CN109402575A - Pedestal and evaporated device - Google Patents
Pedestal and evaporated device Download PDFInfo
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- CN109402575A CN109402575A CN201811613875.3A CN201811613875A CN109402575A CN 109402575 A CN109402575 A CN 109402575A CN 201811613875 A CN201811613875 A CN 201811613875A CN 109402575 A CN109402575 A CN 109402575A
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- conductive
- substrate
- base body
- base
- insulating
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- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 title claims abstract description 6
- 239000000758 substrate Substances 0.000 claims abstract description 81
- 238000001704 evaporation Methods 0.000 claims abstract description 57
- 230000008020 evaporation Effects 0.000 claims abstract description 55
- 238000000034 method Methods 0.000 claims abstract description 22
- 230000005540 biological transmission Effects 0.000 claims abstract description 11
- 238000007740 vapor deposition Methods 0.000 claims description 3
- 238000007599 discharging Methods 0.000 claims description 2
- 239000007888 film coating Substances 0.000 abstract description 9
- 238000009501 film coating Methods 0.000 abstract description 9
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 230000007812 deficiency Effects 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 description 32
- 230000000694 effects Effects 0.000 description 15
- 239000010408 film Substances 0.000 description 12
- 239000011521 glass Substances 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 4
- 230000005611 electricity Effects 0.000 description 4
- 229910052750 molybdenum Inorganic materials 0.000 description 4
- 239000011733 molybdenum Substances 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 238000010549 co-Evaporation Methods 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 230000007774 longterm Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000001737 promoting effect Effects 0.000 description 3
- 238000005096 rolling process Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 1
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- KTSFMFGEAAANTF-UHFFFAOYSA-N [Cu].[Se].[Se].[In] Chemical compound [Cu].[Se].[Se].[In] KTSFMFGEAAANTF-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 229910052711 selenium Inorganic materials 0.000 description 1
- 239000011669 selenium Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000005019 vapor deposition process Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/541—Heating or cooling of the substrates
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The present invention relates to a kind of pedestal and evaporated devices.The pedestal includes: base body, and for carrying substrate to be deposited, the surface of the substrate to be deposited is covered with back electrode layer；Confluence portion along the two sides for being distributed in the base body perpendicular to substrate transmission direction, and insulate with the base body and connects, and when executing evaporation process, the back electrode layer is in contact with the confluence portion；Conductive part is electrically connected and is connected to external power supply with the confluence portion, for providing voltage to the confluence portion when being powered.The technical solution can make the upper and lower surface of substrate to be deposited reach almost the same temperature, to avoid the problem of substrate film coating face temperature deficiency and as the temperature difference of substrate upper and lower surface and caused by problem on deformation, and film formation speed can also be promoted and improve quality of forming film.
Description
Technical Field
The invention relates to the technical field of semiconductor manufacturing, in particular to a base and evaporation equipment.
Background
With the increasing severity of the energy crisis, the development and application of solar energy are very important. Among them, a copper indium gallium selenide (CuInGaSe, CIGS) thin film solar cell has attracted much attention because of its advantages of high photoelectric conversion efficiency, good stability, low manufacturing cost, flexibility, and the like.
The absorption layer of the CIGS thin-film solar cell can be prepared by adopting a co-evaporation technology, wherein the heating treatment is carried out in a co-evaporation process chamber by adopting a high-temperature vacuum radiation baking mode so as to meet the temperature requirement of the co-evaporation process. In view of the uniformity of heating, the glass can be heated only on one side of the glass plane, and the other side is limited by the evaporation method, so that a large-area heating device cannot be installed, and the temperature difference of more than 10 ℃ exists between the upper surface and the lower surface of the glass. The CIGS process temperature is higher than 500 ℃, the glass softening phenomenon begins to occur at the moment, and if the power of the main heater is increased for enabling the temperature of a film coating surface to reach the standard, the softening phenomenon of the upper layer of the glass is serious, so that the glass is deformed and sags, and the subsequent process is influenced. In the related art, an auxiliary heater can be additionally arranged at the bottom so as to improve the temperature of the lower surface of a film coating surface, but the uniformity of the auxiliary heater is limited by the requirement of an evaporation space, and the phenomenon of temperature difference between the upper surface and the lower surface of glass cannot be improved uniformly and efficiently.
Disclosure of Invention
In order to overcome the problems in the related art, embodiments of the present invention provide a base and an evaporation apparatus. The technical scheme is as follows:
according to a first aspect of the embodiments of the present invention, there is provided a base applied to an evaporation apparatus, including:
the base body is used for bearing a substrate to be evaporated, and a back electrode layer is covered on the surface of the substrate to be evaporated;
the confluence parts are distributed on two sides of the base body along the direction vertical to the substrate transmission direction, are in insulated connection with the base body, and are in contact with the confluence parts when the evaporation process is executed;
and the conductive part is electrically connected with the bus part and is connected to an external power supply and used for supplying voltage to the bus part when electrified.
In one embodiment, the bus bar is a bus bar fixed on the bearing surface of the base body.
In one embodiment, the conductive portion includes a conductive slot parallel to the bus bar and connected to an external power source, and a connection post for electrically connecting the conductive slot and the bus bar;
the conductive groove is positioned on one side of the substrate to be evaporated, which is far away from the base body, along the vertical direction of the plane of the substrate to be evaporated, and the projection profile of the conductive groove on the plane of the base body is positioned on the outer side of the projection profile of the bus bar on the plane of the base body.
In one embodiment, the base further includes an insulating portion, the insulating portion is located on the bearing surface of the base body and used for insulating the base body and the substrate to be evaporated from the vapor, and a surface of the insulating portion departing from the base body is flush with a surface of the bus portion departing from the base body.
In one embodiment, the insulating portion is an insulating bar, and the insulating bar and the bus bar are perpendicular to each other.
In one embodiment, the insulating strips include a first insulating strip and a second insulating strip distributed on both sides of the base body in a substrate driving direction, and a third insulating strip located in the middle of the base body.
According to a second aspect of the embodiments of the present invention, an evaporation apparatus is provided, which includes an evaporation chamber and the above-mentioned pedestal.
In one embodiment, the evaporation device further comprises a conductive component, wherein the conductive component is connected with an external power supply and used for supplying voltage to the conductive part in the base.
In one embodiment, the conductive assembly includes a conductive roller in contact with the conductive portion; or,
the conductive component comprises a conductive elastic rod, and an elastic part of the conductive elastic rod is in contact with the conductive part; or,
the conductive assembly comprises a conductive polar plate, and the conductive polar plate is arranged opposite to the conductive part and used for discharging to the conductive part.
In one embodiment, the voltage provided by the external power source is in the range of 20V to 30V.
The technical scheme provided by the embodiment of the invention can have the following beneficial effects:
according to the technical scheme provided by the embodiment of the invention, the bus parts and the conductive parts electrically connected with the bus parts are arranged on the two sides of the base body, so that the back electrode layer of the substrate to be evaporated is in contact with the bus parts when the evaporation process is executed, and thus, when the conductive parts are connected with an external power supply, voltage can be applied to the back electrode layer through the bus parts, and the heating effect on the back electrode layer is realized. Therefore, when the evaporation process is executed, the substrate to be evaporated can enter the evaporation chamber along with the base, on one hand, the heating device at the top of the chamber is adopted to act on the substrate so as to rapidly heat the substrate, on the other hand, the conductive part of the base is controlled to be connected with an external power supply so as to generate a heating effect on the back electrode layer, so that the upper surface and the lower surface of the substrate to be evaporated can reach almost the same temperature, and the problems of insufficient temperature of the coating surface of the substrate and deformation caused by the temperature difference between the upper surface and the lower surface of the substrate are avoided. The deformation problem caused by the temperature difference between the upper surface and the lower surface of the substrate is solved, and the back electrode layer is electrified and heated, so that a large amount of heat radiation can not be generated, the utilization rate is relatively high, and the process temperature requirement of a film coating surface can be met more easily. Furthermore, the temperature rise of the film coating surface can not only generate a large amount of active electrons on the back electrode layer, which is beneficial to the growth of the CIGS film layer, thereby achieving the effects of promoting the film generation speed and improving the film forming quality, but also reducing the requirement on a heating device at the top of the chamber, reducing the power of the heating device and further achieving the effect of reducing the power consumption.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention, as claimed.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention.
FIG. 1 is a schematic diagram of a planar structure of a base shown in accordance with an exemplary embodiment;
FIG. 2 is a sectional view taken along A-A of the base shown in FIG. 1;
FIG. 3 is a cross-sectional view taken along A-A of the base shown in FIG. 1;
FIG. 4 is a schematic diagram of a planar structure of a base shown in accordance with an exemplary embodiment;
FIG. 5 is a cross-sectional view taken along line B-B of the base shown in FIG. 4;
FIG. 6 is a schematic diagram of a planar structure of a base shown in accordance with an exemplary embodiment;
FIG. 7 is a cross-sectional view through C-C of the base shown in FIG. 6;
FIG. 8 is a top view of a base body shown in accordance with an exemplary embodiment;
fig. 9 is a schematic structural view of an evaporation apparatus according to an exemplary embodiment;
FIG. 10 is a schematic diagram illustrating an evaporation chamber connected to an external power source according to an exemplary embodiment;
FIG. 11 is a schematic diagram of an evaporation chamber shown connected to an external power source according to an exemplary embodiment;
fig. 12 is a schematic of an evaporation chamber shown connected to an external power source according to an exemplary embodiment.
Detailed Description
Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present invention. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the invention, as detailed in the appended claims.
The technical scheme provided by the embodiment of the invention relates to a base which is applied to evaporation equipment. Fig. 1 schematically shows a plan structure of a base. According to fig. 1, the base 10 includes a base body 101, a bus portion 102, and a conductive portion 103. Specifically, the base body 101 may be configured to support a substrate to be vapor-deposited, a back electrode layer, such as a molybdenum electrode layer, is covered on a surface of the substrate to be vapor-deposited, which is close to the base body 101, the bus portions 102 are distributed on two sides of the base body 101 along a direction perpendicular to a substrate transmission direction, and are in insulation connection with the base body 101, and the bus portions 102 are in contact with the back electrode layer of the substrate to be vapor-deposited when performing a vapor deposition process; the conductive portion 103 is electrically connected to the bus portion 102 and to an external power supply, and is used to supply a necessary voltage to the bus portion 102 when the external power supply is turned on, i.e., when power is applied.
Fig. 2 and fig. 3 are schematic diagrams illustrating a positional relationship between the substrate 20 to be evaporated and the susceptor 10. The substrate 20 to be evaporated includes a substrate 201, and a back electrode layer 202, such as a molybdenum electrode layer or an aluminum electrode layer, is covered on one surface of the substrate 201 close to the base body 101. For example, referring to the sectional view along the direction a-a in fig. 2 and 3, the base body 101 includes a bearing surface and a driving surface, which are oppositely disposed and have a hollow structure, the bearing surface refers to a surface for placing the substrate 20 to be evaporated, i.e., the upper surface in fig. 2 and 3, and the driving surface refers to a surface for contacting a driving member, e.g., a roller, i.e., the lower surface in fig. 2 and 3, and the hollow area of the hollow structure is determined so as not to affect the film evaporation of the substrate 20 to be evaporated. The bus part 102 is installed on the base body 101, such as the edge of the carrying surface or the side surface of the base 10, and the direction thereof should be parallel to the substrate transmission direction, the bus part 102 can be made of a corrosion-resistant and high temperature-resistant conductive material, such as titanium alloy, and an insulating layer is further required between the bus part 102 and the base body 101 to prevent the bus part 102 from communicating with the evaporation chamber in the power-on state to cause electric leakage. The conductive portion 103 is electrically connected to the bus portion 102 and is also connected to an external power source, and can supply a desired voltage to the bus portion 102 when the external power source is connected. Based on the base 10 structure in this embodiment, when performing the evaporation process, the substrate 20 to be evaporated may be placed on the carrying surface side of the base 10 and be in contact with the bus bar portion 102, for example, the substrate 20 to be evaporated shown in fig. 2 and 3 is placed on the bus bar portion 102 higher than the base body 101, so that the back electrode layer 202 of the substrate 20 to be evaporated is in direct contact with the bus bar portion 102.
Based on this, according to the technical solution provided by the embodiment of the present invention, the bus portions 102 and the conductive portions 103 electrically connected to the bus portions 102 are disposed on two sides of the base body 101, so that the back electrode layer 202 of the substrate 20 to be evaporated is in contact with the bus portions 102 when the evaporation process is performed, and thus, when the conductive portions 103 are connected to an external power source, a voltage is applied to the back electrode layer 202 through the bus portions 102, thereby achieving a heating effect on the back electrode layer 202. Thus, when the evaporation process is performed, the substrate 20 to be evaporated can enter the evaporation chamber along with the base 10, on one hand, a heating device at the top of the chamber is adopted to act on the substrate 201 to rapidly heat the substrate, on the other hand, the conductive part 103 of the base 10 is controlled to be connected with an external power supply to generate a heating effect on the back electrode layer 202, so that the upper surface and the lower surface of the substrate 20 to be evaporated can reach almost the same temperature, and the problems of insufficient temperature of the coating surface of the substrate and deformation caused by the temperature difference between the upper surface and the lower surface of the substrate can be avoided. Because the back electrode layer 202 is not heated by electricity, a large amount of heat radiation can not be generated, and the utilization rate is relatively high, the process temperature requirement of the film coating surface can be more easily met. Furthermore, the temperature increase of the film coating surface can generate a large amount of active electrons in the back electrode layer 202, which is beneficial to the growth of the CIGS film layer, thereby achieving the effects of promoting the film generation speed and improving the film forming quality, and reducing the requirement on a heating device at the top of the chamber, so that the power of the heating device can be reduced, thereby achieving the effect of reducing the power consumption.
In this embodiment, the bus bar 102 may be a bus bar having a width as narrow as possible while ensuring that a space for the substrate 20 to be deposited is provided. In consideration of the need for electrical insulation between the bus bar 102 and the base body 101, in this embodiment, an insulating medium may be added at the connection portion between the bus bar 102 and the base body 101, for example, an insulating layer is coated on the surface of the bus bar 102 contacting the base body 101, or an insulating layer is coated on the surface of the base body 101 contacting the bus bar 102, or an insulating pad is added in the contact area between the bus bar 102 and the base body 101, so that when the conductive portion 103 is connected to an external power supply, the current is not guided to the evaporation chamber, thereby achieving the effect of preventing the device from leaking electricity.
Alternatively, referring to fig. 2, the bus bar may be fixed on the carrying surface of the base body 101 and have the same length as the first side of the base body 101, wherein the first side is a side parallel to the substrate transmission direction, that is, a side provided with the bus bar. In this case, the insulating medium may be provided below the bus bar at a portion contacting the base body 101. Since the bus bars have the same length as the first side of the base body 101, that is, the bus bars are continuously distributed on the side of the base body 101, when the conductive portion 103 is connected to an external power source, the bus bars can uniformly apply an external voltage to the surface of the back electrode layer, thereby ensuring uniformity of heating.
Alternatively, referring to fig. 3, the bus bar may be installed on the side of the base body 101 and have the same length as the first side of the base body 101, wherein the first side is a side parallel to the substrate transmission direction, that is, a side where the bus bar is disposed. At this time, the height of the bus bar should be higher than the base body 101 so as to ensure that the substrate 20 to be evaporated can contact with the bus bar without causing the bus bar to communicate with the base body 101. In this case, the insulating medium may be provided at a portion inside the bus bar, which is in contact with the base body 101. Since the bus bars have the same length as the first side of the base body 101, that is, the bus bars are continuously distributed on the side of the base body 101, when the conductive portion 103 is connected to an external power source, the bus bars can uniformly apply an external voltage to the surface of the back electrode layer, thereby ensuring uniformity of heating.
Fig. 4 schematically shows a plan view of the base 10 based on the structure of the conductive portion 103, and fig. 5 is a cross-sectional view of the base 10 along the direction B-B. In the present embodiment, the conductive part 103 includes a conductive groove 1031 and a connection post 1032. As can be seen from fig. 4 and 5, the conductive slots 1031 are parallel to the bus bars, and the connecting posts 1032 can electrically connect the conductive slots 1031 to the bus bars and can further serve to support the conductive slots 1031. The connection post 1032 extends upward and outward in an inclined manner relative to the base body 101, so that the projection profile of the conductive slot 1031 on the plane of the base body 101 is located on the outer side of the projection profile of the bus bar on the plane of the base body 101, and along the direction perpendicular to the base body 101, the conductive slot 1031 is located on one side of the substrate to be evaporated 20 departing from the base body 101. In this way, when performing the evaporation process, the conductive groove 1031 is located outside the substrate 20 to be evaporated and higher than the substrate 20 to be evaporated, which not only does not affect the top heating device to heat the substrate 201, but also can conveniently achieve the connection with the external power supply.
In consideration of the fact that the area of the substrate 20 to be evaporated is generally large in actual production, merely by overlapping the edge of the substrate on the first side of the susceptor body 101 is likely to cause the middle of the substrate to collapse, the present embodiment may further provide insulating support members at certain positions of the susceptor body 101. Fig. 6 is a schematic plan view schematically showing a base 10 including an insulating support member, and fig. 7 is a sectional view of the base 10 in the direction C-C. As can be seen from fig. 6 and 7, the susceptor 10 may further include an insulating portion 104 disposed on the carrying surface of the susceptor body 101, a surface, i.e., an upper surface, of the insulating portion 104 facing away from the susceptor body 101 is flush with a surface, i.e., an upper surface, of the bus portion 102 facing away from the susceptor body 101, so that a middle portion of the substrate 20 to be evaporated is supported by the insulating portion 104 when the substrate is in contact with the bus portion 102, and at the same time, the substrate body 101 and the substrate 20 to be evaporated are ensured to be insulated from each other, so as to avoid current from being guided to the evaporation chamber to cause current leakage in the power-on state.
In this embodiment, the insulating portions 104 may be insulating bars, and the insulating bars are perpendicular to the bus bars, so as to form a structure staggered horizontally and vertically on the surface of the base body 101 to support the substrate 20 to be vapor deposited. Specifically, the insulating strips include a first insulating strip and a second insulating strip which are distributed on two sides of the base body 101 along the substrate transmission direction, and a third insulating strip which is located in the middle of the base body 101, that is, the insulating strips are distributed on the second side of the base body 101 and are parallel to the middle position of the second side, so that the substrate 20 to be evaporated can be supported and the base body 101 and the substrate 20 to be evaporated can be ensured to be insulated from each other. It should be noted that: fig. 8 schematically illustrates a structure of the base body 101. As can be seen from fig. 8, a supporting beam 800 is disposed at a position of the base body 101 corresponding to the third insulating strip, the supporting beam 800 can be used to support the substrate 20 to be evaporated thereon, so as to avoid the problem of excessive deformation caused by heating the substrate in the heating process, and the supporting beam 800 is also a glass cutting line position in the post-processing, so that the third insulating strip is disposed above the supporting beam 800, and thus the evaporation surface of the substrate 20 to be evaporated is not shielded.
The technical scheme provided by the embodiment of the invention also relates to evaporation equipment which comprises an evaporation chamber and the base 10 structure. Fig. 9 schematically shows a structure of the evaporation apparatus. As shown in fig. 9, the evaporation chamber 80 includes a heating device 801 at the top, an evaporation source 802 at the bottom, and a driving mechanism 803 for transferring a substrate. Specifically, the heating device 801 includes a heating wire and a carbon fiber plate for dissipating heat, which can radiate heat on the substrate 201 side of the substrate 20 to be evaporated, the evaporation source 802 includes a plurality of evaporation sources 802, the plurality of evaporation sources 802 are used for evaporating different materials, such as copper, indium, gallium, and selenium, respectively, the transmission mechanism 803 can be implemented by using a transmission belt or a roller, and the mechanical structure thereof is distributed at the edge of the evaporation chamber for carrying and transmitting the base body 101, although the transmission mechanism 803 needs to be able to withstand the high temperature environment inside the evaporation chamber.
Based on this, when the evaporation apparatus provided by the embodiment of the present invention is used to perform the evaporation process, on one hand, the heating device 801 on the top of the chamber is used to perform radiant heating on the upper surface side of the substrate 20 to be evaporated, and on the other hand, the susceptor 10 structure is used to perform electrical heating on the back electrode layer 202 of the substrate 20 to be evaporated, so that the back electrode layer 202 becomes the self-heating layer of the film plating surface, the heat can directly act on the surface of the coating film, thereby achieving good auxiliary heating effect, leading the upper surface and the lower surface of the substrate 20 to be evaporated to achieve almost the same temperature, the deformation problem caused by the temperature difference between the upper and lower surfaces of the substrate is avoided on the basis of omitting the bottom auxiliary heater, because the back electrode layer 202 is not heated by electricity, a large amount of heat radiation can not be generated, and the utilization rate is relatively high, the process temperature requirement of the film coating surface can be more easily met. Furthermore, the temperature increase of the film coating surface not only can generate a large amount of active electrons on the back electrode layer 202, which is beneficial to the growth of the CIGS film layer, thereby achieving the effects of promoting the film generation speed and improving the film forming quality, but also can reduce the requirement on a heating device at the top of the chamber, so that the power of the heating device can be reduced, and the effect of reducing the power consumption can be achieved.
Considering the connection manner of the conductive part 103 of the base 10 and the external power source, the evaporation apparatus provided by the present embodiment may further include a conductive component connected with the external power source for providing a required voltage to the conductive part 103 in the base 10 by means of the external power source, so as to achieve communication between the external power source and the conductive part 103 of the base 10.
In one embodiment, the conductive component may be a conductive roller brush 804, and the conductive roller brush 804 may contact the conductive portion 103 of the base 10 to communicate the conductive portion 103 with an external power source. Fig. 10 schematically illustrates an evaporation apparatus provided with a conductive rolling brush 804. As can be seen from fig. 10, the axial center of the conductive roller brush 804 is electrically connected to an external power source through a wire, and the roller of the conductive roller brush 804 contacts with the conductive portion 103, such as a conductive groove, of the base 10, so that an external voltage can be guided to the back electrode layer 202 of the substrate 20 to be evaporated through the conductive portion 103 and the bus portion 102 of the base 10 during energization, thereby achieving an effect of electrically heating the back electrode layer 202. The conductive rolling brush 804 is positioned at the upper half part of the evaporation chamber 80, so that the coating space is not occupied, and the probability of being polluted by impurities in the evaporation process can be reduced. It should be noted that: in order to prevent the conductive roller brush 804 from being shorted to the ground during long-term use, the conductive roller brush 804 needs to be periodically cleaned.
In one embodiment, the conductive element may be a conductive elastic bar 805, and the elastic portion of the conductive elastic bar 805 may contact the conductive portion 103 of the base 10 to communicate the conductive portion 103 with an external power source. Fig. 11 schematically shows a schematic view of an evaporation apparatus provided with a conductive elastic bar 805. As can be seen from fig. 11, the tail end of the conductive elastic bar 805 is electrically connected to an external power source through a wire, and the elastic portion of the conductive elastic bar 805 is in contact with the conductive portion 103, such as a conductive groove, of the base 10, so that an external voltage can be conducted to the back electrode layer 202 of the substrate 20 to be evaporated through the conductive portion 103 and the bus portion 102 of the base 10 during energization, thereby achieving an effect of electrically heating the back electrode layer 202. Since the conductive elastic bar 805 is located at the upper half of the evaporation chamber 80, it does not occupy the coating space, so that the probability of being contaminated by impurities during the evaporation process can be reduced. It should be noted that: since the conductive elastic bar 805 is worn during a long-term use, the conductive elastic bar 805 needs to be replaced periodically.
In one embodiment, the conductive component may be a conductive plate 806, and the conductive plate 806 may be disposed opposite to the conductive portion 103 of the base 10 to communicate the conductive portion 103 with an external power source by means of plate discharge. Fig. 12 schematically shows an evaporation apparatus provided with a conductive plate 806. As can be seen from fig. 12, the conductive plate 806 is electrically connected to an external power source through a wire, and is opposite to the conductive portion 103 of the base 10, for example, the conductive groove, and can discharge electricity to the opposite conductive portion 103 when energized, so that an external voltage can be conducted to the back electrode layer 202 of the substrate 20 to be evaporated through the conductive portion 103 of the base 10 and the bus portion 102 when energized, thereby achieving an energizing and heating effect on the back electrode layer 202. Since the conductive elastic bar 805 is located at the upper half of the evaporation chamber 80, it does not occupy the coating space, so that the probability of being contaminated by impurities during the evaporation process can be reduced. It should be noted that: to prevent the conductive plate 806 from shorting to ground during long term use, the conductive plate 806 needs to be cleaned periodically.
It should be noted that: the manner in which the conductive portion 103 of the base 10 communicates with the external power supply is not limited to the above-described embodiment, and any other method may be used as long as it can apply the voltage of the external power supply to the conductive portion 103 and is suitable for the vapor deposition apparatus.
In this embodiment, the voltage of the external power source should be selected according to the power and voltage requirements of the actual heating test. Specifically, the voltage supplied from the external power source may be set in a range of 20V to 30V, and since the thickness of the back electrode layer 202 of the substrate 20 to be evaporated, for example, a molybdenum electrode layer, is generally in the order of micrometers, a low-voltage current source in the voltage range may be selected to match it in order to prevent the molybdenum electrode layer from being broken down or causing arc streaks.
Other embodiments of the invention will be apparent to those skilled in the art from consideration of the specification and practice of the disclosure disclosed herein. This application is intended to cover any variations, uses, or adaptations of the invention following, in general, the principles of the invention and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the invention being indicated by the following claims.
It will be understood that the invention is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the invention is limited only by the appended claims.
Claims (10)
1. The utility model provides a base, is applied to evaporation equipment, its characterized in that includes:
the base body is used for bearing a substrate to be evaporated, and a back electrode layer is covered on the surface of the substrate to be evaporated;
the confluence parts are distributed on two sides of the base body along the direction vertical to the substrate transmission direction, are in insulated connection with the base body, and are in contact with the confluence parts when the evaporation process is executed;
and the conductive part is electrically connected with the bus part and is connected to an external power supply and used for supplying voltage to the bus part when electrified.
2. The pedestal of claim 1, wherein the bus bar is a bus bar fixed to the bearing surface of the pedestal body.
3. The base of claim 2, wherein the conductive portion includes a conductive slot parallel to the bus bar and connected to an external power source, and a connection post for electrically connecting the conductive slot and the bus bar;
the conductive groove is positioned on one side of the substrate to be evaporated, which is far away from the base body, along the vertical direction of the plane of the base body, and the projection profile of the conductive groove on the plane of the base body is positioned on the outer side of the projection profile of the bus bar on the plane of the base body.
4. The susceptor of claim 1, further comprising an insulating portion located on the carrying surface of the susceptor body for insulating the susceptor body and the substrate to be evaporated from each other, wherein a surface of the insulating portion facing away from the susceptor body is flush with a surface of the current collecting portion facing away from the susceptor body.
5. The base of claim 4, wherein the insulating portion is an insulating bar that is perpendicular to the bus bar.
6. The susceptor of claim 5, wherein the insulating strips comprise first and second insulating strips distributed on both sides of the susceptor body in a substrate drive direction, and a third insulating strip located in a middle of the susceptor body.
7. An evaporation apparatus comprising an evaporation chamber and the susceptor according to any one of claims 1 to 6.
8. The vapor deposition apparatus according to claim 7, further comprising a conductive member connected to an external power source for supplying a voltage to the conductive portion in the base.
9. The evaporation apparatus according to claim 8, wherein the conductive member includes a conductive roller brush, the conductive roller brush being in contact with the conductive portion; or,
the conductive component comprises a conductive elastic rod, and an elastic part of the conductive elastic rod is in contact with the conductive part; or,
the conductive assembly comprises a conductive polar plate, and the conductive polar plate is arranged opposite to the conductive part and used for discharging to the conductive part.
10. The vapor deposition apparatus according to claim 8, wherein the voltage supplied from the external power supply is in a range of 20V to 30V.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811613875.3A CN109402575A (en) | 2018-12-27 | 2018-12-27 | Pedestal and evaporated device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811613875.3A CN109402575A (en) | 2018-12-27 | 2018-12-27 | Pedestal and evaporated device |
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| CN109402575A true CN109402575A (en) | 2019-03-01 |
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| CN201811613875.3A Pending CN109402575A (en) | 2018-12-27 | 2018-12-27 | Pedestal and evaporated device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN114318239A (en) * | 2021-12-30 | 2022-04-12 | 中国科学院西安光学精密机械研究所 | Multi-angle adjustable coating workpiece frame for optical oblique vapor deposition coating |
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