CN109413841A - A kind of laminated PCB structure for 3 D stereo encapsulation - Google Patents
A kind of laminated PCB structure for 3 D stereo encapsulation Download PDFInfo
- Publication number
- CN109413841A CN109413841A CN201811339853.2A CN201811339853A CN109413841A CN 109413841 A CN109413841 A CN 109413841A CN 201811339853 A CN201811339853 A CN 201811339853A CN 109413841 A CN109413841 A CN 109413841A
- Authority
- CN
- China
- Prior art keywords
- lead bridge
- substrate
- test point
- laminated pcb
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005538 encapsulation Methods 0.000 title claims abstract description 20
- 238000012360 testing method Methods 0.000 claims abstract description 24
- 239000000758 substrate Substances 0.000 claims abstract description 20
- 238000003466 welding Methods 0.000 claims abstract description 15
- 238000005520 cutting process Methods 0.000 claims description 18
- 238000000034 method Methods 0.000 abstract description 9
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 150000003071 polychlorinated biphenyls Chemical group 0.000 description 15
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000006263 metalation reaction Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/163—Monitoring a manufacturing process
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention discloses a kind of at least one test point pad, at least one lead bridge welding disks, at least one lead bridge that the laminated PCB structure for 3 D stereo encapsulation includes substrate and is disposed on the substrate, the both ends of the lead bridge are connected with the lead bridge welding disk, the periphery that the lead bridge surrounds region is arranged in the test point pad, and is connect with the lead bridge welding disk in outside by PCB trace.A kind of laminated PCB structure for 3 D stereo encapsulation of the invention, utilize the test point pad on substrate, complete electrical testing is carried out after laminated PCB plate Denso, pcb board is with the presence or absence of open circuit or the problem of short circuit after finding Denso in advance, Denso is carried out if problematic to reprocess, to prevent 3 D stereo package module from failing in the technique later period, cost is saved, production efficiency and the quality of production are substantially increased.
Description
Technical field
The present invention relates to printed circuit board technology field, in particular to a kind of laminated PCB knot for 3 D stereo encapsulation
Structure.
Background technique
Three-dimensional encapsulation is an a kind of integrated antenna package technology emerging in recent years, existing three-dimensional encapsulation method
It is realized by following technique: laminated PCB plate Denso, laminated plate are stacked, resin encapsulating molding, are cut and formed, surface metalation is handled,
Surface line engraving.Currently, the miniaturization three-dimensional encapsulation module realized, in design, its upper and lower level is interconnected by laminated PCB plate
The lead bridge of surrounding realizes electric interconnection.But often the electronic circuit of laminated PCB plate is very complicated, if the work in Denso
When skill controls improper or external environment influence, it be easy to cause the defect of part line short or open circuit, and existing laminated PCB plate
Electrical testing can be just only carried out after three-dimensional encapsulation forming, examines whether circuit connects correctly, at this time discovery open circuit or short circuit
Package module can only scrap, significant wastage manpower and material resources, thus bring cost of manufacture rise.
Summary of the invention
In order to overcome the above-mentioned deficiencies of the prior art, the present invention provides a kind of laminated PCBs for 3 D stereo encapsulation
Structure can increase by one of laminated PCB plate electrical testing technique using this laminated PCB structure to guarantee Denso in used technique
Integrality, could discovery circuit open circuit or short-circuit situation in the modular manufacture later period to effectively avoid.
The technical solution adopted by the present invention to solve the technical problems is a kind of laminated PCB knot for 3 D stereo encapsulation
Structure, including substrate and at least one test point pad, at least one lead bridge welding disk, at least one lead for being disposed on the substrate
Bridge, the both ends of the lead bridge are connected with the lead bridge welding disk, and the test point pad, which is arranged, surrounds area in the lead bridge
The periphery in domain, and connect with the lead bridge welding disk in outside by PCB trace.
Further, it is additionally provided with cutting outline border on the substrate and places inside casing, the edge positions of the cutting outline border are set
It sets on the lead bridge, the placement inside casing is arranged inside the cutting outline border.
Further, circular hole, groove are provided on the substrate, 4 inside the cutting outline border are arranged in the circular hole
On corner, the groove is arranged on the sideline of the cutting outline border.
Further, the substrate edges are provided with several through-holes, specifically, the substrate left and right sides edge respectively sets 3
A through-hole is respectively arranged on 4 angles in through-hole, substrate.
The beneficial effects of the present invention are:
A kind of laminated PCB structure for 3 D stereo encapsulation of the invention, using the test point pad on substrate, folded
Complete electrical testing is carried out after layer pcb board Denso, pcb board whether there is open circuit or short-circuit problem after finding Denso in advance, if
It is problematic, it carries out Denso and reprocesses, to prevent 3 D stereo package module from failing in the technique later period, save cost, significantly
Improve production efficiency and the quality of production.
Detailed description of the invention
With reference to the accompanying drawing and specific embodiment the invention will be further described, in which:
Fig. 1 is the structural schematic diagram of the embodiment of the present invention
Fig. 2 is the partial enlarged view in the portion A in Fig. 1.
Specific embodiment
Each preferred embodiment of the invention is described below with reference to accompanying drawings.It provides referring to the drawings
Description, to help the understanding to example embodiment of the invention as defined by appended claims and their equivalents.It includes side
The various details of assistant's solution, but they can only be counted as illustratively.Therefore, it would be recognized by those skilled in the art that
Embodiment described herein can be made various changes and modifications, without departing from scope and spirit of the present invention.Moreover, in order to
Keep specification more clear succinct, by omission pair it is well known that the detailed description of function and construction.
Referring to Figures 1 and 2, a kind of laminated PCB structure for 3 D stereo encapsulation of the embodiment of the present invention: including base
At least one test point pad 2, at least one the lead bridge welding disk 3, at least one lead bridge 4 of plate 1 and setting on substrate 1,
The both ends of the lead bridge 4 are connected with the lead bridge welding disk 3, and the test point pad 2, which is arranged, surrounds area in the lead bridge 4
The periphery in domain, and connect with the lead bridge welding disk 3 in outside by PCB trace.The lead bridge 4 for realizing interior exterior measuring lead
The electrical connection of bridge welding disk 3, the test point pad 2 are used for the electrical testing of laminated PCB plate, guarantee Denso integrality.In this reality
It applies in example, the lead bridge 4 surrounds a rectangle, and the lead bridge welding disk 3 is distributed in inside and outside the lead bridge 4, described
The outside for the rectangle that lead bridge 4 surrounds is arranged in test point pad 2, specifically, the test point pad 2 is upper on the outside of rectangle
The lower each placement in left and right is two rows of or two arrange.Shape, number and the placement of the test point pad 2, lead bridge welding disk 3 and lead bridge 4
Depending on relationship can be according to actual conditions, such as lead bridge 4 can surround a circle, and test point pad 2 can be at any line number
Or any columns is placed, or surrounds one or more circular arc.
Further, it is additionally provided with cutting outline border 5 on the substrate 1 and places inside casing 6, the sideline of the cutting outline border 5 is set
It sets in the middle position of the lead bridge 4, the placement inside casing 6 is arranged inside the cutting outline border 5.The cutting outline border 5
For positioning the position of pcb board excision forming, the cross section of lead bridge is exposed outside after cutting, for realizing upper after plating
Lower layer's electric interconnection, the interior zone for placing inside casing 6 is the placement-and-routing region of electronic component, prevents electronic component from exceeding
Predetermined region.
Further, circular hole 7, groove 8 are provided on the substrate, 4 inside the cutting outline border are arranged in the circular hole
On a corner, the groove is arranged on the sideline of the cutting outline border.Be arranged circular hole 7 and groove 8 effect be module into
Row resin encapsulating is conducive to the flowing of resin when forming this technique, to reduce cavity and bubble.
1 edge of substrate is provided with several through-holes 9, machinery positioning of the through-hole for pcb board when three-dimensional stacked, specifically
, left and right sides edge respectively sets 3 through-holes, and a through-hole is respectively arranged on 4 angles in substrate.The position of through-hole and number are not as this
The restriction of invention, those skilled in the art can be rationally arranged according to the actual situation.In the present embodiment, " edge " is defined as removing
Cut substrate described in the substrate regions of outline border.
Using a kind of laminated PCB structure for 3 D stereo encapsulation of the present embodiment, when forming 3 D stereo encapsulation,
One of laminated PCB plate electrical testing technique can be increased after pcb board Denso, utilize multimeter test or other testing tool inspections
With the presence or absence of the situation for opening short circuit between test point pad, guarantee Denso integrality, to effectively avoid after modular manufacture
Phase could discovery circuit open circuit or short-circuit situation.
The above, only better embodiment of the invention, but the present invention is not limited to above-described embodiments, as long as
The technical effect of the present invention is achieved by any identical or similar means for it, all should belong to protection scope of the present invention.
Claims (5)
1. a kind of laminated PCB structure for 3 D stereo encapsulation, it is characterised in that: including substrate (1) and it is arranged in substrate (1)
On at least one test point pad (2), at least one lead bridge welding disk (3), at least one lead bridge (4), the lead bridge
(4) both ends are connected with the lead bridge welding disk (3), and the test point pad (2), which is arranged, surrounds region in the lead bridge (4)
Outside, and connect with the lead bridge welding disk (3) in outside by PCB trace.
2. a kind of laminated PCB structure for 3 D stereo encapsulation according to claim 1, it is characterised in that: the base
Cutting outline border (5) is additionally provided on plate (1), the sideline of cutting outline border (5) is arranged on the lead bridge (4).
3. a kind of laminated PCB structure for 3 D stereo encapsulation according to claim 2, it is characterised in that: the base
It is additionally provided with cutting outline border (5) on plate (1) and places inside casing (6), placement inside casing (6) setting is in cutting outline border (5).
4. a kind of laminated PCB structure for 3 D stereo encapsulation according to claim 2, it is characterised in that: the base
Circular hole (7), groove (8) are provided on plate (1), circular hole (7) setting is internal in the cutting outline border (5), the groove (8)
It is arranged on the sideline of cutting outline border (5).
5. a kind of laminated PCB structure for 3 D stereo encapsulation according to claim 1, it is characterised in that: the base
Plate (1) edge is provided with several through-holes (9).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811339853.2A CN109413841A (en) | 2018-11-12 | 2018-11-12 | A kind of laminated PCB structure for 3 D stereo encapsulation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811339853.2A CN109413841A (en) | 2018-11-12 | 2018-11-12 | A kind of laminated PCB structure for 3 D stereo encapsulation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109413841A true CN109413841A (en) | 2019-03-01 |
Family
ID=65473005
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811339853.2A Pending CN109413841A (en) | 2018-11-12 | 2018-11-12 | A kind of laminated PCB structure for 3 D stereo encapsulation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109413841A (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0855871A (en) * | 1994-08-09 | 1996-02-27 | Nippon Steel Corp | Semiconductor package |
| JP2000188370A (en) * | 1998-12-22 | 2000-07-04 | Hitachi Ltd | Semiconductor device and manufacture thereof |
| US20010010397A1 (en) * | 2000-01-31 | 2001-08-02 | Masachika Masuda | Semiconductor device and a method of manufacturing the same |
| TW591725B (en) * | 2001-08-31 | 2004-06-11 | Hitachi Ltd | Manufacturing method for semiconductor device |
| KR20060081751A (en) * | 2005-01-10 | 2006-07-13 | 삼성전자주식회사 | Lead frame having air tunnel for exposed lead package |
| US20080204038A1 (en) * | 2007-02-28 | 2008-08-28 | Micronics Japan Co., Ltd. | Multilayer wiring board and method for testing the same |
| JP2012209469A (en) * | 2011-03-30 | 2012-10-25 | Mitsubishi Electric Corp | Power semiconductor device |
| CN103814628A (en) * | 2011-09-19 | 2014-05-21 | 莫塞德技术公司 | Voltage regulation for 3d packages and methods of manufacturing same |
| CN108615715A (en) * | 2018-07-11 | 2018-10-02 | 日月光半导体（昆山）有限公司 | Semiconductor package and lead frame strip used by same |
| CN209545990U (en) * | 2018-11-12 | 2019-10-25 | 珠海欧比特电子有限公司 | A kind of laminated PCB structure for 3 D stereo encapsulation |
-
2018
- 2018-11-12 CN CN201811339853.2A patent/CN109413841A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0855871A (en) * | 1994-08-09 | 1996-02-27 | Nippon Steel Corp | Semiconductor package |
| JP2000188370A (en) * | 1998-12-22 | 2000-07-04 | Hitachi Ltd | Semiconductor device and manufacture thereof |
| US20010010397A1 (en) * | 2000-01-31 | 2001-08-02 | Masachika Masuda | Semiconductor device and a method of manufacturing the same |
| TW591725B (en) * | 2001-08-31 | 2004-06-11 | Hitachi Ltd | Manufacturing method for semiconductor device |
| KR20060081751A (en) * | 2005-01-10 | 2006-07-13 | 삼성전자주식회사 | Lead frame having air tunnel for exposed lead package |
| US20080204038A1 (en) * | 2007-02-28 | 2008-08-28 | Micronics Japan Co., Ltd. | Multilayer wiring board and method for testing the same |
| JP2012209469A (en) * | 2011-03-30 | 2012-10-25 | Mitsubishi Electric Corp | Power semiconductor device |
| CN103814628A (en) * | 2011-09-19 | 2014-05-21 | 莫塞德技术公司 | Voltage regulation for 3d packages and methods of manufacturing same |
| CN108615715A (en) * | 2018-07-11 | 2018-10-02 | 日月光半导体（昆山）有限公司 | Semiconductor package and lead frame strip used by same |
| CN209545990U (en) * | 2018-11-12 | 2019-10-25 | 珠海欧比特电子有限公司 | A kind of laminated PCB structure for 3 D stereo encapsulation |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: Room 102-17, 1st Floor, Building 2, No. 88 Xiangshan Road, Tangjiawan Town, High tech Zone, Zhuhai City, Guangdong Province, 519000 Applicant after: Zhuhai Tanyuxin Technology Co.,Ltd. Address before: 3 / F, R & D building, 1 Baisha Road, Dongan, Tangjiawan Town, Zhuhai, Guangdong 519080 Applicant before: ZHUHAI ORBITA ELECTRONIC Co.,Ltd. |
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| CB02 | Change of applicant information |