CN109390299B - Power semiconductor device, motor controller, and vehicle - Google Patents
Power semiconductor device, motor controller, and vehicle Download PDFInfo
- Publication number
- CN109390299B CN109390299B CN201811261764.0A CN201811261764A CN109390299B CN 109390299 B CN109390299 B CN 109390299B CN 201811261764 A CN201811261764 A CN 201811261764A CN 109390299 B CN109390299 B CN 109390299B
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- power semiconductor
- capacitor
- terminal
- outer body
- semiconductor device
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 75
- 239000003990 capacitor Substances 0.000 claims abstract description 64
- 238000004100 electronic packaging Methods 0.000 claims abstract description 19
- 238000004806 packaging method and process Methods 0.000 claims abstract description 11
- 230000017525 heat dissipation Effects 0.000 claims description 34
- 239000002826 coolant Substances 0.000 claims description 24
- 230000000149 penetrating effect Effects 0.000 claims description 4
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/49—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions wire-like arrangements or pins or rods
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
Abstract
The invention belongs to the field of electronic packaging devices, and particularly provides a power semiconductor device, a motor controller and a vehicle. The invention aims to solve the problems that stray inductance at a connecting port is large and a power device does not have expansibility due to the connection mode of a busbar capacitor and a power module of the conventional power device. The power semiconductor device comprises a plurality of electronic packaging devices, wherein each electronic packaging device comprises a packaging outer body, a power semiconductor unit and a capacitor, the power semiconductor unit and the capacitor are arranged in the packaging outer body, and the capacitor is connected with the direct current side of the power semiconductor unit. Due to the arrangement, the distance between the power semiconductor unit and the capacitor is greatly shortened, and the stray inductance of the busbar is effectively reduced; meanwhile, the modularization and the design expandability of the power device are greatly improved by the arrangement.
Description
Technical Field
The invention belongs to the field of electronic packaging devices, and particularly provides an electronic packaging device, a power semiconductor device, a motor controller and a vehicle.
Background
Taking a motor controller as an example, for the motor controller, the size of the stray inductance of the dc busbar has an important influence on the system efficiency. Especially for the application of wide bandgap semiconductor, the low stray inductance can effectively increase the switching speed of the semiconductor device and reduce the switching loss.
For a conventional motor controller, the semiconductor power module and the bus bar capacitor are usually separately designed and manufactured, and then connected together by means of screws or welding in the final assembly process of the motor controller. Although the design of the semiconductor power module and the design of the bus bar are relatively independent, the consistency and the universality of the bus bar interface are not excessively considered, but the stray inductance at the connecting port of the semiconductor power module and the bus bar capacitor is usually larger by the design mode, so that the bottleneck for restricting the further optimization of the system is formed. Secondly, the traditional design is not expandable, and systems with different power levels often need to be redesigned for a power module and a busbar capacitor, so that the development period of the system is prolonged, and the hardware cost is increased.
In order to realize lower stray inductance of the busbar, improve the power density of the motor controller and reduce the assembly difficulty of the motor controller in the final production process, the busbar capacitor and the power module are preferably integrally designed and packaged in a unified and expandable manner on the device level.
Accordingly, there is a need in the art for a new electronic package device that addresses the above-mentioned problems.
Disclosure of Invention
In a first aspect, the present invention provides an electronic package device comprising a package outer body, and a power semiconductor unit and a capacitor disposed within the package outer body, the capacitor being connected to a dc side of the power semiconductor unit.
In a preferred embodiment of the electronic package device, the electronic package device further includes a first capacitor dc terminal and a second capacitor dc terminal; one side of the first capacitor direct current terminal is connected with the capacitor, and the other side of the first capacitor direct current terminal is connected with the direct current side of the power semiconductor unit; one side of the second capacitor direct current terminal is connected with the capacitor, and the other side of the second capacitor direct current terminal is arranged on the packaging outer body in a penetrating mode.
In a preferred embodiment of the electronic package device, the electronic package device further includes an ac terminal, one side of the ac terminal is connected to the ac side of the power semiconductor unit, and the other side of the ac terminal is disposed on the package outer body in a penetrating manner.
In a preferred technical solution of the above electronic package device, the electronic package device further includes a heat dissipation structure disposed inside the package outer body and arranged along the power semiconductor unit and/or the capacitor.
In a preferred embodiment of the electronic package device, the heat dissipation structure includes a coolant channel, and a coolant inlet and a coolant outlet of the coolant channel are both disposed on the package outer body.
In the above preferred technical solution of the electronic package device, the heat dissipation structure includes a plurality of heat dissipation through holes, and a heat dissipation opening of each of the heat dissipation through holes is disposed on the package outer body.
In a preferred technical solution of the above electronic package device, the first capacitor dc terminal, the second capacitor dc terminal, and the ac terminal include a busbar.
In a second aspect, the present invention further provides a power semiconductor device, comprising a plurality of electronic packaging devices as described in any of the above preferred embodiments; the second capacitance direct current terminals of the electronic packaging devices are connected in parallel.
In a third aspect, the present invention further provides a motor controller, including the power semiconductor device in the above preferred technical solution.
In a fourth aspect, the present invention further provides a vehicle, including the motor controller in the above preferred technical solution.
As can be understood by those skilled in the art, in the technical solution of the present invention, the electronic package device includes a package outer body, and a power semiconductor unit and a capacitor which are arranged in the package outer body, and the capacitor is connected to the direct current side of the power semiconductor unit.
Compared with the traditional design mentioned in the background art, the power semiconductor unit and the capacitor are integrally packaged, the distance between the power semiconductor unit and the capacitor is greatly shortened, the stray inductance at the connecting end of the power semiconductor unit and the capacitor is effectively reduced, and the switching speed of a semiconductor device is improved, which is particularly important for further improving the working efficiency of the power module based on the wide bandgap semiconductor; meanwhile, the modularization of the electronic packaging devices and the expandability of the design are greatly improved due to the arrangement, the design of the system is very convenient due to the modularized design, and only the electronic packaging devices with proper number are connected in parallel according to the power requirement of the system.
Drawings
Preferred embodiments of the present invention are described below in conjunction with an automobile with reference to the accompanying drawings, in which:
fig. 1 is a schematic structural diagram of a power semiconductor device of a motor controller according to an embodiment of the present invention;
fig. 2 and 3 are schematic structural views of an electronic package device of a power semiconductor device according to an embodiment of the present invention;
list of reference numerals:
1. an electronic packaging device; 11. packaging the outer body; 12. a power semiconductor unit; 121. an AC terminal; 13. a capacitor; 131. a first capacitive DC terminal; 132. a second capacitive DC terminal; 14. a heat dissipation structure; 141. a coolant inlet; 142. a coolant outlet.
Detailed Description
It should be understood by those skilled in the art that the embodiments of the present invention are only for explaining the technical principle of the present invention, and are not intended to limit the scope of the present invention. For example, although the present invention is described and illustrated in connection with a motor controller of an automobile, this is not a limitation on the scope and context of use of the electronic package of the present invention, which may also be used in other contexts, such as power components for oil downhole power circuits, etc. Those skilled in the art can make modifications as needed to suit a particular application, and such modified embodiments will still fall within the scope of the present invention.
It should be noted that in the description of the present invention, the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicating the directions or positional relationships are based on the directions or positional relationships shown in the drawings, which are only for convenience of description, and do not indicate or imply that the device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
Furthermore, it should be noted that, in the description of the present invention, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
As shown in fig. 1 to 3, fig. 1 is a schematic structural diagram of a power semiconductor device of a motor controller according to an embodiment of the present invention; fig. 2 and 3 are schematic structural views of an electronic package device of a power semiconductor device according to an embodiment of the present invention. Referring to fig. 1 to 3, the automobile includes a motor controller including a power semiconductor device formed by connecting a plurality of electronic packages 1 in parallel, the plurality of electronic packages 1 being arranged side by side. Each electronic package device 1 includes a package outer body 11, and a power semiconductor unit 12 and a capacitor 13 which are provided inside the package outer body 11, the capacitor 13 being connected to the dc side of the power semiconductor unit 12. As an example, the power semiconductor device is an inverter.
By integrally packaging the power semiconductor unit 12 and the capacitor 13, the distance between the power semiconductor unit 12 and the capacitor 13 is greatly shortened, the stray inductance of the busbar is effectively reduced, and the power density and the working efficiency of the motor controller are improved; meanwhile, the modularization of the motor controller and the expandability of the design are greatly improved through the arrangement, the assembly difficulty of the motor controller in the final production process is reduced, the design of the motor controller becomes very convenient, and if the motor controller only needs to be connected with a proper number of electronic packaging devices 1 in parallel according to the power requirement.
In one embodiment of the present invention, the electronic package device 1 further comprises a first capacitive dc terminal 131 and a second capacitive dc terminal 132; one side of the first capacitive dc terminal 131 is connected to the capacitor 13, and the other side of the first capacitive dc terminal 131 is connected to the dc side of the power semiconductor unit 12; one side of the second dc terminal 132 is connected to the capacitor 13, the other side of the second dc terminal 132 is disposed on the package outer body 11, and the second dc terminals 132 of the electronic packages 1 are connected in parallel. The second capacitor dc terminals 132 of the plurality of electronic packages 1 are all one end of the power semiconductor device. The electronic package device 1 further includes an ac terminal 121, one side of the ac terminal 121 is connected to the ac side of the power semiconductor unit 12, and the other side of the ac terminal 121 is provided to penetrate the package outer body 11. The ac terminals 121 are located at the end of the package outer body 11, and the ac terminals 121 of the plurality of electronic packages 1 are located at the other end of the power semiconductor device. By such an arrangement, normal operation of the electronic package 1 is ensured.
As an example, the first capacitor dc terminal 131, the second capacitor dc terminal 132 and the ac terminal 121 each include a bus bar, and the first capacitor dc terminal 131 and the second capacitor dc terminal 132 are integrated. It can be understood that the first capacitor dc terminal 131 and the second capacitor dc terminal 132 may also be a split structure, and those skilled in the art can reasonably set the first capacitor dc terminal 131 and the second capacitor dc terminal 132 according to actual situations and needs, as long as the electrical connection between the power semiconductor unit 12 and the capacitor 13 and the electrical connection between the power semiconductor unit and the external load can be achieved.
With continued reference to fig. 2 and 3, the electronic package device 1 further comprises a heat dissipation structure 14 disposed within the package outer body 11 and arranged along the power semiconductor unit 12 so as to better carry away heat dissipated by the power semiconductor unit 12. By directly arranging the heat dissipation structure 14 on the outer packaging body 11, the working temperature of the electronic packaging device 1 can be effectively reduced, the normal operation of the motor controller is ensured, and the operation reliability of the motor controller is improved.
It will be appreciated that the heat dissipation structure 14 may also be arranged along the power semiconductor unit 12 and the capacitor 13, enabling an efficient heat dissipation of the power semiconductor unit 12 and the capacitor 13. The heat dissipation structure 14 may be reasonably arranged by those skilled in the art according to actual conditions and needs as long as the position of the heat dissipation structure 14 can achieve heat dissipation to the power semiconductor unit 12 and/or the capacitor 13.
In one embodiment of the present invention, the heat dissipation structure 14 includes a coolant channel, and a coolant inlet 141 and a coolant outlet 142 of the coolant channel are disposed on the package outer body 11. The coolant can be introduced into the coolant channel, and effective heat dissipation of the electronic package device 1 is realized.
By providing the coolant passage, the heat of the power semiconductor unit 12 and the capacitor 13 can be taken away by the coolant, providing effective heat dissipation for the electronic package device 1. Because the semiconductor chip easily generates heat in the working process, and the generated heat is more, the coolant inlet 141 and the coolant outlet 142 can be arranged at the positions close to the power semiconductor units 12, so that the heat exchange is performed on the power semiconductor units 12 first, and the effect of fully utilizing the coolant to effectively dissipate the heat of the power semiconductor units 12 is achieved.
In another embodiment of the present invention, the heat dissipation structure 14 includes a plurality of heat dissipation through holes, and a heat dissipation port of each heat dissipation through hole is disposed on the package outer body 11. By providing the heat dissipation through-hole on the package outer body 11, heat in the heat dissipation through-hole can be taken away by wind or coolant, providing effective heat dissipation for the electronic package device 1.
As an example, the heat dissipating through holes are arranged as cylindrical cavities, which can allow wind or coolant to better pass through the heat dissipating through holes and take away heat. It can be understood that the heat dissipation through hole can be also arranged in other shapes, such as a cuboid cavity or a special-shaped cavity, and the shape of the heat dissipation through hole can be reasonably arranged by the technical personnel in the field according to actual conditions and needs, as long as the heat dissipation through hole can enable wind or coolant to smoothly pass through and take away heat.
It should be noted that, since the power semiconductor unit 12 and the capacitor 13 are directly packaged and integrated to form a minimum unit, when the power level required by the motor controller is low, a power semiconductor device including a small number of "minimum units" (i.e., the electronic package device 1) can be used; obviously, when the power level required by the motor controller is higher, the requirement can be met by using a parallel connection containing a larger number of minimum units. With the arrangement, for the power semiconductor unit 12, the stray inductance of the direct current loop is expected to be controlled within 10nH, so that not only is the stray inductance effectively reduced, but also the motor controller is more convenient and faster to assemble.
As can be seen from the above description, the power semiconductor device of the motor controller of the present invention includes a plurality of electronic package devices connected in parallel, each electronic package device including a package outer body and a power semiconductor unit and a capacitor disposed within the package outer body. The arrangement greatly shortens the distance between the power semiconductor unit and the capacitor, and effectively reduces the stray inductance of the busbar; meanwhile, the modularization of the motor controller and the expandability of the design are greatly improved. Preferably, the electronic package device includes a first capacitive dc terminal, a second capacitive dc terminal, and an ac terminal. Through such setting, guaranteed motor controller's normal operating. Preferably, a heat dissipation structure is disposed on the package outer body. Through the arrangement, the working temperature of the power semiconductor unit and the capacitor can be effectively reduced, the normal operation of the motor controller is ensured, and the operation reliability of the motor controller is improved.
So far, the technical solutions of the present invention have been described in connection with the preferred embodiments shown in the drawings, but it is easily understood by those skilled in the art that the scope of the present invention is obviously not limited to these specific embodiments. Equivalent changes or substitutions of related technical features can be made by those skilled in the art without departing from the principle of the invention, and the technical scheme after the changes or substitutions can fall into the protection scope of the invention.
Claims (7)
1. A power semiconductor device comprising a plurality of electronic packages;
the electronic packaging device comprises a packaging outer body, a power semiconductor unit and a capacitor which are arranged in the packaging outer body,
the capacitor is connected with the direct current side of the power semiconductor unit;
the electronic packaging device further comprises a first capacitor direct current terminal and a second capacitor direct current terminal;
one side of the first capacitor direct current terminal is connected with the capacitor, and the other side of the first capacitor direct current terminal is connected with the direct current side of the power semiconductor unit;
one side of the second capacitor direct current terminal is connected with the capacitor, and the other side of the second capacitor direct current terminal is arranged on the packaging outer body in a penetrating mode;
the electronic packaging devices are arranged side by side, and the second capacitor direct current terminals of the electronic packaging devices are connected in parallel;
the second capacitance direct current terminals of the electronic packaging devices are all positioned at one end of the power semiconductor device;
the electronic packaging device further comprises an alternating current terminal, one side of the alternating current terminal is connected with the alternating current side of the power semiconductor unit, the other side of the alternating current terminal is arranged on the packaging outer body in a penetrating mode, the alternating current terminal is located at the end portion of the packaging outer body, and the alternating current terminals of the electronic packaging devices are located at the other end of the power semiconductor device.
2. The power semiconductor device of claim 1, wherein the electronic package further comprises a heat dissipation structure disposed within the package exterior and disposed along the power semiconductor unit and/or the capacitor.
3. The power semiconductor device of claim 2, wherein the heat dissipation structure comprises a coolant channel, a coolant inlet and a coolant outlet of the coolant channel both disposed on the package outer body.
4. The power semiconductor device according to claim 3, wherein the heat dissipation structure comprises a plurality of heat dissipation through holes, and a heat dissipation opening of each heat dissipation through hole is provided on the package outer body.
5. The power semiconductor device of claim 1, wherein the first capacitive dc terminal, the second capacitive dc terminal, and the ac terminal each comprise a busbar.
6. A motor controller comprising the power semiconductor device according to any one of claims 1 to 5.
7. A vehicle characterized by comprising the motor controller of claim 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811261764.0A CN109390299B (en) | 2018-10-26 | 2018-10-26 | Power semiconductor device, motor controller, and vehicle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811261764.0A CN109390299B (en) | 2018-10-26 | 2018-10-26 | Power semiconductor device, motor controller, and vehicle |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109390299A CN109390299A (en) | 2019-02-26 |
| CN109390299B true CN109390299B (en) | 2022-12-20 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201811261764.0A Active CN109390299B (en) | 2018-10-26 | 2018-10-26 | Power semiconductor device, motor controller, and vehicle |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110336164A (en) * | 2019-07-19 | 2019-10-15 | 重庆巩诚投资有限公司 | Applied to the modular connector on control device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102064672A (en) * | 2009-10-27 | 2011-05-18 | 通用汽车环球科技运作公司 | Power electronics assembly with multi-sided inductor cooling |
| CN106059332A (en) * | 2015-04-15 | 2016-10-26 | 福特全球技术公司 | Power module assembly |
| CN107493687A (en) * | 2015-03-05 | 2017-12-19 | 日立汽车系统株式会社 | Power inverter |
| CN108075672A (en) * | 2016-11-18 | 2018-05-25 | 比亚迪股份有限公司 | Load controller and the electric vehicle with the load controller |
| CN209691742U (en) * | 2018-10-26 | 2019-11-26 | 蔚来汽车有限公司 | Electronic encapsulation device and power semiconductor arrangement, electric machine controller and vehicle |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2555241B (en) * | 2015-04-13 | 2020-05-13 | Abb Schweiz Ag | Power electronics module |
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- 2018-10-26 CN CN201811261764.0A patent/CN109390299B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102064672A (en) * | 2009-10-27 | 2011-05-18 | 通用汽车环球科技运作公司 | Power electronics assembly with multi-sided inductor cooling |
| CN107493687A (en) * | 2015-03-05 | 2017-12-19 | 日立汽车系统株式会社 | Power inverter |
| CN106059332A (en) * | 2015-04-15 | 2016-10-26 | 福特全球技术公司 | Power module assembly |
| CN108075672A (en) * | 2016-11-18 | 2018-05-25 | 比亚迪股份有限公司 | Load controller and the electric vehicle with the load controller |
| CN209691742U (en) * | 2018-10-26 | 2019-11-26 | 蔚来汽车有限公司 | Electronic encapsulation device and power semiconductor arrangement, electric machine controller and vehicle |
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| CN109390299A (en) | 2019-02-26 |
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Effective date of registration: 20200901 Address after: Susong Road West and Shenzhen Road North, Hefei Economic and Technological Development Zone, Anhui Province Applicant after: Weilai (Anhui) Holding Co.,Ltd. Address before: 30 Floor of Yihe Building, No. 1 Kangle Plaza, Central, Hong Kong, China Applicant before: NIO NEXTEV Ltd. |
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