CN109407803A - A kind of computer cabinet radiator and a kind of computer cabinet - Google Patents
A kind of computer cabinet radiator and a kind of computer cabinet Download PDFInfo
- Publication number
- CN109407803A CN109407803A CN201811333845.7A CN201811333845A CN109407803A CN 109407803 A CN109407803 A CN 109407803A CN 201811333845 A CN201811333845 A CN 201811333845A CN 109407803 A CN109407803 A CN 109407803A
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- dissipation channel
- chilling plate
- semiconductor chilling
- computer cabinet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
It further include double air ducts box body, double air duct box bodys include left heat dissipation channel and right heat dissipation channel the invention discloses a kind of computer cabinet radiator and a kind of computer cabinet, including radiating fin, semiconductor chilling plate, negative pressure fan；The huyashi-chuuka (cold chinese-style noodles) of semiconductor chilling plate faces heat dissipation channel to the right towards left heat dissipation channel, the heat of semiconductor chilling plate；Radiating fin is set in left heat dissipation channel, and the right end of radiating fin is abutted with the huyashi-chuuka (cold chinese-style noodles) of semiconductor chilling plate, and the left end of radiating fin is connected with heat conduction copper sheet, and heat conduction copper sheet is used to connect the heater element in radiating fin and computer；The rear portion of left heat dissipation channel and right heat dissipation channel rear portion are equipped with negative pressure fan.The phenomenon that structure of the invention, targetedly, heat conduction copper sheet is directly connected with heater element for heat dissipation, more efficient to the cooling of heater element compared to traditional mode taken a breath with negative pressure fan to entire cabinet, avoids localized hyperthermia in cabinet.
Description
Technical field
The present invention relates to computer field of radiating more particularly to computer cabinet radiators and a kind of computer cabinet.
Background technique
Heater element in computer cabinet includes power supply, central processing unit, mainboard, hard disk, CD-ROM drive, video card etc., is calculated
Machine temperature in chassis is excessively high, will lead to subelement damage.In general, being designed with fan on computer cabinet, fan is to entire machine
The air of case is accelerated, and the hot-air in cabinet is discharged, while sucking outside air.Due in computer cabinet everywhere
Heating efficiency is different, using above-mentioned radiating mode, has led to the higher element of heating efficiency, temperature is higher, and radiate no needle
To property, and radiating efficiency is low, unfavorable to the service life of computer.
Summary of the invention
The technical problem to be solved by the present invention is providing a kind of targeted, high computer cabinet of radiating efficiency that radiates
Radiator.
The solution that the present invention solves its technical problem is:
A kind of computer cabinet radiator, including radiating fin, semiconductor chilling plate, negative pressure fan further include double air ducts
Box body, double air duct box bodys include left heat dissipation channel and right heat dissipation channel；
Installing port is equipped between the left heat dissipation channel and the right heat dissipation channel, the semiconductor chilling plate is connected to institute
It states in installing port, towards the left heat dissipation channel, the heat of the semiconductor chilling plate faces the huyashi-chuuka (cold chinese-style noodles) of the semiconductor chilling plate
To the right heat dissipation channel；
The radiating fin is set in the left heat dissipation channel, the right end of the radiating fin and semiconductor chilling plate it is cold
Face abuts, and the left end of the radiating fin is connected with heat conduction copper sheet, and the left side of the left heat dissipation channel is equipped with heat transfer opening,
The left end of the heat conduction copper sheet is open across the heat transfer, and the heat conduction copper sheet is used to connect the hair in radiating fin and computer
Thermal element；
The rear portion of the left heat dissipation channel and the right heat dissipation channel rear portion are equipped with negative pressure fan.
Further, power supply, the power supply and the semiconductor chilling plate, negative pressure fan are equipped in the left heat dissipation channel
It is electrically connected.
Further, the material of double air duct box bodys is phenoplasts.
Further, the huyashi-chuuka (cold chinese-style noodles) surface of the semiconductor chilling plate is in corrugated, the right side of the radiating fin and half
The huyashi-chuuka (cold chinese-style noodles) shape adaptation of conductor cooling piece simultaneously abuts therewith.
It further, further include turbulent, the turbulent is in triangle cylindricality, and the turbulent is horizontally installed on the left side
The front of heat dissipation channel and the right heat dissipation channel front.
Further, water tank is additionally provided with below the right heat dissipation channel, the upper surface of the water tank is equipped with opening, described to open
Mouth is connected to the water tank and the right heat dissipation channel.
Further, water tank drawer is additionally provided in the water tank.
Further, sponge is equipped in the opening, the bottom of the sponge is protruded into the water tank, the top of the sponge
Portion is set to above the water tank.
Further, rubber seal is equipped between the installing port and the semiconductor chilling plate.
A kind of computer cabinet, including case box further include the computer cabinet radiator of any of the above-described, described double
Air duct box body is set in the case box, and the left heat dissipation channel, right heat dissipation channel run through the cabinet along the longitudinal direction
Cabinet, the right side of the case box are equipped with radiator installation gap, and the right wall of double air duct boxes is set to the heat dissipation
In device installation gap.
The beneficial effects of the present invention are: heat dissipation is targetedly, heat conduction copper sheet is directly connected with heater element, compared to tradition
The mode taken a breath with negative pressure fan to entire cabinet, it is more efficient to the cooling of heater element, it is high to avoid in cabinet part
The phenomenon of temperature.
Detailed description of the invention
To describe the technical solutions in the embodiments of the present invention more clearly, make required in being described below to embodiment
Attached drawing is briefly described.Obviously, described attached drawing is a part of the embodiments of the present invention, rather than is all implemented
Example, those skilled in the art without creative efforts, can also be obtained according to these attached drawings other designs
Scheme and attached drawing.
Fig. 1 is the perspective view of computer cabinet radiator of the invention；
Fig. 2 is the perspective view of computer cabinet of the invention.
Specific embodiment
It is carried out below with reference to technical effect of the embodiment and attached drawing to design of the invention, specific structure and generation clear
Chu is fully described by, to be completely understood by the purpose of the present invention, feature and effect.Obviously, described embodiment is this hair
Bright a part of the embodiment, rather than whole embodiments, based on the embodiment of the present invention, those skilled in the art are not being paid
Other embodiments obtained, belong to the scope of protection of the invention under the premise of creative work.In addition, be previously mentioned in text
All connection/connection relationships not singly refer to that component directly connects, and referring to can be added deduct according to specific implementation situation by adding
Few couple auxiliary, Lai Zucheng more preferably coupling structure.Each technical characteristic in the invention, in not conflicting conflict
Under the premise of can be with combination of interactions.
Referring to Fig.1, Fig. 2, this is the embodiment of the present invention, specifically:
A kind of computer cabinet radiator, including radiating fin 1, semiconductor chilling plate 2, negative pressure fan 3 further include double wind
Road box body, double air duct box bodys include left heat dissipation channel 41 and right heat dissipation channel 42；
Installing port 43, the semiconductor chilling plate 2 are equipped between the left heat dissipation channel 41 and the right heat dissipation channel 42
It is connected in the installing port 43, the huyashi-chuuka (cold chinese-style noodles) of the semiconductor chilling plate 2 is towards the left heat dissipation channel 41, the semiconductor system
Cold 2 heat is facing towards the right heat dissipation channel 42；
The radiating fin 1 is set in the left heat dissipation channel 41, the right end and semiconductor chilling plate of the radiating fin 1
2 huyashi-chuuka (cold chinese-style noodles) abuts, and the left end of the radiating fin 1 is connected with heat conduction copper sheet 11, sets on the left side of the left heat dissipation channel 41
There is heat transfer opening 410, the left end of the heat conduction copper sheet 11 passes through heat transfer opening 410, and the heat conduction copper sheet 11 is for connecting
Heater element in radiating fin 1 and computer；
The rear portion of the left heat dissipation channel 41 and right 42 rear portion of heat dissipation channel are equipped with negative pressure fan 3.
The working principle of above structure is: the heater element in computer, is connected by heat conduction copper sheet 11 and radiating fin 1
It connects, certainly, the heater element in computer has multiple, and the quantity of heat conduction copper sheet 11 is also possible to more than one piece.Radiating fin 1 is on the one hand
Partial heat is conducted to the huyashi-chuuka (cold chinese-style noodles) of semiconductor chilling plate 2, on the other hand passes through the effect of negative pressure fan 3, partial heat is passed
Pass the moving air in left heat dissipation channel 41.Further more, the hot face of semiconductor chilling plate 2 is in right heat dissipation channel 42, pass through
The effect of negative pressure fan 3, the hot face of semiconductor chilling plate 2 transfer heat to the moving air in right heat dissipation channel 42.The knot
Structure is advantageous in that: targetedly, heat conduction copper sheet 11 is directly connected with heater element, uses negative pressure fan compared to traditional for heat dissipation
It is more efficient to the cooling of heater element to the mode of entire cabinet ventilation, the phenomenon that avoiding localized hyperthermia in cabinet.Together
When, the air accelerated in right heat dissipation channel 42 by negative pressure fan 3 cools down to the hot face of semiconductor chilling plate 2, can be certain
The damage or refrigerating efficiency decline that semiconductor chilling plate 2 is avoided in degree, increase the service life of semiconductor chilling plate 2.
Further, power supply 5 is equipped in the left heat dissipation channel 41, the power supply 5 and the semiconductor chilling plate 2 are born
Pressure fan 3 is electrically connected.In this way, semiconductor chilling plate 2 need not be connect with the power supply in computer cabinet, thus, it is not necessary to double
It is punched on the box body of air duct, with electric wire arrangement, reduces the connection inside double air duct box bodys and computer cabinet, it is possible to reduce heat returns
Pass the dust accumulation in computer cabinet and in computer cabinet back.
Further, the material of double air duct box bodys is phenoplasts.It is this since phenoplasts are insulated good insulating
Setting can also play the role of reduction heat and return back in computer cabinet.
Further, the huyashi-chuuka (cold chinese-style noodles) surface of the semiconductor chilling plate 2 be in corrugated, the right side of the radiating fin 1 with
The huyashi-chuuka (cold chinese-style noodles) shape adaptation of semiconductor chilling plate 2 simultaneously abuts therewith.Radiating fin 1 and semiconductor chilling plate 2 connects in above structure
Contacting surface is cambered surface, is faced directly compared with traditional, and contact area is bigger, can increase the huyashi-chuuka (cold chinese-style noodles) of radiating fin 1 Yu semiconductor chilling plate 2
Between contact area, improve heat transfer efficiency.
It further, further include turbulent 51, the turbulent 51 is in triangle cylindricality, and the turbulent 51 is horizontally installed on
The front of the left heat dissipation channel 41 and 42 front of right heat dissipation channel.Above-mentioned turbulent 51 can play auxiliary negative pressure wind
Fan 3 accelerates the effect of air flowing.
Further, water tank 44 is additionally provided with below the right heat dissipation channel 42, the upper surface of the water tank 44 is equipped with opening
45, the opening 45 is connected to the water tank 44 and the right heat dissipation channel 42.The right heat dissipation of water evaporation in water tank 44 to top
In channel 42, as the high-speed flow in the right heat dissipation channel 42 of water tank is drained, band is for taking away the hot face of semiconductor chilling plate 2
Heat has effect very much.
Further, water tank drawer 46 is additionally provided in the water tank 44.Setting water tank drawer 46 can be convenient to water tank 44
In plus water.
Further, sponge is equipped in the opening, the bottom of the sponge is protruded into the water tank, the top of the sponge
Portion is set to above the water tank.Water in water tank 44 can be drawn onto top by sponge, increase the height in water and right heat dissipation channel 42
The contact area of fast air-flow accelerates evaporative heat loss.
Further, rubber seal is equipped between the installing port 43 and the semiconductor chilling plate 2.It is close that rubber is set
Seal can isolate the aqueous vapor in right heat dissipation channel 42, and aqueous vapor is avoided to enter in left heat dissipation channel 41.
The present invention also proposes a kind of computer cabinet, including case box, further includes the computer cabinet of any of the above-described
Radiator, double air duct box bodys are set in the case box, and the left heat dissipation channel 41, right heat dissipation channel 42 are along front and back
The case box is run through in direction, and the right side of the case box is equipped with radiator installation gap, double air duct boxes
Right wall is set in the radiator installation gap.After assembling necessary part in computer cabinet, generally there is biggish space, it will be upper
The computer cabinet radiator stated is set in case box the volume that not will increase case box, also, in above-mentioned structure, double
Space between the intracorporal space of air duct box and case box is spaced apart, moreover it is possible to play dust-proof effect.
Better embodiment of the invention is illustrated above, but the invention is not limited to the implementation
Example, those skilled in the art can also make various equivalent modifications on the premise of without prejudice to spirit of the invention or replace
It changes, these equivalent variation or replacement are included in the claim of this application limited range.
Claims (10)
1. a kind of computer cabinet radiator, including radiating fin (1), semiconductor chilling plate (2), negative pressure fan (3), feature
It is: further includes double air ducts box body, double air duct box bodys include left heat dissipation channel (41) and right heat dissipation channel (42)；
Installing port (43) are equipped between the left heat dissipation channel (41) and the right heat dissipation channel (42), the semiconductor chilling plate
(2) it is connected in the installing port (43), the huyashi-chuuka (cold chinese-style noodles) of the semiconductor chilling plate (2) is towards the left heat dissipation channel (41), institute
State the hot facing towards the right heat dissipation channel (42) of semiconductor chilling plate (2)；
The radiating fin (1) is set in the left heat dissipation channel (41), the right end and semiconductor refrigerating of the radiating fin (1)
The huyashi-chuuka (cold chinese-style noodles) of piece (2) abuts, and the left end of the radiating fin (1) is connected with heat conduction copper sheet (11), the left heat dissipation channel (41)
Left side is equipped with heat transfer opening (410), and the left end of the heat conduction copper sheet (11) passes through heat transfer opening (410), described to lead
Hot copper sheet (11) is used to connect the heater element in radiating fin (1) and computer；
The rear portion of the left heat dissipation channel (41) and right heat dissipation channel (42) rear portion are equipped with negative pressure fan (3).
2. a kind of computer cabinet radiator according to claim 1, it is characterised in that: in the left heat dissipation channel (41)
Equipped with power supply (5), the power supply (5) is electrically connected with the semiconductor chilling plate (2), negative pressure fan (3).
3. a kind of computer cabinet radiator according to claim 1, it is characterised in that: the material of double air duct box bodys
For phenoplasts.
4. a kind of computer cabinet radiator according to claim 1, it is characterised in that: the semiconductor chilling plate (2)
Huyashi-chuuka (cold chinese-style noodles) surface be in corrugated, the right side of the radiating fin (1) and the huyashi-chuuka (cold chinese-style noodles) shape adaptation of semiconductor chilling plate (2) and with
Abutting.
5. a kind of computer cabinet radiator according to claim 1, it is characterised in that: further include turbulent (51), institute
Turbulent (51) are stated in triangle cylindricality, the turbulent (51) is horizontally installed on the front of the left heat dissipation channel (41) and described
Right heat dissipation channel (42) front.
6. a kind of computer cabinet radiator according to claim 1, it is characterised in that: under the right heat dissipation channel (42)
Side is additionally provided with water tank (44), and the upper surface of the water tank (44) is equipped with opening (45), and the opening (45) is connected to the water tank
(44) with the right heat dissipation channel (42).
7. a kind of computer cabinet radiator according to claim 4, it is characterised in that: be additionally provided in the water tank (44)
Water tank drawer (46).
8. a kind of computer cabinet radiator according to claim 4, it is characterised in that: be equipped with sea in the opening (45)
Silk floss, the bottom of the sponge are protruded into the water tank (44), and the top of the sponge is set to above the water tank (44).
9. a kind of computer cabinet radiator according to claim 4, it is characterised in that: the installing port (43) with it is described
Rubber seal is equipped between semiconductor chilling plate (2).
10. a kind of computer cabinet, including case box, it is characterised in that: further include the meter of any one of claims 1 to 9
Calculation machine case radiation device, double air duct box bodys are set in the case box, the left heat dissipation channel (41), right heat dissipation channel
(42) run through the case box along the longitudinal direction, the right side of the case box is equipped with radiator installation gap, institute
The right wall for stating double air ducts box is set in the radiator installation gap.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811333845.7A CN109407803A (en) | 2018-11-10 | 2018-11-10 | A kind of computer cabinet radiator and a kind of computer cabinet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811333845.7A CN109407803A (en) | 2018-11-10 | 2018-11-10 | A kind of computer cabinet radiator and a kind of computer cabinet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109407803A true CN109407803A (en) | 2019-03-01 |
Family
ID=65472499
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811333845.7A Pending CN109407803A (en) | 2018-11-10 | 2018-11-10 | A kind of computer cabinet radiator and a kind of computer cabinet |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109407803A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111240442A (en) * | 2019-11-09 | 2020-06-05 | 湖南化工职业技术学院 | Computer electronic element cooling device |
| CN111587035A (en) * | 2020-05-08 | 2020-08-25 | 枣庄科技职业学院 | Cooling device and computer |
| CN112222642A (en) * | 2020-10-29 | 2021-01-15 | 梁少龙 | A cutting equipment that radiating effect is good for hardware processing |
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| US8341967B2 (en) * | 2010-02-18 | 2013-01-01 | Golden Sun News Techniques Co., Ltd. | Heat-dissipating device for supplying cold airflow |
| CN104679163A (en) * | 2013-11-30 | 2015-06-03 | 鸿富锦精密工业（深圳）有限公司 | Electronic device case |
| CN107506008A (en) * | 2017-10-12 | 2017-12-22 | 钦州学院 | A kind of dust guard suitable for computer host box |
| CN208042555U (en) * | 2018-03-29 | 2018-11-02 | 成都锐点精密工具有限公司 | A kind of oil filtering thermostat |
| CN208079662U (en) * | 2018-08-03 | 2018-11-09 | 成都中科天御通信技术有限公司 | A kind of power amplifier box of subregion shielding control heat dissipation |
-
2018
- 2018-11-10 CN CN201811333845.7A patent/CN109407803A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8341967B2 (en) * | 2010-02-18 | 2013-01-01 | Golden Sun News Techniques Co., Ltd. | Heat-dissipating device for supplying cold airflow |
| CN104679163A (en) * | 2013-11-30 | 2015-06-03 | 鸿富锦精密工业（深圳）有限公司 | Electronic device case |
| CN107506008A (en) * | 2017-10-12 | 2017-12-22 | 钦州学院 | A kind of dust guard suitable for computer host box |
| CN208042555U (en) * | 2018-03-29 | 2018-11-02 | 成都锐点精密工具有限公司 | A kind of oil filtering thermostat |
| CN208079662U (en) * | 2018-08-03 | 2018-11-09 | 成都中科天御通信技术有限公司 | A kind of power amplifier box of subregion shielding control heat dissipation |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111240442A (en) * | 2019-11-09 | 2020-06-05 | 湖南化工职业技术学院 | Computer electronic element cooling device |
| CN111240442B (en) * | 2019-11-09 | 2021-03-19 | 湖南化工职业技术学院 | Computer electronic element cooling device |
| CN111587035A (en) * | 2020-05-08 | 2020-08-25 | 枣庄科技职业学院 | Cooling device and computer |
| CN112222642A (en) * | 2020-10-29 | 2021-01-15 | 梁少龙 | A cutting equipment that radiating effect is good for hardware processing |
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| PB01 | Publication | ||
| PB01 | Publication | ||
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Application publication date: 20190301 |