CN109403582A - A kind of composite floor board easy to disassemble - Google Patents
A kind of composite floor board easy to disassemble Download PDFInfo
- Publication number
- CN109403582A CN109403582A CN201811491495.7A CN201811491495A CN109403582A CN 109403582 A CN109403582 A CN 109403582A CN 201811491495 A CN201811491495 A CN 201811491495A CN 109403582 A CN109403582 A CN 109403582A
- Authority
- CN
- China
- Prior art keywords
- layer
- disassemble
- composite floor
- floor board
- heating wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002131 composite material Substances 0.000 title claims abstract description 21
- 239000010410 layer Substances 0.000 claims abstract description 69
- 238000010438 heat treatment Methods 0.000 claims abstract description 36
- 238000005485 electric heating Methods 0.000 claims abstract description 18
- 238000009825 accumulation Methods 0.000 claims abstract description 17
- 238000009413 insulation Methods 0.000 claims abstract description 15
- 239000002344 surface layer Substances 0.000 claims abstract description 13
- 230000003139 buffering effect Effects 0.000 claims abstract description 8
- 238000009499 grossing Methods 0.000 claims abstract description 6
- 239000000463 material Substances 0.000 claims description 10
- 229920000181 Ethylene propylene rubber Polymers 0.000 claims description 3
- 239000006260 foam Substances 0.000 claims description 3
- 238000001746 injection moulding Methods 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 230000005611 electricity Effects 0.000 claims description 2
- 241000270295 Serpentes Species 0.000 claims 1
- 150000001336 alkenes Chemical class 0.000 claims 1
- 239000004575 stone Substances 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910021389 graphene Inorganic materials 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000009408 flooring Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F15/00—Flooring
- E04F15/02—Flooring or floor layers composed of a number of similar elements
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F15/00—Flooring
- E04F15/22—Resiliently-mounted floors, e.g. sprung floors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
- F24D13/00—Electric heating systems
- F24D13/02—Electric heating systems solely using resistance heating, e.g. underfloor heating
- F24D13/022—Electric heating systems solely using resistance heating, e.g. underfloor heating resistances incorporated in construction elements
- F24D13/024—Electric heating systems solely using resistance heating, e.g. underfloor heating resistances incorporated in construction elements in walls, floors, ceilings
-
- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04F—FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
- E04F2290/00—Specially adapted covering, lining or flooring elements not otherwise provided for
- E04F2290/02—Specially adapted covering, lining or flooring elements not otherwise provided for for accommodating service installations or utility lines, e.g. heating conduits, electrical lines, lighting devices or service outlets
- E04F2290/023—Specially adapted covering, lining or flooring elements not otherwise provided for for accommodating service installations or utility lines, e.g. heating conduits, electrical lines, lighting devices or service outlets for heating
Landscapes
- Engineering & Computer Science (AREA)
- Architecture (AREA)
- Civil Engineering (AREA)
- Structural Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Central Heating Systems (AREA)
Abstract
The invention discloses a kind of composite floor boards easy to disassemble, including the surface layer being arranged from top to bottom, heat dissipating layer, electric heating supporting layer, thermal insulation layer and buffering smoothing layer, through-hole groove is evenly distributed in heat dissipating layer, electric heating layer lower surface is equipped with the support rod being put into for heating wire, the accommodating chamber for accommodating heating wire is equipped in support rod, it is horizontal in accommodating chamber to be equipped with the card slot sticked into for heating wire, thermal insulation layer is equipped with the U-shaped groove sticked into for support rod, the purpose of the present invention is to provide a kind of composite floor boards easy to disassemble, it has the characteristics that replacement intelligent temperature control easy to disassemble and being capable of heat accumulation.
Description
Technical field
The present invention relates to composite floor board technical fields, more specifically, it relates to a kind of composite floor board easy to disassemble.
Background technique
Composite floor board is the one of which on floor, but composite floor board is artificially changed the natural structure of flooring material, is reached
The floor that a certain physical property meets the expected requirements.Currently, people couple and the research of heating floor are very extensive, heating ground
Plate is installed indoors, it is ensured that and it is indoor as warm as spring, but similarly there are problems in this floor, such as on heating ground
When plate somewhere is damaged, integral demounting is needed, is re-assemblied, expends the time；Floor temperature is uncontrollable, and room temperature is excessively high or mistake
It is low, cause the discomfort of human body；And after stopping is heated, room temperature declines too fast problem.
Summary of the invention
In view of the deficiencies of the prior art, the present invention intends to provide a kind of composite floor board easy to disassemble,
Has the characteristics that replacement easy to disassemble heating component and being capable of heat accumulation.
To achieve the above object, the present invention provides the following technical scheme that
A kind of composite floor board easy to disassemble, from top to bottom successively include surface layer, heat dissipating layer, electric heating supporting layer, thermal insulation layer and
Buffering smooths layer, and through-hole groove is evenly distributed in heat dissipating layer, and through-hole groove includes vertical heat accumulation groove and is arranged at the top of heat accumulation groove
With the spherical card slot of bottom, electric heating layer supporting layer lower surface is equipped with to be put into and horizontal support rod, support rod are set for heating wire
There is the accommodating chamber for accommodating heating wire, level is equipped with the card slot sticked into for heating wire in accommodating chamber, and thermal insulation layer is equipped with for support rod
The U-shaped groove being caught in.
Further, surface layer lower surface is equipped with several the first card columns for sticking into spherical card slot vertically, on electric heating supporting layer
Surface is equipped with several the second card columns for sticking into spherical card slot vertically, and the cross-sectional width of spherical card slot is greater than heat accumulation groove cross-sectional width.
Further, the heating wire serpentine-like placement is provided with corresponding snakelike groove on the thermal insulation layer, described
Electric heating layer supporting layer upper surface is provided with the temperature detect switch (TDS) opened and closed for controlling the electric wire circuit.
Further, surface layer is PVC printing layer and wearing layer.
Further, heat dissipating layer is made of graphene or organic silicone material.
Further, electric heating supporting layer is made of ethylene propylene rubber material.
Further, thermal insulation layer is ABS material injection molding.
Further, buffering smoothing layer is eva foam pad.
In conclusion the invention has the following advantages:
1, the setting of the first card column and the second card column keeps this floor convenient for disassembly and assembly, avoids the replacement for carrying out monolith floor every time,
The setting of card column simultaneously also avoids causing next time using the surface for destroying electric heating supporting layer and heat dissipating layer when dismantling after glue
The flaw of surface layer and heat dissipating layer or the waste directly replaced when use；
2, heat accumulation groove is provided in heat dissipating layer, the heat slow release after capable of making heating is reduced and dropped after power supply closing
Thermal loss caused by temperature is too fast is excessive.
Detailed description of the invention
Fig. 1 is one kind provided by the invention composite floor structure schematic diagram easy to disassemble；
Fig. 2 is the configuration schematic diagram of one kind provided by the invention composite floor board easy to disassemble；
Fig. 3 is that electric heating provided by the invention supports schematic diagram of a layer structure.
In figure: 1, surface layer；2, heat dissipating layer；3, electric heating supporting layer；4, thermal insulation layer；5, buffering smoothing layer；6, through-hole groove；
61, heat accumulation groove；62, spherical card slot；63, the first card column；64, the second card column；7, heating wire；71, accommodating chamber；8, support rod；81,
U-shaped groove；9, temperature detect switch (TDS).
Specific embodiment
Embodiment:
Below in conjunction with attached drawing 1-3, invention is further described in detail.
A kind of composite floor board easy to disassemble, as shown in Figs. 1-2, including be arranged from top to bottom surface layer 1, heat dissipating layer 2, electricity
Supporting layer 3, thermal insulation layer 4 and buffering smoothing layer 5 are heated, surface layer 1 is PVC printing layer and wearing layer, and heat dissipating layer 2 is graphene or has
Machine silicone material is made, and electric heating supporting layer 3 is made of ethylene propylene rubber material, when avoiding electrified regulation using insulating materials
Accident occurs, thermal insulation layer 4 is ABS material injection molding, has effects that anticorrosion antiwear, and buffering smoothing layer 5 is eva foam pad,
Also there is sound absorption function other than it floor can be made to pave, through-hole groove 6 is evenly distributed in heat dissipating layer 2, through-hole groove 6 includes vertical
Heat accumulation groove 61 and the spherical card slots 62 of the top and bottom of heat accumulation groove 61 is set, electric heating layer lower surface is equipped with for heating wire 7
The support rod 8 being put into, the both ends of support rod 8 are located at the opposite sides face on floor, facilitate the heating wire 7 between adjacent floor
It is attached, support rod 8 is soft material, and the accommodating chamber 71 for accommodating heating wire 7 is equipped in support rod 8, and thermal insulation layer 4, which is equipped with, to be supplied
The U-shaped groove 81 that support rod 8 sticks into, heating wire 7 are first put into support rod 8, and heating wire 7 is bonded placement with accommodating chamber 71, then with
Support rod 8 is caught in U-shaped card slot together and is locked, and reinforces the overall structure on floor, keeps heating wire 7 not damaged, increases
The service life of heating wire 7,1 lower surface of surface layer are equipped with several the first card columns 63 for sticking into spherical card slot 62, the first card column vertically
63 are equipped with the bulbous protrusion that diameter is greater than 63 diameter of the first card column for cylindrical and bottom, and 3 upper surface of electric heating supporting layer is perpendicular
Several the second card columns 64 for sticking into spherical card slot are directly equipped with, the second card column 64 is that cylindrical and top is equipped with diameter greater than second
The bulbous protrusion of 64 diameter of card column, the diameter of spherical card slot 62 are greater than the diameter of bulbous protrusion, and spherical card slot 62 is for globular process
Rise and be caught in but not easily to fall off, the cross-sectional width of spherical card slot 62 greatly with 61 cross-sectional width of heat accumulation groove, heat accumulation groove 61 and spherical clip
62 height of slot is equal, and heat accumulation groove 61 can be as the circulation duct of a heat, and certain altitude, which is arranged, can reduce thermal losses
And heat is stored in slow release in slot, electric heating layer upper surface is provided with temperature detect switch (TDS) 9, selects KSD301's in this implementation
Temperature detect switch (TDS), KSD301 series of products are a kind of temperature controllers for using bimetal leaf as the temperature module, double when electric appliance works normally
Sheet metal is in free state, and contact is in closure/off-state, and when temperature reaches operating temperature, bimetal leaf is heated to be produced
It gives birth to internal stress and acts rapidly, opened/closed contact, circuit is switched off/on, to play temperature control function.When electric appliance is cooled to
When reset temperature, the automatic closed/open in contact restores normal operating conditions.Heating wire 7 can be controlled when temperature is too low indoors to add
Heat, temperature can control the closing of heating wire 7 after reaching setting temperature indoors.
As shown in figure 3, being all individual 7 heat radiating structure of heating wire on every piece of floor, horizontal be equipped with is powered in accommodating chamber 71
The card slot that heated filament 7 sticks into, the serpentine-like placement of heating wire 7 are provided with corresponding snakelike groove on thermal insulation layer 4, pass through heating wire 7
It spirals the serpentine configuration of setting, heating wire 7 is in adstante febre, and heat can be distributed uniformly from floor upper surface, to interior
It is heated, heating effect is uniform.
Working principle: heating wire 7 in use, be first mounted in support rod 8, the serpentine-like structure of heating wire 7, branch by this floor
Strut 8 and heating wire 7 are caught in U-shaped groove 81 together, then are gradually clamped heat dissipating layer 2 and surface layer 1, and event occurs in certain block heating wire 7
After barrier can direct disassembling, assembling and replacing that piece, without integral demounting.
This specific embodiment is only explanation of the invention, is not limitation of the present invention, those skilled in the art
Member can according to need the modification that not creative contribution is made to the present embodiment after reading this specification, but as long as at this
All by the protection of Patent Law in the scope of the claims of invention.
Claims (8)
1. a kind of composite floor board easy to disassemble, which is characterized in that from top to bottom successively include surface layer (1), heat dissipating layer (2), electricity
Supporting layer (3), thermal insulation layer (4) and buffering smoothing layer (5) are heated, is evenly distributed with through-hole groove (6), institute in the heat dissipating layer (2)
State the spherical card slot that through-hole groove (6) includes vertical heat accumulation groove (61) and is arranged at the top and bottom of the heat accumulation groove (61)
(62), electric heating layer supporting layer (3) lower surface is equipped with is put into and horizontal support rod (8) for heating wire (7), the support
Bar (8) is equipped with the accommodating chamber (71) for accommodating the heating wire (7), and horizontal be equipped with sticks into for heating wire on the accommodating chamber (71)
Card slot, the thermal insulation layer (4) are equipped with the U-shaped groove (81) being caught in for the support rod (8).
2. one kind according to claim 1 composite floor board easy to disassemble, it is characterised in that: surface layer (1) lower surface
It is equipped with multiple the first card columns cooperated respectively with each spherical card slot (62) at the top of the heat accumulation groove (61) vertically
(63), electric heating supporting layer (3) upper surface is equipped with multiple respectively with each positioned at the heat accumulation groove (61) bottom vertically
The cross-sectional width of the second card column (64) that the spherical shape card slot (62) cooperates, the spherical shape card slot (62) is greater than the heat accumulation groove
(61) cross-sectional width.
3. one kind according to claim 1 composite floor board easy to disassemble, it is characterised in that: the heating wire (7) is in snake
Shape is placed, and corresponding snakelike groove, electric heating layer supporting layer (3) the upper surface setting are provided on the thermal insulation layer (4)
There is the temperature detect switch (TDS) (9) for controlling the opening and closing of the heating wire (7) circuit.
4. one kind according to claim 1 composite floor board easy to disassemble, it is characterised in that: the surface layer (1) is PVC print
Brush layer and wearing layer.
5. one kind according to claim 1 composite floor board easy to disassemble, it is characterised in that: the heat dissipating layer (2) is stone
Black alkene or organic silicone material are made.
6. one kind according to claim 1 composite floor board easy to disassemble, it is characterised in that: the electric heating supporting layer
(3) it is made of ethylene propylene rubber material.
7. one kind according to claim 1 composite floor board easy to disassemble, it is characterised in that: the thermal insulation layer (4) is ABS
Material injection molding.
8. one kind according to claim 1 composite floor board easy to disassemble, it is characterised in that: the buffering smooths layer (5)
For eva foam pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811491495.7A CN109403582A (en) | 2018-12-07 | 2018-12-07 | A kind of composite floor board easy to disassemble |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811491495.7A CN109403582A (en) | 2018-12-07 | 2018-12-07 | A kind of composite floor board easy to disassemble |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109403582A true CN109403582A (en) | 2019-03-01 |
Family
ID=65457612
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811491495.7A Pending CN109403582A (en) | 2018-12-07 | 2018-12-07 | A kind of composite floor board easy to disassemble |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109403582A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20200370762A1 (en) * | 2019-12-16 | 2020-11-26 | Huanuan (wuxi) Technology Co., Ltd. | Graphene heating element |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104976679A (en) * | 2015-07-22 | 2015-10-14 | 兰强 | Integrated electric heating floor |
| CN206944304U (en) * | 2017-05-22 | 2018-01-30 | 上海暖匠地暖科技有限公司 | A kind of heat storing type electric heating floor |
| CN208122215U (en) * | 2018-04-27 | 2018-11-20 | 江苏创森新材料有限公司 | A kind of composite floor board easy to disassemble |
| CN210947557U (en) * | 2019-09-03 | 2020-07-07 | 湖州悦锦阁木业有限公司 | Composite floor with heating function |
| CN213710200U (en) * | 2020-09-14 | 2021-07-16 | 上海唐盾材料科技有限公司 | Wear-resisting carpet type composite floor |
-
2018
- 2018-12-07 CN CN201811491495.7A patent/CN109403582A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104976679A (en) * | 2015-07-22 | 2015-10-14 | 兰强 | Integrated electric heating floor |
| CN206944304U (en) * | 2017-05-22 | 2018-01-30 | 上海暖匠地暖科技有限公司 | A kind of heat storing type electric heating floor |
| CN208122215U (en) * | 2018-04-27 | 2018-11-20 | 江苏创森新材料有限公司 | A kind of composite floor board easy to disassemble |
| CN210947557U (en) * | 2019-09-03 | 2020-07-07 | 湖州悦锦阁木业有限公司 | Composite floor with heating function |
| CN213710200U (en) * | 2020-09-14 | 2021-07-16 | 上海唐盾材料科技有限公司 | Wear-resisting carpet type composite floor |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20200370762A1 (en) * | 2019-12-16 | 2020-11-26 | Huanuan (wuxi) Technology Co., Ltd. | Graphene heating element |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20190301 |
|
| WD01 | Invention patent application deemed withdrawn after publication |