CN109411617B - Organic electroluminescent device - Google Patents
Organic electroluminescent device Download PDFInfo
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- CN109411617B CN109411617B CN201710704011.1A CN201710704011A CN109411617B CN 109411617 B CN109411617 B CN 109411617B CN 201710704011 A CN201710704011 A CN 201710704011A CN 109411617 B CN109411617 B CN 109411617B
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/81—Anodes
- H10K50/814—Anodes combined with auxiliary electrodes, e.g. ITO layer combined with metal lines
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/805—Electrodes
- H10K50/82—Cathodes
- H10K50/824—Cathodes combined with auxiliary electrodes
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/341—Short-circuit prevention
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Abstract
The invention provides an organic electroluminescent device which comprises a substrate, wherein the substrate is divided into a light-emitting area and a non-light-emitting area, the non-light-emitting area is provided with a metal auxiliary electrode, the light-emitting area is laminated with a first electrode layer, an organic layer and a second electrode layer, the first electrode layer is patterned into a plurality of conductive units, a plurality of conductive connectors are arranged between the conductive units and the metal auxiliary electrode, at least one conductive connector is provided with a plurality of open circuit triggering areas, and when the device is short-circuited, the open circuit triggering areas can be opened so as to realize the short circuit protection function of the device.
Description
Technical Field
The present invention relates to an organic electroluminescent device, and more particularly, to an organic electroluminescent device having a function of preventing a short circuit phenomenon.
Background
The organic light emitting phenomenon refers to a phenomenon of converting electric energy into light energy using an organic substance. That is, when an appropriate organic layer is disposed between an anode and a cathode, when a voltage is applied between the two electrodes, holes are injected from the anode into the organic layer, and electrons are injected from the cathode into the organic layer. Excitons (exiton) are formed when the injected holes and electrons meet, and light is generated when the excitons fall to the ground state again.
In the OLED panel manufacturing process, defects such as dust particles, burrs, pinholes and cracks inevitably exist, and the distance between the anode and the cathode of the OLED panel is usually very small (about tens to hundreds of nanometers), and in this state, the anode and the cathode may be in direct contact to cause defects (called short-circuit points), or the organic layer between the anode and the cathode becomes thinner than other positions. When the OLED device is operated, current tends to pass more from such defective points than from other locations, so that heat is accumulated at such defective points, resulting in a reduction in quality and reliability of the entire OLED device. The defect region provides a low impedance path through which current flows easily, thereby allowing current to flow little or no way through the organic light emitting element in extreme cases.
Under the same other conditions, the larger the light-emitting area of the OLED screen is, the higher the possibility of short-circuit points is. It is possible to reduce shorting by increasing the thickness of the organic layer, but this requires higher drive voltages for the OLED device, which affects device efficiency, and does not completely eliminate shorting. In addition, the short circuit point problem may be solved by adding a short circuit protection part. The conventional short-circuit prevention design must be added with a mesh auxiliary circuit and matched with a conductive connector to achieve the effect of short-circuit protection, wherein the mesh auxiliary circuit must have good electrical conduction characteristics, so that most of the mesh auxiliary circuit is made of opaque metal materials, which can reduce the effective area of a light-emitting part. Making the conductive connectors with structures or materials as in CN2013800601793, CN2015800143012, CN2015800250832 is effective to increase the reliability of the device.
The conductive connector achieves a certain resistance, mainly through the materials or geometries used, which prevents short-circuit conditions when defects are present (because the resistor is connected in series with the device in which the short-circuit occurs), two important factors for such short-circuit prevention systems must be considered, (1) the pixels of the screen are sufficiently large (i.e. Ncell); (2) the short-circuit resistance is as large as possible (i.e., Rcell-spl); if the above two requirements are not met, the short-circuit prevention effect is not obvious, and high heat (P ═ IR; (P ═ power; I ═ current; R ═ resistance) is generated at the short-circuit point due to high current, thereby reducing the reliability of the panel.
Disclosure of Invention
The invention provides an organic electroluminescent device, wherein a plurality of open circuit triggering areas are arranged on a conductive connector of the device, and when the device is short-circuited, the open circuit triggering areas can be opened so as to realize the short circuit protection function of the device.
In order to achieve the purpose, the invention adopts the following technical scheme:
an organic electroluminescent device comprises a substrate, wherein the substrate is divided into a light-emitting area and a non-light-emitting area, the non-light-emitting area is provided with a metal auxiliary electrode, the light-emitting area is laminated with a first electrode layer, an organic layer and a second electrode layer, the first electrode layer is patterned into a plurality of conductive units, a conductive connector is arranged between each conductive unit and the metal auxiliary electrode, each conductive connector is provided with a plurality of open circuit triggering areas, and when the device is short-circuited, the open circuit triggering areas can be opened so as to realize the short circuit protection function of the device; and a transparent insulating layer covers the conductive connector and the metal auxiliary electrode.
In particular, the narrowing of the width and/or thinning of the thickness of the localized region of the conductive connector forms the open circuit initiation region. The open circuit initiation area is made of the same material as the conductive unit and is prepared in the same layer.
The open circuit triggering area is made of a high-resistance low-melting-point material, the surface resistance and the current density of the high-resistance material are larger than those of the conductive connector, the high-resistance material is an organic semiconductor material or a high polymer material, and the melting point of the high-resistance material is lower than that of the conductive connector.
The cross-sectional area of the disconnection inducing region is 1 to 90%, preferably 20 to 50% of the cross-sectional area of the conductive connector.
The conductive units are electrically connected in parallel. One or a plurality of conductive connectors arranged in parallel are arranged between each conductive unit and the metal auxiliary electrode, and a plurality of open circuit triggering areas are arranged on each conductive connector.
The substrate is a rigid substrate or a flexible substrate.
A disconnection inducing layer is disposed between the disconnection inducing region and the substrate, and a melting point of the disconnection inducing layer is lower than a melting point of the conductive connector.
The sum of the resistances of the conductive connectors between each conductive unit and the metal auxiliary electrode is greater than or equal to 500 omega; preferably 800-.
The open circuit triggering area is formed by partially designing the conductive connector into a concave part, and the length of the concave part is less than 20% of the overall length of the conductive connector, and is preferably 1% -5%.
Compared with the prior art, the technical scheme of the invention has the following beneficial effects:
1. the invention provides a plurality of conductive connectors between a conductive unit and a metal auxiliary electrode of an organic electroluminescent device, wherein a plurality of open circuit triggering areas are arranged on at least one conductive connector, and when the device is short-circuited, the open circuit triggering areas can be fused to achieve the function of open circuit, so that the short circuit protection function of the device is realized. The open circuit triggering area can trigger the conductive unit to open circuit when the current is suddenly increased, so that the condition of large-area short circuit of the screen body can be effectively avoided.
2. A conductive connector is arranged between the conductive unit and the metal auxiliary electrode, a plurality of groove-shaped open circuit initiation areas are arranged on the conductive connector, when a device is in short circuit, the current in the conductive connector is suddenly increased, the resistance of the open circuit initiation areas is large, and a large amount of heat is instantly accumulated in the open circuit initiation areas to cause the melting or fusing of the areas, so that the short circuit protection function of the device is realized.
3. Two conductive connectors are arranged between the conductive unit and the metal auxiliary electrode, wherein a plurality of groove-shaped open circuit triggering areas are arranged on one conductive connector, and the open circuit triggering areas are not arranged on the other conductive connector. When a device is short-circuited, the current in the conductive connector is suddenly increased, the resistance of the open circuit triggering area is larger, and a large amount of heat is instantly accumulated in the open circuit triggering area 3 to melt or fuse the area. The conductive unit and the metal auxiliary electrode are originally electrically connected through two conductive connectors connected in parallel, and the conductive unit is electrically connected with the metal auxiliary electrode only through 1 conductive connector due to the fact that one conductive connector is fused or fused, so that compared with the two conductive connectors, the direct resistance of the conductive connector and the metal auxiliary electrode is doubled, and short circuit of a device can be effectively prevented.
4. Two conductive connectors are arranged between the conductive unit and the metal auxiliary electrode, and each conductive connector is provided with a groove-shaped open circuit triggering area. When the device is short-circuited, the current in the conductive connector is suddenly increased, the resistance of the open circuit initiating area is high, and a large amount of heat is instantly accumulated in the open circuit initiating area to melt or fuse the area, so that the short circuit of the device can be effectively prevented.
5. In the three embodiments of fig. 1 to 3, the open circuit inducing layer is disposed between the open circuit inducing region 3 and the substrate, when a short circuit occurs in a pixel, the open circuit inducing region generates heat, and the heat generates high temperature to burn out the underlying material substrate or the open circuit inducing layer, which results in the collapse of the conductive connector, thereby effectively preventing the short circuit of the device.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a schematic structural diagram of a first embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a second embodiment of the present invention;
FIG. 3 is a schematic structural diagram of a third embodiment of the present invention;
FIG. 4 is a cross-sectional view along AA' of FIG. 3;
description of reference numerals: 1-conductive element, 2-conductive connector, 3-open circuit initiation area, 4-metal auxiliary electrode, 5-open circuit initiation layer, 6-transparent insulation layer, 7-substrate.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
This invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete and will fully convey the concept of the invention to those skilled in the art, and the present invention will only be defined by the appended claims. In the drawings, the size and relative sizes of layers and regions may be exaggerated for clarity. It will be understood that when an element such as a layer, region or substrate is referred to as being "formed on" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly formed on" or "directly disposed on" another element, there are no intervening elements present.
In addition, the technical features involved in the different embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other.
As shown in fig. 1 to 4, an organic electroluminescent device includes a substrate 7, the substrate 7 is divided into a light-emitting region and a non-light-emitting region, the non-light-emitting region is provided with a metal auxiliary electrode 4, the light-emitting region is stacked with a first electrode layer, an organic layer (not shown) and a second electrode layer (not shown), the first electrode layer is patterned into a plurality of conductive units 1, a conductive connector 2 is provided between the conductive units 1 and the metal auxiliary electrode 4, the conductive connector is provided with a circuit breaking initiation region 3, and when a short circuit occurs in a device, the circuit breaking initiation region 3 can be broken to achieve a short circuit protection function of the device. The disconnection inducing region 3 is formed by locally narrowing the width or thinning the thickness of the conductive connector 2, or may be formed by locally narrowing the width and thinning the thickness; it is also possible to use a low melting point,The high-resistance low-melting-point material has higher resistance, the surface resistance and the current density of the high-resistance low-melting-point material are greater than those of the conductive connector, the melting point of the high-resistance low-melting-point material is lower than that of the conductive connector, and the high-resistance material can be an organic semiconductor material such as pentacyclic element; and low-conductivity polymer materials such as PEDOT (polymer doped ethylene terephthalate) PSS (polymer doped sapphire). The cross-sectional area of the disconnection inducing region 3 is 1 to 90%, preferably 20 to 50%, of the cross-sectional area of the conductive connector 2. The cross-sectional area of the conductive connector is the width d of the conductive connector at the normal position (e.g., the upper or lower region of the recess in FIG. 1)1And thickness h1The product (width and thickness of the recess in fig. 1). The conductive units 1 are electrically connected in parallel.
One or a plurality of conductive connectors 2 arranged in parallel are arranged between each conductive unit 1 and the metal auxiliary electrode 4, and each conductive connector is provided with a plurality of open circuit initiation areas 3, specifically 1-10 open circuit initiation areas 3. The substrate may be a rigid substrate or a flexible substrate. When the substrate is a glass substrate, the broken circuit triggering area is melted or fused, the rigid substrate is not melted, but the resistance of the conductive connector is increased, and therefore short circuit is effectively avoided. When the substrate is a flexible substrate, the circuit breaking triggering area is melted or fused, so that the flexible substrate is melted or fused, and the circuit breaking can be realized, thereby realizing the short-circuit protection function of the device.
Preferably, a disconnection-inducing layer 5 is disposed between the disconnection-inducing region 3 and the substrate 7, and a melting point of the disconnection-inducing layer 5 is lower than a melting point of the conductive connector 2. The conductive connector 2 is covered with a transparent insulating layer 6 (the transparent insulating layer 6 is not shown in fig. 1 for the sake of clarity of the structure of the conductive connector). The sum of the resistances of the conductive connectors 2 between each conductive unit 1 and the metal auxiliary electrode 4 is greater than or equal to 500 omega; preferably 800-3000 Ω, the disconnection inducing region 3 is formed by partially designing the conductive connector 2 as a recess, and the length of the recess is less than 20%, preferably 1% -5% of the overall length of the conductive connector.
Specifically, as shown in fig. 1, a conductive connector 2 is disposed between the conductive unit 1 and the metal auxiliary electrode, and a plurality of groove-shaped open circuit initiation regions 3 are disposed on the conductive connector, so that when a device is short-circuited, current in the conductive connector increases suddenly, the resistance of the open circuit initiation region 3 is relatively high, and a large amount of heat is instantly accumulated in the open circuit initiation region 3 to melt or fuse the region, thereby achieving a short circuit protection function of the device.
As shown in fig. 2, according to a second embodiment of the present invention, two conductive connectors 2 are disposed between the conductive unit 1 and the metal auxiliary electrode, wherein one of the conductive connectors is provided with a plurality of groove-shaped disconnection-inducing regions 3, and the other conductive connector is not provided with a disconnection-inducing region. When a device is short-circuited, the current in the conductive connector is suddenly increased, the resistance of the open circuit initiating area 3 is larger, and a large amount of heat is instantly accumulated in the open circuit initiating area 3 to melt or fuse the area. The conductive unit 1 and the metal auxiliary electrode are originally electrically connected through the two conductive connectors 2 connected in parallel, and as one of the conductive connectors is fused or fused, the conductive unit 1 is electrically connected with the metal auxiliary electrode only through 1 conductive connector, so that compared with the two conductive connectors, the resistance between the conductive connector and the metal auxiliary electrode is doubled, and the short-circuit protection function of the device can be effectively prevented.
As shown in fig. 3, according to a third embodiment of the present invention, two conductive connectors 2 are disposed between the conductive unit 1 and the metal auxiliary electrode, and each conductive connector is provided with a groove-shaped disconnection inducing region 3. When a device is short-circuited, the current in the conductive connector is suddenly increased, the resistance of the open circuit initiating region 3 is higher, and a large amount of heat is instantly accumulated in the open circuit initiating region 3 to cause the region to be melted or fused, so that the short circuit protection function of the device can be effectively prevented.
The cross-sectional area of the open circuit initiation region 3 is smaller than that of the conductive unit 1, so that the unit resistance value is larger than that of the conductive unit, and when short circuit occurs, because the resistance value of the open circuit initiation region 3 is large, heat is easy to accumulate to enable the sunken part on the conductive unit 1 to generate heat, fusing is generated or high temperature is generated to burn the lower material substrate of the sunken part or the open circuit initiation layer 5 is fused, so that the sunken part (namely the open circuit initiation region 3) is broken, and the short circuit prevention function of the device is realized.
As another embodiment, in the three embodiments shown in fig. 1 to 3, a disconnection inducing layer 5 (as shown in fig. 4) is disposed between the disconnection inducing region 3 and the substrate, when a short circuit occurs in a pixel, the disconnection inducing region 3 generates heat, the heat generates high temperature to burn out the underlying substrate material or the disconnection inducing layer 5, so that the conductive connector is collapsed, thereby causing a disconnection of the device.
The conductive unit and the conductive connector in the invention are materials commonly used in the field, and the disconnection inducing layer 5 can be materials with a melting point lower than 550 ℃, preferably between 200 ℃ and 350 ℃, such as photoresist, high polymer materials, organic silicon compounds, resin and the like.
The conductive unit, the organic layer above the conductive unit and the second electrode layer form a pixel, wherein the organic layer comprises but is not limited to a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer and the like, the organic layer is prepared from materials conventional in the field, and the thickness of the organic layer is also conventional in the field. The luminescent color can be one or the combination of red, yellow and green luminescent layers.
The conductive unit and the organic light emitting layer and the second electrode layer stacked above the conductive unit form a pixel.
The preparation method comprises the following steps:
s1, manufacturing a metal auxiliary electrode and a patterned first electrode layer to form a plurality of conductive units and conductive connectors;
s2, etching a local area of the conductive connector to narrow and thin the local area so as to form an open circuit triggering area;
and S3, manufacturing an insulating layer material to cover the metal auxiliary electrode, the conductive connector and the open circuit triggering area.
As shown in fig. 3, the structure of the open circuit inducing region is: starting from the substrate: substrate/open circuit inducing layer 5/open circuit inducing region 3/transparent insulating layer.
The sum of the resistances of the conductive connectors between each conductive unit and the metal auxiliary electrode is greater than or equal to 500 omega; preferably 800-3000 omega, the sum including the sum of the normal region and the open circuit initiation region.
It should be understood that the above examples are only for clarity of illustration and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications therefrom are within the scope of the invention.
Claims (11)
1. An organic electroluminescent device comprises a substrate, wherein the substrate is divided into a light-emitting area and a non-light-emitting area, the non-light-emitting area is provided with a metal auxiliary electrode, the light-emitting area is laminated with a first electrode layer, an organic layer and a second electrode layer, the first electrode layer is patterned into a plurality of conductive units,
a plurality of conductive connectors are arranged between the conductive unit and the metal auxiliary electrode, and a plurality of open circuit triggering areas are arranged on at least one conductive connector, and when a device is short-circuited, the open circuit triggering areas can be opened so as to realize the short circuit protection function of the device; a transparent insulating layer covers the conductive connector and the metal auxiliary electrode;
a circuit breaking initiation layer is arranged between the circuit breaking initiation region and the substrate, and the melting point of the circuit breaking initiation layer is lower than that of the conductive connector;
the local area of the conductive connector is narrowed in width and/or thinned in thickness to form the open circuit initiation region.
2. The device of claim 1, wherein the open circuit inducing region is made of the same material as the conductive element and is fabricated in the same layer.
3. The organic electroluminescent device according to claim 1 or 2, wherein the cross-sectional area of the disconnection inducing region is 1 to 90% of the cross-sectional area of the conductive connector.
4. The organic electroluminescent device as claimed in claim 3, wherein the cross-sectional area of the disconnection inducing region is 20% to 50% of the cross-sectional area of the conductive connector.
5. The device of claim 1, wherein the open-circuit inducing region is made of a high-resistance low-melting-point material, the high-resistance low-melting-point material has a higher sheet resistance and a higher current density than the conductive connector, and the high-resistance low-melting-point material is an organic semiconductor material or a polymer material and has a lower melting point than the conductive connector.
6. The organic electroluminescent device according to claim 1,
the conductive units are electrically connected in parallel.
7. The organic electroluminescent device according to claim 6,
one or a plurality of conductive connectors arranged in parallel are arranged between each conductive unit and the metal auxiliary electrode, and a plurality of open circuit triggering areas are arranged on each conductive connector.
8. The organic electroluminescent device as claimed in claim 7, wherein the sum of the resistances of the conductive connectors between each of the conductive units and the metal auxiliary electrode is 500 Ω or more.
9. The device as claimed in claim 8, wherein the sum of the resistances of the conductive connectors between each conductive unit and the metal auxiliary electrode is 800-3000 Ω.
10. The device of claim 7, wherein the open circuit inducing region is formed by partially designing the conductive connector as a recess having a length of 20% or less of the entire length of the conductive connector.
11. The device of claim 10, wherein the open circuit inducing region is formed by partially designing the conductive connector as a recess having a length of 1% -5% of an overall length of the conductive connector.
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| CN103348477A (en) * | 2011-01-12 | 2013-10-09 | 环球展览公司 | OLED lighting device with short tolerant structure |
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| JP2004296154A (en) * | 2003-03-26 | 2004-10-21 | Konica Minolta Holdings Inc | Electrode, its manufacturing method, and organic electroluminescent element |
| US7012585B2 (en) * | 2004-02-06 | 2006-03-14 | Eastman Kodak Company | OLED apparatus having improved fault tolerance |
| JP4876452B2 (en) * | 2005-06-27 | 2012-02-15 | パナソニック電工株式会社 | Lighting device |
| WO2008099315A2 (en) * | 2007-02-12 | 2008-08-21 | Philips Intellectual Property & Standards Gmbh | Large area light emitting diode light source |
| DE102008013031B4 (en) * | 2008-03-07 | 2019-07-25 | Osram Oled Gmbh | Optoelectronic component |
| US8817429B2 (en) * | 2010-11-23 | 2014-08-26 | Samsung Display Co., Ltd. | Power converter, display device including power converter, system including display device, and method of driving display device |
| KR101582719B1 (en) * | 2012-05-31 | 2016-01-05 | 주식회사 엘지화학 | Organic light emitting device and method for preparing the same |
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| CN1722494A (en) * | 2004-05-31 | 2006-01-18 | 三星Sdi株式会社 | Fuse for lithium-ion cell and lithium-ion cell including the fuse |
| CN103348477A (en) * | 2011-01-12 | 2013-10-09 | 环球展览公司 | OLED lighting device with short tolerant structure |
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