CN109413986B - Control method and device for surface mounting equipment and storage medium - Google Patents

Control method and device for surface mounting equipment and storage medium Download PDF

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Publication number
CN109413986B
CN109413986B CN201811361856.6A CN201811361856A CN109413986B CN 109413986 B CN109413986 B CN 109413986B CN 201811361856 A CN201811361856 A CN 201811361856A CN 109413986 B CN109413986 B CN 109413986B
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air pressure
patch
suction
pressure parameter
patch element
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CN109413986A (en
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马辉
杨朋朋
杨汇成
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Lenovo Beijing Ltd
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Lenovo Beijing Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool

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  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

The embodiment of the application discloses a control method and device for a patch device and a storage medium, wherein the method comprises the following steps: determining an element type of the patch element; the patch element is a patch element to be sucked by the material sucking component; determining a first air pressure parameter corresponding to the patch element according to a preset air pressure strategy; and if the first air pressure parameter is not matched with the current second air pressure parameter of the material suction assembly, adjusting the air pressure of the material suction assembly according to the second air pressure parameter.

Description

Control method and device for surface mounting equipment and storage medium
Technical Field
The present disclosure relates to chip mounter technologies, and in particular, to a method and an apparatus for controlling a chip mounter, and a storage medium.
Background
Surface Mount Technology (SMT) is a Circuit connection Technology in which a leadless or short-lead Surface-mounted component (i.e., a chip component) is mounted on the Surface of a Printed Circuit Board (PCB) or other substrate during the production of a Circuit Board, and the Surface-mounted component is soldered and assembled by means of reflow soldering or dip soldering, wherein the chip component such as a Light Emitting Diode (Light Emitting Diode) chip, a resistor, a capacitor, etc. is mounted on a reserved position on the Circuit Board by a chip mounter (i.e., a chip mounting device).
One working cycle of the chip mounter is as follows: material taking → moving to a patch position → patch → moving to a material taking position, when the patch head of the existing patch machine moves to the material taking position, the air pressure of the suction nozzle on the patch head is adjusted through an air pressure adjusting button on the patch machine. The air pressure is required to be adjusted manually according to experience, the requirements for the air pressure are different based on different patch elements, and once the air pressure is determined, the air pressure cannot adapt to different patch elements, so that the condition of leakage suction is caused, and the material throwing rate of the chip mounter is improved.
Disclosure of Invention
The embodiment of the application provides a control method and device of a piece mounting device and a storage medium, and the material throwing rate of the piece mounting device can be reduced.
The control method of the patch device provided by the embodiment of the application is applied to the patch device, the patch device comprises a material sucking assembly, and the method comprises the following steps:
determining an element type of the patch element; the patch element is a patch element to be sucked by the material sucking component;
determining a first air pressure parameter corresponding to the patch element according to a preset air pressure strategy;
and if the first air pressure parameter is not matched with the current second air pressure parameter of the material suction assembly, adjusting the air pressure of the material suction assembly according to the second air pressure parameter.
The paster equipment controlling means that this application embodiment provided is applied to paster equipment, the device includes: the device comprises a type unit, an air pressure determining unit and an adjusting unit; wherein the content of the first and second substances,
the type unit is used for determining the element type of the patch element; the patch element is a patch element to be sucked by a material sucking component of the patch equipment;
the air pressure determining unit is used for determining a first air pressure parameter corresponding to the patch element according to a preset air pressure strategy;
and the adjusting unit is used for adjusting the air pressure of the material sucking assembly according to the second air pressure parameter if the first air pressure parameter is not matched with the current second air pressure parameter of the material sucking assembly.
The computer-readable storage medium provided in the embodiments of the present application stores a computer program, and the computer program, when executed by a processor, implements the steps of the patch device control method described above.
In the embodiment of the application, when the current parameter of the material suction assembly is not matched with the air pressure parameter corresponding to the patch element to be sucked of the material suction assembly, the air pressure of the material suction assembly is adjusted according to the air pressure parameter corresponding to the patch element to be sucked of the material suction assembly; so, according to the paster component of waiting to absorb, effectively adjust inhaling the present atmospheric pressure of material subassembly automatically, reduce the throwing material rate of paster equipment.
Drawings
Fig. 1 is a first schematic flow chart of an implementation of a control method of a patch device according to an embodiment of the present application;
fig. 2 is a schematic diagram of an implementation flow of a control method of a patch device in the embodiment of the present application;
FIG. 3 is a schematic diagram of calibration information according to an embodiment of the present application;
FIG. 4 is a schematic diagram of a plurality of images with rotation angles according to an embodiment of the present disclosure;
fig. 5 is a schematic structural diagram of a control device of a patch device according to an embodiment of the present application;
fig. 6 is a structure of an arch type chip mounter according to an embodiment of the present application;
fig. 7 is a schematic structural diagram of a turret type chip mounter according to an embodiment of the present application;
FIG. 8 is a schematic position diagram of a camera according to an embodiment of the present disclosure;
fig. 9 is a schematic flow chart illustrating an implementation of a control method of a patch device according to an embodiment of the present application;
fig. 10 is a schematic structural diagram of a patch device according to an embodiment of the present application.
Detailed Description
The present application will be described in further detail below with reference to the accompanying drawings and examples. It should be understood that the examples provided herein are merely illustrative of the present application and are not intended to limit the present application. In addition, the following examples are provided as partial examples for implementing the present application, not all examples for implementing the present application, and the technical solutions described in the examples of the present application may be implemented in any combination without conflict.
The embodiment of the application provides a control method of a patch device, the method is applied to the patch device, the patch device comprises a material sucking component and a control device, and each functional module in the control device can be realized by cooperation of a computing resource such as a processor and the like and the material sucking component.
The chip mounting equipment in the embodiment of the application can comprise chip mounting machines such as an arch type chip mounting machine and a turret type chip mounting machine, and the type of the chip mounting equipment is not limited at all.
Of course, the embodiments of the present application are not limited to being provided as methods and hardware, and may be implemented in various ways, for example, as a storage medium (storing instructions for executing the patch device control method provided by the embodiments of the present application).
An embodiment of the present application provides a patch device control method, and as shown in fig. 1, the patch device control method includes:
s101, determining the element type of the patch element to be sucked;
the patch element is a patch element to be sucked by the suction component.
The surface mounting equipment sucks a surface mounting element at the material taking position through the surface mounting head under the condition of not damaging the components and the PCB by taking the materials → moving to the surface mounting position → mounting the surface mounting element to a bonding pad position appointed by the PCB, and moves the surface mounting head to the material taking position again to suck the next surface mounting element. Here, the chip components are supplied to the chip mounting head by a feeder of the chip mounting apparatus in a certain order and sequence for the chip mounting head to suck. The Surface mount device includes Surface Mounted Devices (SMC), Surface Mounted Devices (SMD), and the like, where SMC is a passive component such as a resistor and an inductor that do not need to be polarized, and SMD is an active component such as a capacitor Integrated Circuit (IC) that needs to be polarized.
The chip mounting device can be provided with a control application program, and the control application program forms a control and operation system of the chip mounting device and controls the mounting process of the chip mounting element.
When the chip mounting head of the chip mounting equipment moves to the material taking level to suck the chip components provided by the feeder, the control application program determines the component type of the chip components to be sucked currently. Wherein, the paster component that waits to absorb is the current paster component that waits to absorb that the feeder provided. Here, the magnitude of the first air pressure, which is the air pressure required when the patch element of the different element types is sucked, is different.
Here, the suction assembly is a component for sucking the chip element provided on the chip head, and may include a suction nozzle and a combination of the suction nozzle and a pipe. Wherein, when inhaling the combination that the material subassembly includes pipeline and suction nozzle, suction nozzle and pipe connection, when absorbing the paster component, use air compressor to produce compressed gas, use compressed gas to blow in pipeline and suction nozzle to produce positive and negative atmospheric pressure at the suction nozzle, carry out the absorption of paster component through the gaseous switching of positive negative pressure.
The element type of the patch element may be associated with the size, kind of patch element. Wherein, the kind of patch element includes: resistors, capacitors, inductors, diodes, integrated ICs, and the like. The patch elements of the same type but different sizes differ in element type. Such as: patch elements include the following 3 element types: type 1: 1.0mmx5.0mm, type 2: 1.0mmx5.0mm, type 3: a capacitor IC of 10.0mmx15.0 mm. Wherein patch elements for different element types may be characterized by different type identifications, such as: as in the above example, 000 characterizes type 1, 001 characterizes type 2, and 010 characterizes type 3.
In the embodiment of the present application, the division and the number of the element types of the patch element are not limited at all.
In practical application, when sucking the patch element, a plurality of patch elements to be sucked can be sucked by a plurality of suction nozzles simultaneously, at the moment, the patch elements to be sucked can comprise a plurality of suction nozzles, and the patch device determines the element type of each patch element to be sucked. Wherein, a paster component that waits to absorb corresponds a set of subassembly of inhaling.
S102, determining a first air pressure parameter corresponding to the patch element according to a preset air pressure strategy;
after the patch element to be sucked currently is determined in S101, a first air pressure parameter corresponding to the patch element to be sucked is determined according to a corresponding relationship between the patch element and the first air pressure parameter in the air pressure strategy. Wherein the suction assembly may comprise a suction nozzle, or a combination of a suction nozzle and a conduit. The first air pressure parameter comprises different air pressure types based on different parts corresponding to the material sucking assembly. When the material sucking component comprises a suction nozzle, the air pressure type of the first air pressure parameter corresponding to the patch element comprises the air pressure of the suction nozzle, namely the air pressure required by the suction nozzle when the patch element is sucked. When the material sucking component comprises a suction nozzle and a pipeline, the air pressure type of the first air pressure parameter corresponding to the patch element comprises suction nozzle air pressure and pipeline air pressure, and the pipeline air pressure is the air pressure required by the pipeline when the patch element is sucked.
The corresponding relation between the patch element and the first air pressure parameter in the air pressure strategy in the embodiment of the application can be set by a user, and can also be determined according to the historical record of the patch element sucked by the patch device.
In an embodiment, the method further comprises: determining a third air pressure parameter and a corresponding suction state when the suction component sucks the patch element; the suction state comprises a first suction state representing suction to the patch element and a second suction state representing non-suction to the patch element; obtaining an element type of the patch element; determining the air pressure strategy according to the third air pressure parameter, the suction state and the component type.
When an air pressure strategy is determined, the air pressure used when the suction component sucks the patch element is detected to obtain a third air pressure parameter, the suction state of the suction component when the patch element is sucked through the third air pressure parameter is recorded, and when the suction component successfully sucks the patch element through the third air pressure parameter, the recorded suction state is the first suction state, and the patch element is successfully sucked. When the suction component fails to suck the patch element through the third air pressure parameter, the recorded suction state is a second suction state, and the patch element is not successfully sucked.
And after the third air pressure parameter and the suction state of the patch element are obtained through recording, obtaining a first air pressure parameter corresponding to the patch element according to the element type of the current patch element, and adding the element type and the first air pressure parameter of the patch element to an air pressure strategy. The air pressure strategy comprises first air pressure parameters corresponding to the element types of different patch elements.
When the first air pressure parameter corresponding to the patch element is obtained according to the element type of the current patch element, the third air pressure parameter of the patch element of the element type in the first suction state, namely the normal condition, and the second suction state, namely the material throwing condition can be counted, the air pressure range when the probability of the first suction state is larger than the set probability threshold is obtained, and the determined air pressure range is determined as the first air pressure parameter. Such as: in the statistical history, the third air pressure parameter and the suction state when the patch element of the type 1 is sucked are as follows: 0.51Mpa, first absorption state: 6 times, second suction state: 4 times; 0.52Mpa, first absorption state: 10 times, second suction state: 2 times; 0.53Mpa, first absorption state: 9 times, second suction state: 0 time; 0.54Mpa, first absorption state: 6 times, second suction state: 7 times; when the set probability threshold is 80%, the probability of the first absorption state is greater than 80% when the third air pressure parameter is 0.52Mpa and 0.53Mpa, and at this time, the first air pressure parameter corresponding to the type 1 can be set to be 0.52Mpa to 0.53 Mpa.
When the first air pressure parameter corresponding to the patch element is obtained according to the element type of the current patch element, the third air pressure parameter of the patch element in the first suction state and the second suction state can be counted, and the third air pressure parameter with the maximum probability of the first suction state is obtained and is the first air pressure parameter. Such as: in the same way as the above example, in the statistical history, the third air pressure parameter and the suction state when the patch element of type 1 is sucked are: 0.51Mpa, first absorption state: 6 times, second suction state: 4 times; 0.52Mpa, first absorption state: 10 times, second suction state: 2 times; 0.53Mpa, first absorption state: 9 times, second suction state: 0 time; 0.54Mpa, first absorption state: 6 times, second suction state: 7 times; when the third air pressure parameter is 0.53Mpa, the probability of the first suction state is the maximum and is 100%, and at this time, the first air pressure parameter corresponding to the type 1 may be set to be 0.53 Mpa.
After the third air pressure parameter and the suction state of the patch element are recorded and obtained, the alarm parameter corresponding to the patch element is obtained according to the element type of the current patch element, and the element type and the alarm parameter of the patch element are added to the air pressure strategy. At this time, the air pressure strategy includes alarm parameters corresponding to the element types of the different patch elements. The alarm parameters include an alarm pressure parameter and a corresponding alarm type, where the alarm type represents a probability of the second suction state, such as: when the probability of the second suction state is greater than 20%, the alarm type is alarm type 1, and when the probability of the second suction state is greater than 50%, the alarm type is alarm type 2.
Such as: in the statistical history, the third air pressure parameter and the suction state when the patch element of the type 1 is sucked are as follows: 0.51Mpa, first absorption state: 6 times, second suction state: 4 times; 0.52Mpa, first absorption state: 10 times, second suction state: 2 times; 0.53Mpa, first absorption state: 9 times, second suction state: 0 time; 0.54Mpa, first absorption state: 6 times, second suction state: 7 times; when the set probability threshold is 80%, the probability of the first absorption state is greater than 80% when the third air pressure parameter is 0.52Mpa and 0.53Mpa, and at this time, the alarm air pressure parameter corresponding to the type 1 can be set to include 0.51Mpa, and the corresponding alarm type is alarm type 1; 0.54Mpa, and the corresponding alarm type is alarm type 2.
Here, when the suction assembly includes a suction nozzle and a pipeline, the suction nozzle air pressure in the first air pressure parameter corresponding to the component in the air pressure strategy is determined according to the third air pressure parameter of the suction nozzle, the suction state and the component type, and the pipeline air pressure in the first air pressure parameter corresponding to the component in the air pressure strategy is determined according to the third air pressure parameter of the pipeline, the suction state and the component type.
In this application embodiment, the manner of determining the air pressure policy according to the third air pressure parameter, the suction state, and the component type may be set according to actual requirements, which is not limited in this application embodiment.
In the embodiment of the application, patch elements of different element types are used as analysis objects, air pressure values of the suction nozzle and the pipeline are detected, historical air pressure data of the suction nozzle and the pipeline under normal working and material throwing conditions are collected respectively, required air pressure value ranges of the suction nozzle and the pipeline of the patch elements of different element types are analyzed, the air pressure value ranges required by the different elements obtained through analysis are used as parameters to be built in patch equipment, and processing efficiency of the patch equipment is improved.
S103, if the first air pressure parameter is not matched with the current second air pressure parameter of the material suction assembly, adjusting the air pressure of the material suction assembly according to the first air pressure parameter.
After the first air pressure parameter of the patch element to be sucked at present is sucked from the S102, the first air pressure parameter is compared with the current second air pressure parameter of the sucking component. Wherein the second air pressure parameter is the air pressure of the material suction assembly shifted to the material taking position.
In practical application, the air pressure of the suction nozzle can be detected through the pressure sensor, and the air pressure of the pipeline can be detected through the negative pressure sensor.
And if the first air pressure parameter is a specific air pressure value and the current second air pressure parameter of the material suction assembly is different from the first air pressure parameter, determining that the first air pressure parameter is not matched with the second air pressure parameter. Such as: the first air pressure parameter corresponding to the type 1 is 0.53Mpa, and when the second air pressure parameter is 0.52Mpa, the first air pressure parameter is determined to be not matched with the second air pressure parameter; and when the second air pressure parameter is 0.53Mpa, determining that the first air pressure parameter is matched with the second air pressure parameter.
And if the first air pressure parameter is within an air pressure range, and the current second air pressure parameter of the material suction assembly does not belong to the air pressure range corresponding to the first air pressure parameter, determining that the first air pressure parameter is not matched with the second air pressure parameter. Such as: the first air pressure parameter corresponding to the type 1 is 0.52MPa to 0.53MPa, and when the second air pressure parameter is 0.56MPa, the first air pressure parameter is determined to be not matched with the second air pressure parameter; and when the second air pressure parameter is 0.53Mpa, determining that the first air pressure parameter is matched with the second air pressure parameter.
Here, when the first air pressure parameter includes the air pressure of the suction nozzle, the second air pressure parameter includes the current air pressure of the suction nozzle; when the first air pressure parameter comprises the air pressure of the suction nozzle and the air pressure of the pipeline, the second parameter comprises the current air pressure of the suction nozzle and the current air pressure of the pipeline. Matching the first air pressure parameter and the second air pressure parameter of the same air pressure type.
And if the first air pressure parameter is matched with the second air pressure parameter, controlling the current material suction assembly to suck the patch element.
If first atmospheric pressure parameter and second atmospheric pressure parameter mismatch, adjust the atmospheric pressure of inhaling the material subassembly, adjust to first atmospheric pressure parameter to inhale the paster element through the material subassembly of inhaling after the adjustment. Such as: the first air pressure parameter corresponding to the type 1 is 0.52Mpa to 0.53Mpa, when the second air pressure parameter is 0.56Mpa, the first air pressure parameter is determined to be not matched with the second air pressure parameter, the air pressure of the material suction assembly is adjusted to be 0.52Mpa to 0.53Mpa, and the patch element is sucked through the adjusted air pressure between 0.52Mpa and 0.53 Mpa.
Here, when the patch element to be sucked includes a plurality of patch elements, the first air pressure parameter corresponding to each patch element may be compared with the second air pressure of the suction assembly corresponding to the patch element. Such as: the patch element currently to be sucked comprises: the component 1, the component 2 and the component 3, wherein the component type of the component 1 is type 1, and the component is sucked by the material sucking component 1; the component type of the component 2 is type 2, and the component is sucked by the material sucking component 2; the component type of the component 3 is type 2, and is sucked by the suction assembly 3. The first air pressure parameter corresponding to the type 1 is P11, the first air pressure parameter corresponding to the type 2 is P21, the first air pressure parameter corresponding to the type 3 is P31, the second air pressure parameter of the material suction assembly 1 is P12, the second air pressure parameter of the material suction assembly 2 is P22, and the second air pressure parameter of the material suction assembly 3 is P32; wherein P11 matches P12, P21 matches P22, and P31 does not match P32, at this time, the air pressure of the suction assembly 3 is adjusted to P31, and the element 1, the element 2, and the element 3 are respectively sucked by the suction assemblies having the air pressures of P12, P22, and P31, respectively.
In an embodiment, the method further comprises: when the adjusted air pressure parameter of the material suction element is matched with a set alarm air pressure threshold value, determining an alarm type corresponding to the adjusted air pressure parameter of the material suction element based on the air pressure strategy; and alarming according to the alarm type.
When a first air pressure parameter corresponding to a patch element to be sucked of the suction component is not matched with a current second air pressure parameter of the suction component, detecting the air pressure of the suction component after adjusting the air pressure of the suction component, and giving an alarm when the air pressure parameter of the suction component is matched with a set alarm air pressure threshold value; the set alarm air pressure threshold value may be a set air pressure value, or may be an alarm air pressure parameter in an air pressure strategy.
And when the adjusted air pressure parameter is matched with the alarm air pressure threshold value, determining the alarm type corresponding to the adjusted air pressure parameter according to the air pressure strategy. Here, different alarm modes can be set for different alarm types, such as: and when the alarm type is the alarm type 1, the lamplight flickers, and when the alarm type is the alarm type 2, the voice prompt is carried out, so that the intelligent alarm is carried out according to the current air pressure pertinently.
In practical application, the alarming according to the alarm type includes: and performing alarm according to the alarm type and the components of the material suction assembly, wherein different alarm modes are set for different components, such as: the alarm type corresponding to the air pressure parameter of the suction nozzle is alarm type 1, and the yellow light flickers; and the alarm type corresponding to the air pressure parameter of the pipeline is alarm type 1, and the red light is flickered. In the embodiment of the application, the alarm types and the alarm modes of all the components in the material suction assembly are not limited at all.
According to the control method of the paster device, when the current parameter of the material suction component is not matched with the air pressure parameter corresponding to the paster element to be sucked by the material suction component, the air pressure of the material suction component is adjusted according to the air pressure parameter corresponding to the paster element to be sucked by the material suction component; so, according to the paster component of waiting to absorb, effectively adjust inhaling the present atmospheric pressure of material subassembly automatically, reduce the throwing material rate of paster equipment.
The embodiment of the application provides a control method of a patch device, the method is applied to the patch device, the patch device comprises a material sucking component and a control device, and each functional module in the control device can be realized by cooperation of a computing resource such as a processor and the like and the material sucking component.
The chip mounting equipment in the embodiment of the application can comprise chip mounting machines such as an arch type chip mounting machine and a turret type chip mounting machine, and the type of the chip mounting equipment is not limited at all.
Of course, the embodiments of the present application are not limited to being provided as methods and hardware, and may be implemented in various ways, for example, as a storage medium (storing instructions for executing the patch device control method provided by the embodiments of the present application).
Fig. 2 is a schematic view of an implementation flow of a control method of a patch device according to an embodiment of the present application, and as shown in fig. 2, the control method of the patch device includes:
s201, determining the element type of the patch element to be sucked;
the patch element is a patch element to be sucked by the material sucking component;
the surface mounting equipment sucks a surface mounting element at the material taking position through the surface mounting head under the condition of not damaging the components and the PCB by taking the materials → moving to the surface mounting position → mounting the surface mounting element to a bonding pad position appointed by the PCB, and moves the surface mounting head to the material taking position again to suck the next surface mounting element. Here, the chip components are supplied to the chip mounting head by a feeder of the chip mounting apparatus in a certain order and sequence for the chip mounting head to suck. The Surface mount device includes Surface Mounted Devices (SMC), Surface Mounted Devices (SMD), and the like, where SMC is a passive component such as a resistor and an inductor that do not need to be polarized, and SMD is an active component such as a capacitor Integrated Circuit (IC) that needs to be polarized.
The chip mounting device can be provided with a control application program, and the control application program forms a control and operation system of the chip mounting device and controls the mounting process of the chip mounting element.
When the chip mounting head of the chip mounting equipment moves to the material taking level to suck the chip components provided by the feeder, the control application program determines the component type of the chip components to be sucked currently. Wherein, the paster component that waits to absorb is the current paster component that waits to absorb that the feeder provided. Here, the magnitude of the first air pressure, which is the air pressure required when the patch element of the different element types is sucked, is different.
S202, determining a first air pressure parameter corresponding to the patch element according to a preset air pressure strategy;
after the patch element to be sucked is determined in S201, the first air pressure parameter corresponding to the patch element to be sucked is determined according to the corresponding relationship between the patch element and the first air pressure parameter in the air pressure strategy. Wherein the suction assembly may comprise a suction nozzle, or a combination of a suction nozzle and a conduit. The first air pressure parameter comprises different air pressure types based on different parts corresponding to the material sucking assembly. When the material sucking component comprises a suction nozzle, the air pressure type of the first air pressure parameter corresponding to the patch element comprises the air pressure of the suction nozzle, namely the air pressure required by the suction nozzle when the patch element is sucked. When the material sucking component comprises a suction nozzle and a pipeline, the air pressure type of the first air pressure parameter corresponding to the patch element comprises suction nozzle air pressure and pipeline air pressure, and the pipeline air pressure is the air pressure required by the pipeline when the patch element is sucked.
S203, if the first air pressure parameter is not matched with the current second air pressure parameter of the material suction assembly, adjusting the air pressure of the material suction assembly according to the first air pressure parameter;
after the first air pressure parameter of the current patch element to be sucked is sucked from the S202, the first air pressure parameter is compared with the current second air pressure parameter of the sucking component. Wherein the second air pressure parameter is the air pressure of the material suction assembly shifted to the material taking position. If the first air pressure parameter is not matched with the second air pressure parameter, the air pressure of the material suction assembly is adjusted to be the first air pressure parameter.
S204, sucking the chip element to the chip head through the material sucking assembly;
when the first air pressure parameter is matched with the second air pressure parameter, the material suction component on the chip mounting head is directly controlled to suck the chip mounting element. When the first air pressure parameter is not matched with the second air pressure parameter, the air pressure of the suction assembly is adjusted to be the first air pressure parameter, and the suction assembly on the chip mounting head is controlled to suck the chip mounting element.
S205, collecting position information of the patch element to obtain first position information;
here, the positional information of the chip component may be acquired after the suction nozzle on the chip component sucks the chip component, or the positional information of the chip component may be acquired after the chip component is displaced to a predetermined machine coordinate position by the displacement chip head.
When the suction nozzle on the patch element sucks the patch element and then collects the position information of the patch element, after the suction assembly on the patch head sucks the patch element, the camera at the material taking position is controlled to collect the position information of the patch element sucked on the patch head, and first position information is obtained and comprises the information of the position of the patch element sucked by the suction assembly, such as the center coordinate of the patch element, the element boundary and the like.
When the position information of the patch element is acquired after the patch element is displaced to a specified machine coordinate position, the camera positioned at the machine coordinate position is controlled to acquire the position information of the patch element sucked on the patch head, and first position information is obtained, wherein the first position information comprises information which can determine the position of the patch element sucked by the suction assembly, such as the center coordinate of the patch element, the element boundary and the like.
In an embodiment, the acquiring the position information of the patch element to obtain the first position information includes: acquiring an image including the patch element; carrying out edge detection on the patch element in the image based on a neural network model to obtain the outline of the patch element in the image; determining the first position information according to the outline of the patch element in the image.
After a patch element is sucked, a camera is controlled to collect an image of the patch element, the image of the patch element is used as input of a neural network model, edge detection is carried out on the patch element through the neural network model to obtain an area of the patch element in the image, so that the outline of the patch element is determined, and the center coordinate and the element boundary of the patch element are determined according to the outline of the patch element. When the neural network model carries out edge detection, the characteristics of discontinuous parts in the image are extracted, and the area corresponding to the patch element is determined according to the closed edge, so that the patch image and the background image are distinguished.
The neural network model can adopt edge detection algorithms such as Roberts operator, Sobel operator and Kirsh operator, and can also adopt convolution neural network algorithms such as canny algorithm, YOLO algorithm and Full Convolution Network (FCN) algorithm.
S206, if the first position information is not matched with the reference position information, determining correction information according to the reference position information and the first position information;
the first position information of the patch element in S205 and the reference position information are matched. And when the first position information of the chip element is the center coordinate of the chip element, the corresponding reference position information is the center coordinate of the chip head. When the first position information of the patch element is the element boundary of the patch element, the corresponding reference position information is a reference boundary, and the reference boundary may be a straight line in a preset direction, for example: x-axis and Y-axis in the coordinate axes.
And when the central coordinate of the chip element is different from the central coordinate of the chip head, determining that the central coordinate of the chip element is not matched with the central coordinate of the chip head. Determining that the element boundary of the patch element does not match the reference boundary when the element boundary of the patch element is not in the same direction as the reference boundary.
The central coordinate of the surface mount element is not matched with the central coordinate of the surface mount head, or the element boundary of the surface mount element is not matched with the reference boundary, so that the central coordinate of the surface mount element and the position of the surface mount element mounted on the PCB cannot be centered, and mounting errors are caused. At this time, correction information needs to be determined to adjust the position of the placement head, and the position of the placement element picked up by the placement head is adjusted by adjusting the position of the placement head.
In an embodiment, if the first position information includes center coordinates of the patch element, the reference position information includes center coordinates of the patch head, and the determining correction information according to the reference position information and the first position information includes: determining offset information between the central coordinates of the chip element and the central coordinates of the chip head; and using the offset information as the correction information.
As shown in fig. 3, the center coordinate a of the placement head is (x)0，y0) The patch element has a center coordinate B of (x)Material，yMaterial) Offset information (x) between center coordinates of the chip component and center coordinates of the chip headSchool，ySchool) Is shown in formula (1):
Figure BDA0001867526090000131
in an embodiment, the determining the first position information according to the outline of the patch element in the image includes: acquiring at least three images comprising the patch element; the rotation angles of the patch heads corresponding to the different images are different; and determining the center coordinates of the patch head according to at least three images comprising the patch elements.
Here, a description will be given of a determination process of the center coordinates of the placement head from three images including the placement element. In practical application, the center coordinates of the placement head can be determined by more than three images including the placement elements, and the determination process is similar.
The chip mounting head is rotated by any angle, three original images of the three image chip mounting elements at different rotation angles are acquired, and the three original images of the chip mounting elements are shown in fig. 4 and comprise an image 401, an image 402 and an image 403. The center position coordinates of the image 401, the image 402, and the image 403 are: (x)1，y1)、(x2，y2) And (x)3，y3) The center coordinate (x) of the mounting head0，y0) Can be obtained by the formula (2).
Figure BDA0001867526090000132
In practical applications, the rotation angle between the images 401, 402 and 403 may be 120 °, in which case the center coordinate (x) of the mounting head0，y0) Can be calculated by the formula (3).
Figure BDA0001867526090000133
At this time, when the image including the patch element is N images, N >3, the rotation angle between the ith image and the (i + 1) th image may be set to 360/N, where 1 ≦ i ≦ N.
In an embodiment, the method further comprises: if the first position information comprises element boundaries of the patch elements, the reference position information comprises reference boundaries corresponding to the patch elements; the determining correction information according to the reference position information and the first position information includes: determining a deflection angle between an element boundary of the patch element and the reference boundary; and taking the deflection angle as the correction information.
As shown in fig. 3, the component boundary of the pick-and-place head is LMaterialAngle with respect to the X-axis being θMaterialWhen the reference boundary is the X-axis, the angle of the X-axis is θ00 DEG, the deflection angle theta between the element boundary of the patch element and the reference boundarySchoolIs shown in equation (4):
θschool＝θMaterial-θ0Formula (4)
And S207, correcting the chip mounting head according to the correction information so as to control the chip mounting position of the chip mounting element.
After the correction information is determined in S206, the position or displacement of the placement head is corrected based on the correction information. Wherein, when the position information of gathering the paster component after the suction nozzle on the paster component absorbs the paster component, can adjust the position or the displacement of paster head according to correction information. And when the position information of the patch element is collected after the suction nozzle on the patch element sucks the patch element, the position of the patch head is adjusted according to the correction information.
When the displacement of the chip mounting head is corrected according to the correction information, the displacement information is adjusted through the correction information to obtain adjusted displacement information, and the movement of the chip mounting head is controlled through the adjusted displacement information. Such as: the displacement information in the patch device is (x, y), and the correction information includes (x)School，ySchool) Then adjusted displacement information (x)Moving device，yMoving device) As shown in equation (5), and by the adjusted displacement information (x)Moving device，yMoving device) And controlling the movement of the chip mounting head to move to the specified position for mounting the chip mounting element.
Figure BDA0001867526090000141
In the embodiment of the application, the paster element to be pasted is subjected to image recognition, the deflection angle and the central position of the paster element are calculated, the position of the current paster head is corrected, the throwing rate is reduced, and meanwhile the quality of the board paster is improved.
In order to implement the method of the embodiment of the present application, an embodiment of the present application provides a control device of a patch device, which is applied to the patch device, and each unit included in the control device and each module included in each unit may be implemented by a processor in the patch device; of course, the implementation can also be realized through a specific logic circuit; in the implementation process, the Processor may be a Central Processing Unit (CPU), a microprocessor Unit (MPU), a Digital Signal Processor (DSP), a Field Programmable Gate Array (FPGA), or the like.
As shown in fig. 5, the apparatus includes: a type unit 501, an air pressure determination unit 502 and an adjustment unit 503; wherein the content of the first and second substances,
a type unit 501 for determining an element type of a patch element to be sucked; the patch element is a patch element to be sucked by a material sucking component of the patch equipment;
an air pressure determining unit 502, configured to determine a first air pressure parameter corresponding to the patch element according to a preset air pressure policy;
an adjusting unit 503, configured to adjust the air pressure of the material suction assembly according to the first air pressure parameter if the first air pressure parameter is not matched with the current second air pressure parameter of the material suction assembly.
In one embodiment, the apparatus further comprises: a recording unit configured to:
determining a third air pressure parameter and a corresponding suction state when the suction component sucks the patch element; the suction state comprises a first suction state representing suction to the patch element and a second suction state representing non-suction to the patch element;
obtaining an element type of the patch element;
determining the air pressure strategy according to the third air pressure parameter, the suction state and the component type.
In one embodiment, the apparatus further comprises: an alarm unit configured to:
when the adjusted air pressure parameter of the material suction element is matched with a set alarm air pressure threshold value, determining an alarm type corresponding to the adjusted air pressure parameter of the material suction element based on the air pressure strategy;
and alarming according to the alarm type.
In one embodiment, the apparatus further comprises: the device comprises a suction unit, an acquisition unit, a correction information unit and a correction unit; wherein the content of the first and second substances,
the sucking unit is used for sucking the chip component to a chip mounting head of the chip mounting equipment through the sucking component;
the collecting unit is used for collecting the position information of the patch element to obtain first position information;
a correction information unit for determining correction information according to the reference position information and the first position information if the first position information does not match the reference position information;
and the correction unit is used for correcting the patch head according to the correction information so as to control the patch position of the patch element.
In an embodiment, the acquisition unit is configured to:
acquiring an image including the patch element;
carrying out edge detection on the patch element in the image based on a neural network model to obtain the outline of the patch element in the image;
determining the first position information according to the outline of the patch element in the image.
In an embodiment, the correction information determining unit is configured to:
if the first position information comprises the center coordinates of the patch element and the reference position information comprises the center coordinates of the patch head, determining offset information between the center coordinates of the patch element and the center coordinates of the patch head; and using the offset information as the correction information.
In one embodiment, the apparatus further comprises: a center coordinate unit to:
acquiring at least three images comprising the patch element; the rotation angles of the patch heads corresponding to the different images are different;
and determining the center coordinates of the patch head according to the at least three images comprising the patch elements.
In an embodiment, the correction information determining unit is configured to:
if the first position information comprises element boundaries of the patch elements and the reference position information comprises reference boundaries corresponding to the patch elements, determining a deflection angle between the element boundaries of the patch elements and the reference boundaries;
and taking the angle difference as the correction information.
It is noted that the description of the apparatus embodiment, similar to the description of the method embodiment above, has similar advantageous effects as the method embodiment. For technical details not disclosed in the embodiments of the apparatus of the present application, reference is made to the description of the embodiments of the method of the present application for understanding.
In the embodiment of the application, the chip mounting device may be an arch type chip mounter or a turret type chip mounter. The operation of these two types of pick & place machines will now be described.
As shown in fig. 6, the parts feeder 601 and PCB602 are fixed, and the placement head 603 (on which a plurality of vacuum suction nozzles 604 are mounted) moves back and forth between the parts feeder 601 and PCB602 to take out the mounted parts from the parts feeder 601, adjust the positions and directions of the mounted parts, and place the mounted parts on the PCB 602.
As shown in fig. 7, the turret type mounter is configured such that a component feeder is placed on a feeder 701 moving in a single coordinate, a PCB702 is placed on a table 703 moving in an X/Y coordinate system, and a mounting head is mounted on a turret 704. During operation, the feeder 701 moves the patch element feeder to a material taking position, the vacuum material suction nozzle on the patch head picks up the patch element at the material taking position, the vacuum material suction nozzle rotates to the patch position (forming 180 degrees with the material taking position) through the rotating tower, and the element is attached to the PCB through adjusting the position and the direction of the patch element in the rotating process.
In the embodiment of the application, the patch device can comprise the following five parts: mechanical system, detection identification system, paster head, feeder and treater. Wherein the content of the first and second substances,
the mechanical system comprises: the device comprises a rack shell, a transmission mechanism and a servo positioning system. The rack casing supports all mechanisms of transmission, positioning, transmission and the like of the surface mounting equipment and protects various mechanical and electrical hardware of the equipment. And the transmission mechanism is used for conveying the PCB to a preset position, and then transmitting the PCB subjected to surface mounting to the next procedure after the surface mounting is finished. And the servo positioning system supports the chip mounting head, ensures the precise positioning of the chip mounting head, supports the PCB bearing platform and realizes the movement of the PCB in the X-Y direction.
The detection recognition system includes: identification systems and sensors. And the identification system is composed of a camera and confirms the mounting performance and the position of identification objects such as a PCB, a feeder and a surface mounted component. The sensors comprise a pressure sensor, a negative pressure sensor and the like, and are used for monitoring parameters such as air pressure of the surface mounting equipment.
And the chip mounting head picks up the components through the connected material sucking assembly, can automatically correct the position under the control of the correction information of the processor, and accurately mounts the chip components such as SMC/SMD (surface mounted device) and the like to a specified position.
And the feeder is used for supplying the chip components such as SMC/SMD and the like to the chip mounting head according to a certain rule and sequence so as to be accurately picked up.
A processor: the computer program stored in the running memory is a control and operation system of the chip mounter, first air pressure parameters corresponding to the types of the components are determined according to historical records of the statistical sensor, the air pressure of the material suction assembly is controlled through comparison of the first air pressure parameters and current second air pressure parameters of the sensor, the central coordinates of the chip mounting components and the boundaries of the components are identified through the camera to obtain correction information, and the positions and angles of the chip mounting heads are corrected through the correction information.
The position of the camera may be as shown in fig. 8, after the placement head 803 is moved to a predetermined position to capture the placement element 802, the camera 801 is moved to a fixed position, and an image of the placement head 803 is obtained by the camera 801, so that the center coordinates of the placement head 803 and the placement element 802 and the element boundary of the placement element 802 are obtained, and thus correction information is obtained, the position of the placement head is adjusted, and the center of the placement head, the center of the element, and the center of the position to be placed of the element are on the same straight line.
In this embodiment of the present application, an implementation flow of the patch device control method according to this embodiment of the present application may be as shown in fig. 9, and includes two modules according to division of the functional modules: an air pressure detection module 901 and a correction module 902; here, the air pressure detecting module 901 corresponds to the type unit 501, the air pressure determining unit 502, the adjusting unit 503, the recording unit and the warning unit, and the correcting module 902 corresponds to the above-mentioned sucking unit, the collecting unit, the correcting information unit, the correcting unit and the central coordinate unit.
The air pressure detection module 901: the device is responsible for collecting air pressure data when each patch element absorbs, analyzing the air pressure required by the patch elements and monitoring the air pressure according to the air pressure parameters obtained by analysis. The process comprises the following steps:
s9011, collecting air pressure data of the suction nozzle and the pipeline;
the method comprises the steps of taking components of different component types as analysis objects, detecting air pressure values of a suction nozzle and a pipeline, and respectively collecting historical data of the air pressure values of the suction nozzle and the pipeline under normal working and material throwing conditions.
S9012, analyzing air pressure required by each patch element to obtain an air pressure strategy;
and when components of different component types are sucked through historical data analysis, the required air pressure range of the suction nozzle and the pipeline is obtained to obtain an air pressure strategy. And when the analyzed components of different component types are sucked, the required air pressure range of the suction nozzle and the pipeline is built in the chip mounter system.
S9013, monitoring the current air pressure through an air pressure strategy.
When the component is sucked, the suction nozzle air pressure detection adopts a negative pressure sensor detection mode, the suction nozzle negative pressure condition can be automatically detected regularly, when the detection value of the negative pressure sensor is in the air pressure range corresponding to the patch type in the air pressure strategy, the suction is determined to be normal, otherwise, the suction is determined to be poor. The air pressure detection of the pipeline adopts a pressure sensor, when the detection value of the pressure sensor is in the air pressure range corresponding to the patch type in the air pressure strategy, the suction is determined to be normal, otherwise, the suction is determined to be poor.
When the suction is determined to be poor, an alarm can be given, which comprises the following steps: insufficient air pressure of the suction nozzle and insufficient air pressure of the pipeline. When the air pressure of the suction nozzle is insufficient, the suction nozzle is cleaned or replaced in time; if the air pressure of the pipeline is insufficient, the pipeline needs to be further detected, and the specific fault condition of the pipeline is judged.
Here, vacuum throwing is a very common problem in throwing, generally both caused by a nozzle and a pipe. Firstly, the deformation, blockage and damage of the suction nozzle can cause air pressure deficiency and air leakage, and the suction nozzle cannot suck materials; secondly, the vacuum air pipe channel is not smooth, foreign matters block the vacuum channel, or the air pressure is lacked due to the leakage of the pipeline, so that the material can not be taken or the material falls down in the process of removing the paste. By the chip mounter control method, the whole condition of a chip mounter system can be mastered, and the vacuum material throwing rate of the chip mounter is reduced.
The correction module 902 is configured to collect an element to be attached (a patch element) for image recognition, and correct the position of the patch head according to the recognized image. The process comprises the following steps:
s9021, collecting element images;
s9022, preprocessing an image;
the image preprocessing can include denoising and image enhancement, and can improve image data and inhibit noise from optical path disturbance, system circuit distortion and the like inevitably introduced in the image acquisition process.
S9023, segmenting and positioning the image;
the elements of different element types have different shapes, and the element and the background image are segmented through edge detection of the neural network model to obtain the outline of the element in the image.
S9024, calculating correction information;
obtaining displacement deviation according to the central position of the element and the central position of the chip mounting head: when the central position of the chip mounting head is determined, the element is rotated by 0 degrees, 120 degrees and 240 degrees from the starting position respectively, the position relation of 3 images is acquired, the central points of the 3 images form an equilateral triangle, and the gravity center of the equilateral triangle is actually the central position of the chip mounting head.
And obtaining a boundary straight line of the element image according to the contour of the element, wherein an included angle between the boundary straight line and an X axis in an image coordinate system can be used as a deflection angle of the element to be deflected.
S9025 and correcting the patch head.
And adjusting the position of the chip mounting head according to the displacement deviation and the deflection angle.
The monitoring method and the monitoring device for the patch device, provided by the embodiment of the application, are based on automatic detection of the air pressure of the suction nozzle and the vacuum pipeline, and can digitally adjust the air pressure of the suction nozzle and the vacuum pipeline according to different air pressure sensitivity degrees of different elements on the suction nozzle and the vacuum pipeline aiming at air pressure parameters of different elements; and the position of the element to be attached to the PCB is identified, the deflection angle and the central position of the element are identified, the distance and the error between the element and the center of the position to be attached to the board are judged, the image throwing is reduced, and the quality of the board attaching is improved.
An embodiment of the present application provides a patch device, fig. 10 is a schematic view of a composition structure of an electronic device according to an embodiment of the present application, and as shown in fig. 10, the patch device 1000 includes: a processor 1001, at least one communication bus 1002, memory 1003, a getter assembly 1004, and a placement head 1005. Wherein the communication bus 1002 is configured to enable connective communication between these components.
The processor 1001 is configured to execute the computer program stored in the memory 1003, so as to implement the following steps:
determining the element type of the patch element to be sucked; the patch element is a patch element to be sucked by the material sucking component 1004;
determining a first air pressure parameter corresponding to the patch element according to a preset air pressure strategy;
and if the first air pressure parameter is not matched with the current second air pressure parameter of the material suction assembly, adjusting the air pressure of the material suction assembly according to the first air pressure parameter.
Accordingly, an embodiment of the present application further provides a storage medium, i.e., a computer-readable storage medium, on which a computer program is stored, and the computer program, when executed by a processor, implements the steps of the patch device control method described above.
The above description of the patch device and computer readable storage medium embodiments is similar to the description of the method embodiments above, with similar beneficial effects as the method embodiments. For technical details not disclosed in the embodiments of the patch device and the computer-readable storage medium of the present application, reference is made to the description of the embodiments of the method of the present application for understanding.
In the embodiment of the present application, if the patch device control method is implemented in the form of a software functional module and is sold or used as a standalone product, the patch device control method may also be stored in a computer-readable storage medium. Based on such understanding, the technical solutions of the embodiments of the present application may be essentially implemented or portions thereof contributing to the prior art may be embodied in the form of a software product stored in a storage medium, and including several instructions for causing a computer device (which may be a personal computer, a server, or a network device) to execute all or part of the methods described in the embodiments of the present application. And the aforementioned storage medium includes: various media capable of storing program codes, such as a usb disk, a removable hard disk, a Read Only Memory (ROM), a magnetic disk, or an optical disk. Thus, embodiments of the present application are not limited to any specific combination of hardware and software.
It should be appreciated that reference throughout this specification to "one embodiment" or "an embodiment" means that a particular feature, structure or characteristic described in connection with the embodiment is included in at least one embodiment of the present application. Thus, the appearances of the phrases "in one embodiment" or "in an embodiment" in various places throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. It should be understood that, in the various embodiments of the present application, the sequence numbers of the above-mentioned processes do not mean the execution sequence, and the execution sequence of each process should be determined by its function and inherent logic, and should not constitute any limitation to the implementation process of the embodiments of the present application. The above-mentioned serial numbers of the embodiments of the present application are merely for description and do not represent the merits of the embodiments.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
In the several embodiments provided in the present application, it should be understood that the disclosed apparatus and method may be implemented in other ways. The above-described device embodiments are merely illustrative, for example, the division of the unit is only a logical functional division, and there may be other division ways in actual implementation, such as: multiple units or components may be combined, or may be integrated into another system, or some features may be omitted, or not implemented. In addition, the coupling, direct coupling or communication connection between the components shown or discussed may be through some interfaces, and the indirect coupling or communication connection between the devices or units may be electrical, mechanical or other forms.
The units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units; can be located in one place or distributed on a plurality of network units; some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiment.
In addition, all functional units in the embodiments of the present application may be integrated into one processing unit, or each unit may be separately regarded as one unit, or two or more units may be integrated into one unit; the integrated unit can be realized in a form of hardware, or in a form of hardware plus a software functional unit.
Those of ordinary skill in the art will understand that: all or part of the steps for realizing the method embodiments can be completed by hardware related to program instructions, the program can be stored in a computer readable storage medium, and the program executes the steps comprising the method embodiments when executed; and the aforementioned storage medium includes: various media that can store program codes, such as a removable Memory device, a Read Only Memory (ROM), a magnetic disk, or an optical disk.
Alternatively, the integrated units described above in the present application may be stored in a computer-readable storage medium if they are implemented in the form of software functional modules and sold or used as independent products. Based on such understanding, the technical solutions of the embodiments of the present application may be essentially implemented or portions thereof contributing to the prior art may be embodied in the form of a software product stored in a storage medium, and including several instructions for causing a computer device (which may be a personal computer, a server, or a network device) to execute all or part of the methods described in the embodiments of the present application. And the aforementioned storage medium includes: a removable storage device, a ROM, a magnetic or optical disk, or other various media that can store program code.
The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims (9)

1. A control method of a chip mounting device is applied to the chip mounting device, the chip mounting device comprises a suction assembly, and the method comprises the following steps:
determining the element type of the patch element to be sucked; the patch element is a patch element to be sucked by the material sucking component;
determining a first air pressure parameter corresponding to the patch element according to a preset air pressure strategy;
if the first air pressure parameter is not matched with the current second air pressure parameter of the material suction assembly, adjusting the air pressure of the material suction assembly according to the first air pressure parameter;
determining a third air pressure parameter and a corresponding suction state when the suction component sucks the patch element; the suction state comprises a first suction state representing suction to the patch element and a second suction state representing non-suction to the patch element;
obtaining an element type of the patch element;
determining the air pressure strategy according to the third air pressure parameter, the suction state and the element type; and counting the suction state of the suction component when the suction component sucks the patch element of the element type through the third air pressure parameter, and determining the air pressure range when the probability of the first suction state is greater than a set probability threshold value as the first air pressure parameter of the element type.
2. The method of claim 1, wherein the method further comprises:
when the adjusted air pressure parameter of the material suction assembly is matched with a set alarm air pressure threshold value, determining an alarm type corresponding to the adjusted air pressure parameter of the material suction assembly based on the air pressure strategy;
and alarming according to the alarm type.
3. The method of any of claims 1-2, wherein the placement device further comprises a placement head that displaces the placement element, the method further comprising:
sucking the chip element to the chip head through the sucking component;
collecting position information of the patch element to obtain first position information;
if the first position information does not match the reference position information, determining correction information according to the reference position information and the first position information;
and correcting the patch head according to the correction information so as to control the patch position of the patch element.
4. The method of claim 3, wherein the collecting the position information of the patch element to obtain first position information comprises:
acquiring an image including the patch element;
carrying out edge detection on the patch element in the image based on a neural network model to obtain the outline of the patch element in the image;
determining the first position information according to the outline of the patch element in the image.
5. The method of claim 3, wherein the first position information includes center coordinates of the patch element, the reference position information includes center coordinates of the patch head, and the determining correction information from the reference position information and the first position information includes:
determining offset information between the central coordinates of the chip element and the central coordinates of the chip head;
and using the offset information as the correction information.
6. The method of claim 5, wherein the method further comprises:
acquiring at least three images comprising the patch element; the rotation angles of the corresponding chip mounting heads of different images are different;
and determining the center coordinates of the patch head according to the at least three images comprising the patch elements.
7. The method of claim 3, wherein the first location information comprises element boundaries of the patch elements, and the reference location information comprises reference boundaries corresponding to the patch elements; the determining correction information according to the reference position information and the first position information includes:
determining a deflection angle between an element boundary of the patch element and the reference boundary;
and taking the deflection angle as the correction information.
8. A control device of a chip mounting device is applied to the chip mounting device, and the device comprises: the device comprises a type unit, an air pressure determining unit, an adjusting unit and a recording unit; wherein the content of the first and second substances,
the type unit is used for determining the element type of the patch element to be sucked; the patch element is a patch element to be sucked by a material sucking component of the patch equipment;
the air pressure determining unit is used for determining a first air pressure parameter corresponding to the patch element according to a preset air pressure strategy;
the adjusting unit is used for adjusting the air pressure of the material sucking assembly according to the first air pressure parameter if the first air pressure parameter is not matched with the current second air pressure parameter of the material sucking assembly;
the recording unit is used for determining a third air pressure parameter and a corresponding suction state when the suction component sucks the patch element; the suction state comprises a first suction state representing suction to the patch element and a second suction state representing non-suction to the patch element; obtaining an element type of the patch element; determining the air pressure strategy according to the third air pressure parameter, the suction state and the element type; and counting the suction state of the suction component when the suction component sucks the patch element of the element type through the third air pressure parameter, and determining the air pressure range when the probability of the first suction state is greater than a set probability threshold value as the first air pressure parameter of the element type.
9. A computer-readable storage medium having stored thereon a computer program which, when executed by a processor, implements the steps of the patch device control method of any one of claims 1 to 7.
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