectric subassembly, comprising:
Transparent component, the transparent component extend between first surface and opposite second surface；
Laser array, the laser array are coupled to the second surface of the transparent component, the laser array
It is oriented to send optical signal by the transparent component；
Receiver array, the receiver array are coupled to the second surface of the transparent component, the receiver array
It is oriented to receive optical signal by the transparent component；
Electric substrate, the electric substrate are mechanically coupled to the transparent component；
The first component, the first component are coupled to the electric substrate oppositely with the transparent component, and described first
Part limits holder；With
Second component, the second component be located in the holder limited by the first component the first component and
Between the transparent component, the first surface of the second component is coupled to the laser array and institute by thermal interfacial material
Receiver array is stated, the thermal interfacial material is softer than the first component and the second component, and the of the second component
By coupling solder to the first component, the second surface is opposite with the first surface on two surfaces.
2. photoelectric subassembly as described in claim 1, wherein the electric substrate be coupled to by the second solder mechanical it is described
Transparent component, second solder have the fusing point with different melting points with the solder.
3. photoelectric subassembly as described in claim 1, wherein the transparent component is by being located at the transparent component and described the
Adhesive between two components is coupled to the second component.
4. photoelectric subassembly as described in claim 1, further comprises: redistributing layer, the redistributing layer are located at described transparent
On the second surface of component, the redistributing layer is electrically coupled at least described electric substrate and the laser array or institute
State receiver array.
5. photoelectric subassembly as claimed in claim 4, further comprises: electronic component, the electronic component are coupled to described
The second surface of bright component, the electronic component are electrically coupled to the laser array or described by the redistributing layer
Receiver array.
6. photoelectric subassembly as claimed in claim 4, further comprises: passive component, the passive component are coupled to described
The second surface of bright component, the passive component are electrically coupled to the redistributing layer.
7. photoelectric subassembly as claimed in claim 4, further comprises: one or more lens, one or more of lens
It is located on the first surface of the transparent component, the laser array is oriented at least one by the lens
A transmission optical signal, and the receiver array is oriented to receive optical signal by least another of the lens.
8. a kind of photoelectric subassembly, comprising:
Electric substrate；
Transparent component, the transparent component are coupled on the first side of the electric substrate；
The first component, the first component are coupled to second side opposite with first side of the electric substrate,
Wherein the electric substrate, the transparent component and the first component limit sealing shell；
The internal mechanical ground coupling of laser array or receiver array, the laser array or receiver array in the shell
Close the transparent component, and be oriented and optical signal is sent or received by the transparent component, the laser array or
Receiver array is electrically coupled to the electric substrate；With
Second component, the second component be located in the sealing shell first component and the transparent component it
Between, wherein thermal interfacial material forms the first interface between the second component and the transparent component.
9. photoelectric subassembly as claimed in claim 8, further comprises: the first solder, first solder is at described second
Second contact surface is formed between part and the first component.
10. photoelectric subassembly as claimed in claim 9, further comprises: redistributing layer, the redistributing layer are located at described transparent
On the surface of component, the redistributing layer is electrically coupled at least described electric substrate and the laser array or the receiver
Array.
11. photoelectric subassembly as claimed in claim 10, in which:
The electric substrate is coupled to the transparent component by the second solder mechanical；
The electric substrate is electrically coupled to the redistributing layer by second solder；
Second solder includes the fusing point with different melting points with first solder；And
Boundary limits second solder.
12. photoelectric subassembly as claimed in claim 10, further comprises: electronic component, the electronic component is in the shell
Be internally coupled to the transparent component, the electronic component by the redistributing layer be electrically coupled to the laser array or
The receiver array.
13. photoelectric subassembly as claimed in claim 10, further comprises: passive component, the passive component is in the shell
Be internally coupled to the transparent component, the passive component is electrically coupled to the redistributing layer.
14. photoelectric subassembly as claimed in claim 8, wherein the transparent component is by being located at the transparent component and described the
Adhesive between two components is coupled to the second component.
15. photoelectric subassembly as claimed in claim 8, further comprises: one or more lens, one or more of lens
It is located on the surface of the transparent component, the laser array is oriented to send light by least one of the lens
Signal, and the receiver array is oriented to receive optical signal by least another of the lens.
16. photoelectric subassembly as claimed in claim 8, the second component limits groove, and the thermal interfacial material is located at described
In groove.
17. a kind of photoelectric subassembly, comprising:
Radiator, the radiator include the first component for being located in the inside of holder of second component；
Transparent component；
Photovoltaic array, the photovoltaic array, which is coupled to the transparent component and is oriented, to be sent or is connect by the transparent component
Receive optical signal；
Electronic component, the electronic component are coupled to the transparent component；
Electric substrate, the electric substrate are located between the transparent component and the second component；With
Thermal interfacial material, the thermal interfacial material be located in the photovoltaic array, the electronic component and the first component it
Between, the first component is coupled to the photovoltaic array and the electronic component by the thermal interfacial material.
18. photoelectric subassembly as claimed in claim 17, further comprises: being located in the first component and the second component
Interface solder.
19. photoelectric subassembly as claimed in claim 17, further comprises: being located in the electric substrate and the second component
Interface epoxy resin.
20. photoelectric subassembly as claimed in claim 17, further comprises: being located in the electric substrate and the transparent component
Interface solder.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201662329840P | 2016-04-29 | 2016-04-29 | |
| US62/329,840 | 2016-04-29 | ||
| PCT/US2017/030443 WO2017196577A1 (en) | 2016-04-29 | 2017-05-01 | Interfacing chip on glass assembly |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109417269A true CN109417269A (en) | 2019-03-01 |
| CN109417269B CN109417269B (en) | 2021-02-05 |
Family
ID=59297347
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201780040353.6A Active CN109417269B (en) | 2016-04-29 | 2017-05-01 | Interface chip on glass component |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US10571637B2 (en) |
| EP (2) | EP4163688B1 (en) |
| JP (1) | JP6669893B2 (en) |
| CN (1) | CN109417269B (en) |
| WO (1) | WO2017196577A1 (en) |
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Also Published As
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|---|---|
| JP2019515501A (en) | 2019-06-06 |
| EP3449538A1 (en) | 2019-03-06 |
| JP6669893B2 (en) | 2020-03-18 |
| WO2017196577A1 (en) | 2017-11-16 |
| EP3449538B1 (en) | 2022-11-23 |
| EP4163688B1 (en) | 2024-03-20 |
| EP4163688A1 (en) | 2023-04-12 |
| CN109417269B (en) | 2021-02-05 |
| US20170315314A1 (en) | 2017-11-02 |
| US10571637B2 (en) | 2020-02-25 |
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