CN109411391A - A kind of sensor monocrystalline silicon etching device with refrigerating function - Google Patents

A kind of sensor monocrystalline silicon etching device with refrigerating function Download PDF

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Publication number
CN109411391A
CN109411391A CN201811148641.6A CN201811148641A CN109411391A CN 109411391 A CN109411391 A CN 109411391A CN 201811148641 A CN201811148641 A CN 201811148641A CN 109411391 A CN109411391 A CN 109411391A
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CN
China
Prior art keywords
reaction chamber
water inlet
bracket
monocrystalline silicon
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201811148641.6A
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Chinese (zh)
Inventor
张如根
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bengbu Dragon Zi Lake Gold Force Sensor Plant
Original Assignee
Bengbu Dragon Zi Lake Gold Force Sensor Plant
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bengbu Dragon Zi Lake Gold Force Sensor Plant filed Critical Bengbu Dragon Zi Lake Gold Force Sensor Plant
Priority to CN201811148641.6A priority Critical patent/CN109411391A/en
Publication of CN109411391A publication Critical patent/CN109411391A/en
Pending legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67098Apparatus for thermal treatment
    • H01L21/67109Apparatus for thermal treatment mainly by convection
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • H01L21/67063Apparatus for fluid treatment for etching
    • H01L21/67069Apparatus for fluid treatment for etching for drying etching

Abstract

The present invention is to be related to the technical field of sensor monocrystalline silicon, it is specifically related to a kind of sensor monocrystalline silicon etching device with refrigerating function, the Rotational Cylindrical and reaction chamber are rotatablely connected, the Rotational Cylindrical lower plane offers comb channel, cooling chamber is offered in the Circular Plate, the cooling chamber is connected to comb channel;Cooling tube is provided in the cooling chamber, the reaction chamber lower end is fixedly connected with bracket, drainpipe and water inlet pipe through bracket is fixedly connected on the bracket, and drainpipe and water inlet pipe protrude into comb channel;The water inlet of the cooling tube is connected to water inlet pipe, and the water outlet of cooling tube is connected to outlet pipe, and the present invention has many advantages, such as easy to use, raising etching effect, good cooling effect.

Description

A kind of sensor monocrystalline silicon etching device with refrigerating function
Technical field
The present invention is to be related to the technical field of sensor monocrystalline silicon, is specifically related to a kind of sensor with refrigerating function Monocrystalline silicon etching device.
Background technique
Sensor in process, is both needed to perform etching it processing with monocrystalline silicon;During existing lithography, It is overlayed on horse often through by multiple monocrystalline silicon, and by importing reaction gas to horse position, and is made Reaction gas generates plasma under electric field environment, to perform etching to monocrystalline silicon;Horse usually requires in etching process It is rotated to increase contact evenness of the monocrystalline silicon with plasma, during present sensor monocrystalline silicon etching device, meeting A large amount of heat is generated, if heat cannot be removed timely, certain destruction will be caused to the etching of monocrystalline silicon, influence product Quality, and existing monocrystalline silicon etching device heat dissipation effect is weaker.
Summary of the invention
In view of the foregoing deficiencies of prior art, the purpose of the present invention is to provide a kind of sensings with refrigerating function Device monocrystalline silicon etching device, for solving the problems, such as that existing sensor monocrystalline silicon etching device heat-sinking capability is weak.
In order to achieve the above objects and other related objects, the invention discloses a kind of sensor monocrystalline with refrigerating function Silicon etching device includes reaction chamber, and the upper end of reaction chamber is provided with air duct, is connected to and is arranged outside reaction chamber Gas source room, the lower end of reaction chamber is provided with pump-line, is connected to the vacuum pump being arranged in outside reaction chamber;It is described anti- Outside is answered to be provided with electromagnetic coil;The axial location of the reaction chamber is provided with horse, and the horse is by Rotational Cylindrical and uniformly It is fixedly connected on the Circular Plate composition of rotation column outer wall;
The Rotational Cylindrical and reaction chamber are rotatablely connected, and the Rotational Cylindrical lower plane offers comb channel, opens in the Circular Plate Equipped with cooling chamber, the cooling chamber is connected to comb channel;Cooling tube is provided in the cooling chamber, the reaction chamber lower end is solid Surely it is connected with bracket, drainpipe and water inlet pipe through bracket are fixedly connected on the bracket, and drainpipe is stretched with water inlet pipe Enter in comb channel;The water inlet of the cooling tube is connected to water inlet pipe, and the water outlet of cooling tube is connected to outlet pipe.
It is preferred: to be fixedly connected with servo motor on the bracket, be fixedly connected on the output shaft of the servo motor Gear two, the Rotational Cylindrical lower end are fixedly connected with the gear one ratcheting with gear two.
Preferred: the cooling tube is spiral shape.
As described above, a kind of sensor monocrystalline silicon etching device with refrigerating function of the invention, has beneficial below Effect: cooling chamber is opened up in the Circular Plate for placing monocrystalline silicon piece, and cooling tube is placed in cooling chamber, in irrigation and drainage channel Setting water inlet pipe and outlet pipe are connected to cooling tube respectively, and outlet pipe and water inlet pipe are fixed on bracket, so that water inlet pipe, Cooling tube, outlet pipe will not follow Rotational Cylindrical and Circular Plate to rotate, then can be to Circular Plate by injecting cold water into water inlet pipe Play the role of cooling, cooling effect is obvious.
Detailed description of the invention
Fig. 1 is a kind of main view of the sensor monocrystalline silicon etching device with refrigerating function of the present invention.
Fig. 2 is the cross-sectional view of horse of the present invention.
Fig. 3 is the top view of cooling tube of the present invention.
Wherein: reaction chamber 1, air duct 2, gas source room 3, pump-line 4, vacuum pump 5, horse 6, Rotational Cylindrical 61, comb Channel 611, Circular Plate 62, cooling chamber 621, servo motor 7, electromagnetic coil 8, gear 1, bracket 10, gear 2 11, drainpipe 12, cooling tube 13, water inlet pipe 14.
Specific embodiment
Embodiments of the present invention are illustrated by particular specific embodiment below, those skilled in the art can be by this explanation Content disclosed by book is understood other advantages and efficacy of the present invention easily.
Embodiment 1
As shown in Figure 1-3, the invention discloses a kind of sensor monocrystalline silicon etching device with refrigerating function, includes reaction Room 1, the upper end of reaction chamber 1 are provided with air duct 2, are connected to the gas source room 3 being arranged in outside reaction chamber 1, reaction chamber 1 Lower end be provided with pump-line 4, be connected to the vacuum pump 5 being arranged in outside reaction chamber 1;It is set on the outside of the reaction chamber 1 It is equipped with electromagnetic coil 8;The axial location of the reaction chamber 1 is provided with horse 6, and the horse 6 is fixed by Rotational Cylindrical 61 and uniformly The Circular Plate 62 for being connected to 61 outer wall of Rotational Cylindrical forms;
The Rotational Cylindrical 61 is rotatablely connected with reaction chamber 1, and 61 lower plane of Rotational Cylindrical offers comb channel 611, the circle Cooling chamber 621 is offered in ring flat-plate 62, the cooling chamber 621 is connected to comb channel 611;It is provided in the cooling chamber 621 Cooling tube 13,1 lower end of reaction chamber are fixedly connected with bracket 10, the row through bracket 10 are fixedly connected on the bracket 10 Water pipe 12 and water inlet pipe 14, and drainpipe 12 and water inlet pipe 14 protrude into comb channel 611;The water inlet of the cooling tube 13 with Water inlet pipe 14 is connected to, and the water outlet of cooling tube 13 is connected to outlet pipe 12.
It is preferred: servo motor 7, fixed company on the output shaft of the servo motor 7 are fixedly connected on the bracket 10 It is connected to gear 2 11,61 lower end of Rotational Cylindrical is fixedly connected with the gear one 9 ratcheting with gear 2 11.
Preferred: the cooling tube 13 is spiral shape.
The present invention is implemented:
According to [Fig. 1] [Fig. 2] [Fig. 3], rotated by servo motor 7 by 2 11 band moving gear 1 of gear, gear 1 drives Rotational Cylindrical 61 rotates, and Rotational Cylindrical 61 drives Circular Plate 62 to rotate, since 1 lower end of reaction chamber is fixedly connected with bracket 10, bracket 10 On be fixedly connected with drainpipe 12 and water inlet pipe 14 through bracket 10, therefore water inlet pipe 14, cooling tube 13, outlet pipe 12 will not Rotational Cylindrical 61 and Circular Plate 62 is followed to rotate, by the coolant liquid by cooling tube 13 by the heat absorption in Circular Plate 62, and It is discharged by outlet pipe 12, temperature protection effectively is carried out to the etching process of sensor monocrystalline silicon.
Beneficial effects of the present invention:
Cooling chamber 621 is opened up in the Circular Plate 62 for placing monocrystalline silicon piece, and cooling tube 13 is placed in cooling Room 621, Setting water inlet pipe 14 and outlet pipe 12 are connected to cooling tube 13 respectively in irrigation and drainage channel 611, and by outlet pipe 12 and water inlet pipe 14 It fixes over the mount 10, so that water inlet pipe 14, cooling tube 13, outlet pipe 12 will not follow Rotational Cylindrical 61 and Circular Plate 62 to rotate, It can play the role of cooling to Circular Plate 62 by injecting cold water into water inlet pipe 14 again, cooling effect is obvious.
Finally, it should be noted that above embodiments are only to illustrate the present invention and not limit technology described in the invention Scheme;Therefore, although this specification is referring to above-mentioned each embodiment, the present invention has been described in detail, this Field it is to be appreciated by one skilled in the art that still can modify to the present invention or equivalent replacement;And all do not depart from this The technical solution and its improvement of the spirit and scope of invention, should all cover within the scope of the claims of the present invention.

Claims (3)

1. a kind of sensor monocrystalline silicon etching device with refrigerating function includes reaction chamber, the upper end setting of reaction chamber There is air duct, be connected to the gas source room being arranged in outside reaction chamber, the lower end of reaction chamber is provided with pump-line, connects It is connected to the vacuum pump being arranged in outside reaction chamber;Electromagnetic coil is provided on the outside of the reaction chamber;The axis position of the reaction chamber It installs and is equipped with horse, the horse is made of Rotational Cylindrical with the Circular Plate for being uniformly fixedly connected on rotation column outer wall;Its feature exists In:
The Rotational Cylindrical and reaction chamber are rotatablely connected, and the Rotational Cylindrical lower plane offers comb channel, opens in the Circular Plate Equipped with cooling chamber, the cooling chamber is connected to comb channel;Cooling tube is provided in the cooling chamber, the reaction chamber lower end is solid Surely it is connected with bracket, drainpipe and water inlet pipe through bracket are fixedly connected on the bracket, and drainpipe is stretched with water inlet pipe Enter in comb channel;The water inlet of the cooling tube is connected to water inlet pipe, and the water outlet of cooling tube is connected to outlet pipe.
2. a kind of sensor monocrystalline silicon etching device with refrigerating function according to claim 1, it is characterised in that: institute It states and is fixedly connected with servo motor on bracket, gear two, the Rotational Cylindrical are fixedly connected on the output shaft of the servo motor Lower end is fixedly connected with the gear one ratcheting with gear two.
3. a kind of sensor monocrystalline silicon etching device with refrigerating function according to claim 2, it is characterised in that: institute Stating cooling tube is spiral shape.
CN201811148641.6A 2018-09-29 2018-09-29 A kind of sensor monocrystalline silicon etching device with refrigerating function Pending CN109411391A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201811148641.6A CN109411391A (en) 2018-09-29 2018-09-29 A kind of sensor monocrystalline silicon etching device with refrigerating function

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201811148641.6A CN109411391A (en) 2018-09-29 2018-09-29 A kind of sensor monocrystalline silicon etching device with refrigerating function

Publications (1)

Publication Number Publication Date
CN109411391A true CN109411391A (en) 2019-03-01

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1582489A (en) * 2001-09-03 2005-02-16 东京毅力科创株式会社 Substrate treating device and substrate treating method
US20060191482A1 (en) * 2005-02-04 2006-08-31 Seiichiro Kanno Apparatus and method for processing wafer
US8372212B2 (en) * 2011-04-04 2013-02-12 Kabushiki Kaisha Toshiba Supercritical drying method and apparatus for semiconductor substrates
CN105161411A (en) * 2015-07-09 2015-12-16 江苏德尔森传感器科技有限公司 Sensor monocrystal silicon etching device capable of realizing positioning and processing

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1582489A (en) * 2001-09-03 2005-02-16 东京毅力科创株式会社 Substrate treating device and substrate treating method
US20060191482A1 (en) * 2005-02-04 2006-08-31 Seiichiro Kanno Apparatus and method for processing wafer
US8372212B2 (en) * 2011-04-04 2013-02-12 Kabushiki Kaisha Toshiba Supercritical drying method and apparatus for semiconductor substrates
CN105161411A (en) * 2015-07-09 2015-12-16 江苏德尔森传感器科技有限公司 Sensor monocrystal silicon etching device capable of realizing positioning and processing

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Application publication date: 20190301